Radiator and power conversion equipment

Abstract

The utility model discloses a radiator and a power conversion device, the scheme comprises an evaporator, a first condenser and a connecting pipe, the evaporator comprises an evaporation chamber filled with a phase change medium and a heat dissipation surface used for dissipating heat of a power device; the connecting pipe is communicated with a condensation chamber and an evaporation chamber of the first condenser; the projection of the connecting pipe on the evaporator is located in the area where the evaporation cavity is located. When the radiator works, the power device is arranged on the heat dissipation face, heat generated by the power device enables the phase change working medium in the evaporation cavity to evaporate and absorb heat to form steam, the steam enters the condensation cavity to release heat and be condensed, the condensed working medium returns to the evaporator through the connecting pipe, and the process is repeated, so that the effect of dissipating heat of the power device is achieved. In addition, the projection, on the evaporator, of the connecting pipe is located in the evaporation cavity, and therefore the occupied size of the whole radiator can be reduced.

Description

TECHNICAL FIELD

[0001] The utility model relates to electronic component heat dissipation technical field, especially a radiator and power conversion equipment. BACKGROUND

[0002] The existing power conversion equipment such as inverter, energy storage converter (PCS) mainly adopts air cooling heat dissipation, along with the improvement of power conversion equipment power density, the loss of power device such as insulated gate bipolar transistor (IGBT) also increases greatly, and higher and higher power density puts forward higher challenge to the heat dissipation design of power device.

[0003] Therefore, how to improve the heat dissipation efficiency of power device becomes the technical problem of the technical personnel in the field to be solved urgently. CONTENT OF THE UTILITY MODEL

[0004] The utility model provides a radiator and power conversion equipment to improve the heat dissipation efficiency of power device.

[0005] In order to realize the above-mentioned purpose, the utility model discloses the following technical scheme:

[0006] Firstly, the utility model provides a radiator, including evaporimeter, first condenser and connecting pipe, wherein, evaporimeter includes the evaporative chamber filled with phase change medium and the heat dissipation surface for the heat dissipation of power device;

[0007] The condensing chamber of connecting pipe and first condenser is communicated with evaporative chamber;And the projection of connecting pipe on evaporimeter is located in the area where evaporative chamber is.

[0008] In some examples, the number of first condensers is at least two, and the at least two first condensers are arranged in height direction in turn.

[0009] The evaporative chamber is at least two, and the evaporative chamber is communicated with the corresponding condensing chamber.

[0010] In some examples, the evaporimeter includes at least two sub-evaporators, each sub-evaporator includes an evaporative chamber;At least two sub-evaporators are spliced together.

[0011] In some examples, adjacent sub-evaporators are connected through connecting pieces, and the connecting pieces include connecting bodies and mounting holes located at both ends of the connecting bodies, one mounting hole is mounted on one sub-evaporator, and the other mounting hole is mounted on the other sub-evaporator.

[0012] In some examples, the splicing surface between the two adjacent sub-evaporators is a plane or a curved surface.

[0013] In some examples, the splicing surface between the two adjacent sub-evaporators further comprises a concave-convex matching part, one of the sub-evaporators is provided with a concave part, and the other sub-evaporator is provided with a convex part.

[0014] In some examples, the evaporator comprises at least two evaporation chambers.

[0015] The evaporator comprises a shell and a partition plate arranged in the shell to separate at least two evaporation chambers.

[0016] In some examples, in the height direction, the at least two condensers are arranged in an up-down manner, and adjacent condensers have an airflow channel therebetween.

[0017] In some examples, the connecting pipe comprises a first connecting pipe and a second connecting pipe respectively communicating with the evaporation chambers, and in the height direction, the connecting point of the first connecting pipe with the evaporator is higher than the connecting point of the second connecting pipe with the evaporator.

[0018] In some examples, the number of the first condensers is two, and in the height direction, the angle between the axis of the upper first condenser and the height direction is an acute angle, and the angle between the axis of the lower first condenser and the height direction is an obtuse angle.

[0019] In some examples, the heat sink further comprises a second condenser, and the condensation chamber of the second condenser communicates with the evaporation chamber of the evaporator through an opening.

[0020] In some examples, in the height direction, the end of the second condenser away from the evaporator is higher than the end of the second condenser connected to the evaporator.

[0021] In some examples, the evaporator is provided with an opening, and the condensation chamber of the first condenser communicates with the evaporation chamber of the evaporator through the opening.

[0022] The first condenser comprises a first connecting pipe, and in the height direction, the connecting point of the first connecting pipe with the evaporator is located at the end of the first condenser away from the evaporator.

[0023] In some examples, in the height direction, the end of the first condenser away from the evaporator is higher than the end of the first condenser connected to the evaporator.

[0024] In a second aspect, the present application provides a power conversion device, comprising a heat sink, a power device, and a case, the heat sink is arranged outside the case, the power device is arranged inside the case and directly or indirectly contacts the heat dissipation surface of the heat sink; and the heat sink is the heat sink according to any one of claims 1 to 17.

[0025] In some examples, the power conversion device further comprises a heat dissipation cover, the heat dissipation cover is arranged on the case, and the heat sink is arranged in the heat dissipation cover.

[0026] In some examples, the power conversion device also includes an air-cooling system, which includes a fan and multiple air duct openings. The fan is located inside a heat sink, and the air duct openings are located on the top, bottom, side, or back of the heat sink.

[0027] In some examples, the fan is located below the radiator in the vertical direction.

[0028] In some examples, when the radiator includes at least two first condensers, the fan is located between two adjacent first condensers.

[0029] As can be seen from the above technical solution, when the heat sink of this application is working, the power device is directly arranged at the heat dissipation surface. The heat generated by the device causes the phase change working fluid in the evaporation chamber to evaporate and absorb heat to form steam. The steam enters the condensation chamber, releases heat, and condenses. The condensed working fluid returns to the evaporator through the connecting pipe, and this cycle repeats, thereby achieving the effect of heat dissipation for the power device. In addition, in this application, the projection of the connecting pipe on the evaporator is located inside the evaporation chamber, thus reducing the overall volume occupied by the heat sink. Attached Figure Description

[0030] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are merely some examples or embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on the provided drawings without creative effort, and this utility model can be applied to other similar scenarios based on the provided drawings. Unless obvious from the context or otherwise stated, the same reference numerals in the drawings represent the same structure or operation.

[0031] Figure 1 A perspective view of a radiator provided for an embodiment of this utility model;

[0032] Figure 2 for Figure 1 The side view of the radiator shown;

[0033] Figure 3 A perspective view of a radiator provided for an embodiment of this utility model;

[0034] Figure 4 for Figure 3 The exploded view of the radiator shown;

[0035] Figure 5 for Figure 3 The side view of the radiator shown;

[0036] Figure 6a for Figure 3 Rear view of the radiator shown Figure 1 ;

[0037] Figure 6b For Figure 3 Rear view of the heat sink shown in Figure 2 ;

[0038] Figure 6c For Figure 3 Rear view of the heat sink shown in Figure 3 ;

[0039] Figure 7 A perspective view of a power conversion device provided by an embodiment of the present application is shown in the figure;

[0040] Figure 8 A perspective view of a power conversion device provided by an embodiment of the present application is shown in the figure;

[0041] Figure 9 A perspective view of another heat sink provided by an embodiment of the present application is shown in the figure;

[0042] Figure 10 For Figure 9 Side view of the heat sink shown in

[0043] Figure 11 A perspective view of another power conversion device provided by an embodiment of the present application is shown in the figure;

[0044] Figure 12 A perspective view of another power conversion device provided by an embodiment of the present application is shown in the figure;

[0045] Figure 13 A perspective view of a third heat sink provided by an embodiment of the present application is shown in the figure;

[0046] Figure 14 For Figure 13 Side view shown in

[0047] Figure 15 A perspective view of a third power conversion device provided by an embodiment of the present application is shown in the figure;

[0048] Figure 16 A perspective view of a third power conversion device provided by an embodiment of the present application is shown in the figure;

[0049] Figure 17 A perspective view of a fourth heat sink provided by an embodiment of the present application is shown in the figure;

[0050] Figure 18 For Figure 15 Sectional view of A-A section in

[0051] Figure 19 A side view of a fourth heat sink provided by an embodiment of the present application is shown in the figure;

[0052] Figure 20 A third perspective view of the power conversion device according to the embodiment of the present application;

[0053] Figure 21 A third perspective view of the power conversion device according to the embodiment of the present application;

[0054] In the figure: 10 - radiator; 20 - power device; 30 - case; 40 - heat shield; 50 - magnetic device; 60 - fan;

[0055] 100 - evaporator; 200 - first condenser; 300 - connecting pipe; 400 - connecting piece; 500 - second condenser;

[0056] 110 - condensing surface; 120 - radiating surface; 130 - evaporation chamber; 140 - splicing surface; 150 - shell; 160 - partition; 141 - concave-convex matching part; 100a - sub-evaporator;

[0057] 210 - condensing chamber;

[0058] 310 - first connecting pipe; 320 - second connecting pipe; 410 - connecting body; 420 - mounting hole; 430 - mounting hole; 510 - condensing chamber; 41 - air inlet; 42 - air outlet. DETAILED DESCRIPTION

[0059] The present application will be further described below in conjunction with the drawings and embodiments. It can be understood that the specific embodiments described herein are only used to explain the related application, and not to limit the application. The described embodiments are only a part of the embodiments of the present application, not all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of the present application.

[0060] As described in the background, the power density of the power conversion device in the prior art is also getting higher, and the heat dissipation demand of the power device is also getting higher. The air cooling heat dissipation alone cannot completely improve the heat dissipation demand of the power device, so it is urgent to improve the efficient heat dissipation of the power device.

[0061] To alleviate the above problems, the present application provides a radiator. When the radiator works, the power device is arranged on the radiating surface of the evaporator in the radiator. The heat generated by the power device causes the phase change working medium in the evaporation chamber to evaporate and absorb heat. The steam enters the condenser arranged on the other side of the evaporator to release heat and condense. Through the connecting pipe located in the projection of the evaporation chamber, the steam returns to the evaporator. The phase change circuit is short, so that more heat can be absorbed in unit time, and the heat dissipation efficiency of the power device is improved.

[0062] In addition, the connecting pipe is arranged, so that the condensed liquid phase change medium can flow back to the evaporation chamber conveniently, and the backflow efficiency of the phase change medium is improved.

[0063] The heat sink provided by the embodiments of the present application is described in detail below. Figures 1 to 2 The heat sink 10 provided by the embodiments of the present application can include an evaporator 100, a first condenser 200 and a connecting pipe 300, wherein the evaporator 100 includes an evaporation chamber 130 filled with phase change medium and a heat dissipation surface 120 for dissipating heat of a power device; the connecting pipe 300 connects a condensation chamber 210 of the first condenser 200 and the evaporation chamber 130; and a projection of the connecting pipe 300 on the evaporator is located in an area where the evaporation chamber 130 is located.

[0064] When the heat sink 10 works, the power device 20 is installed at the heat dissipation surface 120, and the heat generated by the power device 20 causes the phase change medium in the evaporation chamber 130 to evaporate and absorb heat to form steam, the steam enters the condensation chamber 210 to release heat and condense, and the condensed working medium returns to the evaporator 100 through the connecting pipe 300, so as to circulate repeatedly, thereby improving the heat dissipation efficiency of the power device. In addition, in the present application, the projection of the connecting pipe 300 on the evaporator 100 is located in the area where the evaporation chamber 130 is located, so that more heat can be absorbed in a unit of time, the heat dissipation efficiency of the power device is improved, and the occupied volume of the entire heat sink 10 can be reduced.

[0065] It should be noted that the heat sink 10 has a height direction Z, a length direction X and a thickness direction Y, and the height direction Z, the length direction X and the thickness direction Y intersect with each other. For example, the heat sink 10 of the present application uses gravity, and the heat sink 10 can be arranged in parallel with the height direction and the gravity direction during use. Correspondingly, the evaporator 100 has a height direction, a length direction and a thickness direction, wherein the height direction, the length direction and the thickness direction of the evaporator 100 correspond to the height direction, the length direction and the thickness direction of the heat sink 10 respectively. Of course, if a driving pump is added to the system, the circulation of the phase change medium can be completed by using the power of the driving pump, which is also within the protection scope of the present application, and in this case, the arrangement direction and position of the heat dissipation can not be required.

[0066] The heat dissipation surface 120 of the evaporator 100 described above is used to dissipate heat from the power device 20, wherein the power device 20 is directly or indirectly mounted on the heat dissipation surface 120, or the power device 20 is arranged near the heat dissipation surface 120, or the power device is in contact with the phase change medium through the window provided on the surface of the evaporator, which can all dissipate heat from the power device 20. In addition, the surface opposite to the heat dissipation surface 120 is the condensation surface 110, and the first condenser 200 is mounted at the condensation surface 110. It should be noted that, in the height direction, the height of the uppermost heat dissipation surface 120 is lower than the liquid level of the phase change medium in the evaporation chamber 130. Thus, it is ensured that the power device 20 mounted at the mounting portion always has the phase change working medium corresponding thereto, thereby reducing the risk of dry burning.

[0067] The number of the first condenser 200 described above can be one, or at least two, as shown in Figures 3 to 5 , Figure 9 , Figure 10 , Figure 13 and Figure 14 , the at least two first condensers 200 are arranged in sequence in the height direction, and the corresponding evaporation chambers 130 are at least two, each evaporation chamber 130 is in communication with the corresponding condensation chamber 210. The present application focuses on the case that the first condenser 200 is two, and the case that the first condenser 200 is other numbers can be referred to the case that the first condenser 200 is one.

[0068] The at least two first condensers 200 are arranged on the condensation surface 110 in the height direction, which can effectively reduce the problem of high size layout caused by the arrangement of multiple layers of power devices 20, and improve the space utilization rate of the evaporator 100 at the overall layout. At the same time, different regional power devices 20 correspond to different condensers, which can release the temperature margin of the power device 20, and further reduce the cost of the heat sink 10. In the prior art, the heat sink with a single evaporator and a single condenser is designed, in order to facilitate the backflow of the phase change medium, the condenser is usually arranged at the upper end of the evaporator. When the power device is more, multiple layers of power devices are arranged on the heat dissipation surface of the evaporator, and the overall design of the evaporator is correspondingly increased. At this time, the condenser also needs to be correspondingly increased in heat exchange volume design, and occupies more space above. At the same time, the heat dissipation requirements of multiple power modules are different, and the overall evaporator structure has a large margin for the heat dissipation requirement of the power module with low loss. Therefore, the at least two first condensers 200 and the at least two evaporators 100 provided in the embodiments of the present application are correspondingly arranged, which not only can alleviate the problem of heat sink design space, but also can design different heat sinks 10 according to the heat generation requirements of different power devices, thereby reducing the design cost.

[0069] One evaporator 100 can be provided with one evaporation chamber 130, and at least two evaporation chambers 130 can also be provided, Figure 3 ,Figure 4 、 Figure 5 、 Figure 9 、 Figure 10 、 Figure 13 and Figure 14 one evaporator 100 is provided with one evaporation chamber 130; Figure 17 and Figure 18 one evaporator 100 is provided with at least two evaporation chambers 130, the evaporator 100 comprises a housing 150 and a partition 160, the partition 160 divides the housing 150 into at least two evaporation chambers 130.

[0070] In some examples, at least two first condensers 200 are respectively installed on different evaporators 100, as shown in Figure 3 、 Figure 4 、 Figure 5 、 Figure 9 、 Figure 10 、 Figure 13 and Figure 14 In other examples, at least two first condensers 200 are respectively installed on the same evaporator 100.

[0071] For the convenience of distinguishing different evaporators 100, it is defined as a sub-evaporator 100a. One sub-evaporator 100a is installed with one first condenser 200, as shown in Figure 3 、 Figure 9 、 Figure 13 According to the requirements, the power device 20 corresponding to the first condenser 200 can be adjusted; after the first condenser 200 is assembled with the corresponding sub-evaporator 100a, the sub-evaporator 100a connected with the corresponding first condenser 200 is finally spliced, which can reduce the height of the heat dissipation device 10, improve the space utilization, and further reduce the cost of the heat dissipation device 10.

[0072] The design elements of the plurality of sub-evaporators 100a can be different. For example, the size of the evaporation plate can be different, the size of the evaporation chamber can be different, the size and number of the condensation plate of the condenser of the sub-evaporator 100a can be different, etc. Different first condensers 200 and sub-evaporators 100a can be designed according to different power of the power device 20, the size of the condensation chamber 210 and the evaporation chamber 130 of the first condenser 200 and the sub-evaporator 100a can be adjusted, the number of heat dissipation fins, the number of evaporation plates or microchannels; according to the requirements and the heat dissipation requirements of the power device 20, the corresponding first condenser 200 and sub-evaporator 100a can be selected, as shown in Figure 3 、 Figure 4 、 Figure 5 、 Figure 9 、 Figure 10 、 Figure 13 and Figure 14 ​

[0073] Take a first condenser 200 installed in a sub-evaporator 100a as an example, the evaporator 100 includes a plurality of sub-evaporators 100a, each of which includes an evaporation chamber 130; two adjacent sub-evaporators 100a are spliced together.

[0074] Referring to Figure 6a , Figure 6b and Figure 6c , Figure 6a , Figure 6b and Figure 6c show the projection of the heat sink 10 in the ZX plane, two adjacent sub-evaporators 100a are spliced together in the first direction to form a splicing surface 140, which can be a plane or a curved surface, wherein Figure 6a and Figure 6b the splicing surface 140 between the two sub-evaporators 100a in the structure shown is a plane, Figure 6c the splicing surface 140 between the two sub-evaporators 100a in the structure shown is a curved surface.

[0075] In order to improve the connection strength between adjacent sub-evaporators 100a and facilitate installation, the splicing surface 140 between the two adjacent sub-evaporators 100a can also include a concave-convex matching part 141, wherein one sub-evaporator 100a is provided with a concave part 141a, and the other sub-evaporator 100a is provided with a convex part 141b. Figure 6b In the structure shown, the sub-evaporator 100a located above is provided with a rectangular structure concave part 141a, and the sub-evaporator 100a located below is provided with a rectangular structure convex part 141b which is a plane; Figure 6c In the structure shown, the sub-evaporator 100a located above is provided with a concave part 141a of a circular arc structure, and the sub-evaporator 100a located below is provided with a convex part 141b of a circular arc structure. The concave-convex matching of the above-mentioned concave part 141a and convex part 141b makes the two sub-evaporators 100a not coincide on a plane in the projection on the YZ plane, thereby improving the connection strength of the splicing surface 140.

[0076] The adjacent sub-evaporators 100a can be mechanically connected, welded or bonded together through a connecting piece 400, Figure 3 and Figure 9 in the heat sink 10 shown, the two sub-evaporators 100a are connected through the connecting piece 400; Figure 13 in the heat sink 10 shown, the two sub-evaporators 100a are connected together by welding or bonding.

[0077] For example, the connecting piece 400 includes a connecting body 410 and mounting holes 420, 430 located at both ends of the connecting body 410, one of which is mounted on one sub-evaporator 100a, and the other is mounted on the other sub-evaporator 100a.

[0078] The above connecting pipe 300 functions to communicate the evaporation chamber 130 and the condensation chamber 210, and the structure of connecting the first condenser 200 and the evaporator 100 by the connecting pipe 300 has the feature of convenient installation. Moreover, the length of the connecting pipe 300 can be adjusted according to actual needs, and the applicability is wider. In addition, the connecting pipe 300 can be a flexible pipe or a hard material pipe. When it is a flexible pipe, the first condenser 200 can be carried by setting other structural members; when it is a hard material pipe, the connecting pipe 300 has the ability to carry the first condenser 200, which can simplify the connection structure of the heat dissipation device 10.

[0079] Referring to Figures 3 to 5 , and Figure 9 and Figure 10 , the connecting pipe 300 can include a first connecting pipe 310 and a second connecting pipe 320 respectively communicating with the evaporation chamber 130, and in the height direction, the connection point of the first connecting pipe 310 with the evaporator 100 is higher than that of the second connecting pipe 320 with the evaporator 100.

[0080] The first connecting pipe 310 contains the steam from the evaporation chamber 130 into the condensation chamber 210, and the second connecting pipe 320 contains the condensing medium from the condensation chamber 210 back to the evaporation chamber 130. The first connecting pipe 310 realizes the phase change of the steam from the evaporation chamber 130 to the condensation chamber 210, and the second connecting pipe 320 realizes the condensing medium from the condensation chamber 210 to the evaporation chamber 130. The backflow of the phase change medium has an independent pipeline, and there is no interference between the backflow of the steam and the condensing medium.

[0081] In some examples, the axis O1 of the first condenser 200 is parallel to the height direction, as shown in Figure 5 , the axes O1 of the two first condensers 200 are parallel to the height direction; in some other examples, the axis O1 of the first condenser 200 has an angle with the height direction, which can be an acute angle, a right angle or an obtuse angle. In the case of two first condensers 200, the two first condensers 200 have an airflow passage therebetween; referring to Figure 10In the height direction, the angle a between the axis of the upper first condenser 200 and the height direction is an acute angle, the angle b between the axis of the lower first condenser 200 and the height direction is an obtuse angle, and the ends of the two first condensers 200 away from the evaporator are away from each other, so that the airflow channel space between the two is enlarged. A fan or the like can be installed here to improve the space utilization of the radiator 10. In addition, the condensers arranged at an angle increase the contact area with the airflow of the fan, improving the heat dissipation efficiency. It should be noted that the axis O1 of the first condenser 200 is determined by the structure thereof. For example, when the first condenser 200 includes a plurality of heat dissipation pipes arranged along the length direction of the first condenser 200, the axis O1 of the first condenser 200 is the center line of the heat dissipation pipes, as shown in Figure 5 、 Figure 10 、 Figure 14 and Figure 19 , Figure 5 the axis O1 of the first condenser 200 is parallel to the height direction, and the center line of the heat dissipation pipe constituting the first condenser 200 is parallel to the height direction; Figure 10 the axes O1 of the two first condensers 200 are arranged obliquely relative to the height direction, and the center lines of the heat dissipation pipes constituting the first condensers 200 are arranged obliquely relative to the height direction, wherein the axis O1 of the upper first condenser 200 is inclined upward, and the axis O1 of the lower first condenser 200 is inclined downward; Figure 14 the axes O1 of the two first condensers 200 are arranged obliquely downward relative to the height direction, and the center lines of the heat dissipation pipes constituting the first condensers 200 are arranged obliquely downward relative to the height direction; Figure 19 the axis O1 of the first condenser 200 is arranged obliquely downward relative to the height direction, and the center line of the heat dissipation pipe constituting the first condenser 200 is arranged obliquely downward relative to the height direction, and the axis O2 of the second condenser 500 is arranged obliquely upward relative to the height direction, and the center line of the heat dissipation pipe constituting the second condenser 500 is arranged obliquely upward relative to the height direction.

[0082] Referring to Figure 13 and Figure 14 , in some examples of the present application, the evaporator 100 is provided with an opening, and the condensing chamber 210 of the first condenser 200 communicates with the evaporation chamber 130 through the opening; the first condenser 200 includes a first connecting pipe 310, and in the height direction, the connecting point of the first connecting pipe 310 and the evaporator 100 is located at the end of the first condenser 200 away from the evaporator 100.

[0083] The steam after vaporization in the evaporation chamber 130 directly enters the condensing chamber 210 from the evaporation chamber 130, and after heat exchange, the condensed medium in the condensing chamber 210 flows back to the evaporation chamber 130 through the first connecting pipe 310.

[0084] In the height direction, the end of the first condenser 200 away from the evaporator 100 is lower than the end of the first condenser 200 connected with the evaporator 100. Due to the inclined arrangement of the first condenser 200, the condensing medium can quickly return to the evaporating chamber 130 under the action of its own gravity, shortening the circulation time of the cooling medium and improving the heat dissipation efficiency.

[0085] The condensing chamber 210 of the first condenser 200 is composed of a plurality of plates or flat tubes with flow channels inside. One end of the plate or flat tube is open and communicates with the opening provided on the evaporator 100. The steam in the evaporating chamber 130 can directly pass through the condensing chamber 210 of the first condenser 200 with flow channels through the opening of the evaporating chamber 130. At this time, the pipeline is not required to communicate the evaporating chamber 130 and the condensing chamber 210.

[0086] Here, the first connecting pipe 310 functions as a return flow. In order to accelerate the return flow, in the height direction, the end of the first condenser 200 close to the evaporator 100 is higher than the end of the first condenser 200 away from the evaporator 100, that is, the end of the first condenser 200 away from the evaporator is arranged downwardly inclined, so that the condensing medium returns to the evaporating chamber 130 through the first connecting pipe 310, improving the return flow efficiency.

[0087] Referring to Figures 17 to 19 The heat sink 10 of the present application can further include a second condenser 500. The evaporator 100 includes an opening, and the condensing chamber 510 of the second condenser 500 communicates with the evaporating chamber 130 through the opening. Through the direct communication between the evaporating chamber 130 and the condensing chamber 510, all or part of the connecting pipeline is cancelled, which can further reduce the return flow path and improve the heat dissipation efficiency of the heat sink.

[0088] In order to improve the return flow efficiency of the liquid in the condensing chamber 510, in the height direction, the end of the second condenser 500 away from the evaporator 100 is higher than the end of the second condenser 500 connected with the evaporator 100. Due to the inclined arrangement of the second condenser 500, the condensing medium can quickly return to the evaporating chamber 130 under the action of its own gravity, shortening the circulation time of the cooling medium and improving the heat dissipation efficiency.

[0089] In the case where the heat sink 10 includes the first condenser 200 and the second condenser 500, in the height direction, the second condenser 500 is located above the first condenser 200. Due to the fact that the distal end of the second condenser 500 is higher than the proximal end, the space between the second condenser 500 and the first condenser 200 is large, which is easy to arrange other structures and improve the space utilization. In other embodiments, the second condenser 500 can also be arranged below the first condenser, which is not specifically limited herein.

[0090] Referring to Figures 17 to 21The utility model also provides a kind of power conversion equipment, can include radiator 10, power device 20 and case 30, power device 20 is arranged on the radiating surface 120 of radiator 10 and is located in case 30, power device is directly contacted with radiating surface through the opening on the case shell, or be arranged on shell, indirectly contacted with radiating surface by shell;Radiator 10 is arranged at the outside of case 30, and radiator 10 is the radiator 10 of any one of the above, since the above-mentioned radiator 10 has the above beneficial effects, the power conversion equipment including the radiator 10 has corresponding effect, which will not be repeated here.

[0091] In some examples, the power conversion equipment can further include a heat shield 40, which is arranged on the case 30 to enclose the radiator 10 in the space enclosed by the heat shield 40 and the case 30. By arranging the heat shield 40, the radiator 10 and other structures can be protected from being accidentally touched.

[0092] The magnetic device 50 of the power conversion equipment of the present application can also be arranged in the heat shield 40.

[0093] The radiator 10 of the present application can be used for heat dissipation of power conversion equipment such as photovoltaic inverters, PCS, wind power converters, etc. At this time, the power conversion equipment includes power devices such as IGBT, magnetic devices such as reactors, and other electronic devices, capacitor devices, etc.

[0094] It should be particularly noted that the power device 20 includes insulated gate bipolar transistors (IGBT) and the like. The power device 20 such as IGBT is located in the case 30 with a higher protection level, and the magnetic device 50 such as reactor is located in the heat shield 40. The internal arrangement of the power conversion equipment is arranged according to the protection level, and the heat dissipation efficiency can be improved.

[0095] In order to further improve the heat dissipation efficiency of the power conversion equipment, the power conversion equipment further includes an air cooling system to dissipate heat from the condenser 200 and the magnetic device 50.

[0096] Specifically, the air cooling system can include a fan 60 and an air duct opening, wherein the air duct opening is formed on the wall of the heat shield 40, and the fan 60 can be arranged at the air duct opening as needed.

[0097] The case 30 and the heat shield 40 are arranged side by side in the thickness direction, the back surface of the case 30 is in contact with the heat shield 40, and the front surface of the case 30 is opposite to the back surface; the front surface of the heat shield 40 is in contact with the case 30, and the back surface of the heat shield 40 is opposite to the front surface; in the height direction, the top surface and the bottom surface of the case 30 are arranged opposite to each other, and the top surface and the bottom surface of the heat shield 40 are arranged opposite to each other.

[0098] The air cooling system can adopt a bottom air inlet structure, the air duct opening in the bottom air inlet structure is located at the bottom surface of the heat sink 40, the air outlet 42 of the bottom air inlet structure is located at the top surface of the heat sink 40, and the fan 60 is arranged at the air duct opening to form a heat dissipation airflow in the direction from the air duct opening to the air outlet 42, so as to take out the heat of the condenser 200 and the condensation side of the evaporator 100 to the heat sink 40; or a back air inlet structure can also be adopted, the air duct opening of the back air inlet structure is located at the back surface of the heat sink 40, the air outlets 42 of the back air inlet structure are located at the bottom surface and the top surface of the heat sink 40, and the fan 60 is arranged at the air duct opening to form two heat dissipation airflows in the direction from the air duct opening to the two air outlets 42, so as to take out the heat of the condenser 200 and the condensation side of the evaporator 100 to the heat sink 40.

[0099] In the case of forming a heat dissipation air duct between a plurality of condensers 200, the air duct opening close to the fan 60 is the air inlet 41, and the remaining air duct openings are the air outlets 42. The air duct opening at the back of the heat sink 40 is the air inlet 41, and the remaining air duct openings are the air outlets 42.

[0100] Embodiment 1

[0101] Referring to Figures 1 to 2 , the heat sink 10 in the illustration includes a structure of one first condenser 200 and one evaporator 100, the first condenser 200 is connected with the evaporator 100 through two connecting pipes 300, which are a first connecting pipe 310 and a second connecting pipe 320, one end of the first connecting pipe 310 is connected with the top of the condenser 200, and the other end of the first connecting pipe 310 is connected with the evaporator 100; one end of the first connecting pipe 310 is connected with the bottom of the condenser 200, and the other end of the first connecting pipe 310 is connected with the evaporator 100, wherein the connection point of the first connecting pipe 310 on the evaporator 100 is higher than the connection point of the second connecting pipe 320 on the evaporator 100. In the length direction of the first condenser 200, a plurality of first connecting pipes 310 and second connecting pipes 320 can be arranged.

[0102] The power device 20 mounted at the heat dissipation surface 120 of the evaporator 100 generates heat, which makes the phase change working medium in the evaporation chamber 130 of the evaporator 100 evaporate and absorb heat to form steam, the steam enters the condensation chamber 210 through the first connecting pipe 310 to release heat and condense, and the condensed working medium returns to the evaporator 100 through the second connecting pipe 320, so as to circulate back and forth, thereby achieving the purpose of heat dissipation of the power device 20 on the evaporator 100.

[0103] Embodiment 2

[0104] Referring to Figures 3 to 5The heat sink 10 shown in the figure includes a structure of two first condensers 200 and two sub-evaporators 100a, and the two first condensers 200 have the same connection structure with the evaporator 100, that is, the first condenser 200 is connected with the evaporator 100 through two connecting pipes 300, which are a first connecting pipe 310 and a second connecting pipe 320 respectively. One end of the first connecting pipe 310 is connected with the top of the condenser 200, and the other end of the first connecting pipe 310 is connected with the evaporator 100. One end of the second connecting pipe 320 is connected with the bottom of the condenser 200, and the other end of the second connecting pipe 320 is connected with the evaporator 100. In addition, the connecting point of the first connecting pipe 310 on the evaporator 100 is higher than the connecting point of the second connecting pipe 320 on the evaporator 100. A plurality of first connecting pipes 310 and second connecting pipes 320 can be arranged in the length direction of the first condenser 200.

[0105] In addition, the evaporator 100 shown in the figure is spliced by two sub-evaporators 100a, and the spliced evaporator 100 is connected and fixed by the connecting piece 400.

[0106] The power device 20 installed at the heat dissipation surface 120 of the upper sub-evaporator 100a generates heat, which makes the phase change working medium in the evaporation chamber 130 of the upper sub-evaporator 100a evaporate and absorb heat to form steam. The steam moves upward to the condensation chamber 210 through the first connecting pipe 310 and releases heat to condense. The condensed working medium returns to the evaporator 100 through the second connecting pipe 320, and the cycle is repeated, so as to achieve the purpose of dissipating heat for the power device 20 on the upper sub-evaporator 100a. The power device 20 installed at the heat dissipation surface 120 of the lower sub-evaporator 100a generates heat, which makes the phase change working medium in the evaporation chamber 130 of the lower sub-evaporator 100a evaporate and absorb heat to form steam. The steam moves upward to the condensation chamber 210 through the first connecting pipe 310 and releases heat to condense. The condensed working medium returns to the evaporator 100 through the second connecting pipe 320, and the cycle is repeated, so as to achieve the purpose of dissipating heat for the power device 20 on the lower sub-evaporator 100a.

[0107] Figure 7 and Figure 8 A power conversion device including the heat sink 10 is disclosed.

[0108] Embodiment 3

[0109] Referring to Figure 9 and Figure 10 , Figure 9 and Figure 10 The heat sink 10 shown in the figure is different from the heat sink 10 shown in Figures 3 to 5 in that Figure 7 and Figure 8In the shown heat sink 10, in the two first condensers 200, the angle a between the axis O1 of the upper first condenser 200 and the height direction is an acute angle, and the angle b between the axis O1 of the upper first condenser 200 and the height direction is an obtuse angle.

[0110] Figure 11 and Figure 12 A power conversion device comprising the above heat sink 10 is disclosed.

[0111] Embodiment 4

[0112] Referring to Figure 13 and Figure 14 The shown heat sink 10 in the illustration shows a structure comprising two first condensers 200 and two sub-evaporators 100a, and the connection structure of the two first condensers 200 with the evaporator 100 is the same, that is, the two first condensers 200 are directly connected with the evaporator 100, and at the same time, the first condensers 200 are also connected with the evaporator 100 through a first connecting pipe 310. It should be noted here that a plurality of connecting pipes 300 can be arranged in the length direction of the first condenser 200.

[0113] In addition, the evaporator 100 is spliced by two sub-evaporators 100a.

[0114] The power device 20 installed at the heat dissipation surface 120 of the upper sub-evaporator 100a generates heat, which causes the phase change working medium in the evaporation chamber 130 of the upper sub-evaporator 100a to evaporate and absorb heat to form steam, the steam moves upward to the condensation chamber 210 to release heat and condense, and the condensed working medium returns to the evaporator 100 under the action of gravity, so as to circulate and reciprocate, thereby achieving the purpose of dissipating heat for the power device 20 on the upper sub-evaporator 100a; the power device 20 installed at the heat dissipation surface 120 of the lower sub-evaporator 100a generates heat, which causes the phase change working medium in the evaporation chamber 130 of the lower sub-evaporator 100a to evaporate and absorb heat to form steam, the steam moves upward to the condensation chamber 210 to release heat and condense, and the condensed working medium returns to the evaporator 100 through the connecting pipe 300, so as to circulate and reciprocate, thereby achieving the purpose of dissipating heat for the power device 20 on the lower sub-evaporator 100a.

[0115] Figure 15 and Figure 16 A power conversion device comprising the above heat sink 10 is disclosed.

[0116] Embodiment 5

[0117] Referring to Figures 17 to 19The radiator 10 shown in the figure includes a first condenser 200, a second condenser 500, and an evaporator 100. In the height direction, the first condenser 200 is located below the second condenser 500. It should be noted that multiple connecting pipes 300 can be arranged along the length of the first condenser 200.

[0118] In addition, the evaporator 100 includes a housing 150 and a partition 160, which divides the interior of the housing 150 into two evaporation chambers 130.

[0119] The power device 20 at the heat dissipation surface 120 corresponding to the evaporator 100 and the second condenser 500 generates heat, causing the phase change working fluid in the evaporation chamber 130 to evaporate and absorb heat to form steam. The steam moves upward into the condensation chamber 210, releases heat, and condenses. The condensed working fluid returns to the evaporator 100 under gravity, and this cycle repeats, thereby achieving the purpose of heat dissipation for the power device 20 above. The power device 20 at the heat dissipation surface 120 corresponding to the evaporator 100 and the first condenser 200 generates heat, causing the phase change working fluid in the evaporation chamber 130 to evaporate and absorb heat to form steam. The steam moves upward into the condensation chamber 210, releases heat, and condenses. The condensed working fluid returns to the corresponding evaporation chamber 130 through the connecting pipe 300, and this cycle repeats, thereby achieving the purpose of heat dissipation for the power device 20 below.

[0120] Figure 20 and Figure 21 A power conversion device including the aforementioned heat sink 10 has been disclosed.

[0121] In the above context, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature.

[0122] In the description of the embodiments of this utility model, unless otherwise stated, " / " means "or". For example, A / B can mean A or B. "And / or" in this article is merely a description of the relationship between related objects, indicating that there can be three relationships. For example, A and / or B can mean: A exists alone, A and B exist simultaneously, and B exists alone.

[0123] It should be noted that, for ease of description, only the parts relevant to the utility model are shown in the accompanying drawings. Unless otherwise specified, the embodiments and features described herein can be combined with each other.

[0124] The above description is merely the preferred embodiment and the explanation of the applied technical principles of the present application, and is not used to limit the present application. For those skilled in the art, the present application can have various changes and modifications. The scope of the present application is not limited to the technical solutions formed by the specific combinations of the above technical features, and should also cover other technical solutions formed by the above technical features or equivalent features in any combination without departing from the above inventive concept. For example, the above features and the technical features disclosed in the present application (but not limited to) with similar functions are replaced with each other to form a technical solution.

Claims

1. A radiator, characterized in that, It includes an evaporator (100), a first condenser (200) and a connecting pipe (300), wherein the evaporator (100) includes an evaporation chamber (130) filled with a phase change medium and a heat dissipation surface (120) for dissipating heat from power devices. The connecting pipe (300) and the condensing chamber (210) of the first condenser (200) are connected to the evaporating chamber (130); and the projection of the connecting pipe (300) on the evaporator (100) is located in the area where the evaporating chamber (130) is located.

2. The radiator as described in claim 1, characterized in that, The number of the first condenser (200) is at least two, and the at least two first condensers (200) are arranged sequentially in the height direction; There are at least two evaporation chambers (130), and each evaporation chamber (130) is connected to a corresponding condensation chamber (210).

3. The radiator as described in claim 2, characterized in that, The evaporator (100) includes at least two sub-evaporators (100a), each of the sub-evaporators (100a) including one of the evaporation chambers (130); the at least two sub-evaporators (100a) are joined together.

4. The radiator as described in claim 3, characterized in that, The adjacent sub-evaporators (100a) are connected by a connector (400), the connector (400) including a connector (410) and mounting holes at both ends of the connector (410), one of the mounting holes being mounted on one sub-evaporator (100a) and the other mounting hole being mounted on the other sub-evaporator (100a).

5. The radiator as described in claim 3, characterized in that, The splicing surface (140) between two adjacent sub-evaporators (100a) is either a plane or a curved surface.

6. The radiator as described in claim 5, characterized in that, The splicing surface (140) between two adjacent sub-evaporators (100a) further includes a concave-convex mating part (141), wherein one of the sub-evaporators (100a) is provided with a concave part (141a) and the other sub-evaporator (100a) is provided with a convex part (141b).

7. The radiator as described in claim 2, characterized in that, The evaporator (100) includes at least two evaporation chambers (130); The evaporator (100) includes a housing and a partition, the partition being arranged within the housing to separate at least two of the evaporation chambers (130).

8. The radiator as described in claim 2, characterized in that, In the vertical direction, at least two of the condensers (200) are arranged vertically, with an airflow passage between adjacent condensers.

9. The radiator as claimed in claim 1, characterized in that, The connecting pipe includes a first connecting pipe (310) and a second connecting pipe (320) that are respectively connected to the evaporation chamber (130). In the height direction, the connection point between the first connecting pipe (310) and the evaporator (100) is higher than the connection point between the second connecting pipe (320) and the evaporator (100).

10. The radiator as claimed in claim 9, characterized in that, There are two first condensers (200). In the height direction, the axis of the upper first condenser (200) makes an acute angle with the height direction, and the axis of the lower first condenser (200) makes an obtuse angle with the height direction.

11. The radiator as claimed in claim 1, characterized in that, The radiator also includes a second condenser (500), the second condensing chamber (510) of the second condenser (500) being connected to the evaporation chamber (130) of the evaporator (100) through an opening.

12. The radiator as claimed in claim 11, characterized in that, In the vertical direction, the end of the second condenser (500) away from the evaporator (100) is higher than the end where the second condenser (500) and the evaporator (100) are connected.

13. The radiator as claimed in claim 11, characterized in that, The evaporator (100) is provided with an opening, and the condensing chamber of the first condenser (200) is connected to the evaporating chamber of the evaporator (100) through the opening; The first condenser (200) includes a first connecting pipe, and in the height direction, the connection point between the first connecting pipe and the evaporator (100) is located at the end of the first condenser (200) away from the evaporator (100).

14. The radiator as claimed in claim 13, characterized in that, In the vertical direction, the end of the first condenser (200) away from the evaporator (100) is lower than the end where the first condenser (200) and the evaporator (100) are connected.

15. The radiator as claimed in claim 13, characterized in that, In the vertical direction, the end of the second condenser (500) away from the evaporator (100) is higher than the end of the second condenser (500) near the evaporator (100).

16. A power conversion device, characterized in that, The device includes a heat sink (10), a power device (20), and a chassis (30). The heat sink (10) is disposed outside the chassis (30), and the power device (20) is disposed inside the chassis (30) and is in direct or indirect contact with the heat dissipation surface (120) of the heat sink. The heat sink (10) is a heat sink (10) as described in any one of claims 1 to 15.

17. The power conversion device as described in claim 16, characterized in that, The power conversion device also includes a heat sink (40), which covers the chassis (30), and the heat sink is located inside the heat sink.

18. The power conversion device as described in claim 17, characterized in that, The power conversion device also includes an air-cooling system, which includes a fan (60) and multiple air duct openings. The fan (60) is located inside the heat sink (40), and the air duct openings are located at the top, bottom, side or back of the heat sink (40).

19. The power conversion device as described in claim 18, characterized in that, In the vertical direction, the fan (60) is located below the radiator.

20. The power conversion device as described in claim 18, characterized in that, When the radiator includes at least two first condensers (200), the fan (60) is located between two adjacent first condensers (200).

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