Direct collection type integrated busbar

Abstract

A direct acquisition type integrated busbar comprises a support, a flexible circuit board arranged on the support and a plurality of diversion members, the flexible circuit board comprises a base material, a front insulation protection film and a back insulation protection film, the base material comprises a base material main body and a plurality of acquisition branches integrally formed on two sides of the base material main body, the free end of each acquisition branch is an acquisition end, and the free end of each acquisition branch is a flexible end. One collection end is fixed with one corresponding flow guide piece through ultrasonic welding, the base material is coated with the positive insulation protection film and the back insulation protection film, and the collection ends are completely exposed. Compared with the prior art, the direct acquisition type integrated busbar provided by the utility model has the advantages that the substrate main body and the acquisition branches are integrally formed, and ultrasonic welding is combined, so that not only is the difficulty of a connection process reduced, but also the connection performance of the acquisition ends and the convergence pieces can be ensured.

Description

Technical Field

[0001] This utility model belongs to the field of integrated busbar technology, specifically relating to a direct-source integrated busbar. Background Technology

[0002] In the field of new energy power and energy storage battery technology, the acquisition of voltage and temperature data of battery modules is a key link to ensure battery safety and performance. Therefore, battery modules are equipped with integrated busbars to detect their data and ensure safe use.

[0003] The integrated busbar mainly consists of a support frame and FPCs and aluminum batteries mounted on the support frame. The FPC's acquisition branches have nickel strips that connect to the aluminum batteries, which in turn connect to the battery cells, thus enabling the integrated busbar's data acquisition function. However, existing FPCs require nickel strips to be mounted on the acquisition branches, necessitating welding these strips to the acquisition branches. This increases the complexity of the manufacturing process and may lead to welding defects, directly impacting the reliability and production efficiency of the battery module. Utility Model Content

[0004] The purpose of this utility model is to overcome the shortcomings of the existing technology and provide a direct-source integrated busbar.

[0005] To achieve the above objectives, this utility model discloses a direct-sampling integrated busbar, including a support, a flexible circuit board mounted on the support, and multiple flow guides. The flexible circuit board includes a substrate, a positive insulating protective film, and a back insulating protective film. The substrate includes a substrate body and multiple collection branches integrally formed on both sides of the substrate body. The free end of each collection branch is a collection end. Each collection end is fixed to a corresponding flow guide by ultrasonic welding. The positive insulating protective film and the back insulating protective film cover the substrate and completely expose the collection end.

[0006] Preferably, the acquisition branch includes a buffer arm and an acquisition end. One end of the buffer arm is connected to the substrate body, and the other end is connected to the acquisition end. The buffer arm is curved.

[0007] Preferably, the buffer arm is stepped.

[0008] Preferably, the acquisition end is polygonal or circular.

[0009] Preferably, the area of ​​the acquisition end is 14 mm². 2 ~18mm 2 .

[0010] Preferably, a connector is inserted into the flexible circuit board.

[0011] Preferably, the substrate is copper foil.

[0012] Compared with the prior art, the beneficial effects of this utility model are as follows:

[0013] In this invention, the substrate of the flexible circuit board includes a substrate body and multiple acquisition branches integrally formed on both sides of the substrate body. The free end of each acquisition branch is an acquisition end connected to the current guide. Thus, it is only necessary to weld to the current guide through the acquisition end, eliminating the need for traditional nickel sheets. Compared with the traditional nickel sheet acquisition structure, this reduces the process of connecting the nickel sheet to the flexible circuit board, lowers the process difficulty, avoids the problem of poor welding that may occur during the welding process, and improves the reliability and production efficiency of the battery module.

[0014] One acquisition end and its corresponding current guide are fixed together by ultrasonic welding. Positive and negative insulating protective films cover the substrate, ensuring the insulation performance of the main structure of the flexible circuit board. The acquisition end is completely exposed, and the free ends of the acquisition branches can be used entirely for connection with the current guide. This reduces the precision requirements of the equipment, lowers costs, and avoids the problem of welding to the insulating protective film during the welding process when only a part of the acquisition end is exposed (the outer side of the connection position is covered by an insulating protective film), resulting in poor welding and low product yield. It also prevents molten material from the insulating protective film from seeping into the welding area, forming impurities or weaknesses that affect the structural integrity of the solder joint. Furthermore, since ultrasonic welding generates significant heat, the complete exposure of the acquisition end also prevents thermal damage to the insulating protective film caused by partial exposure, which could affect the membrane's function. Attached Figure Description

[0015] Figure 1 This is a top view of the direct-access integrated busbar in the embodiment;

[0016] Figure 2 for Figure 1 A three-dimensional exploded structure diagram of the direct-source integrated busbar;

[0017] Bracket 1;

[0018] Flexible circuit board 2; substrate 21; substrate body 211; acquisition branch 212; buffer arm 2121; acquisition end 2122; connector 22; insertion hole 221;

[0019] 3. Flow guide. Detailed Implementation

[0020] To make the above-mentioned objectives, features and advantages of this utility model more apparent and understandable, the utility model will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0021] A type of direct-source integrated busbar, see Figure 1 It includes a support 1, a flexible circuit board 2 mounted on the support 1, and multiple flow guides 3. These structures are existing structures and will not be described in detail here.

[0022] The flexible circuit board 2 includes a substrate 21, a positive insulating protective film, and a back insulating protective film. The substrate 21 is preferably copper foil. It includes a substrate body 211 and multiple acquisition branches 212 integrally formed on both sides of the substrate body 211. The free end of each acquisition branch 212 is an acquisition end 2122 connected to the current guide 3. In this way, it can be welded to the current guide 3 only through the acquisition end 2122, eliminating the need for traditional nickel sheets. Compared with the traditional nickel sheet acquisition structure, it reduces the process of connecting the nickel sheet to the flexible circuit board 2, reduces the process difficulty, avoids the problem of poor welding during the welding process, and improves the reliability and production efficiency of the battery module. A data acquisition end 2122 is fixed to a corresponding flow guide 3 by ultrasonic welding. A positive and a back insulating protective film cover the substrate 21, ensuring the insulation performance of the main structure of the flexible circuit board 2. The data acquisition end 2122 is completely exposed, and the free ends of the acquisition branches 212 can be used entirely for connection to the flow guide 3. This reduces the equipment's processing precision requirements, lowers costs, and avoids the problem of welding to the insulating protective film during the welding process when only a portion of the data acquisition end 2122 is exposed (the outer side of the connection location has an insulating protective film), resulting in poor welding and low product yield. It also prevents molten material from the insulating protective film from seeping into the welding area, forming impurities or weaknesses that affect the structural integrity of the weld joint. Furthermore, since ultrasonic welding generates significant heat, the complete exposure of the data acquisition end 2122 also avoids thermal damage to the insulating protective film caused by partial exposure, which could affect the film's function.

[0023] In this embodiment, the acquisition branch 212 includes a buffer arm 2121 and an acquisition end 2122. One end of the buffer arm 2121 is connected to the substrate body 211, and the other end is connected to the acquisition end 2122. The buffer arm 2121 is curved. The curved buffer arm 2121 can not only buffer the displacement caused by the expansion of the battery cell and avoid damage to the connection between the acquisition end 2122 and the current guide 3, but also buffer the acquisition branch 212 itself during the ultrasonic welding process to prevent the acquisition branch 212 from being pulled and broken due to the force applied to the acquisition branch 212 during the welding process.

[0024] In this embodiment, the buffer arm 2121 is stepped.

[0025] In this embodiment, the acquisition end 2122 is polygonal or circular, with an area of ​​14 mm². 2 ~18mm 2 Preferably 16mm 2 Within this area, the acquisition end 2122 can be guaranteed to have sufficient area to connect with the guide component 3, reducing equipment requirements, while avoiding the problem of the acquisition end 2122 tilting after connection due to excessively large area.

[0026] In this embodiment, see Figure 2 A connector 22 is inserted into the flexible circuit board 2. In the traditional way, the connector 22 is connected and fixed to the flexible circuit board 2 by SMT reflow soldering process. In this embodiment, the connection between the flexible circuit board 2 and the connector 22 is achieved by insertion, which reduces the assembly difficulty and cost, and also facilitates later maintenance.

[0027] Specifically, the insertion hole 221 of the connector 22 is interference-fitted with the flexible circuit board 2.

[0028] Obviously, the above embodiments of this utility model are merely examples for clearly illustrating this utility model, and are not intended to limit the implementation of this utility model. Those skilled in the art can make other variations or modifications based on the above description. It is neither necessary nor possible to exhaustively describe all embodiments here. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this utility model should be included within the protection scope of the claims of this utility model.

Claims

1. A direct-sampling integrated busbar, comprising a support, a flexible circuit board arranged on the support, and a plurality of flow guides, the flexible circuit board comprising a substrate, a front insulating protective film, and a back insulating protective film, characterized in that: The substrate comprises a substrate body and a plurality of collection branches integrally formed on both sides of the substrate body, a free end of each collection branch being a collection end, one collection end being fixed with a corresponding flow guide through ultrasonic welding, and the front and back insulation protective films covering the substrate and leaving the collection ends completely exposed.

2. The direct- platen integrated busbar according to claim 1, characterized in that: The collection branch comprises a buffer arm and a collection end, one end of the buffer arm being connected with the substrate body and the other end being connected with the collection end, and the buffer arm being curved.

3. The direct- platen integrated busbar according to claim 2, characterized in that: The buffer arm is in a stepped shape.

4. The direct- platen integrated busbar according to claim 2, characterized in that: The collection end is in a polygonal or circular shape.

5. The direct- platen integrated busbar of claim 1, wherein: The area of the collection end is 14mm 2 ~ 18mm 2 .

6. The direct- platen integrated busbar according to any one of claims 1-5, characterized in that: The flexible circuit board is inserted with a connector.

7. The direct- platen integrated busbar according to any one of claims 1-5, characterized in that: The substrate is a copper foil.

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