Power conversion device

Abstract

The embodiment of the utility model discloses a power conversion device, and relates to the technical field of new energy equipment, the power conversion device comprises a heat dissipation assembly and a circuit board, the heat dissipation assembly is in heat conduction connection with the circuit board, the heat dissipation assembly comprises a heat exchanger, a heat conduction gasket and a positioning tool, and the heat exchanger is provided with a heat conduction platform; the heat-conducting gasket is arranged on the heat-conducting platform; the positioning tool is connected to the heat conduction platform, the positioning tool is provided with a limiting space, and the heat conduction gasket is arranged in the limiting space. According to the technical scheme provided by the embodiment of the invention, the production and processing procedures of the power conversion device are simplified, and the practicability and reliability of the power conversion device are improved.

Description

TECHNICAL FIELD

[0001] The embodiments in the present application relate to the technical field of new energy equipment, in particular to a power conversion device. BACKGROUND

[0002] In the related art, the power conversion device mostly uses a heat exchanger, a heat sink or the like heat exchanger to conduct heat and dissipate heat for a control circuit board or the like circuit board, so as to avoid overheating of the circuit board and affect stable operation of the power conversion device.

[0003] A heat-conducting gasket such as a ceramic gasket can be arranged between the heat-generating components of the control circuit board and the heat exchanger. By placing the heat-conducting gasket on the heat exchanger and abutting the power components or the like heat-generating components on the circuit board, the heat-conducting gasket can be used to achieve stable heat transfer between the circuit board and the heat exchanger by using the good insulation and heat conduction performance of the heat-conducting gasket, and effectively prevent electrical conduction between the heat-generating components and the heat exchanger.

[0004] However, the current processing procedure for installing and fixing the heat-conducting gasket on the heat exchanger is relatively complicated, and the production cost is relatively high, which reduces the practicability of the power conversion device. CONTENT OF THE INVENTION

[0005] The embodiments in the present application propose a power conversion device, aiming to simplify the production and processing procedure of the power conversion device and improve the practicability and reliability of the power conversion device.

[0006] One embodiment in the present application proposes a power conversion device including a heat dissipation assembly and a circuit board, the heat dissipation assembly is in heat-conducting connection with the circuit board, the heat dissipation assembly includes a heat exchanger, a heat-conducting gasket and a positioning tool, the heat exchanger has a heat-conducting platform, the heat-conducting gasket is arranged on the heat-conducting platform, and the positioning tool is connected to the heat-conducting platform, the positioning tool is provided with a limiting space, and the heat-conducting gasket is arranged in the limiting space.

[0007] In an embodiment, the heat-conducting platform is provided with a limiting protrusion, and the limiting protrusion is used to limit and fix the positioning tool.

[0008] In an embodiment, the positioning tool is provided with a first mounting hole, the limiting protrusion is a positioning pin, and the positioning pin is inserted into the first mounting hole.

[0009] In an embodiment, the heat dissipation assembly further includes a fastening bolt, and the fastening bolt is connected to the heat exchanger through the positioning tool.

[0010] In an embodiment, one side of the positioning tool towards the heat-conducting platform is provided with a buckle, the heat-conducting platform is provided with a second mounting hole, and the buckle is inserted into the second mounting hole.

[0011] In an embodiment, the heat dissipation assembly further comprises a first adhesive member arranged between the positioning tool and the heat conduction platform and connecting the positioning tool and the heat exchanger.

[0012] In an embodiment, the inner wall of the limiting space is concave and provided with a clearance groove. In addition, the positioning tool is provided with a chamfer at the periphery of the limiting space.

[0013] In an embodiment, the material of the positioning tool is an insulating material. In addition, the positioning tool is provided with at least two limiting spaces, and the heat dissipation assembly comprises at least two heat conduction pads, one of which is arranged in one of the limiting spaces.

[0014] In an embodiment, the heat dissipation assembly further comprises a second adhesive member arranged between the heat conduction pad and the heat conduction platform and connecting the heat conduction pad and the heat exchanger. In addition, the surface of the heat conduction pad opposite to the heat exchanger is provided with a heat conduction material.

[0015] In an embodiment, the heat conduction platform is provided with a receiving groove in communication with the limiting space, and the heat conduction pad is arranged in the receiving groove.

[0016] In an embodiment, a first connecting structure is arranged between the heat conduction platform and the heat conduction pad, and the first connecting structure limits and fixes the heat conduction pad to the heat conduction platform. In addition, a second connecting structure is arranged between the heat conduction pad and the positioning tool, and the second connecting structure connects and fixes the heat conduction pad and the positioning tool.

[0017] In the multiple embodiments provided in the present application, the positioning tool is arranged on the heat conduction platform of the heat exchanger to limit and assemble the heat conduction pad, which can avoid opening a groove on the heat conduction platform to accommodate and install the heat conduction pad, and is beneficial to better simplify the production and processing procedure of the heat exchanger and reduce the production cost of the heat dissipation assembly and the power conversion device. In addition, the cooperation and connection of the positioning tool and the heat conduction platform can realize more convenient limiting and assembling of the heat conduction pad on the heat exchanger, guarantee the overall structural stability of the heat dissipation assembly, and effectively improve the practicability and reliability of the power conversion device. BRIEF DESCRIPTION OF DRAWINGS

[0018] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the drawings needed in the embodiments or prior art description will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative labor based on the drawings shown.

[0019] Figure 1 A schematic diagram of the heat dissipation component and circuit board separation structure of an embodiment of the power conversion device provided in this application;

[0020] Figure 2 This application provides a schematic diagram of the structure of a heat dissipation assembly for a power conversion device according to an embodiment.

[0021] Figure 3 for Figure 2 A partial structural exploded view of an embodiment of a heat dissipation component;

[0022] Figure 4 This application provides a partial structural schematic diagram of an embodiment of a heat dissipation component for a power conversion device;

[0023] Figure 5 for Figure 4 An exploded view of the structure of an embodiment of a heat dissipation component;

[0024] Figure 6 This application provides an exploded view of the structure of a heat dissipation assembly for a power conversion device according to an embodiment.

[0025] Figure 7 This application provides a schematic diagram of the structure of an embodiment of a positioning fixture in a power conversion device;

[0026] Figure 8 for Figure 1 A partial exploded view of the heat dissipation component of a power conversion device according to an embodiment;

[0027] Figure 9 for Figure 1 A partial exploded view of another embodiment of the heat dissipation component of a power conversion device;

[0028] Figure 10 for Figure 1 An exploded view of a partial structure of the heat dissipation component of a power conversion device in another embodiment;

[0029] Figure 11 for Figure 1 A cross-sectional view of an embodiment of a heat dissipation component for a power conversion device;

[0030] Figure 12 for Figure 1 An exploded view of an embodiment of a heat-conducting pad and positioning fixture in a power conversion device;

[0031] Figure 13 for Figure 1 A cross-sectional view of another embodiment of the heat dissipation component of the power conversion device;

[0032] Figure 14 for Figure 13 A magnified view of a portion of point A in the middle.

[0033] BRIEF DESCRIPTION OF DRAWINGS

[0034] 1000, power conversion device; 100, heat dissipation assembly; 10, heat exchanger; 11, heat conduction platform; 111, positioning pin; 113, second mounting hole; 115, accommodating groove; 30, heat conduction pad; 41, first connecting structure; 411, protruding plug; 413, plug hole; 415, pressing plate structure; 43, second connecting structure; 431, plug; 433, clamping convex structure; 435, clamping groove; 437, surrounding edge structure; 50, positioning tool; 51, limiting space; 511, avoiding groove; 513, chamfer; 53, first mounting hole; 55, buckle; 200, circuit board; 20, heating component. DETAILED DESCRIPTION

[0035] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor are within the scope of protection of the present application.

[0036] It should be noted that if the directionality indication (such as up, down, left, right, front, back, etc.) is involved in the embodiments of the present application, the directionality indication is only used to explain the relative position relationship, movement condition, etc. between the components in a certain posture, and if the certain posture changes, the directionality indication also changes accordingly.

[0037] In addition, if the description of "first", "second" and the like is involved in the embodiments of the present application, the description of "first", "second" and the like is only for the purpose of description, and cannot be understood as indicating or implying the relative importance of the indicated technical features or implicitly indicating the number of the indicated technical features. Therefore, the features limited by "first", "second" can explicitly or implicitly include at least one of the features. In addition, "and / or" or "and / or" appears throughout the text, which means that the three parallel schemes are included, for example, "A and / or B" includes A scheme, or B scheme, or A and B scheme. In addition, the technical solutions of each embodiment can be combined with each other, but it must be based on the realization of ordinary skilled in the art, when the combination of technical solutions appears contradictory or unachievable, it should be considered that the combination of technical solutions does not exist, nor within the scope of protection claimed by the present application.

[0038] In the related art, the power conversion device mostly uses a heat exchanger, a heat sink or the like heat exchanger to conduct heat and dissipate heat for the circuit board, so as to avoid the circuit board overheating and affecting the stable operation of the power conversion device. A heat-conducting gasket can be arranged between the heat-generating components of the circuit board and the heat exchanger. By placing the heat-conducting gasket on the heat exchanger and abutting the power device and other heat-generating components on the control circuit board, the heat-conducting gasket can be used to achieve stable heat transfer between the circuit board and the heat exchanger, and effectively prevent electrical conduction between the heat-generating components and the heat dissipation device. However, the heat exchanger usually adopts a machining process such as turning to open a groove with a large depth on the surface to accommodate and limit the heat-conducting gasket, which leads to a more complicated machining process of the heat exchanger and the power conversion device, higher production cost, and reduced practicability of the power conversion device. In view of the above problems, the present application provides a power conversion device.

[0039] Please refer to Figures 1 to 7 In an embodiment of the present application, the power conversion device 1000 includes a heat dissipation assembly 100 and a circuit board 200, the heat dissipation assembly 100 is in thermal connection with the circuit board 200, the heat dissipation assembly 100 includes a heat exchanger 10, a heat-conducting gasket 30 and a positioning tool 50, the heat exchanger 10 has a heat-conducting platform 11; the heat-conducting gasket 30 is arranged on the heat-conducting platform 11; the positioning tool 50 is connected to the heat-conducting platform 11, and the positioning tool 50 is provided with a limiting space 51, and the heat-conducting gasket 30 is arranged in the limiting space 51.

[0040] It can be understood that the power conversion device 1000 can include but is not limited to an inverter, a transformer, a bus box, a rectifier, a DC-DC device, etc. The heat dissipation assembly 100 can be arranged on one side of the circuit board 200 such as an integrated circuit board, so that the heat generating components 20 on the circuit board 200 can conduct heat to the heat dissipation assembly 100 for heat dissipation, effectively preventing the circuit board 200 from overheating. Among them, the circuit board 200 can be integrated with multiple components such as power devices and impedance devices, which can stably realize the stable operation and regulation of the power conversion device 1000. The circuit board 200 can directly contact the heat generating components 20 and the heat dissipation assembly 100 for heat conduction. Since some power devices may have the risk of conduction, a heat-conducting gasket 30 can be arranged in the heat dissipation assembly 100. The heat-conducting gasket 30 can be made of ceramic, silica gel or rubber materials with good high-temperature resistance, insulation and heat conduction performance, so that the heat-conducting gasket 30 can have certain heat conduction and insulation effect. Of course, the heat-conducting gasket 30 can also be a gasket structure of other materials and shapes. The application does not limit the material and shape of the heat-conducting gasket 30, as long as it can realize the functions of insulation and heat conduction. By abutting the heat generating components 20 of the circuit board 200 and the heat exchanger 10 with the heat-conducting gasket 30, the heat-conducting gasket 30 can stably transfer the heat generated by the heat generating components 20 to the heat exchanger 10 for heat dissipation, while effectively isolating the electrical energy of the components from the heat exchanger 10, realizing the insulation of the circuit board 200 and the heat dissipation assembly 100, and ensuring the stable operation of the power conversion device 1000. It should be noted that the heat exchanger 10 can be a radiator, a heat exchanger, etc. Of course, it can also be other devices that can realize heat transfer. The application does not limit the specific device form of the heat exchanger 10.

[0041] In the present application, the positioning tool 50 is arranged on the heat-conducting platform 11 of the heat exchanger 10, which can be a hollow frame structure, and a limiting space 51 corresponding to the size and shape of the heat-conducting gasket 30 is formed in the positioning tool 50. The limiting space 51 can be a through-hole space, a groove space formed by recessing the positioning tool 50, or an opening space formed by opening the positioning tool 50. The present application does not limit the specific structure of the limiting space 51, as long as it can achieve certain accommodation and limiting effect of the heat-conducting gasket 30. Then, the positioning tool 50 can be used to limit the assembly of the heat-conducting gasket 30 on the heat-conducting platform 11, prevent the heat-conducting gasket 30 from being installed off-center, and make the heat-conducting gasket 30 stably installed at a position corresponding to the heat-generating component 20 of the circuit board 200, thereby ensuring stable heat conduction and insulation between the heat dissipation assembly 100 and the circuit board 200. During the assembly of the heat dissipation assembly 100, the positioning tool 50 can be first installed on the heat-conducting platform 11 at a position corresponding to the installation of the heat-conducting gasket 30, and then the heat-conducting gasket 30 is placed in the limiting space 51, thereby achieving the installation and limiting of the heat-conducting gasket 30 on the heat exchanger 10 by the positioning tool 50. Alternatively, the heat-conducting gasket 30 can be limited and accommodated in the limiting space 51, and then the positioning tool 50 and the heat-conducting gasket 30 are placed on the heat-conducting platform 11, and the positioning tool 50 is connected with the heat-conducting platform 11 to stably install the heat-conducting gasket 30 at the corresponding position. Of course, in other embodiments, the heat-conducting gasket 30 and the positioning tool 50 can also be assembled in other ways, which are not limited in the present application.

[0042] By using the positioning tool 50 to limit and fix the heat-conducting gasket 30 on the heat-conducting platform 11, the positioning tool 50 can be connected with the heat-conducting platform 11 to position and install the heat-conducting gasket 30 at the corresponding position of the heat exchanger 10, thereby ensuring stable contact and heat conduction between the components of the circuit board 200 and the heat-conducting gasket 30, and avoiding installation deviation of the heat-conducting gasket 30. Moreover, under the action of the positioning tool 50, the heat-conducting gasket 30 can be limited and installed on the heat-conducting platform 11 by forming a groove, which is beneficial to better simplify the production and processing procedures of the heat exchanger 10 and effectively reduce the production cost of the heat dissipation assembly 100. At the same time, by using the independent positioning tool 50 to limit the heat-conducting gasket 30 on the heat-conducting platform 11, the installation position of the heat-conducting gasket 30 can be more conveniently adjusted, so that the heat-conducting gasket 30 can be better installed at a position corresponding to the heat-generating component 20 of the circuit board 200 during actual installation, the installation error between the heat dissipation assembly 100 and the circuit board 200 is reduced, and the reliability and stability of the heat dissipation assembly 100 for heat conduction and heat dissipation of the circuit board 200 are effectively improved.

[0043] The positioning tool 50 can be fixed on the heat exchanger 10 to stabilize the positioning of the heat-conducting gasket 30 on the heat exchanger 10, thereby ensuring the stability of the overall structure of the power conversion device 1000. Alternatively, the positioning tool 50 can be detachably arranged on the heat exchanger 10. When the positioning tool 50 is used to position and assemble the heat-conducting gasket 30 on the heat-conducting platform 11, the heat-conducting gasket 30 can be fixedly connected to the heat-conducting platform 11 by means of adhesion or pressing, and then the positioning tool 50 is removed from the heat exchanger 10. In this way, the positioning tool 50 plays a role in assisting the positioning and assembly, which is conducive to the positioning and assembly of multiple heat-conducting gaskets 30 on the heat exchanger 10 by using the positioning tool 50. Of course, the positioning tool 50 can also be fixed on the heat exchanger 10 in other ways. The assembly method of the positioning tool 50 is not limited in the present application, as long as the positioning tool 50 can be stably assembled on the heat exchanger.

[0044] In an embodiment of the present application, the positioning tool 50 is arranged on the heat-conducting platform 11 of the heat exchanger 10 to position and assemble the heat-conducting gasket 30. In this way, it is not necessary to open a groove in the heat-conducting platform 11 to accommodate and install the heat-conducting gasket 30, which is conducive to simplifying the production and processing procedures of the heat exchanger 10 and reducing the production cost of the heat dissipation assembly 100. Meanwhile, the positioning tool 50 can be cooperatively connected with the heat-conducting platform 11 to realize the convenient positioning and assembly of the heat-conducting gasket 30 on the heat exchanger 10, thereby ensuring the stability of the overall structure of the heat dissipation assembly 100 and effectively improving the practicability and reliability of the power conversion device 1000.

[0045] In an embodiment of the present application, the heat-conducting platform 11 is provided with a limiting protrusion for limiting and fixing the positioning tool 50.

[0046] In the embodiment, the heat exchanger 10 is generally provided with protruding structures such as bolt columns, pins, bosses and the like on the heat-conducting platform 11, which can be abutted with the integrated circuit board of the circuit board 200 to ensure the stability and reliability of the connection between the heat dissipation assembly 100 and the circuit board 200. At this time, the protruding structures on the heat-conducting platform 11 can be set as limiting protrusions, which can make the positioning tool 50 abut multiple limiting protrusions on the heat-conducting platform 11 to realize the limiting installation of the positioning tool 50 on the heat-conducting platform 11; or the positioning tool 50 can be provided with a clamping groove matched with the shape and size of the limiting protrusion, so that the positioning tool 50 is clamped with the limiting protrusion to realize the limiting installation of the positioning tool 50 on the heat-conducting platform 11; or the limiting protrusion can be provided with a plug-in protrusion, and the positioning tool 50 can be provided with a plug-in slot matched with the plug-in protrusion, so that the limiting protrusion is plugged with the positioning tool 50 to realize the limiting installation of the positioning tool 50 on the heat-conducting platform 11. By abutting the limiting protrusion with the positioning tool 50, the limiting installation of the positioning tool 50 on the heat-conducting platform 11 can be realized, which can realize more convenient assembly process of the heat dissipation assembly 100 and better improve the assembly convenience and practicality of the heat dissipation assembly 100.

[0047] The limiting protrusion can also be used to abut and limit the positioning tool 50, which can more conveniently disassemble and assemble the positioning tool 50 on the heat exchanger 10, so that the positioning tool 50 can be more conveniently removed after the heat dissipation assembly 100 is limited and installed with the heat-conducting gasket 30, which facilitates the limiting assembly of multiple heat-conducting gaskets 30 on the heat-conducting platform 11 by the positioning tool 50, and further improves the assembly convenience of the heat dissipation assembly 100. In addition, the limiting protrusion can also be a boss or a limiting column matched with the positioning tool 50 on the heat-conducting platform 11, so that the positioning tool 50 can be more stably limited and assembled on the heat exchanger 10, which facilitates the standardization design of the positioning tool 50 and further improves the overall structural stability and reliability of the heat dissipation assembly 100, thereby ensuring the overall structural stability of the power conversion device 1000.

[0048] Referring to Figure 4 and Figure 5 In an embodiment of the present application, the positioning tool 50 is provided with a first mounting hole 53, and the limiting protrusion is a positioning pin 111 which is inserted into the first mounting hole 53.

[0049] In the embodiment, the limiting protrusion can be a positioning pin 111 arranged on the heat-conducting platform 11, at this time, a first mounting hole 53 with a shape and size matched with the positioning pin 111 can be arranged on the positioning tool 50, the positioning tool 50 can be placed on the heat-conducting platform 11 by inserting the positioning pin 111 into the first mounting hole 53, and the connection stability and reliability of the positioning tool 50 and the heat exchanger 10 can be better improved under the cooperation and fixing of the positioning pin 111 and the first mounting hole 53, so that the positioning tool 50 can more stably limit and mount the heat-conducting gasket 30, and the structural practicability and reliability of the heat dissipation assembly 100 are further improved.

[0050] The heat exchanger 10 can be provided with a protrusion around the positioning pin 111, so that when the positioning pin 111 is inserted into the first mounting hole 53, the protrusion can abut against the inner wall of the first mounting hole 53, or the protrusion can pass through the first mounting hole 53 to abut against the surface of the positioning tool 50 facing away from the heat-conducting platform 11, so that the positioning tool 50 can be more stably arranged on the heat-conducting platform 11, the positioning tool 50 can be fixed to limit the heat-conducting gasket 30, and the structural stability and reliability of the heat dissipation assembly 100 are further improved. Alternatively, the size of the positioning pin 111 can be equal to or slightly smaller than the size of the first mounting hole 53, so that the positioning tool 50 can limit the heat-conducting gasket 30, and after the heat-conducting gasket 30 is connected and fixed to the heat-conducting platform 11, the positioning tool 50 can be directly lifted to be detached from the heat-conducting platform 11, the positioning tool 50 can be conveniently assembled and disassembled on the heat exchanger 10, and the assembly convenience and practicability of the heat dissipation assembly 100 are further improved.

[0051] In an embodiment of the present application, the heat dissipation assembly 100 further comprises a fastening bolt, and the fastening bolt is connected to the heat exchanger 10 through the positioning tool 50.

[0052] In the embodiment, the heat dissipation assembly 100 can be provided with a bolt hole on the heat-conducting platform 11 corresponding to the mounting position of the positioning tool 50, and the positioning tool 50 can be provided with a corresponding avoiding hole or an avoiding notch on the outer periphery, the fastening bolt can pass through the avoiding hole or the avoiding notch on the positioning tool 50 and be connected in the bolt hole, and the positioning tool 50 can be fixed and limited by the fastening bolt connected to the heat exchanger 10, so that the positioning tool 50 can more stably limit and mount the heat-conducting gasket 30 on the heat-conducting platform 11, and the structural stability and reliability of the heat dissipation assembly 100 are further improved.

[0053] The positioning tool 50 can be made of an insulating material such as plastic, and the fastening bolt can also be made of an insulating material such as plastic, so that the electrical conduction between the heat dissipation assembly 100 and the circuit board 200 can be better insulated, and better insulation effect of the heat dissipation assembly 100 and the circuit board 200 can be achieved.

[0054] In addition, the fastening bolt is fixedly connected with the heat exchanger 10 in a threaded manner, which is beneficial to conveniently dismounting the fastening bolt and the positioning tool 50 on the heat exchanger 10. After the positioning tool 50 limits the heat-conducting gasket 30 to stably connect the heat-conducting gasket 30 with the heat-conducting platform 11, the positioning tool 50 can be conveniently dismounted, thereby further improving the assembly convenience and practicality of the heat dissipation assembly 100.

[0055] Referring to Figure 3 In an embodiment of the present application, the positioning tool 50 is provided with a buckle 55 on a side facing the heat-conducting platform 11, and the heat-conducting platform 11 is provided with a second mounting hole 113, and the buckle 55 is inserted into the second mounting hole 113.

[0056] In the embodiment, the heat exchanger 10 can be provided with the second mounting hole 113 on the heat-conducting platform 11 corresponding to the mounting position of the positioning tool 50. At this time, by providing the buckle 55 protruding on the surface of the positioning tool 50 facing the heat-conducting platform 11, the positioning tool 50 can be positioned and fixed on the heat-conducting platform 11 by inserting the buckle 55 into the second mounting hole 113, so that the heat-conducting gasket 30 can be placed into the limiting space 51 of the positioning tool 50 to realize stable limiting and mounting of the heat-conducting gasket 30 on the heat-conducting platform 11, thereby further improving the structural stability and reliability of the heat dissipation assembly 100.

[0057] The outer periphery of the buckle 55 can be provided with a protruding point structure, which can abut against the inner wall of the second mounting hole 113 when the buckle 55 is inserted into the second mounting hole 113, thereby realizing interference fit of the buckle 55 with the heat exchanger 10 and better improving the connection stability and reliability of the positioning tool 50 with the heat exchanger 10. Alternatively, the size of the buckle 55 can be less than or slightly equal to the size of the second mounting hole 113. After the positioning tool 50 can be mounted on the heat exchanger 10 to limit the heat-conducting gasket 30 and stably connect and fix the heat-conducting gasket 30 on the heat-conducting platform 11, the positioning tool 50 can be directly lifted to dismount the positioning tool 50 from the heat exchanger 10, which is convenient for limiting and mounting multiple heat-conducting gaskets 30 on the heat-conducting platform 11 by the positioning tool 50, thereby further improving the dismounting convenience and practicality of the heat dissipation assembly 100.

[0058] In an embodiment of the present application, the heat dissipation assembly 100 further comprises a first adhesive member arranged between the positioning tool 50 and the heat-conducting platform 11 and connecting the positioning tool 50 and the heat exchanger 10.

[0059] In the embodiment, the heat dissipation assembly 100 can use the first adhesive to fix the positioning tool 50 on the heat conduction platform 11, so as to ensure the stable assembly of the positioning tool 50 on the heat exchanger 10, and make the positioning tool 50 stably arranged on the heat conduction platform 11 to limit and install the heat conduction gasket 30, thereby further improving the structural stability and reliability of the heat dissipation assembly 100. The first adhesive is used to connect the positioning tool 50 and the heat conduction platform 11, so that the positioning tool 50 can be more conveniently installed according to the position of the heat generating element of the circuit board 200 during the assembly of the heat dissipation assembly 100, and the assembly convenience and practicability of the heat dissipation assembly 100 are improved.

[0060] In addition, the heat dissipation assembly 100 can be arranged on the heat conduction platform 11 to limit the positioning tool 50, or the positioning pin 111 is used to cooperate with the positioning tool 50 to be inserted, and the first adhesive is used to fix the positioning tool 50 on the heat conduction platform 11, so as to better improve the connection stability and reliability of the heat exchanger 10 and the positioning tool 50, so that the positioning tool 50 can more stably limit and fix the heat conduction gasket 30, and the overall structural stability of the power conversion device 1000 is ensured.

[0061] Referring to Figure 3 , Figure 5 , Figure 6 and Figure 7 In an embodiment of the present application, the inner wall of the limiting space 51 is recessed with an avoiding groove 511. And / or, the positioning tool 50 is provided with a chamfer 513 at the periphery of the limiting space 51.

[0062] In the embodiment, by recessing the limiting groove in the inner wall of the limiting space 51, when the heat conduction gasket 30 is placed into the limiting space 51, the fingers or robot hands of the construction workers can be accommodated in the limiting groove, so as to avoid the interference of the positioning tool 50 during the assembly of the heat conduction gasket 30, and ensure that the heat conduction gasket 30 can be stably placed into the limiting space 51. At the same time, when the heat conduction gasket 30 is removed from the heat conduction platform 11, the avoiding groove 511 can be used to avoid the fingers or robot hands of the user to extract the heat conduction gasket 30 from the limiting space 51, thereby better improving the disassembly convenience of the heat conduction gasket 30 on the heat exchanger 10, and further improving the practicability and reliability of the heat dissipation assembly 100.

[0063] In addition, as Figure 7As shown, by setting the chamfer 513 of the positioning tool 50 at the periphery of the limiting space 51, the surface of the positioning tool 50 can form an inclined or arc-shaped guide structure at the periphery of the limiting space 51, so that the heat-conducting gasket 30 can be more conveniently placed into the limiting space 51 from above the positioning tool 50, avoiding interference of the heat-conducting gasket 30 with the end of the limiting space 51 during assembly, and further improving the assembly convenience and reliability of the heat dissipation assembly 100.

[0064] In an embodiment of the present application, the material of the positioning tool 50 is an insulating material. And / or, the positioning tool 50 is provided with at least two limiting spaces 51, and the heat dissipation assembly 100 includes at least two heat-conducting gaskets 30, one heat-conducting gasket 30 being arranged in one limiting space 51.

[0065] In the embodiment, the positioning tool 50 can be made of plastic, rubber or other materials with good insulating properties, so that when the positioning tool 50 is installed on the heat-conducting platform 11 to limit and fix the heat-conducting gasket 30, the positioning tool 50 can better insulate the electrical conduction between the circuit board 200 and the heat exchanger 10, so that the positioning tool 50 can play a certain insulating role, further improving the structural stability and reliability of the heat dissipation assembly 100.

[0066] In addition, as shown in Figure 1 and Figure 6 The heat dissipation assembly 100 can be provided with at least two limiting spaces 51 in the positioning tool 50, so that at least two heat-conducting gaskets 30 can be simultaneously limited and installed on one positioning tool 50, and when the heat dissipation assembly 100 needs to correspond to a plurality of heat-generating components 20 of the circuit board 200 to set a corresponding number of heat-conducting gaskets 30, the positioning tool 50 can be correspondingly provided with limiting spaces 51 according to the positions of the plurality of heat-generating components 20 of the circuit board 200, so that when the positioning tool 50 is installed on the heat-conducting platform 11, a plurality of heat-conducting gaskets 30 can be more quickly installed corresponding to a plurality of limiting spaces 51, further improving the assembly efficiency of the heat dissipation assembly 100 and ensuring the overall structural stability of the power conversion device 1000.

[0067] In an embodiment of the present application, the heat dissipation assembly 100 further includes a second adhesive arranged between the heat-conducting gasket 30 and the heat-conducting platform 11 and connecting the heat-conducting gasket 30 and the heat exchanger 10. And / or, the surface of the heat-conducting gasket 30 opposite to the heat exchanger 10 is provided with a heat-conducting material.

[0068] In the embodiment, the heat dissipation assembly 100 can connect the heat-conducting gasket 30 and the heat-conducting platform 11 by using a second adhesive such as glue or silicone grease, so that the heat-conducting gasket 30 can be more stably fixed and installed at the corresponding position of the heat-conducting platform 11 under the limiting action of the positioning tool 50, thereby guaranteeing the insulation and heat conduction of the heat-conducting gasket 30 to the heat-generating components 20 of the circuit board 200 and further improving the structural stability and reliability of the heat dissipation assembly 100. The second adhesive can be made of a material with good heat conduction performance, so that the heat on the heat-conducting gasket 30 can be stably transferred to the heat exchanger 10 for heat dissipation, thereby guaranteeing the stable heat dissipation of the heat dissipation assembly 100 to the circuit board 200 and further improving the practicability and reliability of the heat dissipation assembly 100.

[0069] In addition, the heat-conducting gasket 30 can be coated with a heat-conducting material such as heat-conducting silicone grease on the surface facing away from the heat-conducting platform 11, so that the heat-generating components 20 of the circuit board 200 can abut against the heat-conducting material, which is conducive to better transferring the heat generated by the heat-generating components 20 to the heat-conducting gasket 30 through the heat-conducting material and stably transferring the heat to the heat exchanger 10 through the heat-conducting gasket 30 for heat dissipation, thereby achieving better heat dissipation effect of the heat dissipation assembly 100 to the circuit board 200 and further improving the practicability and reliability of the heat dissipation assembly 100.

[0070] Referring to Figure 8 In an embodiment of the present application, the heat-conducting platform 11 is provided with a receiving groove 115 in communication with the limiting space 51, and the heat-conducting gasket 30 is limitedly arranged in the receiving groove 115.

[0071] In the embodiment, the heat exchanger 10 can be provided with a receiving groove 115 corresponding in size to the heat-conducting gasket 30 on the heat-conducting platform 11, so that the positioning tool 50 can be arranged around the receiving groove 115 on the heat-conducting platform 11, which is conducive to limiting and accommodating part of the structure of the heat-conducting gasket 30 in the receiving groove 115 and arranging the remaining part of the heat-conducting gasket 30 in the limiting space 51 of the positioning tool 50, thereby better achieving the positioning assembly of the heat-conducting gasket 30 and better avoiding the assembly misalignment of the heat-conducting gasket 30, and further improving the structural stability and reliability of the heat dissipation assembly 100. Under the limiting action of the positioning tool 50, the receiving groove 115 arranged on the heat-conducting platform 11 can play a certain positioning role, which is conducive to reducing the groove depth of the receiving groove 115, so that the heat dissipation assembly 100 can form the receiving groove 115 on the heat exchanger 10 by using relatively simple stamping technology, thereby better reducing the production and processing technology and production cost of the heat exchanger 10.

[0072] In addition, the heat exchanger 10 can also be provided with a protruding latch structure on the inner wall of the accommodation groove 115, and a corresponding recess structure is provided on the outer periphery of the heat-conducting gasket 30, so that when the heat-conducting gasket 30 is installed in the accommodation groove 115, the latch structure is inserted into the recess structure, and the heat-conducting gasket 30 and the heat exchanger 10 are better fixed; or, the recess structure can be provided on the inner wall of the accommodation groove 115, and the protruding latch structure is provided on the outer periphery of the heat-conducting gasket 30, so that the heat-conducting gasket 30 can be inserted into the recess structure by the latch structure and the recess structure to limit and fix the heat-conducting gasket 30 on the heat exchanger 10; of course, the heat exchanger 10 can also be provided with a second adhesive between the inner wall of the accommodation groove 115 and the outer periphery of the heat-conducting gasket 30, so that the heat-conducting gasket 30 is adhered in the accommodation groove 115 for limiting assembly. The heat-conducting gasket 30 and the accommodation groove 115 can also have many assembly modes, which are not limited in the present application, as long as the heat-conducting gasket 30 can be limited and assembled in the accommodation groove 115.

[0073] Referring to Figure 9 and Figure 10 In an embodiment of the present application, the first connecting structure 41 is provided between the heat-conducting platform 11 and the heat-conducting gasket 30, and the first connecting structure 41 limits and fixes the heat-conducting gasket 30 on the heat-conducting platform 11.

[0074] In the present embodiment, referring to Figure 9 , the first connecting structure 41 can include a protruding latch 411 provided on the heat-conducting platform 11 and a corresponding insertion hole 413 provided on the side of the heat-conducting gasket 30 facing the heat-conducting platform 11, so that the heat-conducting gasket 30 can be fixed and installed on the heat-conducting platform 11 by the cooperation of the protruding latch 411 and the insertion hole 413; or, the first connecting structure 41 can include an insertion hole 413 provided on the heat-conducting platform 11 and a protruding latch 411 provided on the side of the heat-conducting gasket 30 facing the heat-conducting platform 11, so that the heat-conducting gasket 30 can be fixed and installed on the heat-conducting platform 11 by the cooperation of the protruding latch 411 and the insertion hole 413; or, referring to Figure 10The first connecting structure 41 can be a pressing plate structure 415 connected to the heat conduction platform 11. The pressing plate structure 415 can be used to press and fix the heat conduction gasket 30 on the heat conduction platform 11. Of course, the first connecting structure 41 can also be other types of fixing structures. The application does not limit the structure of the first connecting structure 41. As long as the first connecting structure 41 can stably connect the heat conduction gasket 30 and the heat conduction platform 11, it is acceptable. Further, the first connecting structure 41 and the positioning tool 50 are used to stably install the heat conduction gasket 30 on the heat conduction platform 11. This can better improve the connection stability and reliability of the heat conduction gasket 30 and the heat exchanger 10, better realize the positioning and assembly of the heat conduction gasket 30 on the heat exchanger 10, and further ensure the overall structural stability of the power conversion device 1000.

[0075] Referring to Figures 11 to 14 In one embodiment, a second connecting structure 43 is arranged between the heat conduction gasket 30 and the positioning tool 50. The second connecting structure 43 connects and fixes the heat conduction gasket 30 and the positioning tool 50.

[0076] In this embodiment, referring to Figure 11 The second connecting structure 43 can be a bolt 431 penetrating the side wall of the positioning tool 50 and the side wall of the heat conduction gasket 30. The bolt 431 can be used to connect the positioning tool 50 and the heat conduction gasket 30 to form a whole. Alternatively, referring to Figure 12 The second connecting structure 43 can include a clamping convex structure 433 protruding outward from the side wall of the heat conduction gasket 30 and a clamping groove 435 arranged on the inner wall of the limiting space 51 of the positioning tool 50. When the heat conduction gasket 30 is arranged in the limiting space 51, the clamping convex structure 433 and the clamping groove 435 can be used to realize the connection and fixation of the heat conduction gasket 30 and the positioning tool 50. Alternatively, referring to Figure 13 and Figure 14, the second connecting structure 43 can be a surrounding edge structure 437 arranged on the inner wall of the limiting space 51 of the positioning tool 50, and can press the top surface of the heat-conducting gasket 30 when the heat-conducting gasket 30 is arranged in the limiting space 51, so that the positioning tool 50 can be stably and tightly fixed on the heat-conducting platform 11. Of course, the second connecting structure 43 can also be other types of fixing structures, and the structure form of the second connecting structure 43 is not limited in the present application, as long as the second connecting structure 43 can stably connect the heat-conducting gasket 30 and the positioning tool 50. Further, the second connecting structure 43 can better improve the limiting and fixing effect of the positioning tool 50 on the heat-conducting gasket 30 on the heat exchanger 10, effectively prevent the heat-conducting gasket 30 from being installed to deviate, ensure the stable heat conduction of the heat-conducting gasket 30 on the heat generating element 21 of the circuit board 200, and further improve the structural stability and reliability of the heat dissipation assembly 100, and ensure the stable operation of the power conversion device 1000.

[0077] In addition, in some other embodiments, the heat dissipation assembly 100 can be provided with the first connecting structure 41 between the heat-conducting gasket 30 and the heat-conducting platform 50, and the second connecting structure 43 between the heat-conducting gasket 30 and the positioning tool 50, wherein the structure form of the first connecting structure 41 and the second connecting structure 43 can refer to the above. Further, the first connecting structure 41 and the second connecting structure 43 can better improve the connection stability and reliability of the heat-conducting gasket 30, the positioning tool 50 and the heat exchanger 10, realize better positioning and assembly effect of the heat-conducting gasket 30 in the heat dissipation assembly 100, ensure stable contact and heat conduction between the heat dissipation assembly 100 and the circuit board 200, and realize stable operation of the power conversion device 1000.

[0078] The above description is only an exemplary embodiment of the present application, and does not limit the patent scope of the present application, and any equivalent structural transformation made by referring to the content of the present application and the drawings, or direct / indirect application in other related technical fields is included in the patent protection scope of the present application.

Claims

1. A power conversion device, characterized by, The power conversion device comprises a heat dissipation assembly and a circuit board, the heat dissipation assembly is in thermal contact with the circuit board, and the heat dissipation assembly comprises: a heat exchanger having a heat conduction platform; a heat conduction pad arranged on the heat conduction platform; a positioning tool connected to the heat conduction platform, the positioning tool is provided with a limiting space, and the heat conduction pad is arranged in the limiting space.

2. The power conversion device of claim 1, wherein, The heat conduction platform is provided with a limiting protrusion for limiting and fixing the positioning tool.

3. The power conversion device of claim 2, wherein, The positioning tool is provided with a first mounting hole, and the limiting protrusion is a positioning pin inserted into the first mounting hole.

4. The power conversion device of claim 1, wherein, The heat dissipation assembly further comprises a fastening bolt connected to the heat exchanger through the positioning tool.

5. The power conversion device of claim 1, wherein, The side of the positioning tool facing the heat conduction platform is provided with a buckle, and the heat conduction platform is provided with a second mounting hole, and the buckle is inserted into the second mounting hole.

6. The power conversion device of claim 1, wherein, The heat dissipation assembly further comprises a first adhesive arranged between the positioning tool and the heat conduction platform and connecting the positioning tool and the heat exchanger.

7. The power conversion device of any one of claims 1 to 6, wherein, The inner wall of the limiting space is concave and provided with a avoiding groove. And / or, the positioning tool is provided with a chamfer at the periphery of the limiting space.

8. The power conversion device of any one of claims 1 to 6, wherein, The material of the positioning tool is insulating material; And / or, the positioning tool is provided with at least two limiting spaces, and the heat dissipation assembly comprises at least two heat conduction pads, one heat conduction pad is arranged in one limiting space.

9. The power conversion device of any one of claims 1 to 6, wherein, The heat dissipation assembly further comprises a second adhesive arranged between the heat conduction pad and the heat conduction platform and connecting the heat conduction pad and the heat exchanger; And / or, the surface of the heat conduction pad opposite to the heat exchanger is provided with a heat conduction material.

10. The power conversion device of any one of claims 1 to 6, wherein, The heat conduction platform is provided with a receiving groove in communication with the limiting space, and the heat conduction pad is limitedly arranged in the receiving groove.

11. The power conversion device of any one of claims 1 to 6, wherein, A first connecting structure is arranged between the heat conduction platform and the heat conduction pad, and the first connecting structure limits and fixes the heat conduction pad to the heat conduction platform; And / or, a second connecting structure is arranged between the heat conduction pad and the positioning tool, and the second connecting structure connects and fixes the heat conduction pad and the positioning tool.

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