Wafer whirl coating device for chip processing

Abstract

The utility model discloses a wafer whirl coating device for chip processing, which relates to the technical field of wafer whirl coating technical equipment and comprises a mounting frame, a mounting plate and a glue dripping device are arranged on the mounting frame through an electric push rod, a turntable is further rotatably arranged on the mounting frame, and a limiting plate is arranged on the turntable through a sliding plate. A plurality of second screws are further evenly and rotationally arranged in the rotating disc, the second screws penetrate through the sliding plate and are in threaded connection with the sliding plate, a first bevel gear is arranged in the rotating disc through a mounting shaft, and second bevel gears are arranged on the second screws through key connection. Under the action of the electric push rod, the distance between the glue dripping device and the wafer can be accurately controlled, so that the photoresist can be uniformly dripped on the surface of the wafer, meanwhile, the wafer can rotate in the glue spinning process due to the arrangement of the turntable, the uniformity of the photoresist is further improved, and in addition, by adjusting the limiting plate on the sliding plate, the photoresist can be uniformly dripped on the wafer. The device can adapt to wafers of different sizes, and the applicability of the device is improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to wafer glue throwing technical equipment technical field, specifically a kind of wafer glue throwing device for chip processing. BACKGROUND

[0002] In the semiconductor chip manufacturing process, wafer glue throwing is a crucial step, which directly affects the quality and performance of chip. Wafer glue throwing refers to the process of uniformly coating photoresist on the surface of wafer, which requires extremely high precision and uniformity.

[0003] However, the traditional wafer glue throwing device has certain deficiencies in wafer fixing, photoresist dropping and glue throwing uniformity, etc. The fixing method of wafer during glue throwing directly affects the uniformity and precision of glue throwing. Traditional fixing methods often use simple clamps or suction devices. These methods are difficult to ensure the stability and position accuracy of wafer when the size or shape of wafer changes, thereby affecting the glue throwing effect. Secondly, the dropping method and amount of photoresist are also key factors affecting the quality of glue throwing. Traditional glue dropping devices often use fixed glue dropping heads and glue dropping amounts, which are difficult to adapt to different process requirements and changes in wafer size, leading to uneven distribution of photoresist on the wafer surface and affecting subsequent processes. Therefore, we propose a wafer glue throwing device for chip processing. SUMMARY

[0004] The purpose of the utility model is to provide a wafer glue throwing device for chip processing to solve the problems raised in the background art.

[0005] To achieve the above-mentioned purpose, the utility model provides the following technical scheme:

[0006] A wafer glue throwing device for chip processing, comprising a mounting frame, a plurality of electric push rods are uniformly arranged on the upper inner wall of the mounting frame, a mounting plate is arranged at the end of the telescopic arm of the electric push rod, a glue dropping device is arranged on the mounting plate, a turntable is further rotatably arranged on the mounting frame, a sliding plate is slidably arranged on the turntable, a limiting plate is arranged on the sliding plate, a plurality of second screws are further uniformly rotatably arranged in the turntable, the second screws penetrate through the sliding plate and are threadedly connected with the sliding plate, an installation shaft is further rotatably arranged in the turntable, a first bevel gear is arranged on the installation shaft through key connection, a second bevel gear is arranged on the second screw through key connection, and the second bevel gear and the first bevel gear are intermeshed.

[0007] As a further scheme of the utility model, a worm wheel is further arranged on the installation shaft through key connection, and a worm is further rotatably arranged on the turntable, and the worm and the worm wheel are intermeshed.

[0008] As a further scheme of the utility model, a sliding block is further slidably arranged on the mounting plate through a sliding groove, and a scraper is arranged at the bottom of the sliding block.

[0009] As a further scheme of the utility model: first screw rod is rotationally arranged in the chute, and the first screw rod penetrates the sliding block and is threadedly connected with the sliding block.

[0010] As a further scheme of the utility model: a first motor is further arranged on the outer wall of the mounting plate, and a power output shaft of the first motor is connected with the first screw rod through a shaft coupling.

[0011] As a further scheme of the utility model: a second motor is further arranged on the outer wall of the rotating disc, and a power output shaft of the second motor is connected with the worm through a shaft coupling.

[0012] Compared with the prior art, the utility model has the beneficial effects as follows:

[0013] 1. The distance between the glue dropping device and the wafer can be accurately controlled through the telescopic movement of the electric push rod, so that the photoresist can be uniformly dropped on the wafer surface, and meanwhile, the setting of the rotating disc enables the wafer to rotate during the glue dropping process, and the uniformity of the photoresist is further improved in cooperation with the scraper, and in addition, the limiting plate on the sliding plate can be adjusted to adapt to wafers of different sizes, and the applicability of the device is improved.

[0014] 2. The worm and gear mechanism has a self-locking function, can ensure that the wafer does not displace during the glue dropping process, guarantees the precision and stability of the glue dropping, and meanwhile, the position of the sliding plate can be conveniently adjusted through the meshing of the first bevel gear and the second bevel gear, so that the wafer is clamped and fixed, the reliability and stability of the device are improved, the operation difficulty is reduced, and the work efficiency is improved. BRIEF DESCRIPTION OF DRAWINGS

[0015] Fig. 1 It is a structural schematic view of the utility model embodiment.

[0016] Fig. 2 It is a structural schematic view of the mounting plate in the utility model embodiment.

[0017] Fig. 3 It is a structural schematic view of the inside of the rotating disc in the utility model embodiment.

[0018] Legend of reference numerals: 1, mounting frame; 2, electric push rod; 3, mounting plate; 4, glue dropping device; 5, sliding block; 6, scraper; 7, first screw rod; 701, first motor; 8, rotating disc; 9, sliding plate; 10, limiting plate; 11, mounting shaft; 12, first bevel gear; 13, second screw rod; 14, second bevel gear; 15, worm gear; 16, worm; 1601, second motor. DETAILED DESCRIPTION

[0019] The utility model will be combined with the drawings detailed below, in the drawing or specification, similar or same part uses same mark, and in practical application, the shape, thickness or height of each component can be enlarged or reduced. The utility model lists each embodiment only for describing the utility model, and is not used to limit the scope of the utility model. Any obvious modification or change made to the utility model does not deviate from the spirit and scope of the utility model.

[0020] Embodiment

[0021] Please refer to Figs. 1-3 In the utility model embodiment, a wafer glue throwing device for chip processing, including mounting bracket 1, the mounting bracket 1 top inner wall is evenly provided with a plurality of electric push rod 2, electric push rod 2 bottom telescopic arm end is provided with mounting plate 3, is provided with glue dropping device 4 on mounting plate 3, at this time under the action of glue dropping device 4, subsequent glue throwing work can be carried out.

[0022] Mounting bracket 1 still rotationally arranged with carousel 8, the carousel 8 is slidably provided with sliding plate 9, and the sliding plate 9 is provided with limit plate 10, at this time under the action of limit plate 10, wafer can be clamped and fixed, and the clamping and fixing demand for different size wafers can also be met, thereby the applicability of the device is improved to a certain extent, the carousel 8 is also evenly rotationally arranged with a plurality of second screw rods 13 in the inside, the second screw rod 13 is threadedly connected with the sliding plate 9 and penetrates the sliding plate 9, at this time, rotating the second screw rod 13 can drive the sliding plate 9 to move, so that the limit plate 10 can clamp and fix the wafer.

[0023] The carousel 8 is also rotationally arranged with mounting shaft 11 in the inside, the mounting shaft 11 is rotationally arranged with first bevel gear 12 on the carousel 8, the second screw rod 13 is rotationally arranged with second bevel gear 14 on the carousel 8, the second bevel gear 14 is meshed with the first bevel gear 12, at this time, rotating the mounting shaft 11 can drive the second screw rod 13 to rotate through the first bevel gear 12 and the second bevel gear 14, so as to adjust the position of the limit plate 10, so that the limit plate 10 can better clamp and fix the wafer, the mounting shaft 11 is also rotationally arranged with worm gear 15 on the carousel 8, the carousel 8 is also rotationally arranged with worm 16 on the carousel 8, the worm 16 is meshed with the worm gear 15, at this time, rotating the worm 16 can drive the mounting shaft 11 to rotate through the worm gear 15, so as to adjust the limit plate 10, at this time, because the worm gear 15 and the worm 16 have self-locking function, the position of the limit plate 10 after adjustment can be limited, so as to ensure the clamping and fixing quality of the limit plate 10 for the wafer, the carousel 8 is also provided with second motor 1601 on the outer wall, the power output shaft of the second motor 1601 is connected with the worm 16 through a coupling, at this time, the second motor 1601 can drive the worm 16 to rotate.

[0024] The mounting plate 3 is further provided with a sliding block 5 through a sliding groove, and the bottom of the sliding block 5 is provided with a scraper 6, so that the photoresist can be better wiped evenly under the action of the scraper 6 and the rotating disc 8, thereby improving the use efficiency of the photoresist wiping device to a certain extent; the first screw rod 7 is further rotatably arranged in the sliding groove, penetrates through the sliding block 5 and is threadedly connected with the sliding block 5, so that the scraper 6 can be driven to move by rotating the first screw rod 7, thereby adjusting the position of the scraper 6, so as to ensure the photoresist dripping quality of the photoresist dripping device 4; the first motor 701 is further arranged on the outer wall of the mounting plate 3, and the power output shaft of the first motor 701 is connected with the first screw rod 7 through a shaft coupling, so that the first screw rod 7 can be driven to rotate by the first motor 701.

[0025] In actual use, the wafer is placed on the rotating disc 8, and the position of the limiting plate 10 is adjusted by rotating the worm 16 (meshing with the worm wheel 15 and driven by the second motor 1601), the rotation of the worm 16 drives the mounting shaft 11 to rotate through the worm wheel 15, and then the second screw rod 13 is driven to rotate through the meshing of the first bevel gear 12 and the second bevel gear 14, the sliding plate 9 is driven to slide, and finally the position of the limiting plate 10 is adjusted to clamp and fix the wafer, and the stability of the position of the limiting plate 10 is ensured due to the self-locking function of the worm wheel 15 and the worm 16; the electric push rod 2 is started, and the mounting plate 3 at the end of the telescopic arm is lowered to a proper position, at this time, the photoresist dripping device 4 starts to work, the photoresist is dripped on the wafer, the first screw rod 7 is driven to rotate by the first motor 701, the sliding block 5 is driven to move in the sliding groove through the threaded connection, and then the position of the scraper 6 is adjusted, the scraper 6 contacts the wafer and wipes the photoresist evenly in the rotating process of the rotating disc 8, and the photoresist is ensured to be evenly covered on the surface of the wafer.

[0026] It is apparent for those skilled in the art that the present application is not limited to the details of the above exemplary embodiments, and can be implemented in other specific forms without departing from the spirit or essential characteristics of the present application. Therefore, the embodiments should be regarded as exemplary and non-limiting, and the scope of the present application is defined by the appended claims rather than the above description, and all changes falling within the meaning and range of equivalent elements of the claims are intended to be embraced in the present application. Any reference signs in the claims should not be regarded as limiting the claims to which they relate.

[0027] In addition, it should be understood that although the present specification is described in terms of embodiments, not every embodiment contains only one independent technical solution, and the description manner of the specification is only for the sake of clarity, and those skilled in the art should regard the specification as a whole, and the technical solutions in each embodiment can be properly combined to form other embodiments which can be understood by those skilled in the art.

Claims

1. A wafer spin coating apparatus for chip processing, comprising a mounting frame (1), characterized in that, Several electric push rods (2) are evenly arranged on the inner wall above the mounting frame (1). An installation plate (3) is provided at the end of the telescopic arm at the bottom of the electric push rod (2). An adhesive dispensing device (4) is provided on the installation plate (3). A turntable (8) is also rotatably arranged on the mounting frame (1). A sliding plate (9) is slidably arranged on the turntable (8). A limit plate (10) is provided on the sliding plate (9). Several second screws (13) are evenly rotatably arranged inside the turntable (8). The second screws (13) pass through the sliding plate (9) and are threadedly connected to the sliding plate (9). An installation shaft (11) is also rotatably arranged inside the turntable (8). A first bevel gear (12) is connected to the installation shaft (11) by a key. A second bevel gear (14) is connected to the second screw (13) by a key. The second bevel gear (14) meshes with the first bevel gear (12).

2. The wafer spin coating apparatus for chip processing according to claim 1, characterized in that, A worm gear (15) is also connected to the mounting shaft (11) by a key, and a worm (16) is also rotatably mounted on the turntable (8), with the worm (16) meshing with the worm gear (15).

3. The wafer spin coating apparatus for chip processing according to claim 1, characterized in that, The mounting plate (3) is also provided with a slider (5) via a sliding groove, and a scraper (6) is provided at the bottom of the slider (5).

4. The wafer spin coating apparatus for chip processing according to claim 3, characterized in that, A first screw (7) is rotatably disposed in the groove, the first screw (7) passes through the slider (5) and is threadedly connected to the slider (5).

5. The wafer spin coating apparatus for chip processing according to claim 3, characterized in that, The mounting plate (3) is also provided with a first motor (701) on its outer wall. The power output shaft of the first motor (701) is connected to the first screw (7) through a coupling.

6. The wafer spin coating apparatus for chip processing according to claim 2, characterized in that, A second motor (1601) is also provided on the outer wall of the turntable (8), and the power output shaft of the second motor (1601) is connected to the worm gear (16) through a coupling.

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