Circuit board film coating tool

By designing the coating mechanism and unloading mechanism of the circuit board coating fixture, the problems of uneven coating of circuit boards of different thicknesses and manual collection were solved, and efficient and automated circuit board coating processing was realized.

CN223714287UActive Publication Date: 2025-12-23WUHAN ZHAOCHEN TECHNOLOGY CO LTD
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Patent Information

Application Number
CN202422782712.5
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-11-15
Publication Date
2025-12-23
Estimated Expiration
2034-11-15

AI Technical Summary

Technical Problem

Existing circuit board coating fixtures are not convenient for coating circuit boards of different thicknesses, and manual collection is required after coating, which leads to reduced performance and efficiency.

Method used

A circuit board coating fixture was designed, comprising a coating mechanism and a feeding mechanism. The coating mechanism uses a cylinder to drive a hot press roller to move up and down to adjust the height and tension. The feeding mechanism uses a cylinder and a motor to drive a suction frame to automatically feed the circuit board, thereby achieving uniform coating and automatic feeding of circuit boards of different thicknesses.

Benefits of technology

It achieves uniform film coating on circuit boards of different thicknesses, improves processing quality, and reduces manual labor and improves processing efficiency through automatic unloading.

✦ Generated by Eureka AI based on patent content.

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  • Figure CN223714287U_ABST
    Figure CN223714287U_ABST
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Abstract

The utility model relates to a circuit board film covering tool which comprises a workbench, a conveyor is installed in a groove formed in the top of the workbench, two symmetrical supporting plates are arranged at the positions, located on the two sides of the conveyor, of the top of the workbench, and a film covering roller is rotationally installed between the two supporting plates; the film laminating mechanism is arranged at the bottom of the supporting frame, the movable plate is driven to slide up and down along the sliding rod by driving the first air cylinder, the movable plate drives the hot pressing roller to move up and down to adjust the height, and therefore film laminating is conducted on circuit boards with different thicknesses. Meanwhile, the tensioning roller is driven to move up and down to adjust the position, so that the hot pressing roller drives the surface film on the film laminating roller to be uniformly attached to the surface of the circuit board, and the processing quality is improved.
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Description

Technical Field

[0001] This application relates to the field of circuit board processing technology, and in particular to a circuit board coating tooling. Background Technology

[0002] Circuit boards are essential components in many electronic devices, and are among the most important structures in most electronic devices. Circuit boards integrate circuits and electronic components, saving space and reducing the size of the electronic device. The process of manufacturing a circuit board involves first printing the circuitry onto the board, and then sealing it with a film. This film protects the circuit board surface from scratches, providing a degree of protection.

[0003] Existing circuit board coating fixtures are not convenient for coating circuit boards of different thicknesses during use, which reduces their performance. Furthermore, after the circuit boards are coated, they are mostly collected manually, which reduces the effectiveness of the collection. Utility Model Content

[0004] To address the problems mentioned in the background art, this application provides a circuit board coating fixture.

[0005] The circuit board coating fixture provided in this application adopts the following technical solution:

[0006] A circuit board laminating fixture includes a worktable, a conveyor installed in a groove on the top of the worktable, two symmetrical support plates on both sides of the conveyor on the top of the worktable, a laminating roller rotatably mounted between the two support plates, a support frame mounted on the top of the worktable near the edges of the two support plates, a laminating mechanism at the bottom of the support frame, an extension plate at one end of the worktable, two symmetrical fixing plates on the top of the worktable and the top of the extension plate, and a feeding mechanism between the two fixing plates.

[0007] Preferably, the coating mechanism includes a movable plate, which is disposed at the bottom of the support frame. Two protrusions are provided at the bottom of the movable plate, and a hot press roller is rotatably mounted between the two protrusions. A telescopic component that drives the hot press roller to move up and down is also provided at the top of the movable plate.

[0008] Preferably, the telescopic component is a first cylinder, which is fixedly installed on the top of the support frame. One end of the first cylinder passes through a through hole opened on the top of the support frame and is connected to the top of the movable plate. Two sliders are also provided at both ends of the movable plate. One end of the two sliders passes through a through groove opened on the side wall of both ends of the support frame and is slidably installed on a slide rod provided inside the through groove.

[0009] Preferably, two symmetrical connecting rods are also installed on one side of the two protrusions, and a tensioning roller is rotatably installed between the two connecting rods.

[0010] Preferably, the feeding mechanism includes a lead screw, one end of which is connected to a bearing seat provided on the side wall of one of the fixed plates, and the other end of which passes through a through hole opened in the side wall of another fixed plate and is connected to a motor provided on the other side wall. A movable block is adapted to be installed on the lead screw.

[0011] Preferably, the bottom of the movable block is provided with a sliding groove, which is adapted to the slide rails provided on the top of the worktable and the extension plate. A horizontal plate is fixedly installed on the top of the movable block, and a material suction assembly is provided on the horizontal plate.

[0012] Preferably, the suction assembly includes a second cylinder, which is fixedly installed on the top of one end of the horizontal plate. One end of the second cylinder passes through a through hole in the horizontal plate and is connected to a suction frame. The suction frame is I-shaped, and suction discs are respectively provided at the bottom of both ends of the suction frame.

[0013] In summary, this application includes the following beneficial technical effects:

[0014] 1. This utility model is equipped with a film coating mechanism and a telescopic component. Through the cooperation of the film coating mechanism and the telescopic component, the movable plate drives the hot press roller to move up and down to adjust the height, thereby coating circuit boards of different thicknesses. At the same time, it drives the tension roller to move up and down to adjust the position, so that the film on the hot press roller and the film coating roller are evenly adhered to the surface of the circuit board, thereby improving the processing quality.

[0015] 2. This utility model is equipped with a feeding mechanism. The drive motor drives the lead screw to rotate, which causes the horizontal plate on the top of the movable block adapted to be installed on the lead screw to move the suction frame back and forth. The suction plate at the bottom of the suction frame picks up the coated circuit board and realizes automatic feeding, thereby reducing the labor of manual feeding by the workers and improving processing efficiency. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the structure of a circuit board coating fixture according to an embodiment of this application;

[0017] Figure 2 This is a cross-sectional view of the coating mechanism structure of a circuit board coating tooling according to an embodiment of this application;

[0018] Figure 3 This is a cross-sectional view of the side structure of the support frame of a circuit board coating tooling according to an embodiment of this application;

[0019] Figure 4 This is a cross-sectional view of the blanking structure of a circuit board coating tooling according to an embodiment of this application.

[0020] Explanation of reference signs: 1, workbench; 2, conveyor; 3, support plate; 4, laminating roller; 5, support frame; 6, extension plate; 7, fixed plate; 8, movable plate; 9, protrusion; 10, hot pressing roller; 11, first air cylinder; 12, sliding block; 13, sliding rod; 14, connecting rod; 15, tensioning roller; 16, lead screw; 17, motor; 18, movable block; 19, cross plate; 20, second air cylinder; 21, suction frame; 22, suction disc. DETAILED DESCRIPTION

[0021] The following will be further described in detail in combination with the accompanying drawings. Figure 1 The present application is further described in detail.

[0022] The circuit board laminating tool disclosed by the embodiment of the present application comprises a workbench 1, a conveyor 2 is installed in a groove formed on the top of the workbench 1, two symmetrical support plates 3 are arranged on the top of the workbench 1 at both sides of the conveyor 2, a laminating roller 4 is rotatably installed between the two support plates 3, a support frame 5 is installed on the top of the workbench 1 close to the edges of the two support plates 3, a laminating mechanism is arranged on the bottom of the support frame 5, an extension plate 6 is further arranged at one end of the workbench 1, two symmetrical fixed plates 7 are arranged on the top of the workbench 1 and the top of the extension plate 6, and a blanking mechanism is arranged between the two fixed plates 7.

[0023] Reference Figure 1 , Figure 2 and Figure 3The film covering mechanism comprises a movable plate 8 arranged at the bottom of the support frame 5, two protrusions 9 arranged at the bottom of the movable plate 8, a hot pressing roller 10 rotatably arranged between the two protrusions 9, a telescopic assembly arranged at the top of the movable plate 8 and used for driving the hot pressing roller 10 to move up and down, the telescopic assembly being a first air cylinder 11, the first air cylinder 11 being fixedly arranged at the top of the support frame 5, one end of the first air cylinder 11 penetrating through a through hole formed at the top of the support frame 5 and being connected with the top of the movable plate 8, two sliding blocks 12 being arranged at the two ends of the movable plate 8, one end of each of the two sliding blocks 12 penetrating through a through slot formed at the side wall of the support frame 5 and being slidably arranged on a sliding rod 13 arranged in the through slot, two symmetrical connecting rods 14 being arranged at one side of each of the two protrusions 9, and a tension roller 15 being rotatably arranged between the two connecting rods 14. More specifically, when the circuit board is covered with the film, the first air cylinder 11 is driven to drive the movable plate 8 to move up and down to be adjusted, so that the sliding blocks 12 arranged at the two ends of the movable plate 8 slide on the sliding rod 13 arranged in the through slot formed at the side wall of the support frame 5, so that the movable plate 8 drives the hot pressing roller 10 rotatably arranged between the two protrusions 9 at the bottom of the movable plate 8 to move up and down to be adjusted in height, and the two connecting rods 14 arranged at one side of each of the two protrusions 9 drive the tension roller 15 to move up and down to be adjusted in tension of the film on the upper surface of the film covering roller 4, so that the hot pressing roller 10 drives the film on the film covering roller 4 to be closely attached to the surface of the circuit board with different thicknesses, the conveyor 2 is driven to move the circuit board, the hot pressing roller 10 uniformly attaches the film to the surface of the circuit board, and thus the quality of the film covering is improved.

[0024] Reference Figure 4 The blanking mechanism comprises a lead screw 16, one end of the lead screw 16 being connected with a bearing seat arranged at the side wall of one of the fixed plates 7, the other end of the lead screw 16 penetrating through a through hole formed at the side wall of the other fixed plate 7 and being connected with a motor 17 arranged at the other side wall, and a movable block 18 being adaptively arranged on the lead screw 16. A sliding groove is formed at the bottom of the movable block 18, the sliding groove being adapted to a sliding rail arranged at the top of the workbench 1 and the extension plate 6, a horizontal plate 19 being fixedly arranged at the top of the movable block 18, a material suction assembly being arranged on the horizontal plate 19, the material suction assembly comprising a second air cylinder 20, the second air cylinder 20 being fixedly arranged at one end of the horizontal plate 19, one end of the second air cylinder 20 penetrating through a through hole formed at the horizontal plate 19 and being connected with a material suction frame 21, the material suction frame 21 being in the shape of an I-beam, two material suction discs 22 being arranged at the bottom of the material suction frame 21. More specifically, when the circuit board is blanked, the second air cylinder 20 is driven to drive the material suction frame 21 to move downward, so that the material suction discs 22 arranged at the bottom of the material suction frame 21 suck the circuit board covered with the film, then the motor 17 is driven to drive the lead screw 16 to rotate, so that the movable block 18 slides forward and backward along the sliding rail arranged at the top of the workbench 1 and the extension plate 6 through the sliding groove formed at the bottom of the movable block 18, so that the horizontal plate 19 arranged at the top of the movable block 18 drives the material suction frame 21 arranged at the bottom to move forward and backward, thereby automatically blanking the circuit board, reducing the labor degree of manual collection, and thus improving the processing efficiency.

[0025] The implementation principle of the circuit board film covering tool is as follows: during use, the first air cylinder 11 drives the movable plate 8 to move up and down for adjustment, so that the movable plate 8 slides along the two slide rods 13 through the sliding block 12, thereby driving the hot pressing roller 10 installed between the two protrusions 9 at the bottom to move up and down for height adjustment, and the two connecting rods 14 installed on one side of the two protrusions 9 drive the tensioning roller 15 to move up and down for tension adjustment, so that the hot pressing roller 10 drives the surface film on the film roller 4 to be closely attached to the surface of the circuit board with different thicknesses, the conveyor 2 is driven to move the circuit board, the hot pressing roller 10 uniformly attaches the surface film to the surface of the circuit board, after the circuit board film covering is completed, the second air cylinder 20 drives the material suction frame 21 to move downward, so that the material suction disc 22 arranged at the bottom of the two ends of the material suction frame 21 sucks the circuit board, then the motor 17 drives the screw rod 16 to rotate, so that the movable block 18 slides along the slide rail arranged at the top of the workbench 1 and the extension plate 6, the horizontal plate 19 arranged at the top of the movable block 18 drives the material suction frame 21 to move forward and backward, thereby automatically discharging the circuit board, reducing the labor degree of manual collection, and improving the processing efficiency.

[0026] The above are preferred embodiments of the present application, and do not limit the protection scope of the present application, so that: any equivalent changes made according to the structure, shape, principle of the present application should be covered within the protection scope of the present application.

Claims

1. A circuit board coating fixture, comprising a worktable (1), a conveyor (2) installed in a groove on the top of the worktable (1), two symmetrical support plates (3) arranged on both sides of the conveyor (2) on the top of the worktable (1), a coating roller (4) rotatably mounted between the two support plates (3), and a support frame (5) installed on the top of the worktable (1) near the edges of the two support plates (3), characterized in that: The bottom of the support frame (5) is provided with a film covering mechanism, one end of the workbench (1) is also provided with an extension plate (6), and the top of the workbench (1) and the top of the extension plate (6) are provided with two symmetrical fixed plates (7), and a blanking mechanism is arranged between the two fixed plates (7); The film covering mechanism comprises a movable plate (8), the movable plate (8) is arranged at the bottom of the support frame (5), the bottom of the movable plate (8) is provided with two protrusions (9), a hot pressing roller (10) is rotatably installed between the two protrusions (9), and the top of the movable plate (8) is also provided with a telescopic assembly for driving the hot pressing roller (10) to move up and down; The telescopic assembly is a first air cylinder (11), the first air cylinder (11) is fixedly installed at the top of the support frame (5), one end of the first air cylinder (11) penetrates through the through hole formed in the top of the support frame (5) and is connected with the top of the movable plate (8), and the two ends of the movable plate (8) are also provided with two sliding blocks (12), one end of the two sliding blocks (12) penetrates through the through slot formed in the side wall of the support frame (5) and is slidably installed on the sliding rod (13) arranged in the through slot.

2. The circuit board film coating tool of claim 1, wherein: Two protrusions (9) are also installed on one side of the two protrusions (9), and two symmetrical connecting rods (14) are rotatably installed between the two connecting rods (14).

3. The circuit board film coating tool of claim 1, wherein: The blanking mechanism comprises a lead screw (16), one end of the lead screw (16) is connected with the bearing seat arranged in the side wall of one of the fixed plates (7), the other end of the lead screw (16) penetrates through the through hole formed in the side wall of the other fixed plate (7) and is connected with the motor (17) arranged in the other side wall, and the lead screw (16) is adaptively installed with a movable block (18).

4. The circuit board film coating tool of claim 3, wherein: The bottom of the movable block (18) is provided with a sliding groove, the sliding groove is adapted to the sliding rail arranged at the top of the workbench (1) and the extension plate (6), the top of the movable block (18) is fixedly installed with a horizontal plate (19), and the horizontal plate (19) is provided with a material suction assembly.

5. The circuit board film coating tool of claim 4, wherein: The material suction assembly comprises a second air cylinder (20), the second air cylinder (20) is fixedly installed at one end of the top of the horizontal plate (19), one end of the second air cylinder (20) penetrates through the through hole formed in the horizontal plate (19) and is connected with a material suction frame (21), the material suction frame (21) is in the shape of an I-beam, and the two ends of the material suction frame (21) are respectively provided with material suction discs (22).