Wafer placing device

Abstract

The utility model belongs to the technical field of wafers, and discloses a wafer placing device, which comprises a frame body assembly, a rotating piece and a bearing piece, wherein the rotating part is connected to the inner side of the frame body assembly, in an XY plane, the rotating part can rotate relative to the frame body assembly and stop at any position, so that the rotating part is obliquely arranged relative to the frame body assembly, a bearing part used for placing a wafer is placed on the rotating part, and a placing opening of the bearing part is obliquely and upwards placed; the wafer is placed in the supporting member through the placing opening. According to the wafer placement device provided by the utility model, the placement operation of the wafer is simple and convenient, meanwhile, ink dots on the wafer can be prevented from being adhered to the bearing piece, and other good wafers placed on the bearing piece can be prevented from being polluted by the ink dots adhered to the bearing piece, so that the test result of the wafer can be ensured to be more accurate.

Description

TECHNICAL FIELD

[0001] The utility model relates to wafer technical field especially relates to a wafer placing device. BACKGROUND

[0002] In the wafer detection step, the wafer with defects is marked with ink dots, in order to avoid the un-dried ink dots from being smeared on other wafers, the wafers after detection are placed in the flower basket. The flower basket refers to the common placing structure for storing wafers in the prior art.

[0003] Specifically, in the process of placing the un-dried wafers in the flower basket, the wafers need to be pushed to the placing position along the horizontal direction by the operator since the flower basket is usually placed horizontally, which makes the placing operation inconvenient. In addition, since there is a gap between the wafer and the placing position in the flower basket, the wafer is easy to swing during the process of being pushed into the flower basket, which causes the ink dots on the wafer to stick to the flower basket, and the ink dots sticking to the flower basket also pollute other good wafers placed in the flower basket, thereby affecting the test result of the wafer. SUMMARY

[0004] The utility model aims at providing a wafer placing device, which makes the wafer placing operation simple and convenient, and can ensure that the test result of the wafer is relatively accurate.

[0005] To achieve this purpose, the utility model adopts the following technical scheme:

[0006] The wafer placing device comprises:

[0007] A frame assembly;

[0008] A rotating member connected to the inner side of the frame assembly, which can rotate relative to the frame assembly and stop at any position in the XY plane, so that the rotating member is inclined relative to the frame assembly;

[0009] A supporting member placed on the rotating member, and the placing opening of the supporting member is inclined upward, and the wafer is placed in the supporting member through the placing opening.

[0010] As a preferred embodiment, the frame assembly comprises:

[0011] A base;

[0012] At least one connecting member connected to the base, the rotating member is placed on the base and located on one side of the connecting member, and the rotating member is rotationally connected with the connecting member.

[0013] As preferred, the rotating member is provided with a positioning screw, a limiting hole is formed in the side of the rotating member facing the connecting member, the threaded part of the positioning screw is screwed into the limiting hole, a limiting groove is formed in the connecting member in an arc shape, the light rod part of the positioning screw is slidingly connected in the limiting groove, so that the limiting groove can limit the rotating position of the rotating member, and the head of the positioning screw can abut against the outer side of the connecting member.

[0014] As preferred, the connecting member is further provided with a through hole; the rotating member comprises:

[0015] a rotating body;

[0016] at least one rotating rod, the rotating rod is protruded on the side of the rotating body close to the connecting member, and the rotating rod is rotatably connected in the through hole.

[0017] As preferred, the rotating body comprises:

[0018] a first sub-board and a second sub-board, the first sub-board and the second sub-board are connected at an angle, the adjacent two sides of the supporting member are respectively attached on the first sub-board and the second sub-board, the connecting part between the first sub-board and the second sub-board is placed on the base, and the first sub-board and the second sub-board respectively have a gap with the base, and the rotating rod is arranged in the connecting part between the first sub-board and the second sub-board.

[0019] As preferred, the first sub-board is provided with a protruding block, the bottom end of the supporting member is provided with a recess, and the protruding block can be clamped into the recess.

[0020] As preferred, the wafer placing device further comprises:

[0021] a first fixing member, the first fixing member is screwed into the rotating rod, and the head of the first fixing member can abut against the outer side of the connecting member.

[0022] As preferred, the wafer placing device further comprises:

[0023] a second fixing member, a first mounting hole is formed in the rotating body, a plurality of second mounting holes are formed in the connecting member in an interval arrangement, the arrangement shape of each second mounting hole matches the rotating track of the rotating member in the XY plane, and the second fixing member is screwed into the aligned first mounting hole and second mounting hole.

[0024] As preferred, the supporting member comprises:

[0025] a supporting body;

[0026] A plurality of support tabs are arranged in the supporting body in parallel and at equal intervals along the height direction of the supporting body, and a clamping groove is formed between two adjacent support tabs along the height direction of the supporting body, the opening of the clamping groove is the placing opening, and the depth of the clamping groove is d1, which is greater than the thickness of the wafer.

[0027] Preferably, the support tabs are arranged in the supporting body in opposition and at intervals along the length direction of the supporting body, so as to form the clamping grooves on opposite sides of the length direction of the supporting body.

[0028] The wafer placing device has the following beneficial effects:

[0029] The wafer placing device comprises a frame assembly, a rotating member and a supporting member. The rotating member is connected to the inner side of the frame assembly and can rotate relative to the frame assembly and stop at any position in the XY plane, so that the rotating member is arranged obliquely relative to the frame assembly and the supporting member for placing a wafer is placed on the rotating member. The supporting member placed on the rotating member is also placed obliquely, that is, the placing opening of the supporting member is placed obliquely upward. When the wafer is placed in the supporting member through the placing opening, the obliquely upward placed supporting member provides an obliquely downward force to the wafer, so that the wafer can automatically and slowly slide into the placing position in the supporting member, and the worker no longer needs to push the wafer along the horizontal direction to the placing position, so that the wafer placing operation is simple and convenient. Meanwhile, the wafer automatically and slowly slides into the placing position in the supporting member under the obliquely downward force, so that the contact between the wafer and the supporting member is more close, so as to avoid the wafer from swinging during the placing process, to avoid the ink dots on the wafer from adhering to the supporting member, and to avoid the adhered ink dots on the supporting member from polluting other good wafers placed on the supporting member, thereby ensuring that the test result of the wafer is more accurate. BRIEF DESCRIPTION OF DRAWINGS

[0030] Figure 1 is a structural schematic view of the wafer placing device provided by the utility model embodiment;

[0031] Figure 2 is an exploded structural schematic view of the wafer placing device provided by the utility model embodiment;

[0032] Figure 3 is a side view of the wafer placing device provided by the utility model embodiment.

[0033] In the drawings:

[0034] 1, frame assembly; 11, base; 12, connecting piece; 121, limiting groove; 122, through hole;

[0035] 2, rotating piece; 21, rotating main body; 211, first sub-plate; 212, second sub-plate; 22, rotating rod; 23, limiting hole;

[0036] 3, supporting piece; 31, supporting tab; 32, clamping groove; 33, groove. DETAILED DESCRIPTION

[0037] The utility model will be described in further detail below in combination with the drawings and embodiments. It can be understood that the specific embodiments described herein are only used to explain the utility model and are not limited to the utility model. In addition, it should be noted that only the parts related to the utility model are shown in the drawings for ease of description, not all the structures.

[0038] In the description of the utility model, unless otherwise explicitly specified and limited, the terms "connected", "connected", "fixed" should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, or it can be integrated; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the internal communication of two elements or the interaction relationship of two elements. For ordinary skilled in the art, the specific meaning of the above terms in the utility model can be understood according to the specific circumstances.

[0039] In the utility model, unless otherwise explicitly specified and limited, the first feature "on" or "below" the second feature can include that the first and second features are in direct contact, or the first and second features are not in direct contact but are in contact through another feature between them. Moreover, the first feature "on", "above" and "above" the second feature includes that the first feature is directly above and obliquely above the second feature, or only indicates that the horizontal height of the first feature is higher than that of the second feature. The first feature "below", "below" and "below" the second feature includes that the first feature is directly below and obliquely below the second feature, or only indicates that the horizontal height of the first feature is less than that of the second feature.

[0040] In the description of the embodiment, the terms "up", "down", "right", etc. orientation or position relationship is based on the orientation or position relationship shown in the drawings, only for the convenience of description and simplification of operation, and does not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, therefore it cannot be understood as a limitation on the utility model. In addition, the terms "first", "second" are only used to distinguish in the description, and have no special meaning.

[0041] As Figure 1 and Figure 2As shown, the wafer placing device in the embodiment comprises a frame assembly 1, a rotating piece 2 and a supporting piece 3; wherein the rotating piece 2 is connected to the inner side of the frame assembly 1, and in the XY plane, the rotating piece 2 can rotate relative to the frame assembly 1 and stop at any position, so that the rotating piece 2 is arranged obliquely relative to the frame assembly 1, and the supporting piece 3 is placed on the rotating piece 2, and the placing opening of the supporting piece 3 is arranged obliquely upward, and the wafer is placed in the supporting piece 3 through the placing opening.

[0042] The wafer placing device in the embodiment changes the placing mode of the wafer in the supporting piece 3 relative to the prior art; by arranging the rotating piece 2 obliquely, the supporting piece 3 placed on the rotating piece 2 is also arranged obliquely, that is, the placing opening of the supporting piece 3 is arranged obliquely upward; when the wafer is placed in the supporting piece 3 through the placing opening, since the obliquely upward arranged supporting piece 3 provides a downward inclined force to the wafer, the wafer can automatically and slowly slide into the placing position in the supporting piece 3, and the operation personnel no longer needs to push the wafer to the placing position along the horizontal direction, so that the wafer placing operation is simple and convenient; at the same time, since the wafer automatically and slowly slides into the placing position in the supporting piece 3 under the downward inclined force, the contact between the wafer and the supporting piece 3 is more close-fitting, so that the wafer can be prevented from swinging during the placing process, thereby the ink dots on the wafer can be prevented from adhering to the supporting piece 3, and the adhered ink dots on the supporting piece 3 can be prevented from polluting other good wafers placed on the supporting piece 3, and further, the test result of the wafer can be ensured to be more accurate.

[0043] Further, as shown in Figure 1 and Figure 2 , the frame assembly 1 comprises a base 11 and at least one connecting piece 12, the connecting piece 12 is connected to the base 11, the rotating piece 2 is arranged on the base 11 and located at one side of the connecting piece 12, and the rotating piece 2 is rotationally connected with the connecting piece 12. The above arrangement makes the base 11 provide a stable support platform for the connecting piece 12 and the rotating piece 2; at the same time, the rotating piece 2 is rotationally connected with the connecting piece 12, so that the rotating angle or rotating position of the rotating piece 2 can be easily adjusted, and the operation is simple.

[0044] Optionally, as shown in Figure 1 and Figure 2As shown, in the embodiment, two connecting pieces 12 are arranged on the opposite sides of the base 11 in parallel and at intervals, and both of the connecting pieces 12 are connected with the base 11. The above arrangement enables the two connecting pieces 12 to bear force on both sides of the base 11, that is, the rotating piece 2 is arranged between the two connecting pieces 12 to ensure the stability of the rotating piece 2 arranged in the frame assembly 1, and the structural stability of the wafer placing device is improved. In other embodiments, the connecting piece 12 can be arranged as one, which can meet the rotational connection of the rotating piece 2 on the connecting piece 12.

[0045] Further, as shown in Figure 1 and Figure 2 , the rotating piece 2 is provided with a positioning screw (not shown in the figure), the side of the rotating piece 2 facing the connecting piece 12 is provided with a limiting hole 23, the threaded part of the positioning screw is threadedly connected into the limiting hole 23, an arc-shaped limiting groove 121 is arranged on the connecting piece 12, the light rod part of the positioning screw is slidingly connected in the limiting groove 121, so that the limiting groove 121 can limit the rotating position of the rotating piece 2, and the head of the positioning screw can abut to the outer side of the connecting piece 12.

[0046] Specifically, when the rotating piece 2 rotates, the light rod part of the positioning screw slides in the limiting groove 121 to provide a guiding effect for the rotation of the rotating piece 2, and ensure the guiding property and stability of the rotation of the rotating piece 2; when the rotating piece 2 rotates to a specified position, the positioning screw is screwed to make the head of the positioning screw abut tightly to the outer side of the connecting piece 12, thereby fixing the position of the rotating piece 2.

[0047] By arranging the positioning screw sliding in the limiting groove 121, and the positioning screw can be screwed to abut tightly to the outer side of the connecting piece 12, the rotating range of the rotating piece 2 is strictly limited in the groove length arc range allowed by the limiting groove 121, and the rotation of the rotating piece 2 is guided, and the rotating piece 2 can be fixed at any position of the limiting groove 121, thereby enhancing the stability and reliability of the rotating piece 2 when rotating. In other embodiments, the positioning screw can not be arranged.

[0048] Further, as shown in Figure 1 and Figure 2As shown in the drawings, the connecting piece 12 is further provided with a through hole 122; the rotating piece 2 comprises a rotating main body 21 and at least one rotating rod 22, the rotating rod 22 is protruded on the side of the rotating main body 21 close to the connecting piece 12, and the rotating rod 22 is rotationally connected in the through hole 122. The above arrangement can provide support and guide for the rotation of the rotating main body 21, so that the rotating piece 2 can smoothly rotate relative to the connecting piece 12, and the cooperation between the rotating rod 22 and the through hole 122 during rotation can ensure the movement accuracy of the wafer placing device, avoiding problems such as jamming, thereby ensuring the long-term stable operation of the wafer placing device.

[0049] Optionally, as shown in the drawings, Figure 1 and Figure 2 In the embodiment, two rotating rods 22 are provided, the two rotating rods 22 are oppositely protruded on the side of the rotating main body 21 close to the connecting piece 12, and the two rotating rods 22 are both rotationally connected in the corresponding through holes 122. The above arrangement enables the two rotating rods 22 to freely rotate in the through holes 122, thereby driving the rotating main body 21 to more smoothly rotate relative to the connecting piece 12, ensuring the coordination and stability of the rotating piece 2 during rotation.

[0050] Further, as shown in the drawings, Figure 3 The rotating main body 21 comprises a first sub-plate 211 and a second sub-plate 212, the first sub-plate 211 is connected with the second sub-plate 212 at an angle, the adjacent two sides of the supporting piece 3 are respectively attached to the first sub-plate 211 and the second sub-plate 212, the connecting part between the first sub-plate 211 and the second sub-plate 212 is placed on the base 11, and the first sub-plate 211 and the second sub-plate 212 respectively have a gap with the base 11, and the rotating rod 22 is arranged on the connecting part between the first sub-plate 211 and the second sub-plate 212. Among them, one limiting hole 23 is arranged on one side of the first sub-plate 211 and one side of the second sub-plate 212 respectively.

[0051] As shown in the drawings, Figure 3 When the supporting piece 3 is placed on the rotating main body 21, the adjacent two sides of the supporting piece 3 are tightly attached to the first sub-plate 211 and the second sub-plate 212 respectively, so that the contact part between the supporting piece 3 and the rotating main body 21 is tightly attached, and the placement position of the supporting piece 3 on the rotating main body 21 is relatively stable, and the problem of shaking or swinging of the supporting piece 3 on the rotating main body 21 does not occur, thereby providing a reliable basis for subsequent wafer placement; in addition, the rotating rod 22 is arranged on the connecting part between the first sub-plate 211 and the second sub-plate 212, so that the rotating rod 22 can better play a core supporting role in the rotating process of the rotating main body 21, and provide a rotating support point for the rotating function of the wafer placing device.

[0052] As shown in the drawings, Figure 3As shown, the rotating body 21 serves as the load-bearing part of the rotating component 2, and the connection angle α of the rotating body 21 is adjustable. That is, the connection angle α between the first partition plate 211 and the second partition plate 212 is adjustable, so that the first partition plate 211 and the second partition plate 212 can be connected to form a variety of rotating bodies 21 with different structures. This allows the various rotating bodies 21 formed to be adapted to the specific structure of the support component 3, ensuring that the support components 3 with different structures can be placed on the rotating body 21, thereby making the applicability and versatility of the entire wafer placement device better.

[0053] Optionally, such as Figure 3 As shown, in this embodiment, the connection angle α between the first partition plate 211 and the second partition plate 212 is 90°, which is beneficial for adapting the placement position of the support member 3 on the first partition plate 211 and the second partition plate 212, and makes it easier to achieve standardized and precise docking. In other embodiments, the connection angle α between the first partition plate 211 and the second partition plate 212 can also be 180°, so that the first partition plate 211 and the second partition plate 212 coincide to the same horizontal plane, that is, so that one side of the support member 3 is attached to the first partition plate 211 and the second partition plate 212.

[0054] Optionally, such as Figure 2 As shown, in this embodiment, a protrusion (not shown) is provided on the first partition plate 211, and a groove 33 is provided at the bottom end of the support member 3, allowing the protrusion to engage with the groove 33. This arrangement ensures that when the support member 3 is placed on the first partition plate 211, the protrusion on the first partition plate 211 can accurately engage with the groove 33 at the bottom end of the support member 3, thereby achieving a tight connection between the support member 3 and the rotating member 2. This makes the connection between the support member 3 and the rotating member 2 more stable, thus improving the structural stability of the wafer placement device. In other embodiments, the protrusion may not be provided.

[0055] Optionally, such as Figure 2As shown, in the embodiment, the wafer placing device further comprises a first fixing member (not shown in the figure), which is screwed into the rotating rod 22 and the head of which can abut against the outer side of the connecting member 12. The first fixing member is screwed into the inside of the rotating rod 22 through screw connection, and the head of the first fixing member can abut against the outer side of the connecting member 12, so as to achieve the fastening connection between the rotating member 2 and the connecting member 12, further ensure the relative fixation between the rotating member 2 and the connecting member 12 after the rotating rod 22 stops rotating, prevent the rotating member 2 from rotating again due to external force or vibration and the like, and thus guarantee the stability of the supporting member 3 arranged on the rotating member 2, and further guarantee the accuracy and reliability in the wafer placing process. Specifically, the first fixing member is a bolt. In other embodiments, the first fixing member can also be other threaded fasteners, as long as it can achieve the fastening connection between the rotating rod 22 and the connecting member 12.

[0056] Optionally, the wafer placing device further comprises a second fixing member, a first mounting hole is formed on the rotating body 21, and a plurality of second mounting holes are formed on the connecting member 12 in a spaced arrangement, the arrangement shape of each second mounting hole matches the rotating track of the rotating member 2 in the XY plane, and the second fixing member is screwed into the aligned first mounting hole and second mounting hole. Specifically, the first mounting hole is arranged on one side of the first sub-plate 211 and one side of the second sub-plate 212.

[0057] Specifically, when the rotating body 21 is rotated to the preset position, the first mounting hole is aligned with a corresponding second mounting hole, and the second fixing member is fastened and connected through screw connection, so that the rotating body 21 is kept stationary relative to the connecting member 12, and the supporting member 3 placed on the rotating body 21 is kept stable, which can avoid the wafer placed in the supporting member 3 from shaking, and thus can avoid the ink dots on the wafer from adhering to the supporting member 3, and further achieve the structural stability of the wafer placing device.

[0058] Further, as shown in Figs. 1 and 2, Figure 1 and Figure 2 the supporting member 3 comprises a supporting body and a plurality of supporting protrusions 31, the plurality of supporting protrusions 31 are arranged in parallel and at equal intervals in the height direction of the supporting body, and a clamping groove 32 is formed between two adjacent supporting protrusions 31 in the height direction of the supporting body. The slot of the clamping groove 32 is the placing opening of the supporting member 3, the groove depth of the clamping groove 32 is d1, and the groove depth d1 of the clamping groove 32 is greater than the thickness of the wafer. The wafer is ensured to be in a stable placing state in the clamping groove 32, and will not be unstable due to the clamping groove 32 being too shallow. The recess 33 is arranged at the bottom end of the supporting body.

[0059] By setting multiple support tabs 31 arranged in parallel along the height direction of the supporting body, and the interval distance between every two adjacent support tabs 31 is equal, the structural uniformity and stability of the supporting piece 3 are ensured; in addition, the slot depth d1 of the clamping groove 32 is greater than the thickness of the wafer, when the wafer is placed in the clamping groove 32, because the clamping groove 32 has enough slot depth space, it can ensure that the wafer is stably contained in the clamping groove 32, avoiding the problem of extrusion damage during the process of placing the wafer in the clamping groove 32, thereby ensuring the safety and reliability in the whole placing and supporting process.

[0060] Further, as shown in Figure 1 and Figure 2 , along the length direction of the supporting body, that is, the direction perpendicular to the XY plane, the support tabs 31 are oppositely and spacedly arranged in the supporting body, so as to form clamping grooves 32 on the opposite sides of the length direction of the supporting body. The above arrangement makes the supporting piece 3 support the opposite sides of the wafer through the clamping grooves 32 formed on the two sides when placing the wafer, avoiding the problem of uneven placement of the wafer in the supporting piece 3, ensuring that the supporting piece 3 has good supporting stability effect on the wafer, and further preventing the ink dots on the packaged wafer from polluting the supporting piece 3 or other good wafers placed on the supporting piece 3.

[0061] Obviously, the above embodiments of the utility model are only examples for clearly illustrating the utility model, and are not a limitation on the embodiments of the utility model. For ordinary skilled in the art, various obvious changes, readjustment and replacement can be made without departing from the protection scope of the utility model. Here, it is not necessary and impossible to enumerate all the embodiments. Any modification, equivalent replacement and improvement made within the spirit and principle of the utility model should be included in the protection scope of the utility model claim.

Claims

1. A wafer placement device, characterized by, The application relates to a wafer placing device. The wafer placing device comprises: a frame assembly (1); a rotating piece (2) connected to the inner side of the frame assembly (1), which can rotate relative to the frame assembly (1) in an XY plane and stop at any position, so that the rotating piece (2) is arranged to be inclined relative to the frame assembly (1); 2. The wafer placement device of claim 1, wherein, a supporting piece (3) placed on the rotating piece (2), and the placing opening of the supporting piece (3) is arranged to be inclined upward, and a wafer is placed in the supporting piece (3) through the placing opening. The frame assembly (1) comprises: a base (11); 3. The wafer placement device of claim 2, wherein, at least one connecting piece (12) connected to the base (11), the rotating piece (2) is arranged on the base (11) and located on one side of the connecting piece (12), and the rotating piece (2) is rotationally connected with the connecting piece (12).

4. The wafer placement device according to claim 2 or 3, wherein The rotating piece (2) is provided with a positioning screw rod, the rotating piece (2) is provided with a limiting hole (23) on the side surface facing the connecting piece (12), the threaded part of the positioning screw rod is threadedly connected into the limiting hole (23), the connecting piece (12) is provided with an arc-shaped limiting groove (121), the light rod part of the positioning screw rod is slidingly connected into the limiting groove (121), so that the limiting groove (121) can limit the rotating position of the rotating piece (2), and the head part of the positioning screw rod can abut to the outer side surface of the connecting piece (12). The connecting piece (12) is further provided with a through hole (122); the rotating piece (2) comprises: a rotating main body (21); 5. The wafer placement apparatus of claim 4, wherein at least one rotating rod (22) protruding from the side of the rotating main body (21) close to the connecting piece (12), and the rotating rod (22) is rotationally connected into the through hole (122). The rotating main body (21) comprises:

6. The wafer placement apparatus of claim 5, wherein a first sub-plate (211) and a second sub-plate (212) connected at an angle, adjacent two side surfaces of the supporting piece (3) are respectively attached to the first sub-plate (211) and the second sub-plate (212), the connecting part between the first sub-plate (211) and the second sub-plate (212) is arranged on the base (11), and the first sub-plate (211) and the second sub-plate (212) respectively have gaps with the base (11), and the rotating rod (22) is arranged on the connecting part between the first sub-plate (211) and the second sub-plate (212).

7. The wafer placement apparatus of claim 4, wherein The first sub-plate (211) is provided with a protruding block, the bottom end of the supporting piece (3) is provided with a recess (33), and the protruding block can be clamped into the recess (33). The wafer placing device further comprises:

8. The wafer placement apparatus of claim 4, wherein, a first fixing piece threadedly connected into the rotating rod (22), and the head part of the first fixing piece can abut to the outer side surface of the connecting piece (12). The wafer placing device further comprises: A second fixing member, a first mounting hole is formed on the rotating body (21), a plurality of second mounting holes are formed on the connecting member (12) and arranged at intervals, the arrangement shape of each second mounting hole matches the rotating track of the rotating member (2) in the XY plane, and the second fixing member is threadedly connected to the aligned first mounting hole and second mounting hole.

9. The wafer placement device of any of claims 1-3, wherein, The supporting member (3) comprises: a supporting body; a plurality of supporting tabs (31), a plurality of supporting tabs (31) are arranged in parallel and at equal intervals in the height direction of the supporting body in the supporting body, and a clamping groove (32) is formed between two adjacent supporting tabs (31) in the height direction of the supporting body, the opening of the clamping groove (32) is the placing opening, the groove depth of the clamping groove (32) is d1, and the groove depth d1 of the clamping groove (32) is greater than the thickness of the wafer.

10. The wafer placement apparatus of claim 9, wherein, In the length direction of the supporting body, the supporting tabs (31) are oppositely and intervally arranged in the supporting body to form the clamping grooves (32) on the opposite sides of the supporting body in the length direction.

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