Semiconductor packaging clamping tool

Abstract

The utility model discloses a semiconductor packaging clamping tool, and relates to the technical field of semiconductor production. Comprising a support and a turning plate, a rotating shaft is installed on the lower portion of the turning plate through a bearing, the other end of the rotating shaft is installed on the side wall of the support through a bearing, a first rotating air cylinder is installed on the other side wall of the support, and a rotating disc of the first rotating air cylinder is connected with the turning plate; and a supporting plate is mounted on a turntable of the second rotary cylinder. According to the semiconductor packaging and clamping tool, the supporting plate is connected into the negative pressure air source system through the first air guide sliding ring, suction control over the supporting plate can be achieved, rapid and accurate positioning of a semiconductor device is achieved, operation is easy, maintenance is convenient, manual operation and maintenance cost are reduced, and after clamping and positioning, the clamping efficiency is improved. The angle can be rapidly adjusted through the first rotary air cylinder and the second rotary air cylinder, control over automatic rotation or swing of the semiconductor device is achieved, and therefore different adjusting requirements in the machining process are met.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of semiconductor production, concretely to a semiconductor packaging clamping tool. BACKGROUND

[0002] The semiconductor material of the semiconductor device is silicon, germanium or gallium arsenide, which can be used as rectifier, oscillator, light emitter, amplifier, light detector and other equipment, in order to distinguish from integrated circuit, sometimes also called discrete device, the basic structure of most two-terminal devices (i.e. crystal diode) is a PN junction, different semiconductor materials, different processes and geometric structures are used in semiconductor devices, and various crystal diodes with different functions and purposes have been developed, the frequency coverage of crystal diode can be from low frequency, high frequency, microwave, millimeter wave, infrared to light wave, and most of the semiconductor devices need to be clamped and fixed by the corresponding clamping tool during manufacturing, but the existing clamping tool has some deficiencies in the clamping process:

[0003] 1. The clamping and fixing is complicated and time-consuming, the existing clamping tool still adopts manual fixing method to clamp the semiconductor device during the fixing process, which not only wastes a lot of time, but also reduces the work efficiency;

[0004] 2. The adjustable range is small, and the processing is not convenient, after the existing clamping tool is clamped, the fixed angle cannot be adjusted, so when the semiconductor device needs to be rotated for processing during processing, the angle cannot be adjusted, which causes inconvenience in processing. CONTENT OF THE UTILITY MODEL

[0005] The utility model provides a kind of semiconductor packaging clamping tool to solve the problems in the background art.

[0006] To achieve the above object, the utility model provides the following technical scheme: a kind of semiconductor packaging clamping tool, including support and flap, the lower part of the flap is equipped with shaft by bearing, and the other end of shaft is installed on the side wall of support by bearing, the other side wall of support is equipped with first rotary cylinder, and the turntable of first rotary cylinder is connected with flap, the flap is equipped with second rotary cylinder, and the turntable of second rotary cylinder is equipped with supporting plate, the top of supporting plate is equipped with positioning slot, and positioning slot is equipped with air hole, the air passage of supporting plate is equipped with air passage, and air passage and air hole are mutually penetrated, the middle part of air passage is equipped with gas connection channel, and first gas guide slip ring is embedded in gas connection channel.

[0007] Further, the lower part of the flap is embedded with second gas guide slip ring, and the turntable of first rotary cylinder and second gas guide slip ring are located on the same axis.

[0008] Further, the side wall of the support is provided with a first assembly opening, and the first rotary cylinder is located at the first assembly opening.

[0009] Further, the support and the flap are both U-shaped, and the flap is located in the support, and the rotating shaft and the first rotary cylinder are located on the same axis.

[0010] Further, the top of the flap is provided with a second assembly opening, and the second rotary cylinder is located at the second assembly opening.

[0011] Further, the positioning grooves are uniformly distributed on the supporting plate, and the air holes are located in the middle of the positioning grooves.

[0012] Compared with the prior art, the semiconductor packaging clamping tool has the following beneficial effects:

[0013] The semiconductor packaging clamping tool can realize the control of the suction force of the supporting plate through the first air guide slip ring connected to the negative pressure air source system, realize the quick and accurate positioning of the semiconductor device, is simple to operate, convenient to maintain, reduces the manual operation and maintenance cost, and can quickly adjust the angle through the first rotary cylinder and the second rotary cylinder after clamping and positioning, realize the control of the automatic rotation or swing of the semiconductor device, and thus adapt to different adjustment requirements in the machining process. BRIEF DESCRIPTION OF DRAWINGS

[0014] Fig. 1 It is a structural schematic view of the utility model;

[0015] Fig. 2 It is a top view of the utility model;

[0016] Fig. 3 It is a side view of the utility model.

[0017] In the drawing: 1, support; 2, flap; 3, rotating shaft; 4, first rotary cylinder; 5, second rotary cylinder; 6, supporting plate; 7, positioning groove; 8, air hole; 9, air duct; 10, air connection channel; 11, first air guide slip ring; 12, second air guide slip ring; 13, first assembly opening; 14, second assembly opening. DETAILED DESCRIPTION

[0018] The technical solutions in the embodiments of the utility model will be clearly and completely described below with reference to the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, rather than all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor fall within the protection scope of the utility model.

[0019] Please refer to Figs. 1-3The utility model discloses a kind of semiconductor packaging clamping tool, including support 1 and flap 2, the lower portion of flap 2 is equipped with rotating shaft 3 by bearing, and another end of rotating shaft 3 is installed on the side wall of support 1 by bearing, another side wall of support 1 is equipped with first rotary cylinder 4, and the turntable of first rotary cylinder 4 is connected with flap 2, second rotary cylinder 5 is installed on flap 2, and tray 6 is installed on the turntable of second rotary cylinder 5, positioning groove 7 is opened in the top of tray 6, and air hole 8 is equipped in positioning groove 7, air channel 9 is equipped in tray 6, and air channel 9 and air hole 8 are mutually through, air channel 9 is equipped with gas connection channel 10 in middle part, and first gas guide slip ring 11 is embedded in gas connection channel 10, tray 6 is connected into negative pressure gas source system by first gas guide slip ring 11, the suction force control of tray 6 can be realized, the quick, accurate positioning of semiconductor device is realized, it is easy to operate, it is convenient to maintain, reduce manual operation and maintenance cost, after clamping and positioning, angle can be quickly adjusted by first rotary cylinder 4 and second rotary cylinder 5, the control of automatic rotation or swing of semiconductor device is realized, to adapt to different adjustment needs in processing process.

[0020] Specifically, the lower portion of the flap 2 is embedded with a second gas guide slip ring 12, and the second gas guide slip ring 12 and the turntable of the first rotary cylinder 4 are located on the same axis.

[0021] In this embodiment, the main function of the first gas guide slip ring 11 and the second gas guide slip ring 12 is to transmit gas signals between two relative rotating organizations, to ensure that the gas can be transmitted stably and reliably during rotation. The gas guide slip ring is usually composed of a shell, a rotating part and a gas channel. It is designed to transmit gas without limitation in 360 degrees. Its working principle is based on the design that the shaft rotates while the sleeve is fixed, or the sleeve rotates while the shaft is fixed, similar to the rotating principle of a bearing. The structure of the gas guide slip ring includes a main shaft, a sleeve, a bearing and a sealing ring and other components. Through the combination and cooperation of these components, the gas can be transmitted without limitation in 360 degrees. Each ring is isolated by a sealing ring to ensure that the gas works independently in each passage without interference, thereby ensuring the accuracy and efficiency of gas transmission.

[0022] Specifically, the side wall of the support 1 is provided with a first assembly opening 13, and the first rotary cylinder 4 is located at the first assembly opening 13.

[0023] In this embodiment, the first assembly opening 13 plays a role in positioning and fixing during assembly, ensuring the accurate position of the parts during assembly, thereby ensuring the overall precision and quality of the product. The first rotary cylinder 4 controls the angle and speed of rotation or swing by controlling the size and direction of air pressure, thereby achieving the control of automatic rotation or swing of the object in the automatic equipment.

[0024] Specifically, the support 1 and the flap 2 are both U-shaped, and the flap 2 is located in the support 1, and the rotating shaft 3 and the first rotary cylinder 4 are located on the same axis.

[0025] In the embodiment, the rotating shaft 3 is a connecting structure for connecting the flap 2 and the support 1.

[0026] Specifically, the top of the flap 2 is provided with a second assembly opening 14, and the second rotary cylinder 5 is located at the second assembly opening 14.

[0027] In the embodiment, the second assembly opening 14 plays a role of positioning and fixing in the assembly process, ensures the accurate position of the parts during assembly, and thus guarantees the overall precision and quality of the product.

[0028] Specifically, the positioning grooves 7 are uniformly distributed on the supporting plate 6, and the air holes 8 are located in the middle of the positioning grooves 7.

[0029] In the embodiment, the positioning grooves 7 are used for containing semiconductor devices and are adapted to the size of the semiconductor devices for limiting, and when the supporting plate 6 is connected to the negative pressure air source system, suction is generated at the air holes 8 to firmly adsorb and fix the semiconductor devices.

[0030] In use, the supporting plate 6 is connected to the negative pressure air source system through the first air guide slip ring 11, the suction control of the supporting plate 6 can be realized, the semiconductor devices can be quickly and accurately positioned, the operation is simple, the maintenance is convenient, the manual operation and maintenance cost are reduced, after clamping and positioning, the angle can be quickly adjusted through the first rotary cylinder 4 and the second rotary cylinder 5, the automatic rotation or swing control of the semiconductor devices can be realized, and thus different adjustment requirements in the machining process can be adapted.

[0031] In summary, the semiconductor packaging clamping tool, the supporting plate 6 is connected to the negative pressure air source system through the first air guide slip ring 11, the suction control of the supporting plate 6 can be realized, the semiconductor devices can be quickly and accurately positioned, the operation is simple, the maintenance is convenient, the manual operation and maintenance cost are reduced, after clamping and positioning, the angle can be quickly adjusted through the first rotary cylinder 4 and the second rotary cylinder 5, the automatic rotation or swing control of the semiconductor devices can be realized, and thus different adjustment requirements in the machining process can be adapted.

[0032] Although the embodiments of the utility model have been shown and described, it can be understood by those skilled in the art that various changes, modifications, replacements and variations can be made to these embodiments without departing from the principles and spirits of the utility model, the scope of the utility model is defined by the appended claims and their equivalents.

Claims

1. A semiconductor package clamping tool comprising a base (1) and a flap (2), characterized in that: The lower part of the turnover plate (2) is provided with a rotating shaft (3) through a bearing, and the other end of the rotating shaft (3) is provided with a bearing on the side wall of the support (1), the other side wall of the support (1) is provided with a first rotary cylinder (4), the rotating disc of the first rotary cylinder (4) is connected with the turnover plate (2), the turnover plate (2) is provided with a second rotary cylinder (5), the rotating disc of the second rotary cylinder (5) is provided with a supporting plate (6), the top of the supporting plate (6) is provided with a positioning groove (7), the positioning groove (7) is provided with an air hole (8), the supporting plate (6) is provided with an air channel (9), the air channel (9) and the air hole (8) are mutually penetrated, the middle part of the air channel (9) is provided with an air connection channel (10), and the first air guide slip ring (11) is embedded in the air connection channel (10).

2. The semiconductor package clamping tool of claim 1, wherein: The lower part of the turnover plate (2) is provided with a second air guide slip ring (12), and the second air guide slip ring (12) and the rotating disc of the first rotary cylinder (4) are located on the same axis.

3. The semiconductor package clamping tool of claim 1, wherein: The side wall of the support (1) is provided with a first assembly opening (13), and the first rotary cylinder (4) is located at the first assembly opening (13).

4. The semiconductor package clamping tool of claim 1, wherein: The support (1) and the turnover plate (2) are both U-shaped, and the turnover plate (2) is located in the support (1), and the rotating shaft (3) and the first rotary cylinder (4) are located on the same axis.

5. The semiconductor package clamping tool of claim 1, wherein: The top of the turnover plate (2) is provided with a second assembly opening (14), and the second rotary cylinder (5) is located at the second assembly opening (14).

6. The semiconductor package clamping tool of claim 1, wherein: The positioning grooves (7) are uniformly distributed on the supporting plate (6), and the air holes (8) are located in the middle part of the positioning grooves (7).

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