DC-DC seamless switching circuit

Abstract

The utility model relates to a DC-DC seamless switching circuit. The DC-DC seamless switching circuit comprises a first power supply module, a main control chip and a second power supply module, the first power supply module comprises a first battery interface, a first power supply unit and a boost unit, the first battery interface is electrically connected with the first power supply unit, and the boost unit is electrically connected with the power supply unit; the main control chip is electrically connected with the boosting unit; and the second power supply module comprises a second power supply unit, and the second power supply unit is electrically connected with the main control chip. According to the scheme provided by the invention, battery power supply can be seamlessly switched, and the equipment is ensured not to be interrupted during live broadcast or shooting.

Description

TECHNICAL FIELD

[0001] The utility model relates to circuit design technical field especially relates to a DC-DC seamless switching circuit. BACKGROUND

[0002] At present, because the time is longer, so need equipment to work unceasingly, and then need equipment to have sufficient power, can maintain the shooting or live broadcast.

[0003] In the related art, the device is generally powered by replacing the battery, however, the device will be powered off for a short time during the replacement of the battery, thereby affecting the shooting or live broadcast effect. UTILITY MODEL CONTENTS

[0004] The utility model aims at overcoming the insufficient in prior art, provide a DC-DC seamless switching circuit, can seamlessly switch battery power supply, guarantee equipment when live broadcast or shoot not to interrupt.

[0005] The utility model aims at realizing through following technical scheme:

[0006] The first aspect of the application provides a DC-DC seamless switching circuit, comprising: a first power module, including a first battery interface, a first power supply unit and a boost unit, the first battery interface is electrically connected with the first power supply unit, the boost unit is electrically connected with the power supply unit;Master control chip, electrically connected with the boost unit;Second power module, including a second power supply unit, the second power supply unit is electrically connected with the master control chip.

[0007] The first power supply unit includes: MOS tube Q1, MOS tube Q2, resistance R1, resistance R2 and resistance R3, the MOS tube Q1 is electrically connected with the first battery interface, the MOS tube Q2 is electrically connected with the MOS tube Q1, the first end of the resistance R1 is electrically connected with the MOS tube Q1, the second end of the resistance R1 is electrically connected with the first end of the resistance R3, the first end of the resistance R2 is electrically connected with the MOS tube Q1 and the MOS tube Q2 respectively, the second end of the resistance R2 is electrically connected with the first end of the resistance R1.

[0008] The first power supply unit further includes a triode Q3, the capacitor C1, resistance R5 and resistance R4, the triode Q3 is electrically connected with the second end of the resistance R3, the first end of the capacitor C1 is electrically connected with the triode Q3, the second end of the capacitor C1 is grounded, the first end of the resistance R5 is electrically connected with the capacitor C1, the second end of the resistance R5 is electrically connected with the first end of the resistance R4, the second end of the resistance R4 is electrically connected with the master control chip.

[0009] The voltage boosting unit comprises a voltage boosting chip U1, a resistor R10, a MOS tube Q4, a diode D1, a resistor R11, a diode D2, a MOS tube Q5 and an inductor L1, the first end of the diode D1 and the first end of the diode D2 are electrically connected with the voltage boosting chip U1 respectively, the first end of the resistor R10 and the first end of the resistor R11 are electrically connected with the voltage boosting chip U1 respectively, the second end of the resistor R10 is electrically connected with the second end of the diode D1, the second end of the resistor R11 is electrically connected with the second end of the diode D2, the second end of the diode D1 is also electrically connected with the MOS tube Q4, the second end of the diode D2 is also electrically connected with the second end of the MOS tube Q5, the inductor L1 is electrically connected with the MOS tube Q4 and the MOS tube Q5 respectively.

[0010] The voltage boosting unit further comprises a capacitor EC1, a capacitor C2, a capacitor C3 and a capacitor C4, the first end of the capacitor EC1 is electrically connected with the MOS tube Q2 and the first end of the capacitor C2 respectively, the second end of the capacitor EC1 is electrically connected with the second end of the capacitor C2, the first end of the capacitor C3 is electrically connected with the first end of the capacitor C4 and the first end of the capacitor C2 respectively, the second end of the capacitor C3 is electrically connected with the second end of the capacitor C4 and the second end of the capacitor C2 respectively, the second end of the capacitor C4 is grounded.

[0011] The voltage boosting unit further comprises a resistor R71, a resistor R7, a resistor R6 and a resistor R8, the first end of the resistor R71 is electrically connected with the first end of the resistor R7, the second end of the resistor R71 is electrically connected with the second end of the resistor R7, the first end of the resistor R7 is also electrically connected with the first end of the capacitor C4, the second end of the resistor R7 is also electrically connected with the first end of the inductor L1, the first end of the resistor R6 is electrically connected with the first end of the resistor R7, the second end of the resistor R6 is electrically connected with the voltage boosting chip U1, the first end of the resistor R8 is electrically connected with the second end of the resistor R7, the second end of the resistor R8 is electrically connected with the voltage boosting chip U1.

[0012] The second power supply unit comprises a second battery interface, a diode D3 and a MOS tube Q8, the second battery interface is electrically connected with the first end of the diode D3, the second battery interface is also electrically connected with the MOS tube Q8, the first end of the diode D3 is also electrically connected with the MOS tube Q8.

[0013] The second power supply unit further comprises a resistor R28, a resistor R27 and a resistor R29, a first end of the resistor R28 is electrically connected with a second end of the diode D3, a second end of the resistor R28 is electrically connected with a first end of the resistor R27, a second end of the resistor R27 is electrically connected with the MOS tube Q8, and a first end of the resistor R29 is electrically connected with the second end of the resistor R28.

[0014] The second power supply unit further comprises a triode Q9 and a capacitor C13, the triode Q9 is electrically connected with the second end of the resistor R29, a first end of the capacitor C13 is electrically connected with the triode Q9, and a second end of the capacitor C13 is grounded.

[0015] The second power supply unit further comprises a resistor R31 and a resistor R30, a first end of the resistor R31 is electrically connected with a first end of the resistor R30, a second end of the resistor R31 is grounded, and a second end of the resistor R30 is electrically connected with the master control chip.

[0016] Compared with the prior art, the utility model has at least the following advantages:

[0017] The first power module and the second power module are two power supplies, and can be used for power supply. BRIEF DESCRIPTION OF DRAWINGS

[0018] In order to more clearly illustrate the technical scheme of the embodiment of the utility model, the following will be briefly introduced the drawings needed to be used in the embodiment.

[0019] Figure 1 It is the function module diagram of DC-DC seamless switching circuit in an embodiment of the utility model;

[0020] Figure 2 It is the circuit diagram of the first power module and the second power module in an embodiment of the utility model;

[0021] Figure 3 It is the circuit diagram of the master control chip in an embodiment of the utility model. DETAILED DESCRIPTION

[0022] The embodiments of the application will be described in detail below with reference to the drawings. Although the embodiments of the application are shown in the drawings, it should be understood that the application can be implemented in various forms and should not be limited by the embodiments described herein. On the contrary, these embodiments are provided to make the application more thorough and complete, and to fully convey the scope of the application to those skilled in the art.

[0023] It should be understood that, although the terms "first", "second", "third", etc. can be used in this application to describe various information, these information should not be limited to these terms. These terms are only used to distinguish the same type of information from each other. For example, the first information can also be referred to as the second information, and similarly, the second information can also be referred to as the first information without departing from the scope of the application. Therefore, the features defined with "first", "second" can explicitly or implicitly include one or more of the features. In the description of this application, the meaning of "a plurality of" is two or more, unless otherwise explicitly and specifically limited.

[0024] Unless otherwise expressly specified and limited, the terms "mounting", "connecting", "connecting", "fixing" and the like should be understood in a broad sense, for example, it can be fixed connection, or detachable connection or integral; it can be mechanical connection, or electrical connection; it can be directly connected, or indirectly connected through intermediate medium; it can be the internal communication of two elements or the interaction relationship between two elements. For those skilled in the art, the specific meaning of the above terms in this application can be understood according to the specific circumstances.

[0025] At present, the general way to power the device is to replace the battery, but the device will be powered off for a short time during the replacement of the battery, thereby affecting the shooting or live effect.

[0026] In view of the above problems, the DC-DC seamless switching circuit provided by the embodiments of the application can seamlessly switch battery power supply, and ensure that the device does not interrupt during live or shooting.

[0027] The technical solutions of the embodiments of the application are described in detail below with reference to the drawings.

[0028] Please refer to Figures 1 to 3 A DC-DC seamless switching circuit, comprising a first power module 100, a master control chip 200 and a second power module 300, the first power module 100 comprising a first battery interface, a first power supply unit and a boost unit, the first battery interface being electrically connected with the first power supply unit, the boost unit being electrically connected with the power supply unit; the master control chip 200 being electrically connected with the boost unit; the second power module 300 comprising a second power supply unit, the second power supply unit being electrically connected with the master control chip 200.

[0029] It should be noted that the main control chip 200 is U5 in the figure, the first battery interface is XLR+ in the figure, which is an external battery pack, the second power supply unit is a battery pack inside the device, and the voltage boosting unit is used to boost the voltage of XLR+. Specifically, in use, the external battery pack connected by XLR+ is preferentially used for power supply, XLR+ is a battery pack, so there is a case where the voltage of XLR+ is lower than that of the internal battery pack. Since the current flows from the high end to the low end of the voltage, the internal battery pack will be preferentially powered in this case. Therefore, by boosting the voltage through the voltage boosting unit, the voltage of the external battery pack can be boosted to be higher than that of the internal battery pack, so that the power of the external battery pack is used preferentially.

[0030] The first power supply module 100 and the second power supply module 300 are two power supplies, which can be used for power supply. When the first power supply module 100 is out of power, the main control chip 200 can drive the second power supply module 300 to directly supply power, thereby ensuring uninterrupted power supply and ensuring the continuity of live broadcast or shooting.

[0031] Please refer to Figure 2 and Figure 3 In an embodiment, the first power supply unit comprises MOS tube Q1, MOS tube Q2, resistor R1, resistor R2 and resistor R3, MOS tube Q1 is electrically connected with the first battery interface, MOS tube Q2 is electrically connected with MOS tube Q1, the first end of resistor R1 is electrically connected with MOS tube Q1, the second end of resistor R1 is electrically connected with the first end of resistor R3, the first end of resistor R2 is electrically connected with MOS tube Q1 and MOS tube Q2 respectively, and the second end of resistor R2 is electrically connected with the first end of resistor R1. Specifically, the first power supply unit further comprises a triode Q3, a capacitor C1, a resistor R5 and a resistor R4, the triode Q3 is electrically connected with the second end of resistor R3, the first end of capacitor C1 is electrically connected with the triode Q3, the second end of capacitor C1 is grounded, the first end of resistor R5 is electrically connected with capacitor C1, the second end of resistor R5 is electrically connected with the first end of resistor R4, and the second end of resistor R4 is electrically connected with the main control chip 200.

[0032] It should be noted that resistor R1, resistor R2, resistor R3, resistor R5 and resistor R4 are voltage dividing resistors, and capacitor C1 is a filter capacitor.

[0033] Please refer to Figure 2 and Figure 3In an embodiment, the voltage boosting unit comprises a voltage boosting chip U1, a resistor R10, a MOS Q4, a diode D1, a resistor R11, a diode D2, a MOS Q5, and an inductor L1. The first end of the diode D1 and the first end of the diode D2 are electrically connected to the voltage boosting chip U1. The first end of the resistor R10 and the first end of the resistor R11 are electrically connected to the voltage boosting chip U1. The second end of the resistor R10 is electrically connected to the second end of the diode D1. The second end of the resistor R11 is electrically connected to the second end of the diode D2. The second end of the diode D1 is also electrically connected to the MOS Q4. The second end of the diode D2 is also electrically connected to the second end of the MOS Q5. The inductor L1 is electrically connected to the MOS Q4 and the MOS Q5. Specifically, the voltage boosting unit further comprises a capacitor EC1, a capacitor C2, a capacitor C3, and a capacitor C4. The first end of the capacitor EC1 is electrically connected to the first end of the capacitor C2 and the MOS Q2. The second end of the capacitor EC1 is electrically connected to the second end of the capacitor C2. The first end of the capacitor C3 is electrically connected to the first end of the capacitor C4 and the first end of the capacitor C2. The second end of the capacitor C3 is electrically connected to the second end of the capacitor C4 and the second end of the capacitor C2. The second end of the capacitor C4 is grounded. Specifically, the voltage boosting unit further comprises a resistor R71, a resistor R7, a resistor R6, and a resistor R8. The first end of the resistor R71 is electrically connected to the first end of the resistor R7. The second end of the resistor R71 is electrically connected to the second end of the resistor R7. The first end of the resistor R7 is also electrically connected to the first end of the capacitor C4. The second end of the resistor R7 is also electrically connected to the first end of the inductor L1. The first end of the resistor R6 is electrically connected to the first end of the resistor R7. The second end of the resistor R6 is electrically connected to the voltage boosting chip U1. The first end of the resistor R8 is electrically connected to the second end of the resistor R7. The second end of the resistor R8 is electrically connected to the voltage boosting chip U1.

[0034] It should be noted that the voltage boosting chip U1 is used to boost the voltage. The MOS Q4 and the MOS Q5 act as switches. The resistor R71 and the resistor R7 are current limiting resistors. The resistor R6 and the resistor R8 act as current sampling. The diode D2 and the diode D1 protect the MOS. The capacitor EC1, the capacitor C2, the capacitor C3, and the capacitor C4 all act as filters.

[0035] Please refer to Figure 2 and Figure 3In an embodiment, the second power supply unit comprises a second battery interface, a diode D3 and a MOS tube Q8, the second battery interface is electrically connected with a first end of the diode D3, the second battery interface is also electrically connected with the MOS tube Q8, and the first end of the diode D3 is also electrically connected with the MOS tube Q8. Specifically, the second power supply unit further comprises a resistor R28, a resistor R27 and a resistor R29, a first end of the resistor R28 is electrically connected with a second end of the diode D3, a second end of the resistor R28 is electrically connected with a first end of the resistor R27, a second end of the resistor R27 is electrically connected with the MOS tube Q8, and a first end of the resistor R29 is electrically connected with the second end of the resistor R28. Specifically, the second power supply unit further comprises a triode Q9 and a capacitor C13, the triode Q9 is electrically connected with the second end of the resistor R29, a first end of the capacitor C13 is electrically connected with the triode Q9, and a second end of the capacitor C13 is grounded. Specifically, the second power supply unit further comprises a resistor R31 and a resistor R30, a first end of the resistor R31 is electrically connected with a first end of the resistor R30, a second end of the resistor R31 is grounded, and a second end of the resistor R30 is electrically connected with the main control chip 200.

[0036] It should be noted that the second battery interface is VB+ in the figure, the diode D3 plays a role of preventing backflow, and the resistor R28, the resistor R27, the resistor R29, the resistor R31 and the resistor R30 are voltage dividing resistors, and the capacitor C13 is a filter capacitor.

[0037] The circuit principle of the present application is described below:

[0038] Please refer to Figure 2 and Figure 3 Figure 2 Figure 3 The voltage of the power supply port of the device is V+, so due to the role of voltage boosting, the voltage of V+ is always higher than that of VB+. The seamless switching between XLR+ and VB+ is realized by controlling the main control chip 200 to control NET-2 and NET-3.

[0039] For example, when the XLR+ voltage is too low or removed, the main control chip 200 first outputs a low potential to NET-2 to turn off the MOS tube Q1 and the MOS tube Q2, thereby preventing the voltage of VB+ from flowing back to XLR+. Then the main control chip 200 outputs a high potential to NET-3 to turn on the MOS tube Q8, thereby reducing the loss caused by the diode D3 to VB+, thereby improving the efficiency.

[0040] The circuit that continuously supplies power to the device during the time when MOS transistor Q1 and MOS transistor Q2 are closed and MOS transistor Q8 is opened is VB+ supplied through diode D3, thus achieving uninterrupted and seamless power supply. After the new battery is replaced in XLR+, the master control chip 200 will first make MOS transistor Q8 cut off by giving NET-3 a low potential, thereby preventing the V+ voltage from flowing back to VB+. At this time, the device power supply is maintained through VB+ through diode D3, and then the master control chip 200 makes MOS transistor Q1 and MOS transistor Q2 conduct by giving NET-2 a high potential, so that the XLR+ voltage is raised by the voltage boosting unit, thereby realizing the priority use of external XLR+ power supply when XLR+ and VB+ exist at the same time.

[0041] The solutions of the present application have been described in detail above with reference to the accompanying drawings. In the above-described embodiments, the description of each embodiment is focused on respectively, and the parts not described in detail in a certain embodiment can be referred to the relevant description of other embodiments. It should also be known by those skilled in the art that the actions and modules involved in the specification are not necessarily required by the present application. In addition, it can be understood that the steps in the method embodiments of the present application can be adjusted, combined and reduced in sequence according to actual needs, and the modules in the device embodiments of the present application can be combined, divided and reduced according to actual needs.

[0042] The above has described various embodiments of the present application, and the above description is exemplary, not exhaustive, and is not limited to the disclosed embodiments. Many modifications and changes are obvious to those skilled in the art without departing from the scope and spirit of the described embodiments. The selection of the terms used herein is intended to best explain the principles, practical application or improvement of the technology in the market of the embodiments, or to enable other ordinary skilled in the art to understand the embodiments disclosed herein.

Claims

1. A DC-DC seamless switching circuit, characterized in that, include: The first power module includes a first battery interface, a first power supply unit, and a boost unit. The first battery interface is electrically connected to the first power supply unit, and the boost unit is electrically connected to the power supply unit. The main control chip is electrically connected to the boost unit; The second power module includes a second power supply unit, which is electrically connected to the main control chip. The second power supply unit includes a second battery interface, a diode D3, and a MOSFET Q8. The second battery interface is electrically connected to the first end of the diode D3 and is also electrically connected to the MOSFET Q8. The first end of the diode D3 is also electrically connected to the MOSFET Q8.

2. The DC-DC seamless switching circuit according to claim 1, characterized in that, The first power supply unit includes: MOSFET Q1, MOSFET Q2, resistor R1, resistor R2, and resistor R3. MOSFET Q1 is electrically connected to the first battery interface, MOSFET Q2 is electrically connected to MOSFET Q1, the first end of resistor R1 is electrically connected to MOSFET Q1, the second end of resistor R1 is electrically connected to the first end of resistor R3, the first end of resistor R2 is electrically connected to both MOSFET Q1 and MOSFET Q2, and the second end of resistor R2 is electrically connected to the first end of resistor R1.

3. The DC-DC seamless switching circuit according to claim 2, characterized in that, The first power supply unit also includes a transistor Q3, a capacitor C1, a resistor R5, and a resistor R4. The transistor Q3 is electrically connected to the second end of the resistor R3. The first end of the capacitor C1 is electrically connected to the transistor Q3, and the second end of the capacitor C1 is grounded. The first end of the resistor R5 is electrically connected to the capacitor C1, and the second end of the resistor R5 is electrically connected to the first end of the resistor R4. The second end of the resistor R4 is electrically connected to the main control chip.

4. The DC-DC seamless switching circuit according to claim 2, characterized in that, The boost unit includes a boost chip U1, a resistor R10, a MOSFET Q4, a diode D1, a resistor R11, a diode D2, a MOSFET Q5, and an inductor L1. The boost chip U1 is electrically connected to the first terminals of both diodes D1 and D2. The first terminals of both resistors R10 and R11 are electrically connected to the boost chip U1. The second terminal of resistor R10 is electrically connected to the second terminal of diode D1. The second terminal of resistor R11 is electrically connected to the second terminal of diode D2. The second terminal of diode D1 is also electrically connected to MOSFET Q4. The second terminal of diode D2 is also electrically connected to the second terminal of MOSFET Q5. The inductor L1 is electrically connected to both MOSFET Q4 and MOSFET Q5.

5. The DC-DC seamless switching circuit according to claim 4, characterized in that, The boost unit further includes capacitors EC1, C2, C3, and C4. The first terminal of capacitor EC1 is electrically connected to the first terminal of MOSFET Q2 and capacitor C2, respectively. The second terminal of capacitor EC1 is electrically connected to the second terminal of capacitor C2. The first terminal of capacitor C3 is electrically connected to the first terminal of capacitor C4 and capacitor C2, respectively. The second terminal of capacitor C3 is electrically connected to the second terminal of capacitor C4 and capacitor C2, respectively. The second terminal of capacitor C4 is grounded.

6. The DC-DC seamless switching circuit according to claim 5, characterized in that, The boost unit further includes resistors R71, R7, R6, and R8. The first end of resistor R71 is electrically connected to the first end of resistor R7, and the second end of resistor R71 is electrically connected to the second end of resistor R7. The first end of resistor R7 is also electrically connected to the first end of capacitor C4, and the second end of resistor R7 is also electrically connected to the first end of inductor L1. The first end of resistor R6 is electrically connected to the first end of resistor R7, and the second end of resistor R6 is electrically connected to boost chip U1. The first end of resistor R8 is electrically connected to the second end of resistor R7, and the second end of resistor R8 is electrically connected to boost chip U1.

7. The DC-DC seamless switching circuit according to claim 1, characterized in that, The second power supply unit also includes resistors R28, R27 and R29. The first end of resistor R28 is electrically connected to the second end of diode D3, the second end of resistor R28 is electrically connected to the first end of resistor R27, the second end of resistor R27 is electrically connected to MOSFET Q8, and the first end of resistor R29 is electrically connected to the second end of resistor R28.

8. The DC-DC seamless switching circuit according to claim 7, characterized in that, The second power supply unit also includes a transistor Q9 and a capacitor C13. The transistor Q9 is electrically connected to the second end of the resistor R29, the first end of the capacitor C13 is electrically connected to the transistor Q9, and the second end of the capacitor C13 is grounded.

9. The DC-DC seamless switching circuit according to claim 8, characterized in that, The second power supply unit also includes resistors R31 and R30. The first end of resistor R31 is electrically connected to the first end of resistor R30, the second end of resistor R31 is grounded, and the second end of resistor R30 is electrically connected to the main control chip.

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