Processing tool for gas uniformizing disc of semiconductor equipment

Abstract

The utility model relates to the technical field of semiconductor equipment part machining, in particular to a machining tool for a gas uniformizing disc of semiconductor equipment, and aims to solve the problem that an existing tool cannot meet the machining requirement of the gas uniformizing disc. The machining tool comprises a base, a jig table is arranged on the base and comprises a plane base plate and an annular boss, the plane base plate is connected to the base, and the annular boss is arranged on the plane base plate; the annular boss is arranged on the side, away from the base, of the plane base plate and is of a hollow structure, a bearing area for containing the gas uniformizing disc is formed in the annular boss, a plurality of positioning grooves are formed in the outer wall of the annular boss, the multiple positioning grooves are formed in the circumferential direction of the annular boss at intervals, and the annular boss is of a hollow structure. A calibration groove used for guiding assembly is formed in the surface of the annular boss, and a fixing assembly used for fixing the gas uniformizing disc is arranged on the plane base plate. According to the air uniformizing disc machining device, the air uniformizing disc can be accurately positioned and stably fixed in the machining process, and the quality and the consistency of products are improved.

Description

TECHNICAL FIELD

[0001] The application relates to the technical field of semiconductor equipment component processing, in particular to a semiconductor equipment gas distribution plate processing tool. BACKGROUND

[0002] In the semiconductor manufacturing industry, the high precision and stability of the equipment are key factors to ensure product quality and production efficiency; among them, the gas distribution plate, also commonly known as the shower plate or showerhead, plays a crucial role as an important component of semiconductor equipment. The main function of the gas distribution plate is to uniformly distribute and deliver gas or chemical liquid to the wafer surface during the semiconductor manufacturing process. This uniform gas or liquid distribution is crucial for achieving precise chemical reactions, deposition, etching and other process steps, thereby affecting the performance and reliability of the final product.

[0003] During the production and processing of the gas distribution plate, the tooling, as auxiliary equipment, directly affects the processing precision and surface quality of the gas distribution plate. However, existing tooling often cannot accurately position and fix the gas distribution plate, resulting in positional deviation or instability of the gas distribution plate during processing, which affects processing precision, may cause uneven surface processing of the gas distribution plate, and may also cause the overall size and shape of the gas distribution plate to not meet design requirements, thus needing to be improved. CONTENT OF THE INVENTION

[0004] In order to solve the problem that existing tooling cannot meet the processing requirements of the gas distribution plate, the application provides a semiconductor equipment gas distribution plate processing tool.

[0005] The semiconductor equipment gas distribution plate processing tool provided by the application adopts the following technical scheme:

[0006] A semiconductor equipment gas distribution plate processing tool, comprising a base, a jig table is arranged on the base, the jig table comprises a planar substrate and an annular boss, the planar substrate is connected to the base, the annular boss is arranged on the side of the planar substrate away from the base, the annular boss has a hollow structure, a bearing area for placing the gas distribution plate is formed in the annular boss, a plurality of positioning grooves are formed on the outer wall of the annular boss, the plurality of positioning grooves are arranged at intervals along the circumferential direction of the annular boss, a calibration groove for guiding assembly is formed on the surface of the annular boss, and a fixing assembly for fixing the gas distribution plate is arranged on the planar substrate.

[0007] Because the existing tooling often cannot accurately position and fix the air distribution plate, the position of the air distribution plate is prone to deviation or instability during processing, thereby affecting the processing precision, which may not only cause uneven processing of the surface of the air distribution plate, but also may cause the overall size and shape of the air distribution plate to not meet the design requirements; by adopting the technical scheme, the base is provided, the jig table is installed on the base, the jig table is composed of a planar substrate and an annular boss, the annular boss is provided with a positioning groove and a calibration groove, and the planar substrate is provided with a fixing assembly;

[0008] When the product is processed, first, ensure that the base is stably installed on the equipment platform, place the air distribution plate to be processed in the bearing area in the annular boss, the annular boss is a hollow structure, the air distribution plate can be stably placed therein, at the same time, the air distribution plate is preliminarily positioned by using the plurality of positioning grooves on the outer wall of the annular boss, and is further calibrated by the calibration groove, the assembly process is guided, and finally the air distribution plate is fixed by using the fixing assembly, after it is confirmed that the air distribution plate is accurately positioned and firmly fixed, the processing equipment is started, and the air distribution plate is processed;

[0009] Through the jig table, the positioning groove, the calibration groove and the fixing assembly, the design of the annular boss and the positioning groove thereon provides accurate preliminary positioning for the air distribution plate, ensures that the position of the air distribution plate in the circumferential direction is accurate, the calibration groove is further used to guide the assembly process, so that the position of the air distribution plate in the horizontal and vertical directions can meet the design requirements, the processing precision is improved, the adjustment and calibration time in the processing process is reduced, and the fixing assembly on the planar substrate can firmly clamp the air distribution plate, so that any deviation or instability in the processing process is prevented, which is helpful to accurately position and stably fix the air distribution plate in the processing process, reduces the processing error caused by the deviation or instability of the position, the surface of the processed air distribution plate is more uniform, the overall size and shape meet the design requirements, and the quality and consistency of the product are improved.

[0010] Optionally, the fixing assembly comprises a fixing clamp plate, a fixing end, and a connecting bolt, the connecting bolt is arranged on the planar substrate, one end of the fixing clamp plate is threadedly connected to the connecting bolt, the fixing end is connected to the other end of the fixing clamp plate, the fixing end abuts against the air distribution plate, a strip-shaped groove is formed in the fixing clamp plate, and an adjusting bolt for adjusting the clamping degree of the fixing clamp plate to the air distribution plate is arranged in the strip-shaped groove.

[0011] By adopting the technical scheme, the fixing assembly is composed of a fixing clamping plate, a fixing end, and a connecting bolt; when the uniform air distribution disc is fixed, the fixing clamping plate is already installed on the connecting bolt, but is not completely tightened, the fixing clamping plate is rotated to adjust the height of the fixing clamping plate to a proper position by the threaded connection between the fixing clamping plate and the connecting bolt, the purpose of this step is to ensure that the fixing end of the fixing clamping plate can contact the uniform air distribution disc and prepare for the subsequent clamping operation, the adjusting bolt is slightly rotated to adjust the clamping degree of the fixing clamping plate to the uniform air distribution disc by the movement of the adjusting bolt in the strip-shaped groove, the clamping force is gradually increased, and whether the position of the uniform air distribution disc is stable is observed, the uniform air distribution disc is confirmed to be firmly fixed on the tooling, and the processing is started; through the arrangement of the fixing assembly, the clamping degree of the fixing clamping plate to the uniform air distribution disc can be finely adjusted, the stability of the uniform air distribution disc in the processing process is ensured, the fixing clamping plate can accurately contact the uniform air distribution discs with different thicknesses or sizes, the subsequent clamping operation is facilitated, the universality and flexibility of the tooling are enhanced, and the production cost and the frequency of replacing the tooling are reduced.

[0012] Optionally, a flexible buffer pad for preventing product pressure injury is arranged on the fixing end.

[0013] By adopting the technical scheme, the flexible buffer pad is installed on the fixing end; through the arrangement of the flexible buffer pad, the pressure applied by the fixing end to the uniform air distribution disc can be effectively absorbed and dispersed, pressure injury or scratches caused by pressure concentration are prevented, and the quality of the product is further ensured.

[0014] Optionally, a plurality of heat dissipation holes for heat dissipation are arranged on the planar substrate of the jig table, and the plurality of heat dissipation holes are arranged on the planar substrate in sequence and at intervals.

[0015] By adopting the technical scheme, the plurality of heat dissipation holes are arranged on the planar substrate of the jig table; through the arrangement of the plurality of heat dissipation holes, the surface area of the jig table is effectively increased, air circulation is promoted, and the heat dissipation efficiency is improved, which helps to timely discharge the heat generated in the jig table, prevents heat accumulation from causing equipment overheating, reduces the possibility that high temperature may cause material deformation or precision decline in the semiconductor equipment processing process, maintains the stable temperature of the jig table and the uniform air distribution disc thereon, and improves the processing precision and product quality.

[0016] Optionally, a plurality of mounting holes for connection are arranged on the mounting surface of the planar substrate and the base in a one-to-one correspondence.

[0017] Through adoption of the technical scheme, the mounting holes are arranged on the mounting surface of the planar substrate and the base; through arrangement of the mounting holes, the mounting holes are designed to enable the planar substrate and the base to be firmly connected through fasteners such as screws, the connection mode is simple, the assembly time is reduced, and sufficient connection strength can be provided to ensure stability of the jig table during processing.

[0018] Optionally, the base is in an L shape, and reinforcing rib plates for enhancing structural strength are arranged on the base, the reinforcing rib plates are arranged in two groups, and the two reinforcing rib plates are symmetrically arranged on the base.

[0019] Through adoption of the technical scheme, the reinforcing rib plates are welded and fixed on the base, and the reinforcing rib plates are arranged in two groups; through arrangement of the two groups of reinforcing rib plates, the reinforcing rib plates serve as additional support structures, can significantly improve load-carrying capacity and deformation resistance of the base, further enhance stability of the base, and prolong durability and service life of the base.

[0020] Optionally, lightweight holes for reducing weight are arranged on any one of the reinforcing rib plates, and the lightweight holes are arranged on the reinforcing rib plates.

[0021] Through adoption of the technical scheme, the lightweight holes are arranged on the reinforcing rib plates; through arrangement of the lightweight holes, weight of the reinforcing rib plates can be effectively reduced, use of materials is optimized, and therefore manufacturing cost is reduced.

[0022] Optionally, a plurality of screw holes for fixing with a machine table platform are arranged on the base, and the screw holes are arranged on the bottom surface of the base.

[0023] Through adoption of the technical scheme, the screw holes are arranged on the bottom surface of the base; through arrangement of the screw holes, the base can be stably connected with the machine table platform through fasteners such as screws, the connection mode is simple and easy to implement, sufficient connection strength can be provided, stability and accuracy of the jig table during processing are ensured, installation time is reduced, and error rate during installation is reduced.

[0024] In summary, the present application has at least one of the following beneficial technical effects:

[0025] The design of the annular boss and the positioning groove thereon provides accurate preliminary positioning for the gas distribution plate, ensures the accurate position of the gas distribution plate in the circumferential direction, the opening of the calibration groove further guides the assembly process, and the position of the gas distribution plate in the horizontal and vertical directions can meet the design requirements, improving the processing precision and reducing the adjustment and calibration time in the processing process. Meanwhile, the fixing assembly on the plane base plate can firmly clamp the gas distribution plate to prevent any deviation or instability during processing, which helps to accurately position and stably fix the gas distribution plate during processing, reduces the processing error caused by position deviation or instability, makes the surface of the processed gas distribution plate more uniform, and the overall size and shape more consistent with the design requirements, improving the quality and consistency of the product.

[0026] Through the setting of the fixing assembly, the clamping degree of the fixing clamp plate to the gas distribution plate can be finely adjusted to ensure the stability of the gas distribution plate during processing, and the fixing clamp plate can accurately contact the gas distribution plate of different thicknesses or sizes to provide convenience for subsequent clamping operation, enhance the versatility and flexibility of the tooling, and reduce the production cost and the frequency of tooling replacement.

[0027] Through the setting of the flexible buffer pad, the pressure exerted by the fixed end on the gas distribution plate can be effectively absorbed and dispersed to prevent bruising or scratches caused by pressure concentration, further ensuring the quality of the product. BRIEF DESCRIPTION OF DRAWINGS

[0028] Figure 1 is a structural schematic diagram of a semiconductor equipment gas distribution plate processing tooling in an embodiment of the present application.

[0029] Figure 2 is a structural schematic diagram for embodying the jig table structure in an embodiment of the present application.

[0030] Figure 3 is a partial enlarged view for embodying the structure of the fixing assembly in an embodiment of the present application.

[0031] Explanation of reference numerals: 1, base; 2, jig table; 3, plane base plate; 31, heat dissipation hole; 32, mounting hole; 4, annular boss; 41, bearing area; 42, positioning groove; 43, calibration groove; 5, fixing assembly; 51, fixing clamp plate; 52, fixed end; 53, connecting bolt; 6, strip-shaped groove; 7, adjusting bolt; 8, flexible buffer pad; 9, reinforcing rib plate; 91, lightweight hole; 10, screw hole. DETAILED DESCRIPTION

[0032] The following will be described in detail in combination with the accompanying Figures 1-3 The present application will be further described in detail.

[0033] The embodiment of the application discloses a semiconductor equipment air distribution plate processing tool. Figure 1 The semiconductor equipment air distribution plate processing tool comprises a base 1, the base 1 is installed on a platform of an equipment machine in the embodiment, the base 1 is in an L-shaped cross section, the bottom surface of the base 1 is placed on the platform, a plurality of screw holes 10 are formed through the bottom surface of the base 1, preferably, the screw holes 10 are six, so that the base 1 can be stably connected with the platform by means of fasteners such as screws, the connection mode is simple and easy to implement and can provide sufficient connection strength, the stability and accuracy of the jig table 2 in the processing process are ensured, the installation time is reduced, and the error rate in the installation process is also reduced.

[0034] Referring to Figure 1 The base 1 is welded with a reinforcing rib plate 9, the reinforcing rib plate 9 is in two groups, the two groups of reinforcing rib plates 9 are symmetrically installed on the base 1, the reinforcing rib plate 9 can be triangular or trapezoidal, the reinforcing rib plate 9 serves as an additional support structure and can significantly improve the bearing capacity and deformation resistance of the base 1, further enhance the stability of the base 1 and prolong the durability and service life of the base 1.

[0035] Referring to Figure 1 A plurality of lightweight holes 91 are formed through any reinforcing rib plate 9, the lightweight holes 91 can effectively reduce the weight of the reinforcing rib plate 9, optimize the use of materials and thus reduce the manufacturing cost.

[0036] Referring to Figure 1 A jig table 2 is installed on the mounting surface of the base 1, the jig table 2 comprises a planar substrate 3 and an annular boss 4, the planar substrate 3 and the annular boss 4 are combined to form the jig table 2, the planar substrate 3 and the annular boss 4 can be fixed by welding or bolt fixing, the planar substrate 3 is connected to the mounting surface of the base 1, and the annular boss 4 is located at one end of the planar substrate 3 away from the base 1.

[0037] Referring to Figure 1 A plurality of mounting holes 32 are formed through the planar substrate 3 and the mounting surface of the base 1, the mounting holes 32 on the planar substrate 3 and the base 1 are consistent in number, and in the embodiment, the mounting holes 32 on the planar substrate 3 and the mounting surface of the base 1 one-to-one correspond, the mounting holes 32 enable the planar substrate 3 and the base 1 to be firmly connected by means of fasteners such as screws, the connection mode is simple, the assembly time is reduced, and sufficient connection strength can be provided to ensure the stability of the jig table 2 in the processing process.

[0038] Referring to Figure 1 and Figure 2, the plane substrate 3 is provided with a plurality of heat dissipation holes 31, the plurality of heat dissipation holes 31 are sequentially and spacedly arranged on the plane substrate 3, meanwhile, the mounting surface of the base 1 is also provided with corresponding heat dissipation holes 31, the heat dissipation holes 31 on the plane substrate 3 are consistent with the heat dissipation holes 31 on the base 1; the existence of the heat dissipation holes 31 effectively increases the surface area of the jig table 2, promotes air circulation, improves the heat dissipation efficiency, helps to timely discharge the heat generated inside the jig table 2, prevents heat accumulation from causing equipment overheating, reduces the possibility of material deformation or precision decline caused by high temperature in the process of semiconductor equipment processing, maintains the stable temperature of the jig table 2 and the air distribution disc thereon, and improves the processing precision and product quality.

[0039] With reference to Figure 1 and Figure 2 , the annular boss 4 is in a hollow structure, in the embodiment, the annular boss 4 is a hollow ring, a bearing area 41 for placing the air distribution disc is formed in the annular boss 4, meanwhile, a plurality of positioning grooves 42 are formed on the outer wall of the annular boss 4, the positioning grooves 42 are sequentially and spacedly arranged along the circumferential direction of the annular boss 4, preferably, the number of the positioning grooves 42 is three, and the air distribution disc is positioned through the three positioning grooves 42.

[0040] With reference to Figure 1 and Figure 2 , meanwhile, a calibration groove 43 is formed on the surface of the annular boss 4, the formation of the calibration groove 43 further guides the assembly process, so that the position of the air distribution disc in the horizontal and vertical directions can meet the design requirements, improves the processing precision, and reduces the adjustment and calibration time in the processing process.

[0041] With reference to Figure 1 and Figure 3 , the plane substrate 3 is provided with a plurality of fixing assemblies 5, in the embodiment, the fixing assemblies 5 are used for fixing the air distribution disc, the number of the fixing assemblies 5 is multiple, preferably, the number of the fixing assemblies 5 is four, and the four fixing assemblies 5 are respectively located at the corners of the plane substrate 3, each fixing assembly 5 comprises a fixing clamp plate 51, a fixing end 52 and a connecting bolt 53, the connecting bolt 53 is installed on the plane substrate 3, one end of the fixing clamp plate 51 is threadedly connected to the connecting bolt 53, in the embodiment, the fixing clamp plate 51 can be provided with a threaded hole matched with the connecting bolt 53.

[0042] With reference to Figure 1 and Figure 3 , the fixing end 52 is installed at the end of the fixing clamp plate 51 away from the connecting bolt 53, the fixing end 52 is opposite to the air distribution disc, a flexible buffer pad 8 is glued and fixed to the abutting end of the bottom of the fixing end 52, in the embodiment, the flexible buffer pad 8 can be a rubber pad or non-woven fabric, which can effectively absorb and disperse the pressure applied by the fixing end 52 to the air distribution disc, prevent bruising or scratches caused by pressure concentration, and further protect the quality of the product.

[0043] Referring to Figure 1 and Figure 3 A strip-shaped slot 6 is formed on the fixing clamp plate 51, the strip-shaped slot 6 is formed along the length direction of the fixing clamp plate 51, an adjusting bolt 7 is installed in the strip-shaped slot 6, the adjusting bolt 7 is slidable in the strip-shaped slot 6, the adjusting bolt 7 abuts against the planar base plate 3, and in the embodiment, a hole is formed on the planar base plate 3 for cooperation or penetration of the adjusting bolt 7; the clamping degree of the fixing clamp plate 51 on the gas distribution plate can be finely adjusted, the stability of the gas distribution plate in the machining process is ensured, the fixing clamp plate 51 can accurately contact the gas distribution plates with different thicknesses or sizes, the subsequent clamping operation is facilitated, the universality and flexibility of the tooling are enhanced, and the production cost and the frequency of tooling replacement are reduced.

[0044] The implementation principle of the semiconductor equipment gas distribution plate machining tooling in the embodiment of the application is as follows:

[0045] When the product is machined, first, the base 1 is ensured to be stably installed on the equipment machine table platform, the gas distribution plate to be machined is placed in the bearing area 41 in the annular boss 4, the annular boss 4 is a hollow structure, the gas distribution plate can be stably placed therein, the gas distribution plate is preliminarily positioned by using the plurality of positioning grooves 42 on the outer wall of the annular boss 4, and is further calibrated by the calibration groove 43, and the assembly process is guided;

[0046] Finally, the fixing assembly 5 is used to fix the gas distribution plate, the fixing clamp plate 51 has been pre-installed on the connecting bolt 53, but is not completely tightened, the height of the fixing clamp plate 51 is adjusted to a proper position by rotating the fixing clamp plate 51 and using the threaded connection between the fixing clamp plate 51 and the connecting bolt 53, the purpose of this step is to ensure that the fixing end 52 of the fixing clamp plate 51 can contact the gas distribution plate and prepare for the subsequent clamping operation, the adjusting bolt 7 is gently rotated, the clamping degree of the fixing clamp plate 51 on the gas distribution plate is adjusted by moving the adjusting bolt 7 in the strip-shaped slot 6, the clamping force is gradually increased, and whether the position of the gas distribution plate is stable is observed, after it is confirmed that the gas distribution plate has been accurately positioned and firmly fixed, the machining equipment is started, and the gas distribution plate is machined;

[0047] The design of the annular boss 4 and the positioning groove 42 thereon provides accurate preliminary positioning for the gas distribution plate, ensuring that the position of the gas distribution plate in the circumferential direction is accurate, and the opening of the calibration groove 43 further guides the assembly process, so that the position of the gas distribution plate in the horizontal and vertical directions can meet the design requirements, improving the machining precision and reducing the adjustment and calibration time in the machining process. Meanwhile, the fixing assembly 5 on the flat base plate 3 can firmly clamp the gas distribution plate, preventing any deviation or instability during the machining process, which helps to accurately position and stably fix the gas distribution plate during the machining process, reduces the machining errors caused by position deviation or instability, makes the surface of the machined gas distribution plate more uniform, and the overall size and shape more consistent with the design requirements, improving the quality and consistency of the product.

[0048] The above are preferred embodiments of the present application, and do not limit the protection scope of the present application, therefore: any equivalent changes made in structure, shape, principle, etc. according to the present application should be covered within the protection scope of the present application.

Claims

1. A tooling for processing a gas distribution plate in semiconductor equipment, characterized in that: The utility model provides a kind of fixture table, including base (1), the base (1) is provided with jig table (2), the jig table (2) includes plane base plate (3) and annular boss (4), the plane base plate (3) is connected on base (1), the annular boss (4) is arranged on the side of plane base plate (3) away from base (1), the annular boss (4) is hollow structure, the annular boss (4) is formed with the bearing area (41) for placing air distribution plate, positioning slot (42) is set on the outer wall of the annular boss (4), the positioning slot (42) is multiple, multiple positioning slot (42) is interval arranged along the circumferential direction of annular boss (4), calibration slot (43) for guiding assembly is set on the surface of the annular boss (4), the plane base plate (3) is provided with the fixed component (5) for fixing air distribution plate.

2. The semiconductor device gas distribution plate processing tool of claim 1, wherein: The fixed component (5) includes fixed clamping plate (51), fixed end (52), connecting bolt (53), the connecting bolt (53) is arranged on the plane base plate (3), one end of the fixed clamping plate (51) is threadedly connected on the connecting bolt (53), the fixed end (52) is connected on the other end of the fixed clamping plate (51), the fixed end (52) is pressed on air distribution plate, strip slot (6) is set on the fixed clamping plate (51), the strip slot (6) is provided with adjusting bolt (7) for adjusting the clamping degree of fixed clamping plate (51) to air distribution plate.

3. The semiconductor device gas distribution plate processing tool of claim 2, wherein: The fixed end (52) is provided with flexible buffer pad (8) for preventing pressure injury product, and the flexible buffer pad (8) is arranged on the pressing end of the fixed end (52).

4. The semiconductor device gas distribution plate processing tool of claim 1, wherein: A plurality of heat dissipation holes (31) are formed through the plane base plate (3) of the jig table (2) for heat dissipation, and the plurality of heat dissipation holes (31) are sequentially and interval arranged on the plane base plate (3).

5. The semiconductor device gas distribution plate processing tool of claim 1, wherein: A plurality of mounting holes (32) are formed through the mounting surface of the plane base plate (3) and the base (1) for connection, and the positions of the mounting holes (32) on the mounting surface of the plane base plate (3) and the base (1) are one-to-one corresponding.

6. The semiconductor device gas distribution plate processing tool of claim 5, wherein: The base (1) is in L shape, and the base (1) is provided with reinforcing rib plates (9) for enhancing structural strength, the number of the reinforcing rib plates (9) is two groups, and the two reinforcing rib plates (9) are symmetrically arranged on the base (1).

7. The semiconductor device gas distribution plate processing tool of claim 6, wherein: Any one of the reinforcing rib plates (9) is provided with lightweight holes (91) for reducing weight, and the lightweight holes (91) are formed through the reinforcing rib plates (9).

8. The semiconductor device gas distribution plate processing tool of claim 5, wherein: A plurality of screw holes (10) are formed through the base (1) for fixing with machine platform, and the plurality of screw holes (10) are interval arranged on the bottom surface of the base (1).

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