Part of electrochemical device and electrochemical device

Abstract

The utility model relates to the technical field of electrochemical devices, in particular to a part of an electrochemical device and the electrochemical device. The part comprises a base body, the base body comprises a base plate and a plurality of array units, the array units are arranged on the surface of at least one side of the base plate in a protruding mode, and a gap is formed between any adjacent array units; the coating layer is deposited on the surfaces of the substrate and the array units, and the coating layer is provided with metal; wherein the array unit is an array unit of compatible metal, and the metal in the coating layer is the same as the compatible metal of the array unit; or the part further comprises an affinity metal layer arranged between the base body and the coating layer, the affinity metal layer covers the surface of the substrate and the surface of the array unit, the coating layer is deposited on the affinity metal layer, and the metal in the coating layer is the same as the affinity metal of the affinity metal layer. Through the structural improvement, the deposition uniformity of the coating layer in the part can be improved, so that the deposition thickness of the coating layer on the substrate is more uniform.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of electrochemical devices, in particular to a part of an electrochemical device and the electrochemical device. BACKGROUND

[0002] In an electrochemical device made by using an electrochemical deposition reaction as a design principle, how to control the quality of the deposited plating film is a key factor affecting the performance of the electrochemical device. An important factor affecting the quality of the plating film is the uniformity of the film layer, and currently there is often a situation that the thickness of the film layer is not uniform in different areas. CONTENT OF THE UTILITY MODEL

[0003] In order to solve the above technical problems, the present application discloses a part of an electrochemical device and an electrochemical device to improve the uniformity of the plating film in the electrochemical device.

[0004] In a first aspect, the present application provides a part of an electrochemical device, which comprises:

[0005] a substrate, the substrate comprising a substrate plate and a plurality of array units, the array units being protruded on at least one side surface of the substrate plate, and any adjacent array units having a spacing therebetween;

[0006] a plating film layer deposited on the surface of the substrate plate and the array units, the plating film layer having a metal;

[0007] wherein the array units are array units of an affinity metal, and the metal in the plating film layer is the same as the metal to which the array units are affinity; or the part further comprises an affinity metal layer arranged between the substrate and the plating film layer, the affinity metal layer covering the surface of the substrate plate and the array units, and the plating film layer being deposited on the affinity metal layer, and the metal in the plating film layer being the same as the metal to which the affinity metal layer is affinity.

[0008] Further, any of the array units is at least one of a cuboid, a cylinder, a hemisphere, an ellipsoid, a pyramid, a prism, a circular truncated cone or a circular cone.

[0009] Further, adjacent array units have equal spacing therebetween; or,

[0010] adjacent array units have gradually changing spacing therebetween.

[0011] Further, the substrate plate has a first surface and a second surface arranged oppositely, and a plurality of array units are arranged on the first surface and the second surface, and the array units on the first surface and the array units on the second surface are arranged symmetrically or staggered.

[0012] Further, the interval between adjacent array units is 20-30 μm.

[0013] Further, the height of the array unit is 20-60 μm.

[0014] When the projection shape of the array unit on the plane of the substrate is a rectangle, the side length of the rectangle ranges from 20 μm to 60 μm; or when the projection shape of the array unit on the plane of the substrate is a circle, the diameter of the circle ranges from 20 μm to 60 μm.

[0015] Further, the thickness of the substrate is greater than or equal to 15 μm; and / or,

[0016] When the part comprises the affinity metal layer, the thickness of the affinity metal layer is 100-500 nm.

[0017] Further, the electrochemical device is an alkali metal battery, the part is an alkali metal negative electrode, the substrate is a negative electrode current collector, and the plated layer is an alkali metal negative electrode active material layer.

[0018] Further, the alkali metal negative electrode is a lithium metal negative electrode, the substrate is a copper plate, a nickel plate, a titanium plate, or a stainless steel plate, and when the part comprises the affinity metal layer, the affinity metal layer is a lithiumophilic layer comprising one of a metal tin layer, a metal magnesium layer, a polyimide layer, a polyvinylidene fluoride layer, a graphene oxide layer, and a soft and hard carbon layer; or when the array unit is an array unit of an affinity metal, the array unit comprises one of a metal tin array unit, a metal magnesium array unit, a polyimide array unit, a polyvinylidene fluoride array unit, a graphene oxide array unit, and a soft and hard carbon array unit.

[0019] Alternatively,

[0020] When the part comprises the affinity metal layer, the affinity metal layer is a sodiumophilic layer comprising one of a metal aluminum layer, a metal potassium layer, a nitrogenated graphene layer, a graphene oxide layer, a graphene layer, a polytetrafluoroethylene layer, and a benzamide layer.

[0021] In a second aspect, this application provides an electrochemical device comprising the components described in the first aspect, including a metal battery, microelectronic components, a biosensor, a capacitor, or an electrochemical solar cell.

[0022] Compared with the prior art, this application has at least the following beneficial effects:

[0023] This application embodiment improves the structure of the components of the electrochemical device. On the one hand, it sets up a plurality of array units with spacing between each other on a flat substrate. On the other hand, it makes the surface of the substrate in contact with the coating layer have the ability to attract metals. Through the above two structural improvements, the deposition uniformity of the coating layer in the component can be improved, and the deposition thickness of the coating layer on the substrate can be more uniform, thereby helping to improve the performance of the electrochemical device using the component. Attached Figure Description

[0024] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0025] Figure 1 This is a cross-sectional structural schematic diagram of a component of an electrochemical device according to an embodiment of this application;

[0026] Figure 2 This is a schematic diagram of the current collector and the metal affinity layer in the components of the electrochemical device according to the embodiments of this application;

[0027] Figure 3 and Figure 4 This is a schematic diagram of the current density distribution in the current collector of the lithium metal anode in Embodiment 1 of this application;

[0028] Figure 5 and Figure 6 This is a schematic diagram of the current density distribution of the current collector in the lithium metal anode of Embodiment 2 of this application;

[0029] Figure 7 and Figure 8 This is a schematic diagram of the current density distribution of the current collector in the lithium metal anode of Embodiment 3 of this application.

[0030] Explanation of reference numerals in the attached figures:

[0031] 1. Substrate; 11. Base plate; 12. Array unit; 2. Coating layer; 3. Metal affinity layer. Detailed Implementation

[0032] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0033] In this application, the terms "upper," "lower," "left," "right," "front," "rear," "top," "bottom," "inner," "outer," "vertical," "horizontal," "lateral," and "longitudinal" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. These terms are primarily for the purpose of better describing this application and its embodiments, and are not intended to limit the indicated device, element, or component to having a specific orientation, or to be constructed and operated in a specific orientation.

[0034] Furthermore, in addition to indicating location or positional relationship, some of the aforementioned terms may also have other meanings. For example, the term "above" may also be used in some cases to indicate a certain dependency or connection relationship. Those skilled in the art can understand the specific meaning of these terms in this application based on the specific circumstances.

[0035] Furthermore, the terms "installation," "setup," "equipped with," "connection," and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral structure; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium, or an internal connection between two devices, components, or parts. Those skilled in the art can understand the specific meaning of these terms in this application based on the specific circumstances.

[0036] Furthermore, the terms "first," "second," etc., are primarily used to distinguish different devices, components, or parts (which may be the same or different in specific type and construction), and are not intended to indicate or imply the relative importance or quantity of the indicated devices, components, or parts. Unless otherwise stated, "a plurality of" means two or more.

[0037] The implementation scheme of this application will be described in detail below with reference to the embodiments.

[0038] When fabricating electrochemical devices and components using the principle of electrochemical deposition, a flat plate is typically used as the interface carrier. However, due to factors such as the flow characteristics of the electrolyte and the non-uniformity of the current distribution, metal ions tend to over-deposit at certain local locations on the plate (this could be the center, the lower middle, or the four corners), resulting in an uneven thickness of the electrodeposited film on the plate, with some areas being thicker and others thinner. This non-uniformity of the film can adversely affect the performance of components and electrochemical devices, therefore, it is necessary to improve this problem.

[0039] To address the aforementioned problems, embodiments of this application provide an electrochemical device and components used in the electrochemical device. The electrochemical device includes a metal battery, microelectronic components, a biosensor, a capacitor, or an electrochemical solar cell. For example, the electrochemical device is a metal battery, which includes components such as a positive electrode and a negative electrode. Alternatively, the electrochemical device may be a microelectronic component, which refers to a miniature device with dimensions at the micrometer level capable of performing specific functions. Exemplarily, microelectronic components include transistors, integrated circuits, diodes, field-effect transistors, thyristors, optoelectronic devices, sensors, memories, microcontrollers, digital signal processors, processors, or communication chips, etc.

[0040] Because the deposition process of electrochemical devices often results in uneven film uniformity due to varying deposition levels in different areas, it affects the film quality. Therefore, this application improves the structure of the components in the electrochemical device to enhance the uniformity of film deposition. This improves the performance of the electrochemically deposited components from the source of the electrodeposition reaction, increasing the uniformity of film thickness and consistency of quality, ultimately enabling the components to perform better in the electrochemical device. The components of the electrochemical device in this application are described in detail below.

[0041] The parts in the embodiments of this application, combined with Figure 1 and Figure 2 As shown, Figure 1 This is a cross-sectional structural diagram of a part according to an embodiment of this application. Figure 2 This is a schematic diagram of the current collector and the metal affinity layer in a component according to an embodiment of this application. The component includes a substrate 1 and a coating layer 2 deposited on the substrate 1.

[0042] The substrate 1 includes a substrate 11 and a plurality of array units 12. The array units 12 protrude from at least one side surface of the substrate 11. There is a gap between any adjacent array units 12. A coating layer 2 is deposited on the surface of the substrate 11 and the array units 12, and the coating layer 2 is metallic.

[0043] In one optional embodiment, the array unit 12 is a metal-affinity array unit 12, and the metal in the coating layer 2 is the same as the metal affinity of the array unit 12. That is, the material of the array unit 12 is a material with affinity for the metal of the coating layer 2. For example, if the coating layer 2 is a metal inner layer, then the array unit 12 is a lithium-affinity array unit 12. For example, the array unit 12 can be selected as a graphene oxide array unit 12, a tin array unit 12, or a magnesium array unit 12, etc., which have affinity for lithium metal.

[0044] In another optional embodiment, the component further includes an affinity metal layer 3 disposed between the substrate 1 and the coating layer 2. The affinity metal layer 3 covers the surfaces of the substrate 11 and the array unit 12, and the coating layer 2 is deposited on the affinity metal layer 3, wherein the metal in the coating layer 2 is the same as the metal that the affinity metal layer 3 is affinity-bound for. The affinity metal layer 3 is a film layer with metal affinity properties. The fact that the metal in the coating layer 2 is the same as the metal that the affinity metal layer 3 is affinity-bound for means that the metal that the affinity metal layer 3 can affinity for is the metal in the coating layer 2; that is, the affinity metal layer 3 has affinity properties for the coating layer 2. For example, if the coating layer 2 is a lithium metal layer, then the affinity metal layer 3 is a lithium-affinity layer. For example, the affinity metal layer 3 can be selected as a graphene oxide layer, a tin layer, or a magnesium layer, etc., which have affinity properties for lithium metal.

[0045] Furthermore, the substrate 1 serves as the base for electrochemical deposition of the part, providing an interface carrier for electrochemical deposition of the coating. The coating layer 2 is a film layer obtained by electrochemical deposition on the substrate 1. This coating layer 2 can be a metal layer or a metal alloy layer, and whether it is a metal layer or a metal alloy layer, the coating layer 2 has a metallic nature.

[0046] This application embodiment improves the structure of the components of the electrochemical device. On the one hand, it sets a plurality of array units 12 with spacing between each other on a flat substrate 11. On the other hand, it makes the surface of the substrate 1 in contact with the coating layer 2 have the ability to attract metals (including adding an affinity metal layer 3 to the outer layer of the substrate 1 or using array units 12 with the ability to attract metals). Through the above two structural improvements, the deposition uniformity of the coating layer 2 in the component can be improved, and the deposition thickness of the coating layer 2 on the substrate 1 can be more uniform, thereby improving the performance of the electrochemical device using the component.

[0047] The array unit 12 protruding from the surface of the substrate 11 can be used to adjust the current distribution and regulate the ion flux by utilizing the characteristics of its array arrangement, thereby improving the uniformity of electrochemical deposition.

[0048] First, compared to a planar substrate, the structure of the array units 12 protruding on the substrate 11 in this embodiment has a lower average current density, which can regulate the current distribution and make the current density in the bottom region of the array units 12 higher. This current distribution characteristic makes the metal ions to be deposited preferentially begin to deposit in the bottom region of the array units 12 (i.e., the gap region between adjacent array units 12), rather than starting to deposit directly from the top surface of the array units 12.

[0049] Secondly, compared to planar substrates, the array unit 12 in this embodiment has a larger electric field strength, which is beneficial to enhancing the electrocapillary climbing effect of metal ions on the array unit 12. This electric field strength characteristic makes the difference in ion transport rate at various positions along the height direction of the array unit 12 smaller during the upward migration of deposited metal ions from the bottom of the array unit 12, further improving the uniformity of metal ion distribution on the array unit 12, thereby improving the uniformity of the coating.

[0050] Thirdly, this application provides protruding array units 12 on the substrate 11 and maintains a spacing distance, which is equivalent to dividing the substrate 11 into several dispersed channels for the metal ions to be deposited to pass through. The existence of these channels makes the metal ions more inclined to move downward along the height direction of the substrate 1 when deposited on the surface of the substrate 1, rather than only moving in a direction parallel to the plane of the substrate 11. This movement mode of ion flow makes the flow of metal ions relatively more dispersed and uniform, thereby promoting the uniform nucleation and growth of metal ions on the surface of the substrate 1, avoiding the problem of excessive flux and excessive nucleation and growth of metal ions in a certain area during electrochemical deposition on a traditional planar substrate 1.

[0051] By setting an affinity metal layer 3 or using an array unit 12 made of an affinity metal material, the affinity for the metal of the coating layer 2 can be improved, the distribution of metal ion deposition sites can be controlled, and more metal ions can be constrained in the gaps of the array unit 12 to deposit the coating layer 2. This avoids the problem of excessive accumulation of metal ions and uneven deposition in a certain area, and can also reduce the volume expansion problem caused by metal deposition.

[0052] Optionally, any array unit 12 is at least one of a cuboid, cylinder, hemisphere, ellipsoid, pyramid, frustum, cone, or cone. A hemisphere refers to a non-perfect sphere formed by cutting a sphere. For example, a hemisphere can be half a sphere, a dome-shaped structure formed by cutting a small portion of a sphere, or a dome-shaped structure formed by cutting a larger portion of a sphere. This application does not impose any limitations on this.

[0053] Arranged according to the magnitude of the electric field strength, the order is: cuboid array unit > hemispherical array unit > cylindrical array unit > planar substrate. Because the cuboid and hemispherical array units have greater electric field strength, they are more conducive to enhancing the electrocapillary climbing effect of the metal ions to be deposited along the height direction of the array unit 12. That is, the metal ions migrate from the bottom to the top of the array unit 12 at a faster rate, and the difference in ion transport rate from bottom to top is smaller, which is beneficial to further improve the uniformity of metal ion distribution during the deposition process and further improve the uniformity of the coating.

[0054] In this embodiment, the spacing between adjacent array units 12 can be equal or unequal. When the spacing is unequal, the variation of these spacings can be irregular or set in a regular pattern, such as equal arithmetic intervals. Preferably, the spacing between adjacent array units 12 is equal. Array units 12 with equal spacing can provide more uniformly dispersed ion channels for the metal ions to be deposited, thereby improving the deposition uniformity of the electrochemically deposited coating layer 2, making the coating layer 2 more uniform in thickness and the deposition quality more consistent at various locations.

[0055] In this embodiment, the array unit 12 can be disposed on only one side of the substrate 11 or on both sides. Preferably, the substrate 11 has a first surface and a second surface disposed opposite to each other, and a plurality of array units 12 are disposed on both the first surface and the second surface. When array units 12 are disposed on both sides, the array units 12 on the two sides can be staggered (i.e., the horizontal projections of the array units 12 on the two sides on the substrate 11 are staggered or completely staggered) or symmetrically disposed (i.e., the horizontal projections of the array units 12 on the two sides on the substrate 11 completely overlap). When the array units 12 are disposed on both sides and staggered, especially when the horizontal projections on the substrate 11 are completely staggered, there is a higher electric field strength and current density, which is beneficial to further improve the electrocapillary climbing ability of metal ions, reduce the difference in migration rate of metal ions in the height direction of the array unit 12, and improve the deposition uniformity of the coating layer 2 at various positions of the array unit 12.

[0056] In addition, the array unit 12 is preferably disposed perpendicular to the surface of the substrate 11.

[0057] Furthermore, the spacing between adjacent array units 12 is 20 μm to 30 μm. Adjusting the spacing of adjacent array units 12 within this range helps to reduce differences in ion transport rates while ensuring a sufficient number of array units 12 are arranged on the substrate 11. For example, the spacing between adjacent array units 12 is 20 μm, 22 μm, 25 μm, 28 μm, or 30 μm.

[0058] Furthermore, along the thickness direction perpendicular to the substrate 11, the array unit 12 has a height, which is 20 μm to 60 μm. The height of the array unit 12 is proportional to the electric field strength, and the height of the array unit 12 also affects the overall thickness of the component. Adjusting the height of the array unit 12 within the above-mentioned range is beneficial for reducing the difference in ion transport rate while ensuring a suitable overall thickness of the component. For example, the height of the array unit 12 is 20 μm, 25 μm, 30 μm, 35 μm, 40 μm, 45 μm, 50 μm, 55 μm, or 60 μm.

[0059] In one alternative implementation, such as Figure 2 As shown, the array unit 12 is a cuboid, and the projection shape of the array unit 12 onto the plane of the substrate 11 is rectangular, with a side length ranging from 20 μm to 60 μm. The side length of the projection of the array unit 12 onto the plane of the substrate 11 is proportional to the electric field strength, and the size of the array unit 12 has a certain influence on its number on the substrate 11. Therefore, in this embodiment, the side length of the rectangle is preferably controlled within the above range. For example, the side length of the projection of the cuboid onto the plane of the substrate 11 is 20 μm, 25 μm, 30 μm, 35 μm, 40 μm, 45 μm, 50 μm, or 60 μm.

[0060] In another optional embodiment, the array unit 12 is a hemisphere, and the projection shape of the array unit 12 onto the plane of the substrate 11 is circular, with a diameter ranging from 20 μm to 60 μm. The projection diameter of the array unit 12 onto the plane of the substrate 11 is proportional to the electric field strength, and the diameter of the array unit 12 has a certain influence on its number on the substrate 11. Therefore, in this embodiment, the diameter of the circle is preferably controlled within the above range. For example, the diameter range of the projection of the hemisphere onto the plane of the substrate 11 is 20 μm, 25 μm, 30 μm, 35 μm, 40 μm, 45 μm, 50 μm, or 60 μm.

[0061] The substrate 11 has a thickness greater than or equal to 15 μm. A thickness of 15 μm or greater provides good structural support for the array units, coating layers, and other components located on it. For example, the thickness of the substrate 11 is 15 μm, 20 μm, 25 μm, 30 μm, 40 μm, 50 μm, 80 μm, or 100 μm. When the component includes a metal affinity layer 3, the thickness of the metal affinity layer 3 is 100 nm to 500 nm. For example, the thickness of the metal affinity layer 3 is 100 nm, 150 nm, 200 nm, 300 nm, 400 nm, or 500 nm.

[0062] Furthermore, the electrochemical device is an alkali metal battery, the component is an alkali metal negative electrode, the substrate 1 is the negative electrode current collector, and the coating layer 2 is the alkali metal negative electrode active material layer.

[0063] Alkali metal anodes, such as lithium metal anodes and sodium metal anodes, possess high theoretical specific capacity and low potential, thus offering significant technological advantages as metal-based anode materials. However, when depositing alkali metal anode active material layers, such as lithium metal layers, on a planar anode current collector substrate 11 using electrochemical processes, issues such as uneven deposition and surface roughness arise. These problems are further amplified during the cycling process of alkali metal batteries, leading to issues such as intensified side reactions between the electrodes and electrolytes, and the growth of alkali metal dendrites. This not only affects the coulombic efficiency of alkali metal batteries but may even cause safety issues.

[0064] The present application embodiments, by making the structural improvements to components such as alkali metal anodes as described above, can improve the uniformity of the deposition of the alkali metal anode active material layer on the anode current collector from the root of electrochemical deposition. In turn, by improving the film quality such as the thickness uniformity of the alkali metal anode active material layer, the side reactions and alkali metal dendrites of the alkali metal anode during subsequent cyclic charging and discharging can be effectively alleviated, so that such alkali metal anodes can better meet the needs of industrial applications.

[0065] In one optional embodiment, the alkali metal anode is a lithium metal anode. In this lithium metal anode, the substrate 11 is a copper plate, nickel plate, titanium plate, or stainless steel plate, and the alkali metal anode active material layer is a lithium metal layer. To improve the affinity for the alkali metal anode active material, a lithiophilic layer can be added between the anode current collector and the lithium metal layer as an affinity metal layer 3, or the array unit 12 of the anode current collector can be made of a lithiophilic material. When a lithiophilic layer is added, the lithiophilic layer can be one of a tin layer, a magnesium layer, a polyimide layer, a polyvinylidene fluoride layer, a graphene oxide layer, or a soft or hard carbon layer. In this case, the array unit 12 can be a copper array unit 12, a nickel array unit 12, a titanium array unit 12, or a stainless steel array unit 12.

[0066] In another alternative embodiment, the alkali metal anode is a sodium metal anode. Similar to the lithium metal anode, the substrate 11 is a copper plate, nickel plate, titanium plate, or stainless steel plate. Unlike the lithium metal anode, in the sodium metal electrode, the alkali metal anode active material layer is a sodium metal layer. To improve the affinity for sodium metal, a sodium-affinity layer can be added between the anode current collector and the sodium metal layer of the sodium metal anode as a sodium-affinity metal layer 3, or the array unit 12 of the anode current collector can be made of a sodium-affinity material. When the sodium-loving layer or the array unit 12 is made of sodium-loving material, the sodium-loving material can be one of aluminum metal, potassium metal, nitrided graphene, graphene oxide, graphene, polytetrafluoroethylene, and benzamide. That is, the sodium-loving layer includes one of aluminum metal layer, potassium metal layer, nitrided graphene layer, graphene oxide layer, graphene layer, polytetrafluoroethylene layer, and benzamide layer, and the array unit includes one of aluminum metal array unit, potassium metal array unit, nitrided graphene array unit, graphene oxide array unit, graphene array unit, polytetrafluoroethylene array unit, and benzamide array unit.

[0067] The aforementioned metal substrate 11 provides excellent structural support. Furthermore, when the substrate 11 and the array unit 12 are made of the same metal, the bonding force between them is stronger, resulting in a more stable structural connection between the substrate 11 and the array unit 12. The aforementioned lithiophilic layer (or sodium-loving layer) has a good affinity for lithium (or sodium). During the electrochemical deposition of lithium ions (or sodium ions), the lithiophilic layer (or sodium-loving layer) can further regulate the distribution of lithium ion (or sodium ion) deposition sites, avoiding the high ion concentration and excessive ion aggregation in a localized area, as seen with planar substrates, and thus preventing uneven deposition thickness of the metallic lithium layer (or metallic sodium layer) in different areas.

[0068] Furthermore, it should be noted that, taking lithium metal anode as an example, in order to make the anode have lithium-loving properties, conventional processes such as electroplating, vapor deposition, laser drilling, and etching can be used to fabricate tin or magnesium array units on the substrate, so that the array units themselves have lithium-loving properties; alternatively, a lithium-loving layer can be formed on the substrate with array units by coating with lithium-loving materials such as polyimide or graphene oxide.

[0069] The negative electrode sheet of this application embodiment will be further described below with reference to more specific embodiments.

[0070] Example 1

[0071] This embodiment provides a lithium metal anode, comprising:

[0072] The copper current collector includes a copper foil substrate and a plurality of array units disposed on both sides of the substrate and staggered thereon. The array units are copper pillars. The array units are cuboids with a height of 35 μm along the direction perpendicular to the thickness of the substrate. The projected length of the array units on the substrate plane is 40 μm and the width is 40 μm. The thickness of the substrate is 15 μm and the spacing between adjacent array units is 20 μm.

[0073] A lithiophilic layer is formed on the substrate and array units. The lithiophilic layer is a graphene oxide material layer with a thickness of 500 nm.

[0074] The coating layer is deposited on the lithiophilic layer and is the active material layer of the lithium anode.

[0075] Example 2

[0076] The only difference between this embodiment and Embodiment 1 is that the array unit in this embodiment is a hemisphere, and the projection diameter of the array unit on the substrate plane is 40 μm.

[0077] Example 3

[0078] The only difference between this embodiment and Embodiment 1 is that the array unit in this embodiment is a cylinder, the projection diameter of the array unit on the substrate plane is 40 μm, and the height of the array unit is 35 μm.

[0079] Example 4

[0080] The only difference between this embodiment and Embodiment 1 is that: along the direction perpendicular to the substrate thickness, the height of the array unit is 50 μm, the projection length of the array unit on the substrate plane is 40 μm, the width is 40 μm, the thickness of the substrate is 15 μm, and the spacing between adjacent array units is 25 μm.

[0081] Example 5

[0082] The only difference between this embodiment and Embodiment 1 is that: along the direction perpendicular to the substrate thickness, the height of the array unit is 60 μm, the projection length of the array unit on the substrate plane is 50 μm and the width is 55 μm, the thickness of the substrate is 15 μm, and the spacing between adjacent array units is 30 μm.

[0083] Example 6

[0084] The only difference between this embodiment and Embodiment 1 is that the microstructure array in this embodiment is located on one side of the substrate.

[0085] Example 7

[0086] The only difference between this embodiment and Embodiment 1 is that the lithium metal anode in this embodiment does not contain a lithium-loving layer, and the array unit is a tin metal array unit.

[0087] Comparative Example 1

[0088] The only difference between this comparative example and Example 1 is that the copper current collector in this comparative example is a planar copper foil without array units.

[0089] The average electric field strength and average current density of the current collector in the lithium metal anodes of Examples 1 to 3 and Comparative Example 1 were simulated and calculated using finite element method software. The results are shown in Table 1 below. Figures 3 to 8 As shown.

[0090] Table 1 shows the electrical performance test results of the current collectors in Examples 1 to 3 and Comparative Example 1.

[0091]

[0092] The comparison in the table above shows that, compared to planar substrates, current collectors with array units have a stronger electric field and a weaker average current density. Furthermore, combined with... Figures 3 to 8 As shown, the current current density of the current collector with array units is higher at the bottom of the array units and relatively lower at the top. These characteristics of the array units, along with the spacing between them, ultimately result in better uniformity of the electrochemical deposition of the lithium anode active material layer. This ensures that the lithium metal anode can better avoid problems such as lithium metal dendrite formation during subsequent cycling, thus improving the stability of the lithium metal battery.

[0093] The technical solutions disclosed in the embodiments of this application have been described in detail above. Specific examples have been used to illustrate the principles and implementation methods of this application. The descriptions of the embodiments above are only for the purpose of helping to understand the technical solutions and core points of the embodiments of this application. At the same time, for those skilled in the art, there will be changes in the specific implementation methods and application scope based on the ideas of this application. Therefore, the content of this specification should not be construed as a limitation of this application.

Claims

1. A component of an electrochemical device, characterized in that, The component includes: The substrate includes a base plate and a plurality of array units, the array units protruding from at least one side surface of the base plate, and there is a spacing between any adjacent array units; A coating layer is deposited on the surface of the substrate and the array unit, the coating layer having a metallic composition; Wherein, the array unit is an array unit with metal affinity, and the metal in the coating layer is the same as the metal with which the array unit is affinity; or, the component further includes an metal affinity layer disposed between the substrate and the coating layer, the metal affinity layer covering the surface of the substrate and the array unit, the coating layer being deposited on the metal affinity layer, and the metal in the coating layer being the same as the metal with which the metal affinity layer is affinity.

2. The part according to claim 1, characterized in that, Any of the array units is at least one of a cuboid, cylinder, hemisphere, ellipsoid, pyramid, frustum, truncated cone, or cone.

3. The part according to claim 1, characterized in that, The adjacent array elements have equal spacing; or, The adjacent array cells have a gradually changing spacing.

4. The part according to claim 1, characterized in that, The substrate has a first surface and a second surface arranged opposite to each other. A plurality of array units are provided on both the first surface and the second surface, and the array units on the first surface and the array units on the second surface are arranged symmetrically or staggered.

5. The part according to claim 1, characterized in that, The spacing between adjacent array units is 20μm to 30μm.

6. The part according to claim 1, characterized in that, The height of the array unit is 20μm to 60μm; When the projection shape of the array unit on the plane of the substrate is a rectangle, the side length of the rectangle is in the range of 20μm to 60μm; or, when the projection shape of the array unit on the plane of the substrate is a circle, the diameter of the circle is in the range of 20μm to 60μm.

7. The part according to claim 1, characterized in that, The thickness of the substrate is greater than or equal to 15 μm; and / or, When the component includes the affinity metal layer, the thickness of the affinity metal layer is 100 nm to 500 nm.

8. The part according to any one of claims 1 to 7, characterized in that, The electrochemical device is an alkali metal battery, the component is an alkali metal negative electrode, the substrate is a negative electrode current collector, and the coating layer is an alkali metal negative electrode active material layer.

9. The part according to claim 8, characterized in that, The alkali metal anode is a lithium metal anode, the substrate is a copper plate, nickel plate, titanium plate or stainless steel plate, and when the component includes the metal affinity layer, the metal affinity layer is a lithiophilic layer, which includes one of a tin layer, a magnesium layer, a polyimide layer, a polyvinylidene fluoride layer, a graphene oxide layer, and a soft or hard carbon layer. The array unit is a copper array unit, a nickel array unit, a titanium array unit or a stainless steel array unit, or when the array unit is a metal affinity array unit, the array unit includes one of a tin array unit, a magnesium array unit, a polyimide array unit, a polyvinylidene fluoride array unit, a graphene oxide array unit, and a soft or hard carbon array unit. or, The alkali metal negative electrode is a sodium metal negative electrode, the substrate is a copper plate, nickel plate, titanium plate or stainless steel plate, and when the component includes the affinity metal layer, the affinity metal layer is a sodium affinity layer, which includes one of the following: aluminum metal layer, potassium metal layer, nitrided graphene layer, graphene oxide layer, graphene layer, polytetrafluoroethylene layer, and benzamide layer. The array unit is a copper array unit, nickel array unit, titanium array unit or stainless steel array unit, or when the array unit is an affinity metal array unit, the array unit includes one of the following: aluminum metal array unit, potassium metal array unit, nitrided graphene array unit, graphene oxide array unit, graphene array unit, polytetrafluoroethylene array unit, and benzamide array unit.

10. An electrochemical device, characterized in that, The electrochemical device includes the components as described in any one of claims 1 to 9, and the electrochemical device includes a metal battery, a microelectronic component, a biosensor, a capacitor, or an electrochemical solar cell.

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