Semiconductor waste gas treatment device

Abstract

The semiconductor waste gas treatment device comprises an adsorption barrel and a spiral plate, the spiral plate is located in the adsorption barrel and fixed to the adsorption barrel in position, a gas outlet and a gas inlet are formed in the upper end and the lower end of the adsorption barrel respectively, and adsorption particles are filled between the spiral plate and the adsorption barrel. A feeding hole and a discharging hole are respectively formed in the upper end and the lower end of the adsorption barrel, and are respectively connected with a plugging device for plugging. Waste gas rises between the spiral plates, is in contact with the adsorption particles and is absorbed, and the length of the whole adsorption particles is increased in a limited adsorption cylinder space, so that the waste gas is more fully adsorbed; the adsorption particles continuously slide down along the spiral plate under the action of gravity, the completely saturated adsorption particles which are in contact with the waste gas at the lower part firstly leave the adsorption barrel from the discharge hole, and the unsaturated adsorption particles at the upper part slide to the lower part of the adsorption barrel to be reserved, so that the waste gas is continuously adsorbed in later use, the use of the adsorption particles is reduced, and the cost is reduced.

Description

TECHNICAL FIELD

[0001] The utility model relates to the field of waste gas treatment especially a semiconductor waste gas treatment device. BACKGROUND

[0002] Semiconductor waste gas treatment equipment refers to a special equipment for treating waste gas generated in the semiconductor manufacturing process. In the semiconductor industry, the manufacturing process involves various chemicals and processes, such as photolithography, etching, deposition, etc. These processes may generate harmful gases, including acidic gases (such as hydrogen chloride HCl), alkaline gases (such as ammonia NH3), volatile organic compounds (VOCs), particulate matter, and some toxic or corrosive gases. In order to protect the environment and ensure the safety of the workplace, these waste gases must be effectively treated to meet the emission standards before being discharged into the atmosphere. Among them, the adsorption type treatment device uses activated carbon or other adsorbents to capture volatile organic compounds and other adsorbable pollutants.

[0003] The existing adsorption particles are directly installed between the two mesh plates of the adsorption cylinder. The waste gas enters from the mesh plate at one end and comes into contact with the activated carbon, and then is discharged from the mesh plate at the other end. In actual use, when the discharged waste gas after adsorption does not meet the standards, the activated carbon in the adsorption cylinder needs to be replaced. At this time, the activated carbon that first contacts the waste gas has been saturated, but the activated carbon near the gas outlet mesh plate is not saturated, causing waste of part of the activated carbon. SUMMARY

[0004] The utility model aims at solving above -mentioned problem, provides a kind of semiconductor waste gas treatment device, solves above-mentioned problem.

[0005] A semiconductor waste gas treatment device, comprising: an adsorption barrel and a spiral plate, the spiral plate is located inside the adsorption barrel and is fixed in position with the adsorption barrel, the upper and lower ends of the adsorption barrel are respectively formed with a gas outlet and a gas inlet, the spiral plate and the adsorption barrel are filled with adsorption particles, the upper and lower ends of the adsorption barrel are respectively formed with a feed inlet and a discharge outlet, and the feed inlet and the discharge outlet are respectively connected with a sealing device for sealing.

[0006] Further, the adsorption barrel includes a barrel body, an upper flange plate and a lower flange plate, the upper and lower ends of the barrel body are respectively fixed and detachably connected with the upper flange plate and the lower flange plate, and the outer side of the spiral plate is in contact with the barrel body or has a gap through which the adsorption particles cannot pass.

[0007] Further, it further includes a valve and a sealing plug, the feed inlet is located on the upper flange plate, the sealing plug is fixed and detachably connected with the feed inlet, the discharge outlet is located on the lower flange plate, the valve is connected with the discharge outlet, and the valve is fixedly connected with the lower flange plate.

[0008] Further, the device further comprises a funnel and a blocking net, the funnel is located below the lower end of the spiral plate, the lower end of the funnel is communicated with the discharge port, the blocking net is located above the side of the funnel away from the lower end of the spiral plate, the blocking net is fixedly connected with the lower end of the spiral plate or the funnel, and the blocking net is used for blocking the adsorbed particles.

[0009] Further, the device further comprises a central rod, the inner side of the spiral plate is fixedly connected with the central rod, and the central rod is fixedly and detachably connected with the adsorption barrel.

[0010] Further, the device further comprises an inner tube, the central rod is a hollow rod with an opening in the upper portion, the inner tube is located in the central rod, the inner tube is rotationally connected with the central rod, the outer side of the inner tube is attached to the inner side of the central rod, the central rod is formed with a plurality of radial outer through holes, the inner tube is formed with a plurality of radial inner through holes, and the outer through holes and the inner through holes are in one-to-one correspondence.

[0011] The device further comprises a sealing cover, and the sealing cover is fixedly and detachably connected with the upper end of the central rod.

[0012] Further, the inner through holes are tapered holes with a small inner diameter and a large outer diameter.

[0013] Further, the upper portion of the central rod is formed with a flange portion, and the flange portion is attached to the inner wall of the upper end of the upper adsorption barrel.

[0014] Further, the device further comprises a first three-way valve, a standby barrel, a blower, a first air inlet valve, a first air outlet valve, a second air inlet valve and a second air outlet valve, the air outlet of the first three-way valve is communicated with the first air inlet valve and the second air inlet valve through pipelines, the first air inlet valve is communicated with the air inlet of the gas collecting barrel, the air outlet of the gas collecting barrel is communicated with the first air outlet valve, the second air inlet valve is communicated with the air inlet of the standby barrel, the air outlet of the standby barrel is communicated with the second air outlet valve, the first air outlet valve and the second air outlet valve are communicated with the air inlet of the blower through pipelines, and the standby barrel is filled with adsorbed particles.

[0015] Further, the barrel body is fixedly provided with an observation window, and the observation window is located between the two layers of blades of the spiral plate.

[0016] Further, the device further comprises an outer machine box, the adsorption barrel and the standby barrel are located in the outer machine box and are fixedly and detachably connected with the outer machine box, and the adsorption barrel is provided with universal wheels below.

[0017] The device has the following advantages:

[0018] 1. The spiral plate is used, so that the adsorbed particles are in a spiral shape, the waste gas rises along the spiral plate, contacts the adsorbed particles and is absorbed, the length of the overall adsorbed particles is increased in the limited adsorption cylinder space, and the adsorption of the waste gas is more sufficient.

[0019] 2. The adsorption particles slide down the spiral plate under the force of gravity. The adsorption particles at the bottom that are in contact with the waste gas and are completely saturated leave the adsorption cylinder from the discharge port. The adsorption particles at the top that are not saturated slide to the bottom of the adsorption cylinder and are retained. They continue to adsorb waste gas in subsequent use, reducing the use of adsorption particles and lowering costs.

[0020] 3. As the adsorbent particles slide down during discharge, they rub against the inner wall of the adsorption tank and the spiral plate, thereby scraping away the surface deposits. This allows the adsorption tank to be filled with adsorbent particles multiple times before liquid cleaning, extending the cleaning cycle and reducing labor and logistics costs.

[0021] 4. During cleaning, the central rod, which provides support and reinforcement, sprays high-pressure water outward to remove the attached substances without disassembling the adsorption tank, thus improving cleaning efficiency. Attached Figure Description

[0022] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only one embodiment of this utility model. For those skilled in the art, other embodiments can be derived from the provided drawings without creative effort.

[0023] Figure 1 : A top view of the structure of this utility model;

[0024] Figure 2 : Figure 1 Schematic diagram of the cross-sectional structure at point AA;

[0025] Figure 3 : Figure 2 Schematic diagram of the cross-sectional structure at point BB;

[0026] Figure 4 : Figure 2 A magnified view of a section at point C;

[0027] Figure 5 : Figure 2 Schematic diagram of the cross-sectional structure at point DD;

[0028] Figure 6 : A three-dimensional structural schematic diagram of this utility model;

[0029] Figure 7 This utility model includes a three-dimensional structural diagram of the outer shell. Detailed Implementation

[0030] The present invention will be further described below with reference to the accompanying drawings and examples:

[0031] The embodiments of this utility model are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this utility model, and should not be construed as limiting this utility model.

[0032] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0033] In the description of this utility model, it should be understood that the terms "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0034] like Figures 1 to 7 As shown, a semiconductor waste gas treatment device includes: an adsorption tank 3 and a spiral plate 6. The spiral plate 6 is located inside the adsorption tank 3 and is fixed in position to the adsorption tank 3. An air outlet and an air inlet are formed at the upper and lower ends of the adsorption tank 3, respectively. Adsorption particles are filled between the spiral plate 6 and the adsorption tank 3. A feed inlet and a discharge outlet are formed at the upper and lower ends of the adsorption tank 3, respectively. The feed inlet and the discharge outlet are respectively connected to a sealing device for sealing.

[0035] Preferably, the sealing device can be a seal or a valve.

[0036] Furthermore, the adsorption tank 3 includes a tank body 13, an upper flange plate 14, and a lower flange plate 15. The upper and lower ends of the tank body 13 are fixed to and detachably connected to the upper flange plate 14 and the lower flange plate 15, respectively. The outer side of the spiral plate 6 is in contact with the tank body 13 or there is a gap that prevents adsorbed particles from passing through. For example, the diameter of the spiral plate 6 can be slightly smaller than the inner diameter of the tank body 13.

[0037] Furthermore, it also includes a valve 10 and a sealing plug 16. The feed port is located on the upper flange plate 14, the sealing plug 16 is fixed to and detachably connected to the feed port, the discharge port is located on the lower flange plate 15, the valve 10 is connected to the discharge port, and the valve 10 is fixedly connected to the lower flange plate 15.

[0038] Furthermore, it also includes a funnel 18 and a blocking net 19. The funnel 18 is located below the lower end of the spiral plate 6, and the lower end of the funnel 18 is connected to the discharge port. The blocking net 19 is located above the side of the funnel 18 away from the lower end of the spiral plate 6. The blocking net 19 is fixedly connected to the lower end of the spiral plate 6 or the funnel 18. The blocking net 19 is used to block the adsorbed particles and prevent the adsorbed particles on the spiral plate 6 from sliding out of the lower end of the spiral plate 6.

[0039] Preferably, the funnel 18 is made of a mesh plate.

[0040] Furthermore, it also includes a central rod 7, the inner side of the spiral plate 6 is fixedly connected to the central rod 7, and the central rod 7 is fixedly and detachably connected to the adsorption bucket 3.

[0041] Preferably, a flange 71 is formed on the upper part of the central rod 7, and the flange 71 fits against the upper flange plate 14, with the flange 71 and the upper flange plate 14 being sealed. The lower end of the central rod 7 is inserted into the lower flange plate 15 and contacts the flange plate 15. The central rod 7 cannot rotate relative to the flange plate 15 (e.g., the central rod 7 and the flange plate 15 can be connected by a spline), thereby ensuring that the outlet positions of the spiral plate 6 and the adsorption tank 3 are fixed and correspond.

[0042] Furthermore, it also includes an inner tube 8, a hollow rod with an opening above the center rod 7, the inner tube 8 being located in the center rod 7, the inner tube 8 being rotatably connected to the center rod 7, the outer side of the inner tube 8 being in contact with the inner side of the center rod 7, the center rod 7 having a radial outer through hole 70, and the inner tube 8 having a radial inner through hole 80, the outer through hole 70 and the inner through hole 80 corresponding one-to-one;

[0043] Furthermore, the inner through hole 80 is a cone shape with a small inner diameter and a large outer diameter, thereby expanding the spray range during cleaning and covering the entire inner wall of the adsorption tank 3.

[0044] It also includes a sealing cap 72, which is fixed to and detachably connected to the upper end of the center rod 7.

[0045] Furthermore, it also includes a first three-way valve 2, a spare tank 4, a blower 5, a first air inlet valve 11, a first air outlet valve 12, a second air inlet valve 41, and a second air outlet valve 42. The air outlet of the first three-way valve 2 is connected to the first air inlet valve 11 and the second air inlet valve 41 through pipes. The first air inlet valve 11 is connected to the air inlet of the air collection tank 1. The air outlet of the air collection tank 1 is connected to the first air outlet valve 12. The second air inlet valve 41 is connected to the air inlet of the spare tank 4. The air outlet of the spare tank 4 is connected to the second air outlet valve 42. The first air outlet valve 12 and the second air outlet valve 42 are connected to the air inlet of the blower 5 through pipes. The spare tank 4 is filled with adsorbent particles.

[0046] Preferably, the spare tank 4 is fixedly and detachably provided with two mesh plates 43, with the adsorbed particles located between the two mesh plates 43.

[0047] Preferably, the first three-way valve 2 is a T-type three-way pneumatic valve.

[0048] Furthermore, it also includes a gas collection tank 1 connected to a first three-way valve 2 via a pipe.

[0049] Furthermore, the barrel body 13 is fixedly provided with an observation window 17, which is located between the two layers of blades of the spiral plate 6. The observation window 17 allows the staff to directly observe the height of the adsorbed particles in the adsorption barrel 3.

[0050] Furthermore, the adsorbent particles are activated carbon particles. Preferably, the activated carbon particles are soaked in a solution that can chemically react with the waste gas.

[0051] Furthermore, it also includes an external casing 100, in which the adsorption tank 3 and the spare tank 4 are located and fixed to the external casing 100 and detachably connected. A caster wheel is provided below the adsorption tank 3. The external casing 100 serves to protect the internal components. The caster wheel facilitates the movement of the adsorption tank 3 and raises the lower flange plate 15, providing sufficient space for the container or the pipes connecting to the container.

[0052] During normal operation, blower 5 operates, the first inlet valve 11 and the first outlet valve 12 are open, and the second inlet valve 41 and the second outlet valve 42 are closed. Waste gas enters the adsorption tank 3 from the gas collection tank 1 via the first three-way valve 2. After passing through the holes in the barrier mesh 19, the waste gas comes into contact with the adsorption particles filling the spaces between the blades of the spiral plate 6. The adsorption particles adsorb the waste gas and react chemically with it. The harmlessly treated waste gas is then driven by blower 5 and discharged from the outlet of blower 5.

[0053] When the adsorption tank 3 becomes saturated with internally adsorbed particles, the first inlet valve 11 and the first outlet valve 12 are closed, and the second inlet valve 41 and the second outlet valve 42 are opened, using the adsorbed particles in the spare tank 4 for waste gas treatment. At this time, the adsorbed particles in the adsorption tank 3 can be replaced.

[0054] When replacing the adsorbent particles, place the container below and connect it to valve 10, and open valve 10. The adsorbent particles slide downwards along the spiral plate 6 under gravity, falling into the funnel 18, then through the outlet into valve 10, and finally falling from valve 10 into the container. During the downward movement of the adsorbent particles, multiple vertical observation windows 17 can be observed. When the uppermost layer of adsorbent particles reaches the designated observation window 17, close valve 10.

[0055] As the adsorbent particles slide down, the moving adsorbent particles come into contact with and rub against the spiral plate 6 and the inner wall of the barrel 13, which can remove the waste gas deposits attached to the spiral plate 6 and the barrel 13, reducing the number of times the adsorption barrel 3 needs to be cleaned.

[0056] Next, new adsorbent particles are loaded. The sealing plug 16 is opened, and new adsorbent particles are loaded through the sealing plug 16. The new adsorbent particles slide down the spiral plate 6 from top to bottom until the spiral plate 6 is filled. Then the sealing plug 16 is closed, completing the loading operation of the adsorption cylinder 3.

[0057] After repeated filling, the adsorption tank 3 needs to be cleaned. At this time, the adsorption tank 3 can be removed, or the spare tank 4 can be used without removal. Open the sealing cover 72 and use a tool to rotate the inner tube 8, connecting the external through hole 70 and the internal through hole 80, which are not connected during normal operation. Fix and connect the center rod 7 to the water pipe, and introduce high-pressure water into the water pipe. The high-pressure water jet is sprayed outward through the inner tube 8, the internal through hole 80, and the external through hole 70, rinsing the spiral plate 6 and the tank body 13 to remove stubborn deposits. The rinsed wastewater is continuously discharged through valve 10 to prevent water accumulation in the adsorption tank 3, which weakens the impact force of the water jet.

[0058] During drying, natural evaporation is possible. The water pipe at the top of the central rod 7 is replaced with the outlet pipe of a hot air blower, and a gas adsorption device is connected to valve 10. Once the adsorption cylinder is completely dry, the valve is closed, and new adsorption particles are loaded into the feed inlet. Finally, the feed inlet is sealed with the sealing plug 16.

[0059] The present invention has been described above by way of example, but the present invention is not limited to the specific embodiments described above. Any modifications or variations made based on the present invention shall fall within the scope of protection claimed by the present invention.

Claims

1. A semiconductor waste gas treatment device, characterized in that, include: An adsorption tank (3) and a spiral plate (6) are provided. The spiral plate (6) is located inside the adsorption tank (3) and is fixed in position to the adsorption tank (3). An air outlet and an air inlet are formed at the upper and lower ends of the adsorption tank (3). Adsorption particles are filled between the spiral plate (6) and the adsorption tank (3). An inlet and an outlet are formed at the upper and lower ends of the adsorption tank (3). The inlet and outlet are connected to a sealing device for sealing.

2. The semiconductor waste gas treatment device according to claim 1, characterized in that: The adsorption tank (3) includes a tank body (13), an upper flange plate (14) and a lower flange plate (15). The upper and lower ends of the tank body (13) are fixed and detachably connected to the upper flange plate (14) and the lower flange plate (15) respectively. The outer side of the spiral plate (6) is in contact with the tank body (13) or there is a gap that prevents adsorbed particles from passing through.

3. The semiconductor waste gas treatment device according to claim 2, characterized in that: It also includes a valve (10) and a sealing plug (16). The feed port is located on the upper flange plate (14). The sealing plug (16) is fixed to the feed port and detachably connected. The discharge port is located on the lower flange plate (15). The valve (10) is connected to the discharge port. The valve (10) is fixedly connected to the lower flange plate (15).

4. The semiconductor waste gas treatment device according to claim 1, characterized in that: It also includes a funnel (18) and a barrier net (19). The funnel (18) is located below the lower end of the spiral plate (6). The lower end of the funnel (18) is connected to the discharge port. The barrier net (19) is located above the side of the funnel (18) away from the lower end of the spiral plate (6). The barrier net (19) is fixedly connected to the lower end of the spiral plate (6) or the funnel (18). The barrier net (19) is used to block and adsorb particles.

5. The semiconductor waste gas treatment device according to claim 1, characterized in that: It also includes a central rod (7), the inner side of the spiral plate (6) is fixedly connected to the central rod (7), and the central rod (7) is fixedly and detachably connected to the adsorption bucket (3).

6. The semiconductor waste gas treatment device according to claim 5, characterized in that: It also includes an inner tube (8), a hollow rod with an opening above the central rod (7), the inner tube (8) is located in the central rod (7), the inner tube (8) is rotatably connected to the central rod (7), the outer side of the inner tube (8) is in contact with the inner side of the central rod (7), the central rod (7) has a radial outer through hole (70), the inner tube (8) has a radial inner through hole (80), and the outer through hole (70) and the inner through hole (80) correspond one-to-one; It also includes a sealing cap (72), which is fixed to and detachably connected to the upper end of the center rod (7).

7. The semiconductor waste gas treatment device according to claim 5, characterized in that: A flange (71) is formed on the upper part of the central rod (7), and the flange (71) is attached to the inner wall of the upper end of the upper adsorption tank (3).

8. The semiconductor waste gas treatment device according to claim 1, characterized in that: It also includes a first three-way valve (2), a spare tank (4), a blower (5), a first air inlet valve (11), a first air outlet valve (12), a second air inlet valve (41), and a second air outlet valve (42). The outlet of the first three-way valve (2) is connected to the first air inlet valve (11) and the second air inlet valve (41) through pipes. The first air inlet valve (11) is connected to the air inlet of the gas collection tank (1). The air outlet of the gas collection tank (1) is connected to the first air outlet valve (12). The second air inlet valve (41) is connected to the air inlet of the spare tank (4). The air outlet of the spare tank (4) is connected to the second air outlet valve (42). The first air outlet valve (12) and the second air outlet valve (42) are connected to the air inlet of the blower (5) through pipes. The spare tank (4) is filled with adsorbent particles.

9. A semiconductor waste gas treatment device according to claim 2, characterized in that: The barrel body (13) is fixedly provided with an observation window (17), which is located between two layers of blades of the spiral plate (6).

10. A semiconductor waste gas treatment device according to claim 8, characterized in that: It also includes an external casing (100), the adsorption bucket (3) and the spare bucket (4) are located in the external casing (100) and are fixed to and detachably connected to the external casing (100), and a caster wheel is provided below the adsorption bucket (3).

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