Device for eliminating copper powder on rough surface of electronic circuit foil

Abstract

The utility model discloses an electronic circuit foil rough surface copper powder removing device which comprises a base and is arranged on one side of a cathode roller, a stripping roller is arranged at the position, close to the cathode roller, of the upper side of the base, and copper foil led out of the cathode roller is tightly attached to and wound around the stripping roller. A silica gel roller is arranged at the position, close to the stripping roller, of the upper side of the base in a sliding mode, a replaceable dust-sticking paper roll is arranged on one side of the silica gel roller in a sliding mode, when the cathode roller is replaced, the silica gel roller makes contact with the rotating stripping roller and exerts pressure on the rotating stripping roller, and meanwhile the dust-sticking paper roll makes contact with the silica gel roller and exerts pressure on the silica gel roller. Copper powder on the stripping roller can be transferred through the silica gel roller, meanwhile, the copper powder on the silica gel roller can be pasted and collected through the dust-sticking paper roll, and finally, dust-sticking paper on the dust-sticking paper roll is replaced, so that the abnormal quality of trailing / copper nodules can be improved from the source, and the production quality is improved finally.

Description

Technical Field

[0001] This utility model relates to the technical field of electrolytic copper foil production process, specifically to a device for eliminating copper powder from the rough surface of electronic circuit foil. Background Technology

[0002] In today's economic environment, competition within the same industry is becoming increasingly fierce, and homogenization is severe. To improve a company's competitiveness, products need to be of higher quality in order to stand out from the competition. Electrolytic copper foil production mainly consists of four major processes: solution preparation, electrolysis, surface treatment, and slitting. The electrolysis process involves using a cathode roller, anode plate, and electrolytic cell, where copper ions in the electrolyte move towards the cathode roller under the action of direct current, undergoing a reduction reaction to generate copper, which then forms copper foil.

[0003] After the copper foil is rotated out of the electrolyte in the electrolytic cell along with the cathode roller, a stripping roller peels the copper foil off the cathode roller. The rough surface of the copper foil comes into contact with the stripping roller and rubs against it. As production progresses, copper powder will gradually adhere to the stripping roller. This will cause the copper powder to grow into a tail / copper nodule during the subsequent surface treatment process, which will seriously affect the quality of the product. Utility Model Content

[0004] This invention provides a device for removing copper powder from the rough surface of electronic circuit foil, which can solve the problem that copper powder is easily left behind after the existing stripping roller comes into contact with and rubs against the rough surface of the copper foil, thus affecting the quality of subsequent surface treatment processes.

[0005] To achieve the above objectives, this utility model provides the following technical solution: a device for eliminating copper powder on the rough surface of electronic circuit foil, comprising a base installed on one side of a cathode roller, a stripping roller installed on the upper side of the base near the cathode roller, copper foil drawn from the cathode roller passing over the stripping roller tightly, a silicone roller slidably disposed on the upper side of the base near the stripping roller, and a replaceable adhesive paper roll slidably disposed on one side of the silicone roller. When the cathode roller is replaced, the silicone roller contacts and applies pressure to the rotating stripping roller, while the adhesive paper roll contacts and applies pressure to the silicone roller. The silicone roller can transfer the copper powder on the stripping roller, and the adhesive paper roll can collect and adhere the copper powder on the silicone roller. Finally, the adhesive paper on the adhesive paper roll can be replaced, thereby improving the abnormal quality of tailing / copper nodules from the source and ultimately improving production quality.

[0006] Preferably, the surface viscosity of the silicone roller is 400-600 CPS, which can transfer copper powder when the silicone roller comes into contact with the stripping roller, without excessively increasing the resistance to the rotation of the stripping roller.

[0007] Preferably, a slider is installed on the base, and the adhesive paper roll and silicone roller are mounted on the slider. The distance and pressure between the silicone roller and the peeling roller can be controlled by sliding the slider.

[0008] Preferably, a power-driven element is installed on one side of the slider to push the slider closer to or away from the stripping roller, and the power-driven element can automatically control the slider to move automatically.

[0009] Preferably, the silicone roller applies a pressure of 0.4-0.5 MPa to the stripping roller, which can ensure the transfer of copper powder while reducing the resistance of the stripping roller rotation.

[0010] Preferably, the adhesive paper roll applies a pressure of 0.3-0.5 MPa to the silicone roller, which can ensure the transfer of copper powder while reducing the resistance of the peeling roller rotation.

[0011] Compared with the prior art, the beneficial effects of this utility model are:

[0012] With a simple structure, the copper powder on the peeling roller can be transferred by setting a silicone roller, and the copper powder on the silicone roller can be collected and adhered by a dust-adhesive paper roll. Finally, the dust-adhesive paper on the dust-adhesive paper roll can be replaced. In this way, the peeling roller is cleaned and dust-adhesive once when changing rolls in the foil production machine. This can prevent and reduce the generation of copper powder in advance, thereby improving the abnormal quality of tailing / copper nodules from the source and ultimately improving the production quality. Attached Figure Description

[0013] Figure 1 This is a schematic diagram of the overall structure of this utility model.

[0014] Figure label:

[0015] 1. Cathode roller, 2. Base, 3. Peeling roller, 4. Silicone roller, 5. Adhesive paper roll, 6. Copper foil, 7. Slider. Detailed Implementation

[0016] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention.

[0017] This invention addresses the problem that existing stripping rollers easily leave copper powder residue after contact and friction with the rough surface of copper foil, negatively impacting the quality of subsequent surface treatment processes. For example... Figure 1As shown, the following technical solution is provided: a device for eliminating copper powder on the rough surface of electronic circuit foil, including a base 2 installed on one side of a cathode roller 1. A stripping roller 3 is installed on the upper side of the base 2 near the cathode roller 1. Copper foil 6 drawn from the cathode roller 1 passes tightly over the stripping roller 3. A silicone roller 4 is slidably arranged on the upper side of the base 2 near the stripping roller 3. A replaceable adhesive paper roll 5 is slidably arranged on one side of the silicone roller 4. When the cathode roller 1 is replaced, the silicone roller 4 contacts and applies pressure to the rotating stripping roller 3. At the same time, the adhesive paper roll 5 contacts and applies pressure to the silicone roller 4. The silicone roller 4 can transfer the copper powder on the stripping roller 3, and the adhesive paper roll 5 can collect and adhere the copper powder on the silicone roller 4. Finally, the adhesive paper on the adhesive paper roll 5 can be replaced. This can improve the abnormal quality of tailing / copper nodules from the source and ultimately improve the production quality.

[0018] Specifically, when installed, the base 2 is installed on one side of the upper part of the cathode roller 1. The copper foil 6 led out from the cathode roller 1 goes up and around the stripping roller 3 and then turns to the horizontal. As the cathode roller 1 rotates, the copper foil 6 on the cathode roller 1 can be peeled off, and the copper powder on the copper foil 6 will fall and remain on the stripping roller 3.

[0019] After the copper foil 6 on a cathode roller 1 is completely peeled off, the cathode roller 1 is disassembled for rewinding. At the same time as rewinding, the silicone roller 4 and the adhesive paper roll 5 are moved so that the silicone roller 4 comes into contact with and squeezes the peeling roller 3, and the adhesive paper roll 5 comes into contact with the silicone roller 4. Then, the peeling roller 3 is rotated manually or by other means, so that the copper powder on the peeling roller 3 can be collected sequentially on the adhesive paper roll 5.

[0020] The adhesive paper on the adhesive paper roll 5 can be quickly replaced, and the peeling roller 3 can continue to be used after replacement. This way, no residual copper powder will be transferred from the peeling roller 3 to the copper foil 6 on the next cathode roller 1.

[0021] In this embodiment, the surface viscosity of the silicone roller 4 is 400-600 CPS, which can transfer copper powder when the silicone roller 4 comes into contact with the peeling roller 3, without excessively increasing the resistance of the peeling roller 3 to rotation.

[0022] In this embodiment, as Figure 1 The base 2 is equipped with a slider 7, and the adhesive paper roll 5 and silicone roller 4 are mounted on the slider 7. The distance and pressure between the silicone roller 4 and the peeling roller 3 can be controlled by sliding the slider 7. Two sliders 7 can be provided, with the adhesive paper roll 5 and silicone roller 4 respectively mounted on the two sliders 7. The slider 7 can be pushed manually. A slide rail can be provided on the lower side of the slider 7. A locking and positioning structure can be provided on the slider 7 to position the adhesive paper roll 5 and silicone roller 4.

[0023] In this embodiment, in order to facilitate automatic remote control, a power pushing element is installed on one side of the slider 7 to push the slider 7 closer to or away from the peeling roller 3. The power pushing element can automatically control the slider 7 to move automatically. The power pushing element can be a hydraulic cylinder or a pneumatic cylinder. The pressure between the silicone roller 4 and the peeling roller 3 and the pressure between the adhesive paper roll 5 and the silicone roller 4 are controlled by controlling the air pressure or oil pressure.

[0024] In this embodiment, the silicone roller 4 applies a pressure of 0.4-0.5 MPa to the peeling roller 3, which ensures the transfer of copper powder while reducing the resistance to the rotation of the peeling roller 3. Simultaneously, the adhesive paper roll 5 applies a pressure of 0.3-0.5 MPa to the silicone roller 4, which also ensures the transfer of copper powder while reducing the resistance to the rotation of the peeling roller 3.

[0025] It should be noted that all directional indicators (such as up, down, left, right, front, back, etc.) in this utility model embodiment are only used to explain the relative positional relationship and movement of each component in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indicator will also change accordingly.

[0026] Furthermore, in this utility model, descriptions involving terms such as "primary," "secondary," etc., are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "primary" or "secondary" may explicitly or implicitly include at least one of those features. In the description of this utility model, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly and specifically defined.

[0027] In this utility model, unless otherwise explicitly specified and limited, the terms "connection," "fixing," etc., should be interpreted broadly. For example, "fixing" can mean a fixed connection, a detachable connection, or an integral part; it can mean a mechanical connection or an electrical connection; it can mean a direct connection or an indirect connection through an intermediate medium; it can mean the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0028] Furthermore, the technical solutions of the various embodiments of this utility model can be combined with each other, but only if they are based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or cannot be implemented, it should be considered that such combination of technical solutions does not exist and is not within the scope of protection claimed by this utility model.

Claims

1. A device for removing copper powder from the rough surface of electronic circuit foil, comprising: A base (2) is installed on one side of the cathode roller (1). A stripping roller (3) is installed on the upper side of the base (2) near the cathode roller (1). The copper foil (6) drawn from the cathode roller (1) passes tightly over the stripping roller (3). The base (2) is characterized by the following features: A silicone roller (4) is slidably disposed on the upper side of the base (2) near the peeling roller (3). A replaceable adhesive paper roll (5) is slidably disposed on one side of the silicone roller (4). When the cathode roller (1) is replaced, the silicone roller (4) contacts the rotating peeling roller (3) and applies pressure, while the adhesive paper roll (5) contacts the silicone roller (4) and applies pressure.

2. The device for eliminating copper powder on the rough surface of electronic circuit foil according to claim 1, characterized in that: The surface viscosity of the silicone roller (4) is 400-600 CPS.

3. The device for eliminating copper powder on the rough surface of electronic circuit foil according to claim 1, characterized in that: A slider (7) is installed on the base (2), and the adhesive paper roll (5) and silicone roller (4) are installed on the slider (7).

4. The device for eliminating copper powder on the rough surface of electronic circuit foil according to claim 3, characterized in that: A power pushing element is installed on one side of the slider (7) to push the slider (7) closer to or away from the stripping roller (3).

5. The device for eliminating copper powder on the rough surface of electronic circuit foil according to claim 1, characterized in that: The silicone roller (4) applies a pressure of 0.4-0.5 MPa to the peeling roller (3).

6. The device for eliminating copper powder on the rough surface of electronic circuit foil according to claim 1, characterized in that: The adhesive paper roll (5) applies a pressure of 0.3-0.5 MPa to the silicone roller (4).

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