Infrared product glue injection mold

Abstract

The utility model discloses an infrared product glue injection mold, which relates to the technical field of molds, and comprises a lower mold, the lower mold is provided with a glue injection cavity, a main runner, a plurality of first cavities and a plurality of buffer runners, any two adjacent first cavities are communicated through the buffer runner, and the first cavities are communicated with the main runner through the buffer runner. The glue injection cavity is communicated with one of the first cavities positioned on the outermost side through a main runner; an exhaust groove is formed in the lower mold and communicates with the multiple first cavities; the positioning structure is used for positioning the metal frame; and the upper die is provided with a plurality of second cavities, the second cavities and the first cavities jointly form a plurality of forming cavities, the forming cavities are used for forming a packaging layer, and the buffer runner is used for slowing down the flowing speed of the sizing material. According to the infrared product glue injection mold, bubbles carried in glue can be reduced, the number and probability of gaps formed in the packaging layer are effectively reduced, and then the yield of infrared receiving heads manufactured subsequently can be improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to mould technical field, especially a kind of infrared product glue injection mould. BACKGROUND

[0002] Infrared product refers to the product designed and manufactured using infrared technology principle, such as infrared receiving head etc. The production process of infrared receiving head is roughly divided into the following steps, the operator will first put metal frame into mould and carry out glue pouring, so that multiple packaging layers are formed on the glue injection of metal frame. Then the operator will put the metal frame into the separating equipment to separate to obtain multiple infrared receiving heads. At present, in the process of glue injection, a large amount of air bubbles is easily wrapped in the glue, which leads to the formation of multiple gaps in the packaging layer of the subsequently manufactured infrared receiving head, which is not conducive to improving the yield of infrared receiving head. SUMMARY

[0003] The utility model aims at at least solving one of the technical problems existing in prior art. To this end, the utility model provides an infrared product glue injection mould, which is beneficial to improve the yield of infrared receiving head.

[0004] According to the infrared product glue injection mould of the utility model embodiment, the lower mould is provided with glue injection cavity, main flow channel, multiple first cavities and multiple buffer flow channels, the multiple first cavities are distributed linearly along the horizontal direction, any two adjacent first cavities are communicated through the buffer flow channel, and the glue injection cavity is communicated with one of the first cavities located at the outermost side through the main flow channel. The lower mould is provided with exhaust groove, the exhaust groove is communicated with the multiple first cavities, the multiple first cavities can be communicated with the outside atmosphere through the exhaust groove, and the exhaust groove is only used for the gas in the multiple first cavities to enter. The positioning structure is arranged on the lower mould, and the positioning structure is used for positioning metal frame. The upper mould is provided with multiple second cavities, the multiple second cavities are respectively arranged correspondingly with the multiple first cavities, the upper mould can be closed on the lower mould, so that the multiple second cavities and the multiple first cavities form multiple forming cavities respectively, the multiple forming cavities are used for forming packaging layer, the glue injection cavity is used for glue injection, so that the glue can flow into and fill the main flow channel, the multiple buffer flow channels and the multiple forming cavities, and the multiple packaging layers are formed on the metal frame, and the buffer flow channel is used for slowing down the flow speed of the glue.

[0005] At least has the following beneficial effects:

[0006] When a plurality of packaging layers need to be formed on the metal frame, an operator places the metal frame on a positioning structure on the lower mold, the positioning structure can position the metal frame, so that the relative position between the metal frame and the lower mold can be accurate. After the metal frame is placed, the upper mold is closed on the lower mold. The plurality of second cavities on the upper mold and the plurality of first cavities on the lower mold are arranged one by one, so that the plurality of second cavities and the plurality of first cavities form a plurality of forming cavities respectively. After the upper mold is closed on the lower mold, the glue is injected into the glue injection chamber on the lower mold. Since the glue injection chamber is communicated with one of the first cavities located at the outermost side through the main flow channel, and any two adjacent first cavities are communicated through the buffer flow channel, the glue in the glue injection chamber can flow into and fill the main flow channel, the plurality of buffer flow channels and the plurality of forming cavities. The glue in the plurality of forming cavities will solidify on the corresponding position of the metal frame and form a packaging layer. Finally, the upper mold is opened, and the operator takes the metal frame with a plurality of packaging layers from the lower mold. In the process of injecting glue, the glue can flow in the buffer flow channel, and the buffer flow channel can slow down the flow speed of the glue, so that the flow rate of the glue flowing into the forming cavity is slowed down. On the one hand, when the flow rate of the glue flowing into the forming cavity is slowed down, the glue will not produce violent turbulence in the forming cavity, so that the glue can flow more smoothly into the forming cavity, and the probability of the glue wrapping air and forming bubbles is reduced. On the other hand, when the flow rate of the glue flowing into the forming cavity is slowed down and the bubbles in the glue break, the gas generated by the breaking of the bubbles has enough time to pass through the exhaust groove communicated with the forming cavity and be discharged to the outside atmosphere, avoiding the gas generated by the breaking of the bubbles to re-form bubbles. The infrared product glue injection mold can reduce the bubbles carried in the glue, effectively reduce the number and probability of forming voids in the packaging layer, and then facilitate to improve the yield of the infrared receiving head subsequently manufactured.

[0007] According to the infrared product glue injection mold, the buffer flow channel comprises a first flow channel and two second flow channels, two ends of the first flow channel are communicated with adjacent two first cavities through the two second flow channels respectively, and an included angle is formed between the first flow channel and the second flow channels.

[0008] According to the infrared product glue injection mold, the length direction of the first flow channel is parallel to the distribution direction of the plurality of first cavities.

[0009] According to the infrared product glue injection mold, the first flow channel and the second flow channel are perpendicular to each other.

[0010] According to the infrared product glue injection mold, a circular arc surface is arranged at the connection between the inner side wall of the first flow channel and the inner side wall of the second flow channel.

[0011] The length direction of the exhaust groove is parallel to the distribution direction of the plurality of first cavities.

[0012] The plurality of pin grooves are respectively communicated with the plurality of first cavities, and the plurality of pin grooves are used for the plurality of pin portions on the metal frame to extend in.

[0013] The infrared product glue injection mold further comprises a ejector pin mechanism, the ejector pin mechanism is arranged on the lower mold, and the ejector pin mechanism is used for lifting the metal frame from the lower mold.

[0014] Additional aspects and advantages of the present application will be given in part in the following description, and will become apparent from the description, or will be learned by practice of the present application. BRIEF DESCRIPTION OF DRAWINGS

[0015] The present application will be further described below in combination with the drawings and embodiments, wherein:

[0016] Figure 1 A structure schematic view of the metal frame with a plurality of packaging layers according to the embodiment of the present application;

[0017] Figure 2 Another view structure schematic view of the metal frame with a plurality of packaging layers according to the embodiment of the present application;

[0018] Figure 3 A structure schematic view of the lower mold and the metal frame in the infrared product glue injection mold according to the embodiment of the present application;

[0019] Figure 4 A sectional view schematic view of the lower mold in the infrared product glue injection mold according to the embodiment of the present application;

[0020] Figure 5 A Figure 4 A local enlarged view of A in the middle;

[0021] Figure 6 A schematic view of the first cavity and the buffer runner in the infrared product glue injection mold according to the embodiment of the present application;

[0022] Figure 7 A schematic view of the upper mold in the infrared product glue injection mold according to the embodiment of the present application;

[0023] REFERENCE NUMERALS:

[0024] Lower mold 100; Glue injection cavity 110; Main runner 120; First cavity 130; Buffer runner 140; First runner 141; Second runner 142; Pin groove 150; Exhaust groove 160;

[0025] upper die 200; second cavity 210;

[0026] metal frame 300; pin portion 310; packaging layer 320. DETAILED DESCRIPTION

[0027] The embodiments of the present application are described in detail below, examples of which are shown in the drawings, wherein the same or similar notations represent the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by reference to the drawings are exemplary only, and are used only for explaining the present application, and cannot be understood as a limitation of the present application.

[0028] In the description of the present application, it should be understood that, in relation to the orientation description, for example, the orientation or position relationship indicated by the upper, lower, front, rear, left, right, etc. is based on the orientation or position relationship shown in the drawings, and is only for the convenience of describing the present application and simplifying the description, and does not indicate or imply that the device or element indicated must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation of the present application.

[0029] In the description of the present application, the plural refers to two or more. If there is a description of the first, second, it is only for the purpose of distinguishing the technical features, and cannot be understood as indicating or implying the relative importance or implicitly indicating the number of the indicated technical features or implicitly indicating the sequence of the indicated technical features.

[0030] In the description of the present application, unless otherwise explicitly limited, the words such as setting, installing, connecting, etc. should be broadly understood, and the person skilled in the art can reasonably determine the specific meaning of the above words in the present application in combination with the specific content of the technical solution.

[0031] Reference Figures 1 to 3 and Figure 7 The infrared product glue injection mold according to the embodiments of the present application comprises a lower die 100, an upper die 200 and a positioning structure.

[0032] The lower mold 100 is provided with a glue injection cavity 110, a main runner 120, a plurality of first cavities 130 and a plurality of buffer runners 140. The plurality of first cavities 130 are linearly distributed along the horizontal direction. Any two adjacent first cavities 130 are communicated through the buffer runner 140. The glue injection cavity 110 is communicated with one of the first cavities 130 at the outermost side through the main runner 120. The lower mold 100 is provided with an exhaust groove 160. The exhaust groove 160 is communicated with the plurality of first cavities 130. The plurality of first cavities 130 can be communicated with the atmosphere through the exhaust groove 160. The exhaust groove 160 is only used for the gas in the plurality of first cavities 130 to enter. A positioning structure is arranged on the lower mold 100. The positioning structure is used for positioning the metal frame 300. The upper mold 200 is provided with a plurality of second cavities 210. The plurality of second cavities 210 are respectively arranged corresponding to the plurality of first cavities 130. The upper mold 200 can be closed on the lower mold 100, so that the plurality of second cavities 210 respectively form a plurality of forming cavities with the plurality of first cavities 130. The plurality of forming cavities are used for forming the packaging layer 320. The glue injection cavity 110 is used for injecting glue. The glue can flow into and fill the main runner 120, the plurality of buffer runners 140 and the plurality of forming cavities. The metal frame 300 is formed with the plurality of packaging layers 320. The buffer runner 140 is used for slowing down the flow speed of the glue.

[0033] It should be explained that in the prior art, the infrared product glue injection mold is used in cooperation with a glue injection device and a lifting driving device. In order to inject the packaging layer 320 on the metal frame 300, the operator needs to first place the metal frame 300 on the lower mold 100, and then the lifting driving device drives the upper mold 200 to descend and close on the lower mold 100. Then the glue injection device injects glue into the cavity formed after the upper mold 200 and the lower mold 100 are closed, so that the metal frame 300 is formed with the plurality of packaging layers 320. In order to ensure production efficiency, the glue injection speed of the glue injection device is usually kept at a high value. When the glue injection speed is too fast, the glue with high flow rate will produce violent turbulence in the mold. This turbulence will wrap a large amount of air, thereby forming air bubbles. On the other hand, when the flow rate of the glue is high, the gas released by the broken air bubbles cannot be discharged in time, and new air bubbles are formed, so that a plurality of voids are formed in the packaging layer 320 of the infrared receiver head produced subsequently, thereby reducing the yield of the infrared receiver head and improving the stability of the produced infrared receiver head.

[0034] The lower mold 100 is provided with a glue injection cavity 110, a main runner 120, a plurality of first cavities 130 and a plurality of buffer runners 140, and the plurality of first cavities 130 are distributed in a straight line along the horizontal direction. In the embodiment of the utility model, the distribution direction of the plurality of first cavities 130 is parallel to the left-right direction. Any two adjacent first cavities 130 are communicated through the buffer runner 140, and the glue injection cavity 110 is communicated with one of the outermost first cavities 130 through the main runner 120. In the embodiment of the utility model, the glue injection cavity 110 on the lower mold 100 is communicated with the output end of the glue injection device, so that the glue material transported by the glue injection device can be injected into the glue injection cavity 110, and the glue material in the glue injection cavity 110 can flow into the main runner 120 first, and then the glue material in the main runner 120 flows into one of the outermost first cavities 130. Then the glue material in the first cavity 130 flows into the next first cavity 130 through the buffer runner 140, and so on, so that the glue material can flow into the plurality of first cavities 130. The positioning structure on the lower mold 100 can be in abutment with the metal frame 300, so that the positioning structure plays a positioning role on the metal frame 300, ensuring the accuracy of the relative position of the metal frame 300 and the lower mold 100, and further ensuring that the corresponding position on the metal frame 300 can accurately form the packaging layer 320.

[0035] As an embodiment of the utility model, the buffer runner 140 can be an S-shaped runner. It can be understood that after the glue material flows into the S-shaped runner, the S-shaped runner can effectively slow down the flow speed of the glue material.

[0036] The upper die 200 is provided with a plurality of second cavities 210, and the plurality of second cavities 210 are correspondingly arranged with the plurality of first cavities 130. In the embodiment of the utility model, the upper die 200 is connected with the output end of the lifting driving device. The lifting driving device can drive the upper die 200 to descend, so that the upper die 200 is combined with the lower die 100. After the upper die 200 is combined with the lower die 100, the second cavity 210 and the first cavity 130 jointly form a forming cavity. After the rubber material flows into the first cavity 130, the rubber material will fill the first cavity 130 and the second cavity 210, that is, the rubber material will fill the forming cavity. After the rubber material is solidified and formed in the forming cavity, the rubber sealing layer can be formed. In the embodiment of the utility model, the lower die 100 is provided with a guide column, and the upper die 200 is provided with a punching hole. After the upper die 200 is combined with the lower die 100, the guide column can be inserted into the guide hole. The guide column and the guide hole are common settings in the die field, and will not be further described here. The lower die 100 is provided with an exhaust groove 160. After the upper die 200 is combined with the lower die 100, the plurality of first cavities 130 are all communicated with the outside atmosphere through the exhaust groove 160, so that the gas in the plurality of first cavities 130 can be discharged to the outside atmosphere through the exhaust groove 160, that is, the gas in the plurality of forming cavities can be discharged to the outside atmosphere through the exhaust groove 160. In the embodiment of the utility model, the exhaust groove 160 is only used for gas to pass through, and the rubber material in the first cavity 130 cannot flow into the exhaust groove 160.

[0037] In the embodiment of the utility model, after the upper die 200 is combined with the lower die 100, the exhaust groove 160 is equivalent to a narrow gap. Because there is a huge difference in the flowability of gas and rubber material, the narrow gap exhaust groove 160 only allows gas to pass through and prevents rubber material from flowing in. The depth of the narrow gap exhaust groove 160 can be 0.01mm, and will not be further described here.

[0038] It can be understood that when a plurality of encapsulation layers 320 need to be formed on the metal frame 300, the operator places the metal frame 300 on the positioning structure on the lower mold 100, and the positioning structure can position the metal frame 300, so that the relative position between the metal frame 300 and the lower mold 100 can be accurate. After the metal frame 300 is placed, the upper mold 200 is closed on the lower mold 100. The plurality of second cavities 210 on the upper mold 200 are arranged one by one with the plurality of first cavities 130 on the lower mold 100, so that the plurality of second cavities 210 and the plurality of first cavities 130 form a plurality of forming cavities. After the upper mold 200 is closed on the lower mold 100, the glue is injected into the glue injection cavity 110 on the lower mold 100. Since the glue injection cavity 110 is communicated with the outermost one of the first cavities 130 through the main flow channel 120, and any two adjacent first cavities 130 are communicated through the buffer flow channel 140, the glue in the glue injection cavity 110 can flow into and fill the main flow channel 120, the plurality of buffer flow channels 140 and the plurality of forming cavities. The glue in the plurality of forming cavities will solidify on the corresponding position of the metal frame 300 and form the encapsulation layer 320. Finally, the upper mold 200 is opened, and the operator takes the metal frame 300 with a plurality of encapsulation layers 320 from the lower mold 100. During the glue injection process, the glue can flow in the buffer flow channel 140, and the buffer flow channel 140 can slow down the flow rate of the glue, so that the flow rate of the glue flowing into the forming cavity is slowed down. On the one hand, when the flow rate of the glue flowing into the forming cavity is slowed down, the glue in the forming cavity will not produce violent turbulence, so that the glue can flow more smoothly into the forming cavity, reducing the probability of air being wrapped into the glue and forming bubbles. On the other hand, when the flow rate of the glue flowing into the forming cavity is slowed down and the bubbles in the glue break, the gas generated by the breaking of the bubbles has enough time to pass through the exhaust groove 160 communicated with the forming cavity and be discharged to the outside atmosphere, avoiding the gas generated by the breaking of the bubbles to re-form bubbles. The infrared product glue injection mold can reduce the bubbles carried in the glue, effectively reduce the number and probability of forming voids in the encapsulation layer 320, thereby facilitating to improve the yield of the infrared receiving head subsequently manufactured, and improving the stability of the infrared receiving head manufactured.

[0039] Reference Figures 4 to 6The buffer flow channel 140 comprises a first flow channel 141 and two second flow channels 142, two ends of the first flow channel 141 are communicated with two adjacent first cavities 130 through the two second flow channels 142 respectively, and an included angle is formed between the first flow channel 141 and the second flow channels 142. It can be understood that after the rubber material flows into the forming cavity, the rubber material in the forming cavity will first flow into one of the second flow channels 142. Then the flow direction of the rubber material in one of the second flow channels 142 will change and flow into the first flow channel 141. Then the flow direction of the rubber material in the first flow channel 141 will change and flow into the other second flow channel 142. Finally, the rubber material in the other second flow channel 142 flows into the next forming cavity. It is not difficult to see that the flow direction of the rubber material changes twice during the process of flowing into the next forming cavity through the first flow channel 141 and the two second flow channels 142, thereby effectively reducing the flow speed of the rubber material.

[0040] With reference to Figure 4 and Figure 6 The length direction of the first flow channel 141 is parallel to the distribution direction of the plurality of first cavities 130, and the first flow channel 141 is perpendicular to the second flow channels 142. The length direction of the first flow channel 141 is parallel to the left-right direction, and the length direction of the two second flow channels 142 is perpendicular to the length direction of the first flow channel 141. It can be understood that the first flow channel 141 and the second flow channels 142 are straight flow channels, and the two second flow channels 142 are perpendicular to the first flow channel 141, so that the first flow channel 141 and the second flow channels 142 can slow down the flow speed of the rubber material and also enable the rubber material to flow into the next forming cavity in the shortest flow path. The shorter flow path enables the rubber material to flow into the next forming cavity faster while slowing down the flow speed, which is beneficial to ensuring the production efficiency.

[0041] As an embodiment of the utility model, an arc surface is arranged between the inner side wall of the first flow channel 141 and the inner side wall of the second flow channel 142. It can be understood that the arc surface can play a transition role, avoiding the formation of a right-angle bend at the communication between the two ends of the first flow channel 141 and the two second flow channels 142, reducing the formation of vortex, and enabling the rubber material to change the flow direction more smoothly.

[0042] With reference to Figure 4 and Figure 5 The length direction of the exhaust groove 160 is parallel to the distribution direction of the plurality of first cavities 130. It can be understood that the exhaust groove 160 is communicated with the plurality of first cavities 130, and the length direction of the exhaust groove 160 is parallel to the distribution direction of the first cavities 130, so that the gas in the plurality of first cavities 130 can be discharged more uniformly, avoiding the accumulation of gas in a local part, and ensuring smooth exhaust.

[0043] With reference to Figure 4 andFigure 5 The lower mold 100 is provided with a plurality of pin grooves 150, the plurality of pin grooves 150 are respectively communicated with the plurality of first cavities 130, and the plurality of pin grooves 150 are used for allowing the plurality of pin portions 310 on the metal frame 300 to extend in. Figure 1 Figure 2 In the embodiment of the utility model, the metal frame 300 is provided with a plurality of pin portions 310, each pin portion 310 has three pins. After the operator places the metal frame 300 on the lower mold 100, the positioning structure plays a positioning role on the metal frame 300, so that the plurality of pin portions 310 on the metal frame 300 extend into the plurality of pin grooves 150 on the lower mold 100 respectively, and the plurality of pin portions 310 on the metal frame 300 extend into the plurality of first cavities 130 respectively, thereby forming the packaging layer 320 on the plurality of pin portions 310 on the metal frame 300. In the embodiment of the utility model, the positioning structure can be a positioning groove, the shape of the positioning groove is close to the metal frame 300, so that the metal frame 300 can be placed in the positioning groove, thereby playing a positioning role on the metal frame 300, which will not be further described here.

[0044] As an embodiment of the utility model, the infrared product glue injection mold further includes a ejector mechanism, the ejector mechanism is arranged on the lower mold 100, and the ejector mechanism is used for lifting the metal frame 300 from the lower mold 100. It can be understood that after the glue injection is completed, the upper mold 200 rises to open the mold, and then the ejector mechanism lifts the metal frame 300 with a plurality of packaging layers 320 from the lower mold 100, so that the operator can carry out discharging. The ejector mechanism is a common mechanism in the mold, and its structure and principle will not be further described here. As an embodiment of the utility model, the infrared product glue injection mold further includes a heating mechanism, the heating mechanism is arranged on the lower mold 100, and the heating mechanism is used for heating the lower mold 100. It can be understood that the heating mechanism can increase the temperature of the lower mold 100, improve the fluidity of the glue, and optimize the forming effect of the glue. The heating mechanism includes a plurality of heating rods, the lower mold 100 is provided with a plurality of mounting holes, and the plurality of heating rods are respectively inserted into the plurality of mounting holes.

[0045] In the embodiment of the utility model, referring to Figure 3 Figure 7 ​​The lower mold 100 is provided with a plurality of glue injection cavities 110 and a plurality of main flow channels 120, a plurality of first cavities 130 are arranged in a row, the lower mold 100 is provided with a plurality of rows of first cavities 130, and any two adjacent first cavities 130 in the left-right direction are communicated through a buffer flow channel 140. The number and arrangement mode of the second cavities 210 on the upper mold 200 are consistent with those of the first cavities 130. The left and right sides of one glue injection cavity 110 are provided with one main flow channel 120 respectively, one glue injection cavity 110 is communicated with two main flow channels 120 simultaneously, and one main flow channel 120 is communicated with three rows of first cavities 130 simultaneously, and the corresponding glue injection process will not be described further here.

[0046] The technical features of the above-described embodiments can be combined in any manner. To make the description concise, all possible combinations of the technical features in the above-described embodiments are not described, but as long as the combinations of the technical features do not conflict, they should be considered within the scope of the present disclosure.

[0047] Of course, the present application is not limited to the above-mentioned embodiments, and those skilled in the art can make equivalent modifications or replacements without departing from the spirit of the present application. These equivalent modifications or replacements are all included in the scope defined by the claims of the present application.

Claims

1. An infrared product injection mold characterized by, The application relates to a metal frame packaging device and a packaging method thereof. The lower mold (100) is provided with an injection cavity (110), a main flow channel (120), a plurality of first cavities (130) and a plurality of buffer flow channels (140), the plurality of first cavities (130) are linearly distributed along a horizontal direction, any two adjacent first cavities (130) are communicated through the buffer flow channel (140), and the injection cavity (110) is communicated with one of the first cavities (130) located at the outermost side through the main flow channel (120). The lower mold (100) is provided with an exhaust groove (160) communicated with the plurality of first cavities (130), the plurality of first cavities (130) can be communicated with the outside atmosphere through the exhaust groove (160), and the exhaust groove (160) is only used for allowing the gas in the plurality of first cavities (130) to enter. A positioning structure is arranged on the lower mold (100) and used for positioning a metal frame (300). The upper mold (200) is provided with a plurality of second cavities (210) corresponding to the plurality of first cavities (130), the upper mold (200) can be closed on the lower mold (100) so that the plurality of second cavities (210) and the plurality of first cavities (130) jointly form a plurality of forming cavities, the plurality of forming cavities are used for forming packaging layers (320), the injection cavity (110) is used for injecting glue, the glue can flow into and fill the main flow channel (120), the plurality of buffer flow channels (140) and the plurality of forming cavities, and the metal frame (300) is formed with the plurality of packaging layers (320), and the buffer flow channel (140) is used for slowing down the flow speed of the glue.

2. The infrared product injection mold of claim 1, wherein: The buffer flow channel (140) comprises a first flow channel (141) and two second flow channels (142), the two ends of the first flow channel (141) are communicated with two adjacent first cavities (130) through the two second flow channels (142), and an included angle is formed between the first flow channel (141) and the second flow channels (142).

3. The infrared product injection mold of claim 2, wherein: The length direction of the first flow channel (141) is parallel to the distribution direction of the plurality of first cavities (130).

4. The infrared product injection mold of claim 3, wherein: The first flow channel (141) and the second flow channels (142) are perpendicular to each other.

5. The infrared product injection mold of claim 2, wherein: An arc surface is arranged at the connection between the inner side wall of the first flow channel (141) and the inner side wall of the second flow channels (142).

6. The infrared product injection mold of claim 1, wherein: The length direction of the exhaust groove (160) is parallel to the distribution direction of the plurality of first cavities (130).

7. The infrared product injection mold of claim 1, wherein: The lower mold (100) is provided with a plurality of pin grooves (150) communicated with the plurality of first cavities (130), and the plurality of pin grooves (150) are used for allowing a plurality of pin portions (310) on the metal frame (300) to extend in.

8. The infrared product injection mold of claim 1, wherein: A pin mechanism is also included, which is arranged on the lower die (100) and used to lift the metal frame (300) from the lower die (100).

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