Spray forming device for preparing dispersion strengthened copper-based material
By designing a spray forming device, the complexity and cost issues of dispersion-strengthened copper-based materials were solved, achieving efficient and low-cost uniform dispersion phase distribution and producing high-performance copper-based material ingots.
Patent Information
- Application Number
- CN202423317206.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-31
- Publication Date
- 2025-12-23
- Estimated Expiration
- 2034-12-31
AI Technical Summary
Existing technologies for preparing dispersion-strengthened copper-based materials involve complex processes, long production cycles, and high costs. They also suffer from uneven dispersion and segregation issues, making it difficult to achieve stable industrial production.
By employing a spray forming device, through the design of the spray deposition chamber and spray components, and utilizing a rotary lifting drive device and an atomizing device, copper molten metal and oxide powder are simultaneously sprayed and distributed to form a uniform dispersed phase distribution, thus producing a billet with fine grains and no macroscopic segregation.
The process was simplified, production efficiency was improved, costs were reduced, and copper-based material ingots with stable performance were obtained.
Smart Images
Figure CN223699346U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model belongs to metal preparation technical field especially relates to a kind of spray forming device of preparation dispersion strengthened copper-based material. BACKGROUND
[0002] Oxide dispersion strengthened copper-based material is a kind of composite material combined with copper-based material and nano oxide, and Al2O3, Y2O3 and ZrO2 etc. Oxide is often used as dispersion strengthening phase to improve the strength of material by hindering dislocation movement. This material has high strength, hardness, conductivity and other properties, and is often used as functional material for electrical conductivity and thermal conductivity, widely used in lead frame, torch nozzle, high-power tube and continuous casting machine crystallizer. Not only the high conductivity and thermal conductivity of copper matrix are continued, but also the high strength, wear resistance and corrosion resistance of oxide are inherited. The existing technical scheme has the problems of complex process flow, long production cycle and high cost in preparing dispersion strengthened copper-based material. To solve the problems of uneven dispersion and segregation, and at the same time reduce production cost and improve production efficiency, it is urgent to research and simplify the process flow to realize stable industrial production. SUMMARY
[0003] According to the above problems of the prior art, the utility model aims to provide a kind of spray forming device of preparation dispersion strengthened copper-based material.
[0004] To achieve the above purpose, the technical scheme adopted is:
[0005] A kind of spray forming device of preparation dispersion strengthened copper-based material, including spray deposition chamber, the upper of the spray deposition chamber is equipped with at least two groups of spray assembly, each group of spray assembly includes nozzle, the nozzle includes spray port, spray deposition tray is arranged in the spray deposition chamber, the spray port is all aimed at the upper surface of spray deposition tray, and the spray port of the nozzle in one group of spray assembly and the nozzle in another group of spray assembly are aimed at the same point of spray deposition tray, and the spray deposition tray is connected with rotary lifting driving device, to drive spray deposition tray to carry out synchronous rotation and lifting.
[0006] Based on the above technical scheme, the utility model can also be improved as follows:
[0007] Preferably, the spray assembly further includes tundish and atomization device, the upper of the nozzle is connected with atomization device, the atomization device is located in atomization chamber, the upper of the atomization chamber is connected with tundish, the bottom of the tundish is equipped with tundish spout, and the tundish spout is communicated with the atomization device.
[0008] Preferably, the atomization chamber is communicated with the lower spray deposition chamber through through-hole.
[0009] Preferably, the different nozzles of the same point of the aligned spray deposition disc can oscillate synchronously.
[0010] Preferably, the same point is any point in the radial direction of the spray deposition disc.
[0011] Preferably, the spray deposition disc is lowered synchronously while rotating.
[0012] More preferably, the two groups of spray assemblies are symmetrically arranged on the two sides above the spray deposition disc.
[0013] Preferably, the rotating and lowering driving device comprises a lowering device for driving the spray deposition disc to lower and a rotating device for driving the spray deposition disc to rotate.
[0014] Preferably, the liquid species in the intermediate package in the different spray assemblies are different.
[0015] Compared with the prior art, the beneficial effects of the present application are that: the present application solves the problem of uniform distribution of dispersed phase of oxide dispersion strengthened copper-based material by the rapid solidification characteristics of spray forming technology, and prepares a billet with fine grains, no macrosegregation and low impurity content. The technology has the characteristics of short process flow, high production efficiency, reduced cost and stable performance of the blank. BRIEF DESCRIPTION OF DRAWINGS
[0016] Figure 1 is a schematic view of a spray forming device for preparing a dispersion strengthened copper-based material of the present application;
[0017] The reference signs are: 1, intermediate package; 2, intermediate package spout; 3, atomization device; 4, nozzle; 5, spray deposition chamber; 6, spray deposition disc; 7, lifting device; 8, rotating device; 9, billet; 10, atomization chamber. DETAILED DESCRIPTION
[0018] The present application will be described below in conjunction with examples, which are only used to explain the present application and not to limit the scope of the present application.
[0019] In the description of the present application, it should be noted that the orientations or positional relationships indicated by the terms "vertical", "upper", "lower", "horizontal" and the like are based on the orientations or positional relationships shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and therefore cannot be understood as indicating or implying that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application.
[0020] In the description of the utility model, still need explaining, unless another explicit provision and limitation, term '' set '', '' install '', '' link '', '' connect '' should do broad sense understanding, for example, can be fixed connection, also can be detachable connection, or integrally connected, can be mechanical connection, also can be electrical connection, can be direct connection, also can indirectly connect through intermediate medium, can be two elements inside the intercommunication, for ordinary skilled in the art, can understand the concrete meaning of above-mentioned term in the utility model according to specific circumstances.
[0021] As Figure 1 The utility model provides a kind of spray forming device for preparing dispersion strengthened copper-based material, including spray deposition chamber 5, the upper of the spray deposition chamber 5 is equipped with two groups of spray assembly, each group of spray assembly includes nozzle 4, the nozzle 4 includes spray port, spray deposition tray 6 is equipped in the spray deposition chamber 5, the spray port is all aligned with the upper surface of spray deposition tray 6, and the spray port of nozzle 4 in one group of spray assembly and the spray port of nozzle 4 in another group of spray assembly are aligned with the same point of spray deposition tray 6, the spray deposition tray 6 is connected rotation lifting drive arrangement, to drive spray deposition tray 6 to carry out synchronous rotation and lifting.
[0022] In an alternative embodiment, the spray assembly further comprises a tundish 1 and an atomization device 3, the upper of the nozzle 4 is connected with the atomization device 3, the atomization device 3 is located in the atomization chamber 10, the atomization chamber 10 is communicated with the lower spray deposition chamber 5 through the through hole, the upper of the atomization chamber 10 is connected with the tundish 1, the bottom of the tundish 1 is provided with a tundish spout 2, and the tundish spout 2 is located above the atomization device 3.
[0023] As a preferred embodiment, the different nozzles 4 aligned with the same point of the spray deposition tray 6 can swing synchronously.
[0024] As a preferred embodiment, the same point is any point in the radial direction of the spray deposition tray 6.
[0025] In an alternative embodiment, the spray deposition tray 6 rotates while descending synchronously.
[0026] As a preferred embodiment, the two groups of spray assemblies are symmetrically arranged on the two sides above the spray deposition tray 6.
[0027] In an alternative embodiment, the rotation lifting drive arrangement comprises a lifting device 7 and a rotating device 8, the lifting device 7 is used to drive the spray deposition tray 6 to lift, and the rotating device 8 is used to drive the spray deposition tray 6 to rotate.
[0028] In an alternative embodiment, the rotating device 8 is a motor, connected with the upper lifting device 7 through a rotating shaft.
[0029] In a preferred embodiment, the lifting device 7 can be a hydraulic cylinder, pneumatic cylinder, or electric cylinder, or other device capable of lifting.
[0030] In this embodiment, the intermediate package 1 in the different spraying components contains different types of liquid.
[0031] In this embodiment, the atomizing device 3 is an atomizer.
[0032] In an optional embodiment, the nozzle 4 may be located in the atomization chamber 10, the spray deposition chamber 5, or partly in the spray deposition chamber 5 and partly in the atomization chamber 10, as long as it does not affect the entry of the atomized copper molten metal and oxide powder into the spray deposition chamber 5 through the through hole, and does not affect the oscillation of the nozzle 4.
[0033] At work, with Figure 1 Taking two sets of spraying components, each containing a nozzle 4, as an example, the spraying deposition plate 6 is driven to rise to the upper part of the spraying deposition chamber 5 by a lifting device 7 and a rotating device 8. Molten copper and oxide powder, smelted in a vacuum induction melting furnace, are poured into two intermediate ladles 1 respectively, and flow into the atomizing device 3 of the atomizing chamber 10 through the intermediate ladle nozzle 2 at the bottom of the intermediate ladle 1. The atomizing device 3 uses high-pressure inert gas to atomize the molten metal droplets into fine particles and oxide powder for spraying. The molten copper particles and oxide powder, after being atomized by the atomizing device 3, enter the two nozzles 4, are sprayed through the nozzles 4, and meet and adhere at the same point on the upper surface of the rotating and descending spraying deposition plate 6. The two nozzles 4 swing synchronously, and the swing angle of the nozzles 4 is adjusted and controlled so that the molten copper and oxide powder always meet at the same point on the upper surface of the spraying deposition plate 6. For example... Figure 1 At this time, the oscillation path of the two nozzles 4 is a line segment from point A to point B, then back from point B to point A, and then back from point A to point B, repeating in a cycle. Accompanied by the rapid rotation and slow descent of the jet deposition disk 6, a billet 9 is formed. In order to obtain a relatively regular billet 9, the oscillation path of the nozzles 4 passes through the center position of the circle on the upper surface of the jet deposition disk 6, which is point C. Point C corresponds to the center point of the line segment from A to B. The nozzles 4 oscillate synchronously while the jet deposition disk 6 rotates rapidly and descends slowly, thus forming a cylindrical billet 9 on the jet deposition disk 6.
[0034] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.
Claims
1. A spray forming apparatus for preparing dispersion-strengthened copper-based materials, characterized in that, The device includes a jet deposition chamber, above which are two sets of jetting components. Each set of jetting components includes a nozzle, which includes a jetting orifice. The jet deposition chamber contains a jet deposition disk. The jetting orifices are all aligned with the upper surface of the jet deposition disk. The nozzles in one set of jetting components and the jetting orifices of the nozzles in the other set of jetting components are aligned with the same point on the jet deposition disk. The jet deposition disk is connected to a rotation and lifting drive device to drive the jet deposition disk to rotate and lift synchronously.
2. The spray forming apparatus for preparing dispersion-strengthened copper-based materials according to claim 1, characterized in that, The spray assembly also includes an intermediate package and an atomizing device. The atomizing device is connected above the nozzle and is located in the atomizing chamber. An intermediate package is connected above the atomizing chamber, and an intermediate package nozzle is provided at the bottom of the intermediate package. The intermediate package nozzle is connected to the atomizing device.
3. The spray forming apparatus for preparing dispersion-strengthened copper-based materials according to claim 2, characterized in that, The atomizing chamber is connected to the jet deposition chamber below through a through hole.
4. The spray forming apparatus for preparing dispersion-strengthened copper-based materials according to claim 1, characterized in that, Different nozzles aligned with the same point on the jet deposition disk can swing synchronously.
5. The spray forming apparatus for preparing dispersion-strengthened copper-based materials according to claim 4, characterized in that, The same point refers to any point in the radial direction of the jet deposition disk.
6. The spray forming apparatus for preparing dispersion-strengthened copper-based materials according to claim 1, characterized in that, The two sets of spraying components are symmetrically arranged on both sides above the spraying deposition disk.
7. The spray forming apparatus for preparing dispersion-strengthened copper-based materials according to claim 1, characterized in that, The rotary lifting drive device includes a lifting device and a rotating device. The lifting device is used to drive the jet deposition disk to rise and fall, and the rotating device is used to drive the jet deposition disk to rotate.