Cold box control module and cold box
By employing a removable semiconductor cooling chip and energy recovery device on the sealed circuit board, the problem of heat accumulation on the sealed circuit board is solved, achieving efficient heat dissipation and energy reuse, and reducing maintenance costs.
Patent Information
- Application Number
- CN202423274785.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-30
- Publication Date
- 2025-12-23
- Estimated Expiration
- 2034-12-30
AI Technical Summary
Existing technologies cannot effectively solve the problem of heat accumulation on sealed circuit boards, which affects the normal operation of components and the accuracy of ambient temperature measurement. At the same time, the non-removable semiconductor cooling chip increases the difficulty of disassembly and maintenance costs.
The device employs a detachable semiconductor cooling chip and a heating element connected by a fixed structure. It converts thermal energy into electrical energy through an energy recovery device. Combined with sealant and modular design, it achieves heat dissipation and energy reuse, reducing maintenance difficulty.
It achieves efficient heat dissipation in enclosed spaces without affecting the accuracy of ambient temperature measurement, saves energy and reduces emissions, and lowers maintenance costs.
Smart Images
Figure CN223714437U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model belongs to the technical field of semiconductor refrigeration fin heat dissipation, especially relates to a cold box control module and cold box. BACKGROUND
[0002] For the heat dissipation treatment of the heat generating element on the circuit board, the existing treatment method generally sets up heat dissipation fins, heat dissipation fans or heat dissipation sheet metal on the heat generating element, however, these ways are only to discharge heat to the board, for the circuit board with sealing requirement (for example, the cold box has higher waterproof requirement to the circuit structure), firstly, these heat still accumulates in the closed space and continuously influences the normal operation of the element and the accuracy of the measurement environment temperature, secondly, it cannot form effective air convection, so that the heat dissipation effect is greatly reduced, thirdly, the absorbed heat energy cannot be effectively utilized.
[0003] In addition, the existing treatment method also sets up the semiconductor refrigeration fin on the heat generating element through the adhesive way, however, this non-detachable adhesive way often also increases the dismounting difficulty, thereby increasing the maintenance cost.
[0004] Therefore, the prior art needs to be improved and developed. UTILITY MODEL CONTENTS
[0005] The utility model discloses a cold box control module and cold box, solve the problem that the traditional heat dissipation mode cannot satisfy the heat dissipation requirement of sealed circuit board and the setting non-detachable semiconductor refrigeration fin leads to the increase of dismounting difficulty, reach the effect of satisfying the heat dissipation requirement, improving the measurement precision of environmental temperature, realizing energy saving and emission reduction through recycling energy and reducing the maintenance cost.
[0006] Firstly, the utility model provides a kind of cold box control module, including box body, the box body is sealed and internally mounted with circuit board and energy recovery device, the circuit board is arranged with heat generating element, the surface of all the heat generating element is provided with semiconductor refrigeration fin, the semiconductor refrigeration fin can convert the heat energy of the heat generating element into electric energy;The heat generating element and the semiconductor refrigeration fin are detachably connected by fixed structure;All the corner positions of the fixed structure are provided with claw inlay protruding towards up and down two sides, the fixed structure is fixedly connected with the heat generating element by the claw inlay of one side and is fixedly connected with the semiconductor refrigeration fin by the claw inlay of other side;
[0007] The energy recovery device comprises a direct-current voltage converter, an MCU and a protection switch, the direct-current voltage converter is connected with all the semiconductor refrigerating sheets through the protection switch and is used for outputting the electric energy input by the semiconductor refrigerating sheets to a load, the MCU is connected with the protection switch and is used for controlling the protection switch to cut off the connection between the direct-current voltage converter and all the semiconductor refrigerating sheets when the electric energy input by the semiconductor refrigerating sheets is overvoltage or overcurrent.
[0008] The cold box control module provided by the utility model realizes energy conversion by the semiconductor refrigerating sheet, solves the heat dissipation problem of the circuit board in the closed space, does not change the environment temperature, is favorable for improving the measurement precision of the environment temperature, simultaneously realizes energy recycling, achieves the effect of energy saving and emission reduction, and the semiconductor refrigerating sheet is easy to disassemble, and the maintenance cost can be effectively reduced.
[0009] Further, all spaces in the box body are filled with sealing glue.
[0010] The filling sealing glue can further improve the protection level of the circuit board.
[0011] Further, the fixing structure is made of heat-conducting material.
[0012] Further, the fixing structure is made of copper material.
[0013] In a second aspect, the utility model provides a cold box, including above-mentioned the cold box control module.
[0014] Further, it also includes a box body, the box body is provided with mounting groove, the cold box control module with mounting groove is detachable connection.
[0015] As can be seen from the above, the cold box control module of the utility model realizes energy recycling by the semiconductor refrigerating sheet for heat dissipation of the sealed circuit board and conversion of heat energy into electric energy, the energy conversion and recycling mode avoids heat accumulation in the closed space, realizes heat dissipation of the heating element, does not affect the environment temperature, is favorable for improving the measurement precision of the environment temperature, simultaneously can achieve the effect of energy saving and emission reduction, and the semiconductor refrigerating sheet is easy to disassemble, and the maintenance cost is reduced.
[0016] Other features and advantages of the utility model will be set forth in the following description, and partially become obvious from the description, or be understood by implementing the utility model embodiments. The purpose and other advantages of the utility model can be realized and obtained by the structure specially pointed out in the written description and the drawings. BRIEF DESCRIPTION OF DRAWINGS
[0017] Figure 1 It is a structure schematic view of a cold box control module provided by the utility model embodiment.
[0018] Figure 2 It is a structure schematic view of one kind circuit board in the embodiment of the utility model.
[0019] Figure 3 It is an explosion view of the heating element, fixed structure and semiconductor refrigeration sheet in the embodiment of the utility model.
[0020] Figure 4 It is a structure schematic view of a cold box provided by the embodiment of the utility model.
[0021] Label explanation:
[0022] 100, box body;200, circuit board;210, heating element;220, semiconductor refrigeration sheet;230, fixed structure;231, claw inlay;310, direct current voltage converter;320, MCU;330, protection switch;400, load;500, cold box control module;600, box body;610, mounting groove. Specific implementation
[0023] The embodiment of the utility model is described in detail below, and the examples of the embodiment are shown in the drawings, wherein the same or similar reference signs represent the same or similar elements or elements with the same or similar functions throughout. The embodiment described below by referring to the drawings is exemplary and is only used to explain the utility model, and cannot be understood as a limitation on the utility model.
[0024] In the description of the utility model, it is understood that the orientation or positional relationship indicated by the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise" and the like is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the utility model and simplifying the description, and does not indicate or imply that the indicated device or element must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the utility model. In addition, the terms "first", "second" are only for the purpose of description, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features. Therefore, the features limited by "first", "second" can explicitly or implicitly include one or more of the features. In the description of the utility model, the meaning of "multiple" is two or more, unless otherwise specifically limited.
[0025] In the description of the utility model, it is necessary to explain, unless another explicit provision and limitation, the term "installation", "link", "connection" should be broad sense understanding, for example, can be fixed connection, also can be detachable connection, or integrally connected;Can be mechanical connection, also can be electrical connection or can communicate with each other;It can be directly connected, also can be indirectly connected through intermediate medium, can be the communication of two elements or the interaction relationship of two elements.For ordinary skilled in the art, the above-mentioned terms can be understood according to the specific meaning of the utility model.
[0026] In the utility model, unless another explicit provision and limitation, the first feature is "on" or "under" the second feature can include the direct contact of the first and second features, can also include that the first and second features are not in direct contact but are in contact through another feature between them.Moreover, the first feature "on", "above" and "on" the second feature includes that the first feature is directly above and obliquely above the second feature, or only indicates that the horizontal height of the first feature is higher than that of the second feature.The first feature "under", "below" and "under" the second feature includes that the first feature is directly below and obliquely below the second feature, or only indicates that the horizontal height of the first feature is less than that of the second feature.
[0027] The following disclosure provides many different embodiments or examples for implementing different structures of the utility model.For the purpose of simplifying the disclosure of the utility model, the components and settings of specific examples are described in the following.Their purpose is not to limit the utility model, of course, and they are only examples.In addition, the utility model can repeatedly refer to numbers and / or reference letters in different examples, and such repetition is for the purpose of simplification and clarity, which itself does not indicate the relationship between the various embodiments and / or settings discussed.In addition, the utility model provides various specific examples of processes and materials, but those skilled in the art can realize the application of other processes and / or the use of other materials.
[0028] Reference is made to the accompanying drawings Figure 1 The utility model provides a cold box control module, including box body 100, box body 100 is sealed and installs circuit board 200 and energy recovery device in the inside, be arranged with heating element 210 on circuit board 200, all the surface of heating element 210 is provided with semiconductor refrigeration piece 220, and semiconductor refrigeration piece 220 can convert the heat energy of heating element 210 into electric energy;
[0029] The energy recovery device comprises a direct current voltage converter 310, an MCU 320, and a protection switch 330. The direct current voltage converter 310 is connected with all the semiconductor refrigeration pieces 220 through the protection switch 330 and is used to output the electric energy input by the semiconductor refrigeration pieces 220 to a load 400. The MCU 320 is connected with the protection switch 330 and is used to control the protection switch 330 to cut off the connection between the direct current voltage converter 310 and all the semiconductor refrigeration pieces 220 when the electric energy input by the semiconductor refrigeration pieces 220 is overvoltage or overcurrent.
[0030] In the embodiment, after the semiconductor refrigeration pieces 220 are arranged on all the heating elements 210 to absorb the heat energy generated by the heating elements 210, the semiconductor refrigeration pieces 220 output direct current voltage. In actual application, high enough direct current voltage can be output by the semiconductor refrigeration pieces 220 through series and parallel combination, and then the voltage is output to the load 400 (for a cold box, the load can be a refrigerator, a display, or other small-power electrical appliances) by the direct current voltage converter 310, so that energy recovery and reuse are realized.
[0031] Further, the MCU 320 and the protection switch 330 are arranged to control the input and output of the direct current voltage, so that the energy recovery device is safely and stably operated.
[0032] In some embodiments, all the spaces in the box body 100 are filled with sealing glue, and the filling of the sealing glue can further improve the protection level of the circuit board, and is beneficial to dustproof, fireproof, and waterproof of the circuit board.
[0033] In some embodiments, the heating elements 210 are non-detachably connected with the semiconductor refrigeration pieces 220, for example, the heating elements 210 are glued on the semiconductor refrigeration pieces 220. However, this non-detachable mode is not convenient for disassembling the semiconductor refrigeration pieces 220, and when the semiconductor refrigeration pieces 220 are damaged, the user has difficulty in replacing the semiconductor refrigeration pieces 220, so that the maintenance cost is increased.
[0034] In some embodiments, the heating elements 210 are detachably connected with the semiconductor refrigeration pieces 220 through the fixing structure 230, which includes but is not limited to buckle connection, screw connection, magnetic attraction connection, and the like, so as to facilitate the user to assemble and disassemble the semiconductor refrigeration pieces 220.
[0035] In some preferred embodiments, reference is made to the accompanying drawings of Figure 2 and the accompanying drawings of Figure 3 All the corner positions of the fixing structure 230 are provided with claw inlays 231 protruding towards the upper and lower sides, the fixing structure 230 is fixedly connected with the heating elements 210 through the claw inlays 231 on one side and is fixedly connected with the semiconductor refrigeration pieces 220 through the claw inlays 231 on the other side.
[0036] In actual application, the user can fix the fixing structure 230 to the corresponding object by bending the claw inserts 231 inward, the inwardly bent claw inserts 231 can be in interference fit with the corresponding object to achieve the fixing effect, or the ends of the claw inserts 231 can be buckled on the upper surface of the corresponding object to limit the corresponding object from being pulled out, thereby achieving the fixing effect, and the outwardly bent claw inserts 231 can make the fixing structure 230 separate from the corresponding object, the overall structure is simple, the semiconductor refrigeration sheet 220 is convenient to assemble and disassemble, thereby reducing the maintenance cost, and the structure is stable, firm and high in reliability.
[0037] In some embodiments, the fixing structure 230 is made of a heat-conducting material, which can accelerate heat transfer and be beneficial to improving the energy conversion efficiency of the semiconductor refrigeration sheet 220, thereby accelerating heat dissipation.
[0038] In some preferred embodiments, the fixing structure 230 is made of copper material, which has good heat conductivity and plasticity, and the user can more easily assemble and disassemble by bending the claw inserts 231.
[0039] With reference to the accompanying drawings, Figure 4 The utility model provides a cold box, including cold box control module 500 in above -mentioned embodiment.
[0040] In some embodiments, with reference to the accompanying drawings, Figure 4 The cold box further comprises a box body 600, the box body 600 is provided with a mounting groove 610, and the cold box control module 500 is detachably connected with the mounting groove 610, which includes but is not limited to buckle connection, screw connection, magnetic attraction connection, key connection, pin connection and the like, and the modular design is more beneficial to the user to replace the cold box control module 500 alone, thereby saving maintenance cost, and it is also convenient to take out the cold box control module 500 for separate maintenance, thereby reducing the maintenance difficulty.
[0041] In the description of the present specification, the description of the terms "one embodiment", "some embodiments", "illustrative embodiment", "example", "specific example" or "some examples" means that the specific features, structures, materials or characteristics described in connection with the described embodiment or example are included in at least one embodiment or example of the utility model. In the present specification, the illustrative description of the above terms does not necessarily refer to the same embodiment or example. Moreover, the described specific features, structures, materials or characteristics can be combined in any one or more embodiments or examples in a suitable manner.
[0042] The above only describes some embodiments of the utility model. Those skilled in the art can make several modifications and improvements without departing from the creative concept of the utility model, and these all belong to the protection scope of the utility model.
Claims
1. A cold box control module comprising a box body (100), characterized in that, The box body (100) is sealed and internally mounted with a circuit board (200) and an energy recovery device, the circuit board (200) is arranged with heat generating elements (210), the surface of all the heat generating elements (210) is provided with semiconductor refrigerating fins (220), the semiconductor refrigerating fins (220) can convert the heat energy of the heat generating elements (210) into electric energy; the heat generating elements (210) and the semiconductor refrigerating fins (220) are detachably connected through a fixing structure (230); all the corner positions of the fixing structure (230) are provided with claw inlays (231) protruding towards the upper and lower sides, the fixing structure (230) is fixedly connected with the heat generating elements (210) through the claw inlays (231) on one side and is fixedly connected with the semiconductor refrigerating fins (220) through the claw inlays (231) on the other side; The energy recovery device comprises a direct current voltage converter (310), an MCU (320) and a protection switch (330), the direct current voltage converter (310) is connected with all the semiconductor refrigerating fins (220) through the protection switch (330) and is used for outputting the electric energy input by the semiconductor refrigerating fins (220) to a load (400); the MCU (320) is connected with the protection switch (330) and is used for controlling the protection switch (330) to cut off the connection between the direct current voltage converter (310) and all the semiconductor refrigerating fins (220) when the electric energy input by the semiconductor refrigerating fins (220) is overvoltage or overcurrent.
2. The cold box control module of claim 1, wherein, All the spaces in the box body (100) are filled with sealing glue.
3. The cold box control module of claim 1, wherein, The fixing structure (230) is made of heat conductive material.
4. The cold box control module of claim 3, wherein, The fixing structure (230) is made of copper material.
5. A cold box characterized in that, The cold box control module (500) comprises the cold box control module (500) according to any one of claims 1-4.
6. The cold box of claim 5, wherein, Further comprising a box body (600), the box body (600) is provided with a mounting groove (610), and the cold box control module (500) is detachably connected with the mounting groove (610).