Water recycling system

Abstract

The utility model relates to the field of solar cells, and particularly discloses a water recycling system, which comprises a pure water preparation mechanism used for providing pure water; the silicon wafer cleaning mechanism is connected with the pure water preparation mechanism and used for receiving the pure water from the pure water preparation mechanism, and the silicon wafer cleaning mechanism is further used for cleaning the silicon wafer through the pure water and generating first treatment liquid; the carrier boat cleaning mechanism is connected with the silicon wafer cleaning mechanism and used for receiving the first treating fluid from the silicon wafer cleaning mechanism, and the carrier boat cleaning mechanism is further used for cleaning the carrier boat through the first treating fluid and generating second treating fluid; and the recycling mechanism is used for collecting the first treating fluid or the second treating fluid. According to the water recycling system, the dependence of the cleaning procedure on pure water can be reduced, the cleaning quality can be guaranteed, and efficient utilization of water resources is achieved.

Description

TECHNICAL FIELD

[0001] The utility model relates to the field of solar cell, especially to a water recycling system. BACKGROUND

[0002] In the solar cell production process, it involves multiple cleaning procedures, and the water used in these procedures is mostly pure water, which consumes a large amount of pure water, resulting in significant waste of water resources, which is a problem that needs to be solved. UTILITY MODEL CONTENT

[0003] In order to reduce the dependence of cleaning procedures on pure water while ensuring cleaning quality, the utility model embodiment discloses a water recycling system.

[0004] A water recycling system comprises:

[0005] A pure water preparation mechanism for providing pure water;

[0006] A silicon wafer cleaning mechanism connected to the pure water preparation mechanism for receiving the pure water from the pure water preparation mechanism, the silicon wafer cleaning mechanism further being configured to clean silicon wafers with the pure water and generate a first treatment liquid;

[0007] A boat cleaning mechanism connected to the silicon wafer cleaning mechanism for receiving the first treatment liquid from the silicon wafer cleaning mechanism, the boat cleaning mechanism further being configured to clean boats with the first treatment liquid and generate a second treatment liquid;

[0008] A recycling mechanism for collecting the first treatment liquid or the second treatment liquid.

[0009] As an optional implementation, in the utility model embodiment, the silicon wafer cleaning mechanism comprises at least:

[0010] An alkaline cleaning part for performing alkaline cleaning treatment on the silicon wafers;

[0011] An acid cleaning part for cleaning the silicon wafers treated by the alkaline cleaning part;

[0012] A slow lifting part for cleaning the silicon wafers treated by the acid cleaning part;

[0013] The slow lifting part is connected to the pure water preparation mechanism.

[0014] As an optional implementation, in the utility model embodiment, the silicon wafer cleaning mechanism comprises at least:

[0015] The silicon wafer cleaning mechanism has function grooves and water grooves arranged at intervals;

[0016] The alkali washing part comprises at least a first water tank and an alkali washing functional tank arranged in sequence.

[0017] The acid washing part comprises at least a second water tank and an acid washing functional tank arranged in sequence.

[0018] The slow lifting part comprises at least a third water tank and a slow lifting tank arranged in sequence.

[0019] The slow lifting tank, the third water tank, the second water tank and the first water tank are sequentially communicated, so that the first treatment liquid sequentially flows among the slow lifting tank, the third water tank, the second water tank and the first water tank.

[0020] As an optional embodiment, in the embodiment of the utility model, the slow lifting tank, the third water tank, the second water tank and the first water tank are communicated through connecting pipes;

[0021] The connecting pipes are provided with limiting valves, and the limiting valves are used for limiting the one-way flow of the first treatment liquid from the slow lifting tank to the third water tank, the second water tank and the first water tank.

[0022] As an optional embodiment, in the embodiment of the utility model, the slow lifting tank, the third water tank, the second water tank and the first water tank are communicated through connecting pipes;

[0023] As an optional embodiment, in the embodiment of the utility model, the sub tanks are provided with conductivity detection devices.

[0024] The connecting pipes connected with the sub tanks are three-way connecting pipes.

[0025] As an optional embodiment, in the embodiment of the utility model, the silicon wafer cleaning mechanism comprises one or a combination of multiple kinds of the following mechanisms: a texturing cleaning mechanism, an alkali throwing cleaning mechanism or an RCA cleaning mechanism.

[0026] The texturing cleaning mechanism comprises:

[0027] A first pre-cleaning part is used for pre-cleaning the silicon wafer.

[0028] A texturing part is used for texturing the silicon wafer treated by the first pre-cleaning part.

[0029] A group of alkali washing parts.

[0030] A group of acid washing parts.

[0031] the slow lifting part;

[0032] the alkali-throwing cleaning mechanism comprises:

[0033] a second pre-cleaning part for pre-cleaning the silicon wafer;

[0034] a first alkali-throwing part for first alkali-throwing treatment of the silicon wafer treated by the second pre-cleaning part;

[0035] three groups of the alkali-washing parts;

[0036] one group of the acid-washing parts;

[0037] the slow lifting part;

[0038] the RCA cleaning mechanism comprises:

[0039] a third pre-cleaning part for pre-cleaning the silicon wafer;

[0040] a second alkali-throwing part for second alkali-throwing treatment of the silicon wafer treated by the third pre-cleaning part;

[0041] one group of the alkali-washing parts;

[0042] three groups of the acid-washing parts;

[0043] the slow lifting part.

[0044] As an optional implementation, in the embodiment of the utility model, the wafering cleaning mechanism comprises:

[0045] the wafering part comprises at least a fourth water tank and a wafering tank arranged in sequence, and the fourth water tank is communicated with the first water tank through a connecting pipe;

[0046] the alkali-throwing cleaning mechanism comprises:

[0047] the first alkali-throwing part comprises at least a fifth water tank and a first alkali-throwing tank arranged in sequence, and the fifth water tank is communicated with the adjacent first water tank through a connecting pipe;

[0048] and the adjacent first water tanks in the three groups of alkali-washing parts are communicated;

[0049] the RCA cleaning mechanism comprises:

[0050] the second alkali-throwing part comprises at least a sixth water tank and a second alkali-throwing tank arranged in sequence, and the sixth water tank is communicated with the first water tank through a connecting pipe;

[0051] and the adjacent second water tanks in the three groups of acid-washing parts are communicated.

[0052] As an optional implementation, in the embodiment of the utility model, the boat cleaning mechanism includes several acid washing tanks, spray water tanks and several water washing tanks arranged in sequence;

[0053] The water washing tank at the end is communicated with the silicon wafer cleaning mechanism, the adjacent several water washing tanks are communicated, and the spray water tank is communicated with the adjacent water washing tank.

[0054] As an optional implementation, in the embodiment of the utility model, the silicon wafer cleaning mechanism and the boat cleaning mechanism are further provided with a recycled water collecting pool for collecting the first treatment liquid from the silicon wafer cleaning mechanism, the recycled water collecting pool is communicated with the water washing tank at the end;

[0055] And / or,

[0056] The boat cleaning mechanism is further connected with a tail gas treatment washing tower, the tail gas treatment washing tower is communicated with the spray water tank, and the tail gas treatment tower is used for treating tail gas by the second treatment liquid and generating waste liquid;

[0057] The recycling mechanism is connected with the tail gas treatment washing tower to collect the waste liquid from the tail gas treatment washing tower;

[0058] And / or,

[0059] A drying chamber is arranged in the silicon wafer cleaning mechanism or the boat cleaning mechanism for drying the cleaned silicon wafer or boat.

[0060] Compared with the prior art, the utility model has the beneficial effects that:

[0061] The water recycling system provided by the embodiment of the utility model ingeniously connects the pure water preparation mechanism, the silicon wafer cleaning mechanism and the boat cleaning mechanism in sequence according to the different cleanliness requirements of different processes such as cleaning silicon wafer and boat, so that the pure water preparation, silicon wafer cleaning and boat cleaning are connected in series, which not only greatly improves the use efficiency of water resources, but also ensures the high-quality cleaning of silicon wafer by using the pure water provided by the pure water preparation mechanism in the silicon wafer cleaning mechanism. BRIEF DESCRIPTION OF DRAWINGS

[0062] In order to more clearly illustrate the technical scheme in the embodiments of the present application, the drawings used in the embodiments will be briefly introduced as follows. Obviously, the drawings described in the following embodiments are only some of the embodiments of the present application, and not all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor are within the scope of protection of the present application.

[0063] Figure 1 is a flow diagram of the water recycling system disclosed in the embodiments of the present application.

[0064] Figure 2 is a flow diagram of the etching cleaning mechanism, alkali etching cleaning mechanism and RCA cleaning mechanism disclosed in the embodiments of the present application.

[0065] Icon: 100, pure water preparation mechanism;

[0066] 200, silicon wafer cleaning mechanism; 1, etching cleaning mechanism; 11, alkali cleaning part; 111, first water tank; 112, alkali cleaning functional tank; 12, acid cleaning part; 121, second water tank; 122, acid cleaning functional tank; 13, slow lifting part; 131, third water tank; 132, slow lifting tank; 14, connecting pipe; 15, auxiliary tank; 16, first pre-cleaning part; 17, etching part; 171, fourth water tank; 172, etching tank; 2, alkali etching cleaning mechanism; 21, second pre-cleaning part; 22, first alkali etching part; 221, fifth water tank; 222, first alkali etching tank; 3, RCA cleaning mechanism; 31, third pre-cleaning part; 32, second alkali etching part; 321, sixth water tank; 322, second alkali etching tank;

[0067] 300, boat cleaning mechanism; 10, acid cleaning tank; 20, spraying water tank; 30, water washing tank;

[0068] 400, recovery mechanism;

[0069] 500, recycled water collection pool;

[0070] 600, tail gas treatment washing tower;

[0071] 700, drying chamber. DETAILED DESCRIPTION

[0072] The technical scheme in the embodiments of the present application will be described clearly and completely in combination with the drawings in the embodiments of the present application. Obviously, the described embodiments are only some of the embodiments of the present application, and not all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor are within the scope of protection of the present application.

[0073] In the utility model, the terms "upper", "lower", "left", "right", "front", "back", "top", "bottom", "inner", "outer", "middle", "vertical", "horizontal", "transverse", "longitudinal" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings. These terms are mainly used for better describing the utility model and its embodiments, and are not used to limit the indicated devices, elements or components to have a specific orientation, or to be constructed and operated in a specific orientation.

[0074] In addition to indicating the orientation or positional relationship, the above-mentioned terms can also be used to indicate other meanings, for example, the term "upper" can also be used to indicate a certain dependent relationship or connection relationship in some cases. For ordinary skilled persons in the art, the specific meanings of these terms in the utility model can be understood according to the specific circumstances.

[0075] In addition, the terms "mount", "set", "provided with", "connect", "connected" should be understood broadly. For example, it can be fixedly connected, detachably connected, or integrally constructed; it can be mechanically connected, or electrically connected; it can be directly connected, or indirectly connected through an intermediate medium, or the internal communication between two devices, elements or components. For ordinary skilled persons in the art, the specific meanings of the above-mentioned terms in the utility model can be understood according to the specific circumstances.

[0076] In addition, the terms "first", "second" and the like are mainly used to distinguish different devices, elements or components (the specific types and structures can be the same or different), and are not used to indicate or imply the relative importance and quantity of the indicated devices, elements or components. Unless otherwise stated, the meaning of "multiple" is two or more.

[0077] The technical solutions of the utility model will be further described below in combination with embodiments and drawings.

[0078] Referring to Figure 1 A water recycling system comprises:

[0079] A pure water preparation mechanism 100 is configured to provide pure water.

[0080] A silicon wafer cleaning mechanism 200 is connected to the pure water preparation mechanism 100 and configured to receive the pure water from the pure water preparation mechanism 100. The silicon wafer cleaning mechanism 200 is further configured to clean the silicon wafer by using the pure water and generate a first treatment liquid.

[0081] A boat cleaning mechanism 300 is connected to the silicon wafer cleaning mechanism 200 and configured to receive the first treatment liquid from the silicon wafer cleaning mechanism 200. The boat cleaning mechanism 300 is further configured to clean the boat by using the first treatment liquid and generate a second treatment liquid.

[0082] A recovery mechanism 400 is configured to collect the first treatment liquid or the second treatment liquid.

[0083] The utility model provides a kind of water recycling system, utilize the different process such as cleaning silicon wafer, boat and different water cleanliness requirement, pure water preparation mechanism 100, silicon wafer cleaning mechanism 200, boat cleaning mechanism 300 are sequentially connected cleverly, to make pure water preparation, silicon wafer cleaning and boat cleaning link in series, not only greatly improve the use efficiency of water resources, and first pure water provided by pure water preparation mechanism 100 is used in silicon wafer cleaning mechanism 200, ensure the high-quality cleaning of silicon wafer.Simultaneously, the first treatment liquid used in silicon wafer cleaning is used in boat cleaning again, realize the reasonable reuse of water resources, effectively reduce production cost.This improvement significantly reduces the dependence on fresh pure water, and reduces waste liquid discharge, provides strong support for the sustainable development of solar cell production industry.

[0084] It should be noted that the silicon wafer in the utility model not only covers the original silicon wafer, but also includes the intermediate product form plated with a specific functional film layer on the silicon wafer after processing. That is, the silicon wafer at any processing stage is covered within the scope of the utility model.

[0085] Referring to Figure 2 In some embodiments, the silicon wafer cleaning mechanism 200 at least includes:

[0086] An alkali washing part 11 is configured to perform alkali washing treatment on the silicon wafer.

[0087] An acid washing part 12 is configured to clean the silicon wafer treated by the alkali washing part 11.

[0088] A slow lifting part 13 is configured to clean the silicon wafer treated by the acid washing part 12.

[0089] The slow lifting part 13 is connected to the pure water preparation mechanism 100.

[0090] The embodiment realizes multi-step deep cleaning of the silicon wafer through the continuous treatment of the alkali washing, the acid washing and the slow lifting part 13. It is particularly important that the pure water is first connected to the slow lifting part 13. This design fully considers that the slow lifting is the last process of silicon wafer cleaning and has the highest requirement for water quality. Therefore, such connection setting not only ensures that the water source used by the slow lifting part 13 is the purest, avoids secondary pollution, but also further ensures the final cleaning quality of the silicon wafer.

[0091] Referring to Figure 2 Further, in some embodiments, the silicon wafer cleaning mechanism 200 has function grooves and water grooves arranged at intervals.

[0092] The alkali washing part 11 at least includes a first water groove 111 and an alkali washing function groove 112 arranged in sequence.

[0093] The acid washing part 12 at least comprises a second water tank 121 and an acid washing functional tank 122 arranged in sequence;

[0094] The slow lifting part 13 at least comprises a third water tank 131 and a slow lifting tank 132 arranged in sequence;

[0095] The slow lifting tank 132, the third water tank 131, the second water tank 121 and the first water tank 111 are communicated in sequence, so as to make the first treatment liquid flow in sequence among the slow lifting tank 132, the third water tank 131, the second water tank 121 and the first water tank 111.

[0096] The predetermined steps of the silicon wafer cleaning are alkaline washing, acid washing and slow lifting, and drying is performed after the cleaning is completed. The above-mentioned alkaline washing part 11, acid washing part 12 and slow lifting part 13 each comprise at least one functional tank and one preposed water tank. In the cleaning process of the alkaline washing part 11, the first water tank 111 is passed first, and then the alkaline washing functional tank 112 is entered. In the cleaning process of the acid washing part 12, the second water tank 121 is passed first, and then the acid washing functional tank 122 is entered. In the cleaning process of the slow lifting part 13, the third water tank 131 is passed first, and then the slow lifting tank 132 is entered. The water tank arranged before the functional tank can effectively reduce the influence of the residual functional liquid left by the previous step, thereby reducing the chemical interference between different cleaning stages and ensuring the high efficiency of the silicon wafer cleaning process.

[0097] More importantly, the slow lifting tank 132, the third water tank 131, the second water tank 121 and the first water tank 111 are communicated in sequence, so as to control the flow direction of the first treatment liquid to be opposite to the cleaning direction of the silicon wafer. This not only realizes the recycling of the first treatment liquid and significantly reduces the demand amount of pure water, but also ingeniously utilizes the natural law of acid-base neutralization. Specifically, after the treatment of the alkaline washing functional tank 112, the alkaline functional liquid attached to the surface of the silicon wafer is brought into the second water tank 121, so that the first treatment liquid in the second water tank 121 presents alkalinity. Similarly, after the treatment of the acid washing functional tank 122, the acidic functional liquid attached to the surface of the silicon wafer is brought into the third water tank 131, so that the first treatment liquid in the third water tank 131 presents acidity. When the acidic first treatment liquid in the third water tank 131 flows into the second water tank 121 and contacts the first treatment liquid with alkalinity in the second water tank 121, the pH value of the second water tank 121 can be effectively balanced through acid-base neutralization, thereby avoiding the problem of alkaline accumulation in the second water tank 121 caused by continuous cleaning, and further improving the cleaning quality of the silicon wafer.

[0098] With reference to Figure 2 In some embodiments, the slow lifting tank 132, the third water tank 131, the second water tank 121 and the first water tank 111 are all communicated through the connecting pipe 14;

[0099] The connecting pipe 14 is provided with a limiting valve (not shown in the figure) for limiting the one-way flow of the first treatment liquid from the slow lifting groove 132 to the third water tank 131, the second water tank 121 and the first water tank 111 in turn.

[0100] By matching the connecting pipe 14 and the limiting valve, the one-way flow path of the first treatment liquid from the slow lifting groove 132 to the third water tank 131, the second water tank 121 and finally to the first water tank 111 is ensured. This makes the cleaning process of the silicon wafer later, the first treatment liquid in the water tank is recycled less times, and the purity is higher, so that the silicon wafer can contact the more pure treatment liquid in the final cleaning stage, effectively improving the cleaning effect and quality.

[0101] Furthermore, the design of one-way flow avoids the backflow of the first treatment liquid. If the first treatment liquid flows freely between the water tanks, the recycling degree of the first treatment liquid in each water tank is difficult to control, which leads to the decrease of the purity of the first treatment liquid in each water tank, and further affects the cleaning quality of the silicon wafer. The limiting valve effectively prevents this situation from happening, ensuring that each water tank can maintain the desired purity and treatment effect.

[0102] Specifically, the limiting valve can be a one-way valve, a pneumatic valve or a manual valve, etc. In the application process, it can be installed according to needs.

[0103] Referring to Figure 2 In some embodiments, a sub-tank 15 is arranged between the adjacent slow lifting groove 132 and water tank, and between the adjacent water tanks, the sub-tank 15 is used for collecting the first treatment liquid, the connecting pipe 14 is communicated with the sub-tank 15, and the limiting valve is arranged on the connecting pipe 14 between the sub-tank 15 and the slow lifting groove 132 and the water tank.

[0104] The above-mentioned sub-tank 15 not only can collect and store the first treatment liquid, but also can give the sub-tank 15 the flexible adjustment ability to the water demand of different water tanks by matching the use of the connecting pipe 14 and the limiting valve. In actual operation, the opening and closing state of the limiting valve can be adjusted according to the water demand of the first treatment liquid in each water tank, and the flow of the first treatment liquid between each sub-tank 15 and each water tank is accurately controlled. This ensures that each water tank can obtain the appropriate first treatment liquid, which not only meets the quality requirements of the silicon wafer cleaning, but also avoids the waste of resources.

[0105] Referring to Figure 2 In some embodiments, an electric conductivity detection device (not shown in the figure) is arranged in the sub-tank 15.

[0106] The connecting pipe 14 connected with the sub-tank 15 is a three-way connecting pipe.

[0107] The conductivity is a key index for evaluating the purity of water quality and whether it meets the use requirements. By arranging the conductivity detection device in the auxiliary groove 15, the real-time and accurate monitoring of the conductivity of the first treatment liquid can be realized, so that the system can instantly master the water quality and accurately judge whether it meets the standard.

[0108] The arrangement of the conductivity, the three-way connecting pipe and the limiting valve makes it possible to automatically adjust the flow path of the treatment liquid according to the water quality monitoring result. When the conductivity detection device finds that the conductivity of the first treatment liquid is too high and does not meet the cleaning standard, the system will quickly respond and accurately control the three-way connecting pipe and the limiting valve to guide the first treatment liquid that does not meet the standard to the boat cleaning mechanism 300 or the recycling mechanism 400, so as to avoid its influence on the cleaning quality of the silicon wafer. On the contrary, if the conductivity of the first treatment liquid is qualified, the system will automatically deliver the first treatment liquid to the corresponding water tank, so as to ensure that each water tank can receive the high-quality first treatment liquid that meets the cleaning requirements.

[0109] Reference Figure 2 In some embodiments, the silicon wafer cleaning mechanism 200 includes one or a combination of the following: a texturing cleaning mechanism 1, an alkali cleaning mechanism 2 or an RCA cleaning (wet chemical cleaning method) mechanism 3.

[0110] The texturing cleaning mechanism 1 includes:

[0111] A first pre-cleaning part 16 for pre-cleaning the silicon wafer;

[0112] A texturing part 17 for texturing the silicon wafer treated by the first pre-cleaning part 16;

[0113] A group of alkali cleaning parts 11;

[0114] A group of acid cleaning parts 12;

[0115] A slow lifting part 13;

[0116] The alkali cleaning mechanism 2 includes:

[0117] A second pre-cleaning part 21 for pre-cleaning the silicon wafer;

[0118] A first alkali cleaning part 22 for first alkali cleaning the silicon wafer treated by the second pre-cleaning part 21;

[0119] Three groups of alkali cleaning parts 11;

[0120] A group of acid cleaning parts 12;

[0121] A slow lifting part 13;

[0122] The RCA cleaning mechanism 3 includes:

[0123] The third pre-cleaning part 31 is used for pre-cleaning treatment of the silicon wafer;

[0124] The second alkali etching part 32 is used for second alkali etching treatment of the silicon wafer treated by the third pre-cleaning part 31;

[0125] The alkali etching part 11;

[0126] The acid etching part 12;

[0127] The slow lifting part 13.

[0128] The silicon wafer cleaning mechanism 200 comprises one or more combinations of the texturing cleaning mechanism 1, the alkali etching cleaning mechanism 2 or the RCA cleaning mechanism 3. The system can provide corresponding cleaning solutions according to different silicon wafer processing requirements. Specifically, the texturing cleaning mechanism 1 realizes the complete process of the silicon wafer from pre-cleaning to texturing treatment through the orderly cooperation of the first pre-cleaning part 16, the texturing part 17, the alkali etching part 11, the acid etching part 12 and the slow lifting part 13, ensuring the uniformity of the silicon wafer surface morphology and the accurate control of the roughness. The alkali etching cleaning mechanism 2 realizes efficient polishing and flattening treatment of the silicon wafer surface through the cooperative cooperation of the second pre-cleaning part 21, the first alkali etching part 22, the three alkali etching parts 11, the one acid etching part 12 and the slow lifting part 13, further improving the surface quality of the silicon wafer. The RCA cleaning mechanism 3 provides more thorough silicon wafer cleaning effect through the cooperative cooperation of the third pre-cleaning part 31, the second alkali etching part 32, the alkali etching part 11, the three acid etching parts 12 and the slow lifting part 13, effectively removing the metal ions and organic matter residues on the surface of the silicon wafer, laying a solid foundation for the subsequent solar cell preparation process.

[0129] Referring to Figure 2 In some embodiments, the texturing cleaning mechanism 1 comprises:

[0130] The texturing part 17 at least comprises a fourth water tank 171 and a texturing tank 172 arranged in sequence, and the fourth water tank 171 is communicated with the first water tank 111 through the connecting pipe 14;

[0131] In the alkali etching cleaning mechanism 2:

[0132] The first alkali etching part 22 at least comprises a fifth water tank 221 and a first alkali etching tank 222 arranged in sequence, and the fifth water tank 221 is communicated with the adjacent first water tank 111 through the connecting pipe 14;

[0133] And the adjacent first water tanks 111 in the three alkali etching parts 11 are communicated;

[0134] In the RCA cleaning mechanism 3:

[0135] The second alkali-removing part 32 comprises at least a sixth water tank 321 and a second alkali-removing tank 322 arranged in sequence, and the sixth water tank 321 is connected with the first water tank 111 through the connecting pipe 14;

[0136] and the adjacent second water tanks 121 in the three acid-washing parts 12 are connected.

[0137] By further limiting the connection mode of the water tanks in the etching cleaning mechanism 1, the alkali-removing cleaning mechanism 2 and the RCA cleaning mechanism 3, more efficient recycling and utilization of water resources can be realized while ensuring the cleaning effect. In the etching cleaning mechanism 1, the fourth water tank 171 is connected with the first water tank 111 through the connecting pipe 14, which enables the first processing liquid in the first water tank 111 to be effectively recycled to the fourth water tank 171 for cleaning the silicon wafer before etching. This not only improves the utilization rate of water resources, but also ensures the continuity and stability of the liquid in the cleaning process. Similarly, in the alkali-removing cleaning mechanism 2, the fifth water tank 221 is also connected with the adjacent first water tank 111 through the connecting pipe 14, which ensures that the first processing liquid in the first water tank 111 can be continuously recycled to the fifth water tank 221 for reuse. In the RCA cleaning mechanism 3, the sixth water tank 321 is connected with the first water tank 111 through the connecting pipe 14, which ensures that the first processing liquid in the first water tank 111 can be continuously recycled to the sixth water tank 321 for reuse, thereby improving the recycling rate of the first processing liquid.

[0138] Referring back Figure 1 In some embodiments, the boat cleaning mechanism 300 comprises a plurality of acid-washing tanks 10, a plurality of spraying water tanks 20 and a plurality of water-washing tanks 30 arranged in sequence.

[0139] The terminal water-washing tank 30 is connected with the silicon wafer cleaning mechanism 200, the adjacent water-washing tanks 30 are connected, and the spraying water tank 20 is connected with the adjacent water-washing tank 30.

[0140] The arrangement of the above-mentioned boat cleaning mechanism 300 ensures that the boat sequentially passes through the acid-washing, spraying and water-washing steps during the cleaning process, and then enters the drying chamber 700 for drying treatment, thereby obtaining comprehensive and thorough cleaning.

[0141] In particular, the terminal water-washing tank 30 is connected with the silicon wafer cleaning mechanism 200, which not only enables the first processing liquid of the silicon wafer cleaning mechanism 200 to serve as the initial water source of the water-washing tank 30, but also helps to ensure that the second processing liquid in the terminal water-washing tank 30 is recycled and utilized for the least number of times, and has relatively high purity, which is conducive to improving the cleaning quality of the boat.

[0142] In addition, the adjacent washing tanks 30 and the spray water tank 20 are connected, which not only reduces the waste of water resources, but also improves the cleaning effect of the boat, and further enhances the recycling of the second treatment liquid in the boat cleaning mechanism 300.

[0143] The number of acid washing tanks 10 and the number of washing tanks 30 can be set according to the cleaning needs of the boat, preferably, the number of acid washing tanks 10 is 5, and the number of washing tanks 30 is 4.

[0144] Referring to Figure 1 In some embodiments, a recovery water collection pool 500 is further provided between the silicon wafer cleaning mechanism 200 and the boat cleaning mechanism 300, which is used to collect the first treatment liquid from the silicon wafer cleaning mechanism 200, and the recovery water collection pool 500 is connected with the washing tank 30 at the end.

[0145] The recovery water collection pool 500 added between the silicon wafer cleaning mechanism 200 and the boat cleaning mechanism 300 can store and adjust the amount of first treatment liquid, ensure that sufficient water resources can be provided quickly and stably when needed, and is beneficial to enhance the collaborative work capability between the silicon wafer cleaning mechanism 200 and the boat cleaning mechanism 300, and also helps to maintain the dynamic balance of the internal liquid, and ensure the continuity and stability of the cleaning process.

[0146] Referring to Figure 1 In some embodiments, a tail gas treatment washing tower 600 is further connected to the boat cleaning mechanism 300, the tail gas treatment washing tower 600 is connected with the spray water tank 20, and the tail gas treatment tower is used to treat the tail gas by the second treatment liquid and generate waste liquid;

[0147] The recovery mechanism is connected with the tail gas treatment washing tower 600 to collect the waste liquid from the tail gas treatment washing tower 600.

[0148] In the boat cleaning mechanism 300, the boat is first subjected to acid washing by the acid washing tank 10, which makes the boat surface adhere to the acidic functional liquid. Then it is sprayed, and these acidic functional liquids are brought into the spray water tank 20, so that the water in the spray water tank 20 has weak acid characteristics. The tail gas treatment washing tower 600 is connected with the spray water tank 20, and the second treatment liquid with weak acidity is used as a liquid for neutralizing alkaline waste gas such as ammonia gas, so that the second treatment liquid becomes a useful medium in the tail gas treatment process, which not only effectively treats the waste gas, but also maximizes the use of the second treatment liquid, and has high environmental and economic benefits.

[0149] Referring to Figure 1 Further, the first treatment liquid, the second treatment liquid and the third treatment liquid recovered by the recovery mechanism 400 can be discharged to the municipal waste liquid treatment center.

[0150] Referring to Figure 1 and Figure 2 In some embodiments, a drying chamber 700 is arranged in the wafer cleaning mechanism 200 or the boat cleaning mechanism 300 to dry the cleaned wafer or boat. The drying method can be air drying or oven drying.

[0151] Referring to Figure 1 Further, when the pure water used in the wafer cleaning mechanism 200 needs to be heated, a power station cooling tower and / or a machine end water heater can be arranged between the pure water preparation mechanism 100 and the wafer cleaning mechanism 200. The power station cooling tower can be used to exchange heat with the pure water to heat the pure water to a certain temperature, such as about 50-60°C. The machine end water heater can be heated to a set temperature according to the temperature requirement of the wafer cleaning process, and then the pure water is supplied to the slow lifting groove 132 of the wafer cleaning mechanism 200.

[0152] The water recycling system disclosed in the above embodiments of the present application is described in detail, and the principle and implementation mode of the present application are described by applying specific examples. The above embodiment is only used to help understand the water recycling system of the present application and its core idea. Meanwhile, for those skilled in the art, according to the idea of the present application, the specific implementation mode and application range will be changed, and the above description should not be understood as a limitation of the present application.

Claims

1. A water recycling system, characterized by, The application relates to a silicon wafer cleaning device. The device comprises: a pure water preparation mechanism for providing pure water; a silicon wafer cleaning mechanism connected with the pure water preparation mechanism, for receiving the pure water from the pure water preparation mechanism, and further for cleaning silicon wafers by the pure water and generating a first treatment liquid; a boat cleaning mechanism connected with the silicon wafer cleaning mechanism, for receiving the first treatment liquid from the silicon wafer cleaning mechanism, and further for cleaning boats by the first treatment liquid and generating a second treatment liquid; 2. The water recycling system of claim 1, wherein, a recovery mechanism for collecting the first treatment liquid or the second treatment liquid. The silicon wafer cleaning mechanism comprises at least: an alkali cleaning part for alkali cleaning treatment of the silicon wafer; an acid cleaning part for cleaning the silicon wafer treated by the alkali cleaning part; a slow lifting part for cleaning the silicon wafer treated by the acid cleaning part; 3. The water recycling system of claim 2, wherein, wherein the slow lifting part is connected with the pure water preparation mechanism. The silicon wafer cleaning mechanism has function tanks and water tanks arranged at intervals; wherein the alkali cleaning part comprises at least a first water tank and an alkali cleaning function tank arranged in sequence; the acid cleaning part comprises at least a second water tank and an acid cleaning function tank arranged in sequence; the slow lifting part comprises at least a third water tank and a slow lifting tank arranged in sequence; 4. The water recycling system of claim 3, wherein, the slow lifting tank, the third water tank, the second water tank and the first water tank are sequentially communicated, for sequentially circulating the first treatment liquid among the slow lifting tank, the third water tank, the second water tank and the first water tank. The slow lifting tank, the third water tank, the second water tank and the first water tank are communicated by connecting pipes; 5. The water recycling system of claim 4, wherein, a limiting valve is installed on the connecting pipe, and the limiting valve is used for limiting the one-way flow of the first treatment liquid from the slow lifting tank to the third water tank, the second water tank and the first water tank.

6. The water recycling system of claim 5, wherein, A sub-tank is arranged between adjacent slow lifting tanks and water tanks, and between adjacent water tanks, and the sub-tank is used for collecting the first treatment liquid; the connecting pipe is communicated with the sub-tank, and the limiting valve is installed on the connecting pipe between the sub-tank and the slow lifting tank or the water tank. An electric conductivity detection device is arranged in the sub-tank; 7. The water recycling system of claim 3, wherein, The connecting pipe connected with the sub-tank is a three-way connecting pipe. The silicon wafer cleaning mechanism comprises one or a combination of a texturing cleaning mechanism, an alkali etching cleaning mechanism or an RCA cleaning mechanism; wherein the texturing cleaning mechanism comprises: a first pre-cleaning part for pre-cleaning treatment of the silicon wafer; a texturing part for texturing treatment of the silicon wafer treated by the first pre-cleaning part; a group of alkali cleaning parts; a group of acid cleaning parts; the slow lifting part; the alkali etching cleaning mechanism comprises: a second pre-cleaning part for pre-cleaning treatment of the silicon wafer; a first alkali etching part for first alkali etching treatment of the silicon wafer treated by the second pre-cleaning part; three groups of alkali cleaning parts; a group of acid cleaning parts; the slow lifting part; the RCA cleaning mechanism comprises: a third pre-cleaning part for pre-cleaning treatment of the silicon wafer; a second alkali etching part for second alkali etching treatment of the silicon wafer treated by the third pre-cleaning part; a group of alkali cleaning parts; The three groups of acid washing units; The slow lifting unit.

8. The water recycling system of claim 7, wherein, The texturing cleaning mechanism comprises: The texturing unit comprises at least a fourth water tank and a texturing tank arranged in sequence, and the fourth water tank is communicated with the first water tank through a connecting pipe; The alkali throwing cleaning mechanism comprises: The first alkali throwing unit comprises at least a fifth water tank and a first alkali throwing tank arranged in sequence, and the fifth water tank is communicated with the adjacent first water tank through a connecting pipe; The first water tanks in the three groups of alkali washing units are communicated with each other; The RCA cleaning mechanism comprises: The second alkali throwing unit comprises at least a sixth water tank and a second alkali throwing tank arranged in sequence, and the sixth water tank is communicated with the first water tank through a connecting pipe; The second water tanks in the three groups of acid washing units are communicated with each other.

9. The water recycling system according to any one of claims 1 to 8, wherein, The boat cleaning mechanism comprises a plurality of acid washing tanks, a spraying water tank and a plurality of water washing tanks arranged in sequence; The terminal water washing tank is communicated with the silicon wafer cleaning mechanism, the adjacent water washing tanks are communicated with each other, and the spraying water tank is communicated with the adjacent water washing tanks.

10. The water recycling system of claim 9, wherein, The silicon wafer cleaning mechanism and the boat cleaning mechanism are further provided with a recovered water collecting pool for collecting the first treatment liquid from the silicon wafer cleaning mechanism, and the recovered water collecting pool is communicated with the terminal water washing tank; And / or, The boat cleaning mechanism is further connected with a tail gas treatment washing tower, the tail gas treatment washing tower is communicated with the spraying water tank, the tail gas treatment washing tower is used for treating tail gas by the second treatment liquid and generating waste liquid; The recovery mechanism is connected with the tail gas treatment washing tower to collect the waste liquid from the tail gas treatment washing tower; And / or, A drying chamber is arranged in the silicon wafer cleaning mechanism or the boat cleaning mechanism to dry the cleaned silicon wafer or boat.

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