System for converting V-By-One and LVDS signals into HDMI signals

Abstract

The utility model discloses a V-By-One and LVDS (Low Voltage Differential Signaling) signal-to-HDMI (High Definition Multimedia Interface) signal system, which is characterized by comprising an input signal receiving module, a signal processing and converting module, an HDMI signal converting module, an HDMI signal output module, a dial switch and a main control module, the corresponding end of the main control module is electrically connected with the corresponding ends of the signal processing and conversion module, the HDMI signal conversion module and the dial switch respectively; the corresponding end of the input signal receiving module is electrically connected with the corresponding end of the signal processing and conversion module and the corresponding end of the HDMI signal conversion module. The HDMI signal conversion module is also electrically connected with the corresponding end of the HDMI signal output module; the input signal receiving module is used for receiving a V-By-One signal and an LVDS (Low Voltage Differential Signaling) signal; and the signal processing and conversion module is used for converting the signal input by the input signal interface into a unified LVDS (Low Voltage Differential Signaling) signal.

Description

TECHNICAL FIELD

[0001] The utility model relates to liquid crystal drive mainboard technical field, especially in a kind of V-By-One and LVDS signal conversion HDMI signal's system BACKGROUND

[0002] In modern display technology field, the test of liquid crystal drive mainboard is the key link to ensure the quality of display equipment. With the development of display technology, the market demand for high-definition (HD), full high-definition (FHD) and ultra high-definition (UHD) display equipment is increasing.

[0003] The disadvantages of prior art are:

[0004] The test system lacks: there is a lack of a system that can comprehensively test liquid crystal drive mainboards on the market, especially for devices that support dual-channel LVDS, four-channel LVDS and 8Lane V-by-One input. This makes it difficult for manufacturers to effectively test these mainboards.

[0005] Inconvenient operation: the existing test system is inconvenient to operate and use, lacks flexibility and ease of use. This makes the testing process cumbersome and is not conducive to improving testing efficiency.

[0006] Compatibility problem: the existing liquid crystal drive mainboard test system can usually only support a single type of signal or resolution, and cannot simultaneously support HD, FHD and UHD signals. This limits the versatility of the test system, increases testing costs and complexity.

[0007] Complex testing process: due to the lack of a unified test platform, testers need to use multiple different devices to test drive mainboards of different signal sources, which not only increases the difficulty of testing, but also reduces testing efficiency.

[0008] Lack of flexibility: the test system on the market usually only supports conversion of one resolution, which undoubtedly increases the additional burden for manufacturers who need to test multiple resolution display devices.

[0009] Low production efficiency: in a large-scale production environment, the existing test system cannot quickly and effectively detect the quality of display mainboards, resulting in low production efficiency and increasing manual intervention and time costs. INVENTION CONTENTS

[0010] In view of the problems existing in the prior art, the utility model provides a kind of V-By-One and LVDS signal conversion HDMI signal's system

[0011] In order to achieve the above purpose, the utility model provides a kind of V-By-One and LVDS signal conversion HDMI signal's system, comprising:

[0012] The input signal receiving module, the signal processing and conversion module, the HDMI signal conversion module, the HDMI signal output module, the dial switch, and the main control module are connected electrically.

[0013] The main control module is connected electrically with the signal processing and conversion module, the HDMI signal conversion module, and the dial switch.

[0014] The input signal receiving module is connected electrically with the signal processing and conversion module and the HDMI signal conversion module.

[0015] The input signal receiving module is configured to receive V-By-One signals and LVDS signals.

[0016] The signal processing and conversion module is configured to convert signals input by the input signal interface into unified LVDS signals.

[0017] The HDMI signal conversion module is configured to convert LVDS signals input by the signal processing and conversion module or input by the input signal interface into HDMI signals.

[0018] Preferably, the input signal receiving module comprises a first input interface, a second input interface, a third input interface, and an audio input interface.

[0019] The first input interface is configured to receive V-By-One signals, support 10-bit V-By-One signals, and have a resolution of 3840×2160.

[0020] The second input interface is configured to receive FHD LVDS signals, support 8-bit or 10-bit LVDS signals, and have a resolution of 1920×1080.

[0021] The third input interface is configured to receive HD LVDS signals, support 8-bit LVDS signals, and have a resolution of 1366×768.

[0022] The audio input interface is configured to receive I2S audio signals.

[0023] Preferably, the signal processing and conversion module comprises a signal processing and conversion MST6M60FVC chip, which is configured to process different types of input signals input by the input signal receiving module into 1920×1080 resolution LVDS signals.

[0024] Preferably, the HDMI signal conversion module comprises an HDMI signal conversion core IT6263, and the HDMI signal conversion core IT6263 is electrically connected to the third input interface, the audio input interface and the signal processing and conversion MST6M60FVC chip.

[0025] Preferably, the HDMI signal output module comprises an HDMI output interface, and the HDMI output interface is electrically connected to the HDMI signal conversion core IT6263.

[0026] Preferably, the master control module comprises an MCU, and the MCU is STC8C2K64S2; and the MCU is electrically connected to the HDMI signal conversion core IT6263 and the signal processing and conversion MST6M60FVC chip.

[0027] Preferably, the V-By-One and LVDS to HDMI system further comprises a storage module, and the storage module is electrically connected to the signal processing and conversion module.

[0028] Preferably, the storage module comprises a storage chip MX25L1605, and the storage chip MX25L1605 is electrically connected to the signal processing and conversion MST6M60FVC chip.

[0029] The technical scheme of the utility model has the following beneficial effects:

[0030] The utility model discloses a system for testing liquid crystal drive mainboard, which can be compatible with high definition (HD), full high definition (FHD) and ultra high definition (UHD), support dual-channel LVDS, four-channel LVDS signal and 8Lane V-by-one input, and can adjust the mode to be tested through a dial switch, so as to solve the problem that there is no system for testing liquid crystal drive board on the market.

[0031] The system can process common signal sources on the market, output HDMI signal, and connect to a display screen or an HDMI signal analyzer to test the output signal of the drive mainboard, so as to facilitate the testing process and optimize the testing process.

[0032] Signal conversion flexibility: the product can convert the special signal of the display mainboard (LVDS or V-by-One) into a general HDMI signal through interface compatibility, which is convenient for connecting to ordinary HDMI display devices for testing. The product supports multiple resolutions, and LVDS usually supports HD or FHD, and V-by-One supports higher resolution UHD, which is suitable for different mainboard requirements.

[0033] The application advantage of the production line is that the test process is simplified, the panel signal is converted into HDMI, the test is completed by using a standard HDMI display device, the complicated steps of customizing a display device are omitted, the test efficiency is improved, the quality of the display mainboard is quickly detected in mass production, and the manual intervention and time cost are greatly reduced.

[0034] Through the advantages, the LVDS and V-by-One conversion HDMI test board becomes an important tool in display technology development and test. BRIEF DESCRIPTION OF DRAWINGS

[0035] Figure 1 It is a module schematic diagram of the utility model;

[0036] Figure 2 It is a control schematic diagram of the utility model;

[0037] Figure 3 It is a circuit principle diagram of MST6M60FVC chip U2A of the utility model;

[0038] Figure 4 It is a circuit principle diagram of MST6M60FVC chip U2B of the utility model;

[0039] Figure 5 It is a circuit principle diagram of MST6M60FVC chip U2C of the utility model;

[0040] Figure 6 It is a circuit principle diagram of MST6M60FVC chip U2D of the utility model;

[0041] Figure 7 It is a circuit principle diagram of MST6M60FVC chip U2E of the utility model;

[0042] Figure 8 It is a circuit principle diagram of MST6M60FVC chip U2F of the utility model;

[0043] Figure 9 It is a circuit principle diagram of HDMI signal conversion chip IT6263 U9 of the utility model;

[0044] Figure 10 It is a circuit principle diagram of HDMI signal conversion chip IT6263 U10 of the utility model;

[0045] Figure 11 It is a circuit principle diagram of the utility model main control module;

[0046] Figure 12 It is a circuit principle diagram of the utility model storage module. DETAILED DESCRIPTION

[0047] The embodiments of the present application are described below in detail, examples of which are shown in the drawings, wherein the same or similar notations represent the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by reference to the drawings are exemplary, and are intended to explain the present application, and cannot be understood as a limitation of the present application.

[0048] In the description of the present application, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise" and the like indicate the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and therefore cannot be understood as indicating or implying that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation of the present application.

[0049] In addition, the terms "first", "second" are only for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the technical features indicated. Therefore, the features defined as "first", "second" can explicitly or implicitly include one or more of the features. In the description of the present application, the meaning of "multiple" is two or more, unless otherwise specifically limited.

[0050] In the present application, unless otherwise specifically defined and limited, the terms "mounting", "connection", "connection", "fixing" and the like should be broadly understood, for example, it can be fixedly connected, or it can be detachably connected, or integrally connected; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium, or it can be the communication between two elements. For ordinary skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0051] In the present application, unless otherwise specifically defined and limited, the first feature "above" or "below" the second feature can include the direct contact of the first and second features, or the indirect contact of the first and second features through another feature between them. Moreover, the first feature "above", "above" and "above" of the second feature includes the first feature directly above and obliquely above the second feature, or only indicates that the horizontal height of the first feature is higher than that of the second feature. The first feature "below", "below" and "below" of the second feature includes the first feature directly below and obliquely below the second feature, or only indicates that the horizontal height of the first feature is less than that of the second feature.

[0052] Reference Figures 1 to 12The utility model provides a system of V-By-One and LVDS signal conversion HDMI signal, include:

[0053] Input signal receiving module 100, signal processing and conversion module 200, HDMI signal conversion module 300, HDMI signal output module 400, DIP switch 600, main control module 500;

[0054] The main control module 500 corresponding end is electrically connected with signal processing and conversion module 200, HDMI signal conversion module 300, DIP switch 600 corresponding end respectively;

[0055] The input signal receiving module 100 corresponding end is electrically connected with signal processing and conversion module 200, HDMI signal conversion module 300 corresponding end respectively;The HDMI signal conversion module 300 is still electrically connected with HDMI signal output module 400 corresponding end;

[0056] The input signal receiving module 100 is used for receiving V-By-One signal and LVDS signal;

[0057] Signal processing and conversion module 200 are used for converting the signal of input signal interface input into unified LVDS signal;

[0058] The HDMI signal conversion module 300 is used for converting the LVDS signal of signal processing and conversion module input or the LVDS signal of input signal interface input into HDMI signal;

[0059] DIP switch 600 (DIP SWITCH) is used for user to set input signal type and system working mode, to control signal processing and conversion module and the working state of HDMI signal conversion module;

[0060] Main control module 500 contains microcontroller (MCU), is used for controlling DIP switch setting signal flow direction and mode switching, detects panel power state, and communicates with signal processing and conversion module and HDMI signal conversion module through I2C interface.

[0061] Further, the input signal receiving module 100 comprises a first input interface 101, a second input interface 102, a third input interface 103, and an audio input interface 104; wherein the first input interface 101 is configured to receive a V-By-One signal, supports a 10-bit V-By-One signal, and has a resolution of 3840x2160; the second input interface 102 is configured to receive an FHD LVDS signal, supports an 8-bit or 10-bit LVDS signal, and has a resolution of 1920x1080; the third input interface 103 is configured to receive an HD LVDS signal, supports an 8-bit LVDS signal, and has a resolution of 1366x768; and the audio input interface 104 is configured to receive an I2S audio signal; in this embodiment, the input signal receiving module 100 is configured to receive V-By-One and LVDS signals from different sources, and an I2S audio signal; allows the system to be compatible with multiple signal inputs, and improves the versatility and applicability of the system, wherein the first input interface 101 and the second input interface 102 are both FI-RE51S interfaces, the third input interface 103 is a FI-X30SSL interface, and the audio input interface 104 is a PH-2.0 interface.

[0062] Further, the signal processing and conversion module 200 comprises a signal processing and conversion MST6M60FVC chip, which is configured to uniformly process different types of input signals input by the input signal receiving module into a 1920x1080 resolution LVDS signal output; the signal processing and conversion MST6M60FVC chip is provided with six (see Figures 3 to 8 ), and is denoted as MST6M60FVC chip U2A, MST6M60FVC chip U2B, MST6M60FVC chip U2C, MST6M60FVC chip U2D, MST6M60FVC chip U2E, and MST6M60FVC chip U2F; in this embodiment, the signal processing and conversion module 200 converts the received V-By-One and LVDS signals into a unified LVDS signal format, simplifies the subsequent signal processing process through the unified signal format, and enables the system to process input signals of different resolutions; the MST6M60FVC is responsible for receiving V-by-One and LVDS signals and performing conversion. It uniformly processes different types of input signals (V-by-One or LVDS) into an LVDS output, and the resolution is fixed at 1920x1080.

[0063] Reference Figures 9 to 10The HDMI signal conversion module 300 includes an HDMI signal conversion core IT6263, and the HDMI signal conversion core IT6263 is electrically connected to the third input interface, the audio input interface and the signal processing and conversion MST6M60FVC chip in a one-to-one manner. The HDMI signal conversion core IT6263 includes an HDMI signal conversion core IT6263(U9) and an HDMI signal conversion core IT6263(U10). In this embodiment, the HDMI signal conversion module 300 converts the unified LVDS signal into an HDMI signal and embeds an I2S audio signal, so that the converted signal can be transmitted through an HDMI interface, is compatible with an existing HDMI display device, supports audio and video synchronous transmission, and is responsible for converting the LVDS signal output by the MST6M60FVC into an HDMI signal. The IT6263 supports I2C control and audio (I2S) signal input.

[0064] Further, the HDMI signal output module 400 includes an HDMI output interface, and the HDMI output interface is electrically connected to the HDMI signal conversion core IT6263 in a one-to-one manner. In this embodiment, the HDMI signal output module 400 provides an HDMI interface for outputting the converted HDMI signal, and a user can transmit the signal to a display device through the HDMI interface to realize high-quality video and audio output.

[0065] Referring to Figure 11 The main control module 500 includes an MCU, and the MCU is an STC8C2K64S2. The MCU is electrically connected to the HDMI signal conversion core IT6263 and the signal processing and conversion MST6M60FVC chip in a one-to-one manner. The main control module 500 is used for controlling signal flow direction, mode switching, detecting a panel power supply state, and communicating with the signal processing and conversion module and the HDMI signal conversion module through an I2C interface. As a control center of the system, the main control module 500 ensures that the modules work cooperatively to realize accurate processing and conversion of signals. The MCU is used for panel power supply detection (PANEL_VCC Detect), control signal selection (DIPSWITCH dial switch setting), and communication with the IT6263 chip and the MST6M60FVC chip through the I2C interface.

[0066] Referring to Figure 12 The V-By-One and LVDS to HDMI system further includes a storage module 700, and the storage module 700 is electrically connected to the signal processing and conversion module 200 in a one-to-one manner. The storage module 700 includes a storage chip MX25L1605, and the storage chip MX25L1605 is electrically connected to the signal processing and conversion MST6M60FVC chip in a one-to-one manner.

[0067] The working principle of the utility model is as follows:

[0068] The main function of the product is to convert different signal types (V-by-One and LVDS) into HDMI output signals. The core working components include:

[0069] Working process:

[0070] Input signal receiving:

[0071] According to the needs of users, V-by-One or LVDS signals are input through the FI-RE51S or FI-X30SSL interface, and I2S audio signals are input through the PH-2.0 interface.

[0072] Signal processing and conversion:

[0073] V-by-One or LVDS signals enter the signal processing and conversion MST6M60FVC chip: according to the system configuration (provided by NOR Flash) and the control of MCU, the signal entering the signal processing and conversion MST6M60FVC chip processes and uniformly converts the input signal into a 1920×1080 resolution LVDS signal output.

[0074] MCU detects signals and power states: through PANEL_VCC Detect, it is confirmed whether the mainboard is working normally, and through I2C control, the working state of the HDMI signal conversion chip IT6263 is controlled.

[0075] HDMI signal generation:

[0076] The LVDS signal output by the signal processing and conversion MST6M60FVC chip enters the HDMI signal conversion chip IT6263, which converts it into an HDMI signal, and embeds the I2S audio into the HDMI. The HDMI signal conversion chip IT6263 outputs the final HDMI signal to the display device.

[0077] User control:

[0078] Users set the input signal type (V-by-One, FHD LVDS or HD LVDS) through DIP SWITCH;

[0079] MCU controls the flow direction and mode switching of signals according to the configuration of DIP SWITCH.

[0080] Output display:

[0081] The HDMI signal is transmitted to external display devices such as televisions or monitors to display complete video and audio content.

[0082] The above merely describes preferred embodiments of the present application, and is not intended to limit the patent scope of the present application, and any equivalent structural transformation or direct / indirect application in other related technical fields under the inventive concept of the present application, as described in the present application specification and drawings, is included in the patent protection scope of the present application.

Claims

1. A system for converting V-By-One and LVDS signals to HDMI signals, the system comprising: a first converter for converting the V-By-One signals to HDMI signals; and a second converter for converting the LVDS signals to HDMI signals. The system comprises an input signal receiving module, a signal processing and conversion module, an HDMI signal conversion module, an HDMI signal output module, a dial switch and a main control module. The main control module is electrically connected with the signal processing and conversion module, the HDMI signal conversion module and the dial switch. The input signal receiving module is electrically connected with the signal processing and conversion module and the HDMI signal conversion module. The input signal receiving module is used for receiving V-By-One signals and LVDS signals. The signal processing and conversion module is used for converting the signals input by the input signal interface into unified LVDS signals. The HDMI signal conversion module is used for converting the LVDS signals input by the signal processing and conversion module or the LVDS signals input by the input signal interface into HDMI signals. The input signal receiving module comprises a first input interface, a second input interface, a third input interface and an audio input interface.

2. The system for converting V-By-One and LVDS signals to HDMI signals according to claim 1, wherein, The first input interface is used for receiving V-By-One signals and supports 10-bit V-By-One signals with a resolution of 3840x2160. The second input interface is used for receiving FHD LVDS signals and supports 8-bit or 10-bit LVDS signals with a resolution of 1920x1080. The third input interface is used for receiving HD LVDS signals and supports 8-bit LVDS signals with a resolution of 1366x768. The audio input interface is used for receiving I2S audio signals. The signal processing and conversion module comprises a signal processing and conversion MST6M60FVC chip which is used for processing the different types of input signals input by the input signal receiving module into 1920x1080 resolution LVDS signals.

3. The system for converting V-By-One and LVDS signals to HDMI signals according to claim 2, wherein, The HDMI signal conversion module comprises an HDMI signal conversion chip IT6263 which is electrically connected with the third input interface, the audio input interface and the signal processing and conversion MST6M60FVC chip.

4. The system for converting V-By-One and LVDS signals to HDMI signals according to claim 3, wherein, The HDMI signal output module comprises an HDMI output interface which is electrically connected with the HDMI signal conversion chip IT6263.

5. The system for converting V-By-One and LVDS signals to HDMI signals according to claim 4, wherein, The main control module comprises an MCU which is STC8C2K64S2.

6. The system for converting V-By-One and LVDS signals to HDMI signals according to claim 5, wherein, The system further comprises a storage module which is electrically connected with the signal processing and conversion module.

7. The system for converting V-By-One and LVDS signals to HDMI signals according to claim 6, wherein, The storage module comprises a storage chip MX25L1605 which is electrically connected with the signal processing and conversion MST6M60FVC chip.

8. The system for converting V-By-One and LVDS signals to HDMI signals according to claim 7, wherein, ​

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