Heat dissipation PCB hard board, high-integration heat dissipation camera module and unmanned aerial vehicle
By using graphene sheets and copper areas in the drone camera module, combined with a copper pillar and ground hole design, the problem of high-temperature heat dissipation of the photosensitive chip is solved, achieving efficient heat dissipation and ensuring module performance and lifespan.
Patent Information
- Application Number
- CN202423041444.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-10
- Publication Date
- 2025-12-23
- Estimated Expiration
- 2034-12-10
AI Technical Summary
In drone camera modules, as the number of pixels in the image sensor increases, the power consumption increases, leading to higher temperatures. Limited heat dissipation space affects image quality and module lifespan, and existing heat dissipation designs have limited effectiveness.
The graphene sheet is directly connected to the photosensitive chip mounting area, and the heat is transferred to the edge of the PCB rigid board and the drone shell through copper areas and copper pillars. Combined with ground holes, additional heat dissipation channels are provided to achieve efficient heat dissipation.
It significantly reduces the internal temperature of the camera module by 10℃~15℃, preventing performance degradation and damage, and improving heat dissipation efficiency without increasing the module size.
Smart Images
Figure CN223714236U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to camera module technical field, concretely relates to a heat dissipation PCB hard board, high integration heat dissipation camera module and unmanned plane. BACKGROUND
[0002] With the popularization of electronic equipment and the rapid development of technology, the technology of unmanned plane has made remarkable progress, especially in image capture and transmission. The pixels of the camera module carried by the unmanned plane are constantly improving, providing photographers and professional photographers with clearer and more delicate images. However, this technological progress has also brought new problems, that is, the performance requirements for the camera module are increasingly stringent, while the space available for accommodating electronic components inside the module is increasingly limited.
[0003] In the camera module, the photosensitive chip as the core component, its performance directly determines the image capture quality and color restoration effect. With the increasing number of pixels, the power consumption of the photosensitive chip also increases, which causes the temperature of the module to rise significantly when working for a long time or running in a complex environment. At the same time, the photosensitive chip itself occupies a large internal space, making the heat dissipation space inside the module increasingly limited.
[0004] The heat dissipation problem is crucial for the camera module. On the one hand, excessive temperature can cause the performance of the photosensitive chip to decline, thereby affecting the clarity of image capture and the accuracy of color restoration. On the other hand, high temperature can also cause damage to other electronic components inside the module, shortening the service life of the module. Especially in dark or complex light environments, high temperature can cause significant image noise, and even color distortion.
[0005] Currently, the heat dissipation design of the camera module for unmanned plane has been researched and tried in the market. For example, by optimizing the heat dissipation Pad design of the module itself, using the ground layer design in PCB / FPC wiring to enhance heat conduction; by increasing the number of through holes to provide a heat dissipation channel; and increasing the heat dissipation area of the exposed copper at the bottom of the module, etc. to improve the heat dissipation performance of the module. However, these methods have limited heat dissipation effect in the limited module space.
[0006] In addition, due to the limitation of the internal space of the module, directly attaching high-power electronic components such as photosensitive chips to the module also increases the difficulty of heat dissipation. Therefore, how to realize efficient and reliable heat dissipation design in the limited module space has become a technical problem to be solved. SUMMARY
[0007] The utility model aims at providing a heat dissipation PCB hard board, high integration heat dissipation camera module and unmanned plane, which can quickly conduct the heat inside the module to reduce the temperature inside the module.
[0008] The utility model discloses a kind of heat dissipation PCB hard boards, including PCB hard board, the middle part of the PCB hard board is equipped with photosensitive chip mounting area, further including fin, the first end of the fin is connected on the photosensitive chip mounting area of PCB hard board;The second end of the fin extends from the photosensitive chip mounting area to the direction away from the photosensitive chip mounting area.
[0009] Optionally, the fin is a graphene sheet. The thermal conductivity of the graphene sheet is 5300 W / (m-k), and the graphene sheet can quickly transfer heat from the core components of the camera module, such as the photosensitive chip. This high-efficiency heat transfer capability significantly reduces the temperature gradient inside the camera module, reducing the formation of hot spots, thereby effectively preventing performance degradation or damage caused by overheating.
[0010] Optionally, at least one copper area is further provided on the edge of the PCB hard board, and the second end of the fin is connected to at least one of the copper areas. By providing copper areas on the edge of the PCB hard board and connecting them to the second end of the fin, the heat generated by the photosensitive chip during operation can be effectively transferred to these copper areas through the fin. The high thermal conductivity of copper allows heat to be quickly absorbed and dispersed, thereby improving heat dissipation efficiency.
[0011] Optionally, a copper column connected to the copper area is mounted on the back of the PCB hard board at a position corresponding to the copper area, and the copper column protrudes from the back of the PCB hard board. By mounting a copper column connected to the copper area on the back of the PCB hard board and protruding the copper column from the back of the PCB hard board, the heat on the PCB hard board can be further transferred to the housing of the unmanned aerial vehicle through the copper column. In this way, heat can be more effectively dissipated to the surrounding environment, thereby further improving heat dissipation efficiency.
[0012] Optionally, the copper column and the copper area are welded together. Welding the copper column and the copper area together ensures good thermal connection between them, thereby avoiding heat loss during transmission.
[0013] Optionally, the back of the PCB hard board is provided with a copper-exposed area at a position corresponding to the photosensitive chip mounting area. By providing a copper-exposed area on the back of the PCB hard board corresponding to the photosensitive chip mounting area, the heat dissipation area can be further increased, so that the heat generated by the photosensitive chip can be quickly transferred to the PCB hard board and quickly dissipated to the surrounding environment through the copper-exposed area. This helps to improve heat dissipation efficiency and reduce the working temperature of the photosensitive chip.
[0014] Optionally, the PCB hard board is further provided with a plurality of ground holes. The ground holes on the PCB hard board can provide additional heat dissipation channels, so that heat can be dissipated more quickly through these channels to the other side of the PCB hard board or the surrounding environment. In addition, the ground holes can also reduce the area and weight of the PCB hard board, and help to improve the electrical performance of the entire circuit board. Therefore, the ground holes are beneficial to improve the heat dissipation efficiency and optimize the circuit board design.
[0015] In a second aspect, the utility model provides a high integration heat dissipation camera module, adopts the heat dissipation PCB hard board of the utility model.
[0016] In a third aspect, the utility model provides an unmanned aerial vehicle, including unmanned aerial vehicle body and the high integration heat dissipation camera module of the utility model, the high integration heat dissipation camera module is installed on unmanned aerial vehicle body.
[0017] Optionally, the high integration heat dissipation camera module is installed on the unmanned aerial vehicle body through the copper column thereon by screw. By cooperating the copper column and the screw, the high integration heat dissipation camera module is installed on the unmanned aerial vehicle body, can quickly transfer the heat on the PCB hard board to the shell of the unmanned aerial vehicle through the copper column, and the heat can be dissipated more effectively to the surrounding environment, thereby further improving the heat dissipation effect.
[0018] The utility model has the advantages that the utility model directly connects the heat dissipation fin on the photosensitive chip mounting area, can very quickly transfer the heat from the core component (such as photosensitive chip) of camera module to the wider area of heat dissipation fin. The efficient heat transfer capacity significantly reduces the temperature (temperature can reduce 10 DEG C ~ 15 DEG C) inside camera module, reduces the formation of hot spot, thereby effectively prevents the performance reduction or damage caused by overheating. In addition, the size of heat dissipation fin is very thin and small, and the overall size of camera module is not increased. BRIEF DESCRIPTION OF DRAWINGS
[0019] Figure 1 It is the structure schematic view of high integration heat dissipation camera module in the embodiment of the application;
[0020] Figure 2 It is the analysis diagram of high integration heat dissipation camera module in the embodiment of the application;
[0021] Figure 3 It is the overhead view of high integration heat dissipation camera module in the embodiment of the application;
[0022] Figure 4 It is the heat dissipation effect diagram (not add heat dissipation fin) of conventional camera module;
[0023] Figure 5The heat dissipation effect diagram (with a heat dissipation sheet) of the high-integration heat dissipation camera module in the embodiment of the present application;
[0024] Figure 6 The structural schematic diagram of the heat dissipation PCB hard plate in the embodiment of the present application;
[0025] Figure 7 The back surface schematic diagram of the heat dissipation PCB hard plate in the embodiment of the present application;
[0026] Figure 8 The distribution schematic diagram of the ground hole in the heat dissipation PCB hard plate in the embodiment of the present application;
[0027] Explanation of the signs in the drawings:
[0028] In the drawings: 1, lens, 2, base, 3, support, 4, heat dissipation PCB hard plate, 5, copper area, 6, copper column, 7, graphene sheet, 8, photosensitive chip, 9, optical filter, 10, DA glue, 11, ground hole, 12, exposed copper area. DETAILED DESCRIPTION
[0029] The other advantages and effects of the present application can be easily understood by the person skilled in the art from the content disclosed in the present specification. The present application can also be implemented or applied by means of other different specific embodiments, and each detail in the present specification can be modified or changed based on different viewpoints and applications without departing from the spirit of the present application. It should be understood that the preferred embodiments are only for illustrating the present application, but not for limiting the protection scope of the present application.
[0030] As shown in Figure 6 and Figure 7 In the embodiment of the present application, a heat dissipation PCB hard plate includes a PCB hard plate and a heat dissipation sheet 7. The middle part of the PCB hard plate is provided with a photosensitive chip mounting area, and the first end of the heat dissipation sheet 7 is connected to the photosensitive chip mounting area of the PCB hard plate. The second end of the heat dissipation sheet 7 extends from the photosensitive chip mounting area to a direction away from the photosensitive chip mounting area.
[0031] In a possible embodiment, the heat dissipation sheet 7 is a graphene sheet. The thermal conductivity coefficient of the graphene sheet is 5300 W / (m-k). The high thermal conductivity coefficient of the graphene sheet means that it can very quickly transfer heat from the core components (such as the photosensitive chip 8) of the camera module to a wider area of the heat dissipation sheet 7. This efficient heat transfer capability significantly reduces the temperature gradient inside the camera module, reduces the formation of hot spots, and effectively prevents performance degradation or damage caused by overheating.
[0032] As shown in Figure 1As shown, in one possible embodiment, at least one copper region 5 is further provided on the edge of the PCB rigid board, and the second end of the heat sink 7 is connected to at least one of the copper regions 5. By providing copper regions 5 on the edge of the PCB rigid board and connecting them to the second end of the heat sink 7, the heat generated by the photosensitive chip 8 during operation can be effectively transferred to these copper regions 5 through the heat sink 7. The high thermal conductivity of copper allows heat to be quickly absorbed and dispersed, thereby improving heat dissipation efficiency.
[0033] like Figure 1 , Figure 2 and Figure 7 As shown, in one possible embodiment, a copper pillar 6 connected to the copper region 5 is installed on the back side of the PCB rigid board at a position corresponding to the copper region 5, and the copper pillar 6 protrudes from the back side of the PCB rigid board. By installing the copper pillar 6 connected to the copper region 5 on the back side of the PCB rigid board and making the copper pillar 6 protrude from the back side of the PCB rigid board, the heat on the PCB rigid board can be further transferred to the drone's shell through the copper pillar 6. In this way, the heat can be dissipated more effectively into the surrounding environment, thereby further improving the heat dissipation effect.
[0034] In one possible embodiment, the copper pillar 6 is welded to the copper region 5. Welding the copper pillar 6 to the copper region 5 ensures a good thermal connection between them, thereby preventing heat loss during the transfer process.
[0035] like Figure 7 As shown, in one possible embodiment, the back of the PCB rigid board has an exposed copper area 12 at a position corresponding to the photosensitive chip mounting area. Providing an exposed copper area 12 on the back of the PCB rigid board corresponding to the photosensitive chip mounting area can further increase the heat dissipation area, allowing the heat generated by the photosensitive chip 8 to be transferred to the PCB rigid board more quickly and dissipated into the surrounding environment more rapidly through the exposed copper area 12. This helps improve heat dissipation efficiency and reduce the operating temperature of the photosensitive chip 8.
[0036] like Figure 8 As shown, in one possible embodiment, the PCB rigid board is also provided with several ground holes 11 ( Figure 8 All the small white round holes in the diagram are ground vias 11. Including ground vias 11 on the PCB provides additional heat dissipation channels, allowing heat to be dissipated more quickly to the other side of the PCB or the surrounding environment. Furthermore, ground vias 11 can reduce the area and weight of the PCB, while also contributing to improved electrical performance of the entire circuit board. Therefore, including ground vias 11 is beneficial for improving heat dissipation efficiency and optimizing circuit board design.
[0037] The existing camera module generally includes a PCB hard board, a base 2, a graphene sheet, DA glue 10, LHA glue, a support 3, a filter 9, a chip, a copper column 6, a resistor, a capacitor, a DC-DC (direct current power conversion module) / LDO (low dropout linear regulator), and a lens 1. The PCB hard board is mainly used to bear the photosensitive chip 8, the support 3, the lens 1, the resistor, the capacitor, the DC-DC / LDO, and the like in the high-integration heat-dissipation camera module. The graphene sheet is used to fill the flat surface at the bottom of the photosensitive chip 8 and improve the heat conductivity. The graphene sheet has a high heat conductivity (5300 W / (m-k)) and can improve the heat dissipation speed of the camera module. The copper column 6 is made of aluminum-copper alloy material, which has a higher heat conductivity than steel and iron and has a strength and toughness comparable to steel and iron. The photosensitive chip 8 is mainly borne on the upper surface of the graphene sheet, and the periphery of the photosensitive chip 8 is bonded to the PCB hard board by DA glue 10. The DA glue 10 can well bond the photosensitive chip 8 and the PCB hard board together, increase the reliability of the fixation of the photosensitive chip 8, and reduce the heat generated by the photosensitive chip 8 during work. The LHA glue is mainly used to fix the support 3 on the PCB hard board, but the heat conductivity of the LHA glue is less than 1 W / (m-k). The support 3 is mainly used to protect the capacitor and the photosensitive chip 8 and bear the filter 9. The heat conductivity of the support 3 is generally less than 2 W / (m-k). The filter 9 is mainly used to filter out stray light and transmit useful visible light to the photosensitive chip 8. The filter 9 also protects the photosensitive chip 8. However, the main material of the filter 9 is glass, which has a heat conductivity of only 1 W / (m-k). The heat conductivities of these materials are all low, which is not conducive to the rapid transmission of heat. The heat generated at the bottom of the photosensitive chip 8 needs to be transmitted to the outside of the camera module through the DA glue 10, the PCB hard board, and the steel sheet. The heat conductivities of the DA glue 10 and the PCB hard board are very low. When the photosensitive chip 8 works for a long time at a high frame rate, it is difficult for the heat to be transmitted to the outside of the camera module, which leads to the accumulation of heat in the camera module and the failure of heat dissipation, which is not conducive to the normal work of the camera module.
[0038] As shown in Figures 1 to 3 To solve the above problems, the embodiment of the present application provides a high-integration heat-dissipation camera module. The PCB hard board adopts the heat-dissipation PCB hard board 4 in the embodiment of the present application. That is, the glue is drawn in the photosensitive chip mounting area of the PCB hard board (i.e., below the photosensitive chip 8). A square area with a diameter of 3 mm is reserved at the glue drawing position (the shape and size of the square area are determined according to the heat dissipation requirement and the size of the graphene sheet). The first end of the designed graphene sheet is attached in the square area, and the second end of the graphene sheet is in contact with the copper area 5 at the edge of the PCB hard board, which can quickly conduct the heat generated by the work of the photosensitive chip 8. In addition, the copper area 5 and the copper column 6 below are connected together through SMT, and the conducted heat can be quickly transmitted to the outside, thereby achieving good heat dissipation effect.
[0039] AsFigure 4 and Figure 5 As shown in the figure, when no graphene sheet is added, the temperature inside the camera module reaches 85 DEG C; after adding the graphene sheet, the internal temperature of the high-integration heat-dissipation camera module is reduced to 72 DEG C, and it is verified through experiments that the temperature can be reduced by 10 DEG C to 15 DEG C after adding the graphene sheet.
[0040] In the embodiment of the application, a kind of unmanned aerial vehicle, including unmanned aerial vehicle body, and as high-integration heat-dissipation camera module in the embodiment of the application, high-integration heat-dissipation camera module is installed on unmanned aerial vehicle body.Unmanned aerial vehicle assembly fixed camera module is connected together by screw and copper column 6, so it is convenient to transfer the heat generated in high-integration heat-dissipation camera module to outside, to achieve good heat dissipation effect.
[0041] The above embodiment is the preferred embodiment of the present application, but the embodiment of the present application is not limited by the above embodiment, any change, modification, replacement, combination, simplification made without departing from the spirit and principle of the present application, should be equivalent replacement method, all included in the protection scope of the present application.
Claims
1. A heat-dissipating PCB rigid board, comprising a PCB rigid board, wherein a photosensitive chip mounting area is provided in the middle of the PCB rigid board, characterized in that: It also includes a heat sink (7), the first end of which is connected to the photosensitive chip mounting area of the PCB rigid board; the second end of which extends from the photosensitive chip mounting area in a direction away from the photosensitive chip mounting area.
2. The heat dissipation PCB rigid board according to claim 1, characterized in that: The heat sink (7) is a graphene sheet.
3. The heat dissipation PCB rigid board according to claim 1, characterized in that: At least one copper region (5) is provided on the edge of the PCB rigid board, and the second end of the heat sink (7) is connected to at least one of the copper regions (5).
4. The heat dissipation PCB rigid board according to claim 3, characterized in that: On the back of the PCB rigid board, a copper pillar (6) is installed at a position corresponding to the copper area (5) and is connected to the copper area (5), and the copper pillar (6) protrudes from the back of the PCB rigid board.
5. The heat dissipation PCB rigid board according to claim 4, characterized in that: The copper pillar (6) is welded together with the copper region (5).
6. The heat dissipation PCB rigid board according to claim 1, characterized in that: The back of the PCB rigid board has an exposed copper area (12) at a position corresponding to the photosensitive chip mounting area.
7. The heat dissipation PCB rigid board according to claim 1, characterized in that: The PCB rigid board is also provided with several ground holes (11).
8. A highly integrated heat dissipation camera module, characterized in that: The heat dissipation PCB rigid board (4) as described in any one of claims 1 to 7 is adopted.
9. A drone, characterized in that, It includes the drone body and the highly integrated heat dissipation camera module as described in claim 8, wherein the highly integrated heat dissipation camera module is mounted on the drone body.
10. The UAV according to claim 9, characterized in that: The highly integrated heat dissipation camera module is mounted on the drone body with screws via copper pillars (6) on it.