Projector with high heat dissipation performance

Abstract

The utility model relates to the technical field of projectors, and discloses a projector with high heat dissipation performance, which comprises a projector main body, a heat dissipation part and a semiconductor cooling part, a heat dissipation fan is arranged on one side of a heat conduction seat, and the lower end of a projection piece is connected onto the heat conduction seat. Heat generated by the light source part of the projection part can be conducted through the heat conduction seat, the heat is blown out of the outer shell through the cooling fan installed on one side of the heat conduction seat, meanwhile, the cooling fan can discharge the heat generated by the light source part of the projection part during working, and the semiconductor cooling part is installed on one side of the lower end of the outer shell. According to the projector, a low-temperature area is formed at the cold end of the semiconductor chilling plate for cooling, and the cooling fan extracts cold air at the cold end during working, so that the cold air flows through the light source part, the heat dissipation performance of the projector is better, and the phenomenon that internal elements are damaged due to too high temperature can be effectively avoided.

Description

TECHNICAL FIELD

[0001] The utility model relates to a projector technical field especially is related to a high heat dissipation projector. BACKGROUND

[0002] The projector is also called a projector, and is a device that can project an image or video onto a screen cloth, and can be connected to a computer, VCD, DVD, BD, game console, DV and the like through different interfaces to play corresponding video signals.

[0003] The existing projector generates a large amount of heat when in use, but the heat dissipation performance of the existing projector is low, and the high temperature can damage the internal components, and the heat can only be discharged from the projector shell through the fan, and the shell cannot be effectively cooled, and a high heat dissipation projector is needed. UTILITY MODEL CONTENT

[0004] The utility model provides a kind of high heat dissipation projector, to solve the problem that the heat dissipation performance of the existing projector in prior art is low when in use, and the heat can only be discharged from the projector shell through the fan, and the shell cannot be effectively cooled.

[0005] The technical problem solved by the utility model is realized by the following technical scheme:

[0006] A kind of high heat dissipation projector, comprising:

[0007] The projector main body includes an outer shell and a projection element arranged in the outer shell.

[0008] The heat dissipation part is arranged on one side of the outer shell, and the heat dissipation part includes a heat-conducting seat connected to the lower end of the projection element and a heat dissipation fan installed on one side of the heat-conducting seat.

[0009] The semiconductor cooling part is installed on one side of the lower end of the outer shell, and the semiconductor cooling part includes a frame seat for connecting the outer shell and a semiconductor refrigerating sheet installed in the frame seat.

[0010] In a specific embodiment, the rear end of the outer shell is provided with an air-permeable opening, the front end of the outer shell is provided with a heat dissipation opening, and a partition plate is arranged in the outer shell.

[0011] In a specific embodiment, the projection device comprises an LED matrix light source installed at the lower end inside the outer shell and a reflecting plane mirror arranged at the upper end inside the outer shell, and a lens is installed at the front end of the outer shell.

[0012] In a specific embodiment, the lower end of the LED matrix light source is provided with a thermal interface pad seat.

[0013] In a specific embodiment, the thermal interface pad seat is a member made of copper material.

[0014] In a specific embodiment, the heat-conducting seat comprises a base and a connecting elbow pipe connected to the lower end of the base, and the other end of the connecting elbow pipe is provided with a second fin, and the connecting elbow pipe is inserted into the second fin.

[0015] In a specific embodiment, the heat-conducting seat is a member made of copper material.

[0016] In a specific embodiment, the heat-conducting seat and the LED matrix light source are arranged on the two sides of the partition plate respectively, and the lower end of the partition plate is provided with a communication port.

[0017] The utility model has the beneficial effect that:

[0018] The heat-conducting seat is a member made of copper material. BRIEF DESCRIPTION OF DRAWINGS

[0019] In order to more clearly illustrate the technical scheme in the embodiments of the utility model or the prior art, the drawings needed in the description of the embodiments or the prior art will be briefly introduced below, and obviously, the drawings in the following description are only some embodiments of the utility model, and for those skilled in the art, other drawings can be obtained according to these drawings without creative labor.

[0020] Figure 1 It is the whole structure schematic diagram of the utility model.

[0021] Figure 2 It is the internal structure schematic diagram of the outer shell of the utility model.

[0022] Figure 3 The utility model discloses a heat dissipation part structure schematic view.

[0023] Figure 4 The utility model discloses a semiconductor cooling part structure schematic view.

[0024] Figure 5 The utility model discloses a projector main body and heat dissipation part structure schematic view.

[0025] In the drawing: 100, projector main body;110, outer shell;111, air permeation opening;112, heat dissipation opening;113, partition plate;120, projection element;121, LED matrix light source;101, heat interface board seat;122, reflection plane mirror;123, lens;200, heat dissipation part;210, heat conduction seat;211, base;212, connecting elbow pipe;213, second fin;220, heat dissipation fan;300, semiconductor cooling part;310, frame seat;320, semiconductor refrigeration piece;330, first fin. DETAILED DESCRIPTION

[0026] In order to make the purpose, technical scheme and advantage of the embodiments of the present application more clear, the technical scheme in the embodiments of the present application will be described clearly and completely below in combination with the drawings in the embodiments of the present application. Obviously, the described embodiments are some of the embodiments of the present application, but not all the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work belong to the scope of protection of the present application.

[0027] Therefore, the following detailed description of the embodiments of the present application provided in the drawings is not intended to limit the scope of the claimed present application, but only represents selected embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work belong to the scope of protection of the present application.

[0028] It should be noted that: similar signs and letters represent similar items in the following drawings, so once an item is defined in one drawing, it does not need to be further defined and explained in the subsequent drawings.

[0029] In the description of the present application, it needs to be understood that the orientation or positional relationship indicated by the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise" and the like are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application.

[0030] In addition, the terms "first", "second" are only for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the technical features indicated. Therefore, the features defined with "first", "second" can explicitly or implicitly include one or more of the features. In the description of the present application, the meaning of "multiple" is two or more, unless otherwise explicitly specified and limited.

[0031] In the present application, unless otherwise explicitly specified and limited, the terms "mounting", "connecting", "connecting", "fixing" and the like should be understood broadly, for example, it can be fixed connection, or detachable connection, or integral; it can be directly connected, or indirectly connected through an intermediate medium; it can be the internal communication of two elements or the interaction relationship of two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0032] In the present application, unless otherwise explicitly specified and limited, the first feature "on" or "under" the second feature can include that the first and second features are in direct contact, or that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, the first feature "on", "above" and "on" the second feature includes that the first feature is directly above and obliquely above the second feature, or only indicates that the horizontal height of the first feature is higher than that of the second feature. The first feature "under", "below" and "under" the second feature includes that the first feature is directly below and obliquely below the second feature, or only indicates that the horizontal height of the first feature is less than that of the second feature.

[0033] Referring to Figures 1-5 The utility model provides a kind of high heat dissipation projector, comprising:

[0034] Projector main body 100, projector main body 100 includes shell body 110 and the projection piece 120 being set in shell body 110;

[0035] The heat dissipation part 200 is arranged at the inner side of the outer shell 110, and comprises a heat conduction seat 210 connected with the lower end of the projection part 120 and a heat dissipation fan 220 arranged at one side of the heat conduction seat 210.

[0036] The semiconductor cooling part 300 is arranged at the lower end of the outer shell 110, and comprises a frame seat 310 for connecting with the outer shell 110 and a semiconductor refrigeration sheet 320 arranged in the frame seat 310. The cold end of the semiconductor refrigeration sheet 320 faces the inner side of the outer shell 110, and the hot end of the semiconductor refrigeration sheet 320 faces the outer side of the outer shell 110. A first fin 330 is arranged on the cold end of the semiconductor refrigeration sheet 320, which greatly increases the area of the cold end of the semiconductor refrigeration sheet 320.

[0037] The heat dissipation fan 220 is arranged at one side of the heat conduction seat 210, and the lower end of the projection part 120 is connected with the heat conduction seat 210. During use, the heat generated by the light source part of the projection part 120 can be conducted through the heat conduction seat 210 and blown out of the outer shell 110 by the heat dissipation fan 220 arranged at one side of the heat conduction seat 210. At the same time, the heat dissipation fan 220 can also exhaust the heat generated by the light source part of the projection part 120 when working. The semiconductor cooling part 300 is arranged at the lower end of the outer shell 110, and a low-temperature area is formed at the cold end of the semiconductor refrigeration sheet 320 for cooling. The cold air at the cold end is drawn away by the heat dissipation fan 220 when working, so that the cold air flows through the light source part, greatly reducing the temperature of the light source part, and making the heat dissipation of the projector better and effectively preventing the damage of internal components caused by high temperature.

[0038] Further preferably, the rear end of the outer shell 110 is provided with an air passage 111, the front end of the outer shell 110 is provided with a heat dissipation opening 112, and a partition plate 113 is arranged in the outer shell 110.

[0039] Further preferably, the projection part 120 comprises an LED matrix light source 121 arranged at the lower end of the inner side of the outer shell 110 and a reflecting plane mirror 122 arranged at the upper end of the inner side of the outer shell 110, and a lens 123 is arranged at the front end of the outer shell 110.

[0040] Further, the lower end of the LED matrix light source 121 is provided with a thermal interface plate seat 101.

[0041] Further, the thermal interface plate seat 101 is a component made of copper material.

[0042] As a further preferred embodiment of the above, the heat-conducting seat 210 comprises a base 211 and a connecting elbow 212 connected to the lower end of the base 211, the other end of the connecting elbow 212 is provided with a second fin 213, and the connecting elbow 212 is inserted into the second fin 213.

[0043] Further, the heat-conducting seat 210 is a member made of copper material.

[0044] The heat-conducting seat 210 and the LED matrix light source 121 are respectively arranged on both sides of the partition plate 113, and the lower end of the partition plate 113 is provided with a communication opening.

[0045] The heat-conducting seat 210 and the LED matrix light source 121 are respectively arranged on both sides of the partition plate 113, and the lower end of the partition plate 113 is provided with a communication opening.

[0046] The basic principle and main features of the present application and the advantages of the present application are shown and described above. Those skilled in the art should understand that the present application is not limited by the above examples, and the above examples and descriptions in the specification are only to illustrate the principles of the present application. Without departing from the spirit and scope of the present application, various changes and improvements can be made to the present application, and these changes and improvements all fall within the scope of the present application. The scope of protection of the present application is defined by the appended claims and their equivalents.

Claims

1. A high heat dissipating projector, characterized by, The utility model relates to a kind of projection device, including: Projector body (100), the projector body (100) includes outer shell (110) and the projection piece (120) being arranged in the outer shell (110) inside; Heat dissipation part (200), the heat dissipation part (200) is arranged in the inner side of the outer shell (110), the heat dissipation part (200) includes the heat conduction seat (210) being connected with the lower end of the projection piece (120) and the heat dissipation fan (220) being installed in the heat conduction seat (210) side; Semiconductor cooling part (300), the semiconductor cooling part (300) is installed in the lower end side of the outer shell (110), the semiconductor cooling part (300) includes the frame seat (310) for the outer shell (110) connection and the semiconductor refrigeration sheet (320) being installed in the frame seat (310), the cold end of the semiconductor refrigeration sheet (320) is towards outer shell (110) inside, the hot end of the semiconductor refrigeration sheet (320) is towards outer shell (110) outside, first fin (330) is installed on the cold end of the semiconductor refrigeration sheet (320).

2. The high heat dissipating projector according to claim 1, wherein: The rear end of the outer shell (110) is provided with air-permeable opening (111), the front end of the outer shell (110) is provided with heat dissipation opening (112), and the outer shell (110) is provided with partition plate (113).

3. The high heat dissipating projector according to claim 2, wherein: The projection piece (120) includes LED matrix light source (121) being installed in the lower end of outer shell (110) and reflection plane mirror (122) being arranged in the upper end of the outer shell (110), and the front end of the outer shell (110) is provided with lens (123).

4. The high heat dissipating projector of claim 3, wherein: The lower end of the LED matrix light source (121) is provided with thermal interface plate seat (101).

5. The high heat dissipating projector of claim 4, wherein: The thermal interface plate seat (101) is a component made of copper material.

6. The high heat dissipating projector of claim 5, wherein: The heat conduction seat (210) includes base (211) and connecting elbow pipe (212) being connected in the lower end of the base (211), the other end of the connecting elbow pipe (212) is provided with second fin (213), and the connecting elbow pipe (212) is inserted in the second fin (213).

7. The high heat dissipating projector of claim 6, wherein: The heat conduction seat (210) is a component made of copper material.

8. The high heat dissipating projector of claim 7, wherein: The heat conduction seat (210) and LED matrix light source (121) are respectively arranged in the two sides of the partition plate (113), and the lower end of the partition plate (113) is provided with communication port.

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