Sequencing chip positioning device and gene sequencing system
By incorporating magnetic alignment and positioning components on the stage and chip packaging assembly, the problem of inaccurate positioning of sequencing chips during multiple rounds of temperature increases and decreases is solved, achieving omnidirectional fixation, preventing creep and breakage, and ensuring positional consistency.
Patent Information
- Application Number
- CN202422975315.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-04
- Publication Date
- 2025-12-26
- Estimated Expiration
- 2034-12-04
AI Technical Summary
In existing technologies, the relative creep between the sequencing chip and the stage during multiple rounds of heating and cooling leads to inaccurate placement, posing a risk of leakage and making the chip fragile.
The sequencing chip is fixed in all directions by using a first horizontal positioning component, a second horizontal positioning component, and a vertical alignment component on the stage, combined with a second vertical alignment component on the chip packaging component, and magnetic alignment adsorption force is used to prevent peristalsis.
To ensure the sequencing chip remains in the same position during multiple heating and cooling cycles, preventing creep and breakage, and enabling rapid and accurate placement.
Smart Images
Figure CN223723106U_ABST
Abstract
Description
Technical Field
[0001] This disclosure relates to the field of biomedical detection, and in particular to a sequencing chip positioning device and a gene sequencing system. Background Technology
[0002] In gene sequencing, the sequencing chip needs to be accurately placed on the stage to complete a series of sequencing processes, including temperature regulation, liquid transfer, and image capture. For example, the chip must not shift relative to the stage during multiple temperature cycles to ensure accurate image recognition; furthermore, the chip's liquid inlet / outlet ports must be aligned with and sealed to the corresponding ports on the stage to prevent reagent leakage. Therefore, how to quickly and accurately place the chip on the stage while ensuring that the relative position of the sequencing chip and the stage remains stable during multiple temperature cycles without damaging the chip is a key technical challenge.
[0003] Currently, gene sequencers typically employ the following approach: placing the sequencing chip on a stage with two directional positioning pins on the horizontal surface of the stage. The chip is held firmly against these pins by mechanical clamping, negative pressure adsorption, or a combination of both. While the pins on the horizontal surface ensure no chip movement in the direction closest to them, they cannot prevent movement in the opposite direction. Even negative pressure adsorption or mechanical clamping cannot fundamentally solve the chip movement problem. During sequencing, repeated placement of the chip may result in slight positional deviations, posing a risk of leakage. Furthermore, additional mechanical clamping can easily cause the chip to break. Utility Model Content
[0004] In view of this, the present disclosure provides a sequencing chip positioning device and a gene sequencing system, which at least partially solves the problems in the prior art, such as inaccurate placement caused by the relative creep of the sequencing chip and the stage during multiple rounds of temperature rise and fall.
[0005] In a first aspect, embodiments of this disclosure provide a sequencing chip positioning device, comprising:
[0006] A stage, wherein a first horizontal positioning component, a second horizontal positioning component, and a first vertical centering component are provided on the stage;
[0007] The chip packaging assembly is disposed on the stage. The chip packaging assembly includes a housing, an open cavity chamber for accommodating sequencing chips is provided on the housing, a chip pressure plate is provided on the open side of the open cavity chamber, and a second vertical alignment component is provided on the open cavity chamber.
[0008] The second vertical alignment component and the first vertical alignment component have magnetic alignment attraction force;
[0009] The sequencing chip is moved to abut against the first horizontal direction positioning assembly and the second horizontal direction positioning assembly under the action of the magnetic force in the magnetic pair, and the second vertical direction centering assembly is in a position that is magnetically attracted and offset from the first vertical direction centering assembly.
[0010] Optionally, the first vertical direction centering assembly comprises a first magnet and a second magnet that are symmetrically arranged relative to a longitudinal center axis of the object table.
[0011] The second vertical direction centering assembly comprises a third magnet and a fourth magnet that are symmetrically arranged relative to a longitudinal center axis of the sequencing chip, and the third magnet and the fourth magnet are correspondingly arranged with the first magnet and the second magnet and have magnetic centering attractive forces with the first magnet and the second magnet, respectively.
[0012] The longitudinal center axis of the object table is parallel to the longitudinal center axis of the sequencing chip.
[0013] A center line of the first magnet and the second magnet is perpendicular to the first direction and parallel to the second direction.
[0014] Optionally, the third magnet and the first magnet constitute a first pair of magnets, and the fourth magnet and the second magnet constitute a second pair of magnets.
[0015] The centering characteristics of the second pair of magnets are consistent with the centering characteristics of the first pair of magnets.
[0016] When the sequencing chip abuts against the first horizontal direction positioning assembly and the second horizontal direction positioning assembly, the distance from the center of the magnet of the first magnet to the first horizontal direction positioning assembly is less than the distance from the center of the magnet of the third magnet to the first horizontal direction positioning assembly, and the distance from the center of the magnet of the second magnet to the first horizontal direction positioning assembly is greater than the distance from the center of the magnet of the fourth magnet to the first horizontal direction positioning assembly.
[0017] Optionally, when the second vertical direction centering assembly is in the position that is magnetically attracted and offset from the first vertical direction centering assembly, the third magnet has a first magnetic centering offset force relative to the first magnet, the fourth magnet has a second magnetic centering offset force relative to the second magnet, and the direction of the second magnetic centering offset force is parallel to the direction of the first magnetic centering offset force.
[0018] Optionally, first receiving grooves and second receiving grooves are formed in the object table to respectively accommodate the first magnet and the second magnet.
[0019] The first magnet and the second magnet are protrudingly arranged, and the protruding heights of the first magnet and the second magnet are consistent.
[0020] The first through hole comprises adjacent first hole section and second hole section, the inner diameter of the first hole section is larger than the inner diameter of the second hole section, the third magnet is installed in the first hole section, and the inner diameter of the second hole section is smaller than the outer diameter of the first magnet;
[0021] The second through hole comprises adjacent third hole section and fourth hole section, the inner diameter of the third hole section is larger than the inner diameter of the fourth hole section, the fourth magnet is installed in the third hole section, and the inner diameter of the fourth hole section is smaller than the outer diameter of the second magnet;
[0022] The length of the second hole section and the fourth hole section is H, and 0.3mm≤H≤0.5mm.
[0023] Optionally, the object table comprises a first area and a second area protruding from the first area, and the first horizontal direction positioning assembly is arranged on the first area;
[0024] The second area is provided with a chip matching area, the first horizontal direction positioning assembly is arranged on the first side of the chip matching area, and the second horizontal direction positioning assembly is arranged on the second side of the chip matching area;
[0025] The first magnet and the second magnet are arranged on the third side and the second side of the chip matching area respectively, the third side is the opposite side of the second side, and the first side is the adjacent side of the second side.
[0026] Optionally, the shell is provided with an open groove, and the open cavity is located in the open groove; the opening of the open groove is located on the side of the shell close to the object table;
[0027] The chip pressing plate is provided with two, the two chip pressing plates are symmetrically arranged with respect to the transverse center axis of the sequencing chip, and the distance between the two chip pressing plates is greater than the length of the second area in the longitudinal direction of the chip matching area;
[0028] A clamping protrusion is arranged between the open cavity and the open groove, and the chip pressing plate is provided with a clamping groove matched with the clamping protrusion;
[0029] The open groove is provided with a limiting groove on both sides, and the length of the limiting groove is greater than the length of the second area in the longitudinal direction of the chip matching area.
[0030] Optionally, the sequencing chip comprises a chip bottom plate and a chip body arranged on the top of the chip bottom plate, and the length and width of the chip bottom plate are greater than the length and width of the chip body;
[0031] The chip bottom plate is tightly pressed against the first horizontal direction positioning assembly and the second horizontal direction positioning assembly under the action of the magnetic centering attraction force.
[0032] Optionally, a chip cover plate is arranged on the side of the open chamber away from the object table, and the chip cover plate has a transparent region matched with the chip body.
[0033] In a second aspect, the application discloses a gene sequencing system, comprising the sequencing chip positioning device.
[0034] The sequencing chip positioning device provided by the application can realize the movement of the sequencing chip to tightly press against the first horizontal direction positioning assembly and the second horizontal direction positioning assembly under the action of the magnetic centering attraction force, and the second vertical centering assembly and the first vertical centering assembly are in a position offset from the magnetic attraction center, by arranging the first horizontal direction positioning assembly, the second horizontal direction positioning assembly, the first vertical centering assembly, and the second vertical centering assembly on the chip packaging assembly.
[0035] The above description is only a summary of the technical solutions of the present application, in order to more clearly understand the technical means of the present application, the content of the specification can be implemented, and in order to make the above and other purposes, features and advantages of the present application more obvious and easy to understand, the following preferred embodiments are described in detail below, and the accompanying drawings are described as follows. BRIEF DESCRIPTION OF DRAWINGS
[0036] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following will briefly introduce the drawings needed in the embodiments. Obviously, the drawings in the following description are only some embodiments of the present application, and those skilled in the art can obtain other drawings according to these drawings without creating any creative labor.
[0037] Figure 1 The assembly schematic diagram of the sequencing chip positioning device provided by the embodiments of the present application.
[0038] Figure 2 The assembly schematic diagram of the sequencing chip positioning device provided by the embodiments of the present application. Figure 1 The assembly schematic diagram of the sequencing chip positioning device provided by the embodiments of the present application.
[0039] Figure 3 The assembly schematic diagram of the sequencing chip positioning device provided by the embodiments of the present application. Figure 1 The assembly schematic diagram of the sequencing chip positioning device provided by the embodiments of the present application.
[0040] Figure 4 Fig. 1 is a schematic diagram of a chip packaging assembly. Figure 1 Fig. 2 is a schematic diagram of a chip packaging assembly.
[0041] Figure 5 Fig. 3 is a schematic diagram of a chip packaging assembly.
[0042] Figure 6 Fig. 4 is a schematic diagram of a chip packaging assembly.
[0043] BRIEF DESCRIPTION OF DRAWINGS
[0044] 100, a stage; 110, a first area; 120, a second area; 121, a chip matching area;
[0045] 200, a chip packaging assembly; 210, a chip cover plate; 211, a transparent area; 220, a housing; 221, an open groove; 2211, a limiting groove; 222, an open cavity; 223, a first through hole; 224, a clamping protrusion; 230, a sequencing chip; 231, a chip body; 232, a chip bottom plate; 240, a chip pressing plate; 241, a clamping groove;
[0046] 300, a first horizontal direction positioning assembly;
[0047] 400, a second horizontal direction positioning assembly;
[0048] 510, a first magnet; 520, a second magnet;
[0049] 610, a third magnet; 620, a fourth magnet. DETAILED DESCRIPTION
[0050] The present disclosure will be described in further detail below with reference to the drawings and embodiments. It can be understood that the specific embodiments described herein are only intended to explain the related content, and not to limit the present disclosure. In addition, it should be noted that only parts related to the present disclosure are shown in the drawings for ease of description.
[0051] It should be noted that the embodiments and features in the embodiments of the present disclosure can be combined with each other without conflict. The technical solutions of the present disclosure will be described in detail below with reference to the drawings and in combination with the embodiments.
[0052] Unless otherwise specified, the exemplary embodiments shown will be understood to provide exemplary features of various details that can implement the technical concepts of the present disclosure in practice. Therefore, unless otherwise specified, the features of various embodiments can be additionally combined, separated, interchanged and / or rearranged without departing from the technical concepts of the present disclosure.
[0053] The use of cross-hatching and / or shading in the drawings is generally used to illustrate the boundaries and / or transitions between adjacent portions of a part. As such, unless specified, the presence or absence of cross-hatching and / or shading is not intended to convey or indicate any preference or requirement for specific material, material properties, dimensions, proportions, commonality of the illustrated parts between the parts, and / or any other characteristic, attribute, property, etc. of the parts. Moreover, in the drawings, the size and relative sizes of parts can be exaggerated for clarity and / or descriptive purposes. When exemplary embodiments can be practiced differently, a specific sequence of processes can be performed in an order other than described. For example, two processes described in succession can be performed at substantially the same time or in the reverse order as described. Further, like reference numerals denote like parts throughout the specification.
[0054] When a part is referred to as being "on" or "over" another part, "connected to" or "coupled to" another part, it can be directly on, connected or coupled to the other part, or intervening parts can be present. In contrast, when a part is referred to as being "directly on," "directly connected to," or "directly coupled to" another part, there are no intervening parts present. For this reason, the term "connected" can refer to physical or electrical connections, with or without intervening parts.
[0055] For descriptive purposes, the disclosure can use spatial or relative terms, such as "below," "lower," "lowermost," "above," "upper," "uppermost," "vertical," "horizontal," and the like, which are intended to be interpreted in accordance with the case in which the device is oriented in a particular direction. For example, if the device in the drawings were turned over, then a part described as "below" or "beneath" another part would then be oriented "above" the other part. Thus, the exemplary term "below" can encompass both an orientation of above and below. Moreover, the device can be oriented in further positions (e.g., rotated 90 degrees or at other orientations), and accordingly, the spatially relative descriptions used herein interpreted accordingly.
[0056] The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting. As used herein, the singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. Furthermore, to the extent that the terms "comprising," "including," "containing," and / or "having" and variations thereof are used herein, such terms are intended to be inclusive, in an aspect, it is noted that the terms "substantial," "approximately," and other similar terms are used as terms of approximation and not as terms of degree, as such, they are used to account for inherent deviations in measurements, calculations, and / or provided values that would be recognized by those of ordinary skill in the art.
[0057] Referring to Figure 1 and Figure 2 The present application discloses a sequencing chip positioning device, specifically comprising a stage 100 and a chip packaging assembly 200 arranged on the stage 100, the chip packaging assembly 200 is used for packaging a chip, and the stage 100 is used for carrying the chip packaging assembly 200; for different chip sequencing, only the chip in the chip packaging assembly 200 needs to be replaced, through the chip packaging assembly 200, the chip can be quickly placed on the stage 100 after each replacement; through the structure and position setting of the stage 100 and the chip packaging assembly 200, the relative position of the chip and the stage 100 can be ensured not to creep during multiple rounds of temperature rising and falling, and the chip will not be damaged.
[0058] Specifically, the stage 100 is provided with a first horizontal direction positioning assembly 300, a second horizontal direction positioning assembly 400 and a first vertical centering assembly, wherein the first horizontal direction positioning assembly 300 is used for limiting the longitudinal movement of the chip, and the second horizontal direction positioning assembly 400 is used for limiting the transverse movement of the chip.
[0059] The first vertical centering assembly comprises a first magnet 510 and a second magnet 520 which are symmetrically arranged relative to the longitudinal center axis of the stage 100; the stage 100 is provided with a first accommodating groove and a second accommodating groove which accommodate the first magnet 510 and the second magnet 520 respectively, the first magnet 510 and the second magnet 520 are protrudingly arranged, and the protruding heights of the first magnet 510 and the second magnet 520 are consistent.
[0060] The stage 100 comprises a first area 110 and a second area 120 which is protrudingly arranged relative to the first area 110, specifically, the top of the second area 120 is higher than the top of the first area 110.
[0061] The first horizontal direction positioning assembly 300 is arranged in the first area 110; the second area 120 is provided with a chip matching area 121, the first horizontal direction positioning assembly 300 is arranged at the first side of the chip matching area 121, and the second horizontal direction positioning assembly 400 is arranged at the second side of the chip matching area 121.
[0062] The first magnet 510 and the second magnet 520 are arranged at the third side and the second side of the chip matching area 121 respectively; the third side is the opposite side of the second side, and the first side is the adjacent side of the second side.
[0063] The chip packaging assembly 200 comprises a shell 220, and an open cavity 222 for accommodating a sequencing chip 230 is formed in the shell 220, wherein the sequencing chip 230 comprises a chip bottom plate 232 and a chip body 231 arranged on the top of the chip bottom plate 232, the length and the width of the chip bottom plate 232 are greater than the length and the width of the chip body 231, and the chip bottom plate 232 can effectively protect the chip body 231 itself and prevent the chip body 231 from being damaged in the sequencing process.
[0064] An open side (in this embodiment, the lower side) of the open cavity 222 is provided with a chip pressing plate 240, which is used to relatively fix the sequencing chip 230 and the shell 220, that is, the movement position of the shell 220 is the movement position of the sequencing chip 230.
[0065] A chip cover plate 210 is arranged on the side of the open cavity 222 away from the object table 100, the chip cover plate 210 has a transparent area 211 matched with the chip body 231, which facilitates detection of the sequencing chip 230 installed in the open cavity 222; through the arrangement of the chip cover plate 210, the space on the upper side of the sequencing chip 230 can be sealed, and the protection of the sequencing chip 230 in the sequencing process can be realized.
[0066] Preferably, the chip cover plate 210 is fixed to the shell 220 by double-sided adhesive tape, which is simple and efficient.
[0067] Further, a sealing rubber gasket matched with the liquid inlet and outlet holes on the sequencing chip 230 is arranged between the sequencing chip 230 and the chip pressing plate 240, which is used to seal the sequencing chip 230 and effectively prevent the leakage of sequencing reagents.
[0068] Meanwhile, reference is made to Figure 3 and Figure 4The side of the shell 220 away from the chip cover plate 210 is provided with an open groove 221, and an open cavity 222 is located inside the open groove 221, preferably in the center of the open groove 221; the opening of the open groove 221 is located on the side of the shell 220 close to the object table 100, and limiting grooves 2211 are provided on both sides of the open groove 221, the length of the limiting grooves 2211 is greater than the length of the second area 120 in the longitudinal direction of the chip matching area 121, that is, the second area 120 of the object table 100 can be located in the limiting grooves 2211, realizing the adaptation with the object table 100 and improving the assembly compactness of the shell 220 and the object table 100.
[0069] In this embodiment, two chip pressing plates 240 are provided, the two chip pressing plates 240 are symmetrically arranged with respect to the transverse center axis of the sequencing chip 230, and the distance between the two chip pressing plates 240 is greater than the length of the second area 120 in the longitudinal direction of the chip matching area 121, thereby improving the installation compactness of the shell 220 and the object table 100.
[0070] A clamping protrusion 224 is arranged between the open cavity 222 and the open groove 221, and the chip pressing plate 240 is provided with a clamping groove 241 matched with the clamping protrusion 224; specifically, the two ends of each chip pressing plate 240 are provided with a clamping groove 241, and two clamping protrusions 224 are arranged on the two sides of the open cavity 222, and the clamping protrusions 224 and the clamping grooves 241 are fixed, thereby realizing the fixation of the chip pressing plate 240 and the shell 220, that is, the fixation of the sequencing chip 230.
[0071] Referring to Figure 2 , referring to Figure 5 and Figure 6 , a second vertical centering assembly is arranged on the open cavity 222, and the second vertical centering assembly has magnetic centering attraction with the first vertical centering assembly.
[0072] The second vertical centering assembly includes a third magnet 610 and a fourth magnet 620 symmetrically arranged with respect to the longitudinal center axis of the sequencing chip 230, the third magnet 610 and the fourth magnet 620 are respectively arranged corresponding to the first magnet 510 and the second magnet 520, and have magnetic centering attraction with the first magnet 510 and the second magnet 520, specifically, the opposite faces of the third magnet 610 and the first magnet 510 have opposite polarities, and the opposite faces of the fourth magnet 620 and the second magnet 520 have opposite polarities, and the corresponding two magnets will generate an attractive force in the normal direction; when the chip packaging assembly 200 is placed on the object table 100, the chip packaging assembly 200 and the object table 100 have a magnetic attraction in the vertical direction (i.e. vertically).
[0073] The longitudinal central axis of the object table 100 is parallel to the longitudinal central axis of the sequencing chip 230; the central line of the first magnet 510 and the second magnet 520 is perpendicular to the first direction and parallel to the second direction.
[0074] In this embodiment, the third magnet 610 and the first magnet 510 constitute a first pair of magnets, and the fourth magnet 620 and the second magnet 520 constitute a second pair of magnets. The centering characteristics of the second pair of magnets are consistent with the centering characteristics of the first pair of magnets, thereby ensuring the consistency of the magnetic attraction.
[0075] The first magnet 510, the second magnet 520, the third magnet 610, and the fourth magnet 620 are respectively installed at corresponding positions by using glue.
[0076] The direction in which the sequencing chip 230 moves towards the first horizontal direction positioning assembly 300 is referred to as the first direction, and the direction in which the sequencing chip 230 moves towards the second horizontal direction positioning assembly 400 is referred to as the second direction. The object table 100 is stationary, and the direction in which the sequencing chip 230 moves from top to bottom towards the object table 100 is referred to as the third direction.
[0077] When the sequencing chip 230 abuts against the first horizontal direction positioning assembly 300 and the second horizontal direction positioning assembly 400, the distance from the magnet center of the first magnet 510 to the first horizontal direction positioning assembly 300 is less than the distance from the magnet center of the third magnet 610 to the first horizontal direction positioning assembly 300, and the distance from the magnet center of the second magnet 520 to the first horizontal direction positioning assembly 300 is greater than the distance from the magnet center of the fourth magnet 620 to the first horizontal direction positioning assembly 300. That is, in this embodiment, the magnetic centering biasing forces of the first pair of magnets and the second pair of magnets are both in the A direction. Through the magnetic attraction of the second vertical centering assembly and the first vertical centering assembly, a continuous force is provided for the sequencing chip 230 to move in the first direction and the second direction. Through this continuous force, the sequencing chip 230 is moved to abut against (i.e., closely abut) the first horizontal direction positioning assembly 300 and the second horizontal direction positioning assembly 400. The sequencing chip 230 is moved to the position by the first horizontal direction positioning assembly 300 and the second horizontal direction positioning assembly 400, and at the same time, the sequencing chip 230 is limited. Although the sequencing chip 230 is moved to the position, the third magnet 610 and the first magnet 510, and the fourth magnet 620 and the second magnet 520 are still in a biased state. That is, the magnetic attraction of the second vertical centering assembly and the first vertical centering assembly continuously provides a close-abutting force for the sequencing chip 230 to move in the first direction and the second direction. Through the close-abutting force in the horizontal direction and the adsorption force in the vertical direction, the limitation of the first horizontal direction positioning assembly 300 and the second horizontal direction positioning assembly 400 can effectively ensure the position fixation of the sequencing chip 230.
[0078] When the second vertical alignment assembly is in a position of magnetic center offset from the first vertical alignment assembly, the third magnet 610 has a first magnetic alignment offset force relative to the first magnet 510, and the fourth magnet 620 has a second magnetic alignment offset force relative to the second magnet 520, the direction of the second magnetic alignment offset force is parallel to the direction of the first magnetic alignment offset force, that is, when the chip package assembly 200 is placed on the object table 100, the third magnet 610 in the second vertical alignment assembly is always offset from the center of the first magnet 510 in the first vertical alignment assembly, the fourth magnet 620 in the second vertical alignment assembly is always offset from the center of the second magnet 520 in the first vertical alignment assembly, and the offset direction of the third magnet 610 relative to the first magnet 510 is consistent with the offset direction of the fourth magnet 620 relative to the second magnet 520.
[0079] In this application, through the offset of the upper and lower side magnets in the horizontal direction, the characteristics of the same profile magnet offset alignment are used to fix the position of the sequencing chip.
[0080] In this application, when the first pair of magnets and the second pair of magnets are respectively in the theoretical magnetic center alignment, the side of the sequencing chip 230 interferes with the first horizontal direction positioning assembly 300 and the second horizontal direction positioning assembly 400, so it can be understood that the chip package assembly 200 and the object table 100 are in an offset position when installed and assembled.
[0081] The housing 220 is provided with a first through hole 223 and a second through hole, the first through hole 223 includes adjacent first and second hole sections, the inner diameter of the first hole section is larger than that of the second hole section, the third magnet 610 is installed in the first hole section, and the inner diameter of the second hole section is smaller than the outer diameter of the first magnet 510, preventing the first magnet 510 from entering the hole and contacting the third magnet 610.
[0082] Similarly, the second through hole includes adjacent third and fourth hole sections, the inner diameter of the third hole section is larger than that of the fourth hole section, the fourth magnet 620 is installed in the third hole section, and the inner diameter of the fourth hole section is smaller than the outer diameter of the second magnet 520, preventing the second magnet 520 from entering the hole and contacting the fourth magnet 620.
[0083] In this embodiment, the lengths of the second and fourth hole sections are H, and 0.3mm≤H≤0.5mm, through this distance, the magnetic attraction force between the first magnet 510 and the third magnet 610 and between the second magnet 520 and the fourth magnet 620 can be ensured, that is, the pressing force on the sequencing chip 230 is always provided.
[0084] Further, in the assembled state, the chip bottom plate 232 is abutted against the first horizontal direction positioning assembly 300 and the second horizontal direction positioning assembly 400 under the action of the magnetic centering attraction force, so as to realize protection of the chip body 231.
[0085] When one first magnet 510 and one second magnet 520 are provided, the first magnet 510 is arranged at a middle position on one side of the chip matching area 121, and the second magnet 520 is arranged at a middle position on the other side of the chip matching area 121, so as to ensure sufficient acting force on the sequencing chip 230.
[0086] In this embodiment, the first magnet 510 and the second magnet 520 are preferably provided with two, that is, two first magnets 510 are arranged on the same side, and two second magnets 520 are arranged on the other side at the same time. It should be noted that the number of magnets can be more, as long as the principle of the present application is met, which is within the protection scope of the present application, and therefore will not be described here.
[0087] Further, the first magnet 510, the second magnet 520, the third magnet 610, and the fourth magnet 620 in the present application are all cylindrical, which is convenient for processing and installation.
[0088] It should be noted that the magnet in the present application can also be square, special-shaped, or other shapes, as long as it can meet the scheme of the present application, which is within the protection scope of the present application, and therefore will not be described here.
[0089] Further, the first horizontal direction positioning assembly 300 includes one positioning pin, because it is a limit on the width side of the sequencing chip 230, and therefore the positioning pin can be arranged at a position near the longitudinal center line of the chip matching area 121, as long as it can ensure the limiting action on the sequencing chip 230, and the specific arrangement position can be determined.
[0090] The second horizontal direction positioning assembly 400 preferably includes two positioning pins, because it is a limit on the length side of the sequencing chip 230, and the two positioning pins arranged at intervals can ensure the limiting action on the movement of the sequencing chip 230 in the second direction.
[0091] In this embodiment, the two positioning pins are preferably arranged between the two second magnets 520, which can ensure that the magnetic centering biasing force has sufficient close force of the sequencing chip 230 relative to the first horizontal direction positioning assembly 300 and the second horizontal direction positioning assembly 400.
[0092] When the chip packaging assembly 200 is placed on the object table 100, under the attraction of the magnets, the chip packaging assembly 200 will be automatically placed on the object table 100 and closely attached to the surface of the object table 100. Due to the biasing of the upper and lower magnets, under the action of the biasing force, the sequencing chip 230 will automatically close to the three positioning pins, so as to complete the placement of the sequencing chip 230.
[0093] When the sequencing chip 230 is in contact with the width-side positioning pin and the length-side positioning pin, the two pairs of magnets are not in the magnetic center alignment, and the magnetic center biasing force still acts on the sequencing chip 230.
[0094] The sequencing chip positioning device disclosed in the present application can realize the movement of the sequencing chip under the action of the magnetic center biasing force to be in contact with the first horizontal direction positioning assembly and the second horizontal direction positioning assembly, and the second vertical centering assembly and the first vertical centering assembly are in the position of magnetic center biasing, by the first horizontal direction positioning assembly, the second horizontal direction positioning assembly, the first vertical centering assembly, and the second vertical centering assembly on the chip packaging assembly.
[0095] In a second aspect, the present application discloses a gene sequencing system, comprising the sequencing chip positioning device of the first aspect, which can realize the rapid and accurate placement of different chips, and ensure that the chip and the object table do not have relative creep during the multiple temperature rising and falling processes.
[0096] In the description of the present application, the description of the terms "one embodiment / way", "some embodiments / ways", "example", "specific example", or "some examples" means that the specific features, structures, materials or characteristics described in connection with the embodiment / way or example are included in at least one embodiment / way or example of the present application. In the present application, the illustrative description of the above terms does not necessarily refer to the same embodiment / way or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any appropriate manner in any one or more embodiments / ways or examples. In addition, the skilled in the art can combine and combine the different embodiments / ways or examples described in the present application and the features of the different embodiments / ways or examples without contradiction.
[0097] In addition, the terms "first", "second", etc. are used only for the purpose of description, and should not be understood as indicating or implying relative importance or a specific number of the technical features indicated. Thus, the features defined with "first", "second" can explicitly or implicitly include at least one of the features. In the description of the present application, the meaning of "a plurality of" is at least two, such as two, three, etc., unless otherwise explicitly and specifically limited.
[0098] Those skilled in the art will understand that the above-mentioned embodiments are only for the purpose of clearly illustrating the present disclosure, and are not intended to limit the scope of the present disclosure. Other changes or modifications can be made on the basis of the above disclosure, and these changes or modifications are still within the scope of the present disclosure.
Claims
1. A sequencing chip positioning device, characterized by, The utility model relates to a chip sequencing device, including: A stage is provided with first horizontal direction positioning assembly, second horizontal direction positioning assembly and first vertical centering assembly; Chip package assembly is arranged on the stage, and the chip package assembly includes the shell, the shell is provided with the open cavity that holds sequencing chip, the open side of open cavity is provided with chip pressing plate, and second vertical centering assembly is arranged on the open cavity; Second vertical centering assembly and first vertical centering assembly have magnetic centering adsorption force; Sequencing chip moves to the abutting of first horizontal direction positioning assembly, second horizontal direction positioning assembly under the action of magnetic centering adsorption force, and second vertical centering assembly and first vertical centering assembly are in the position of magnetic adsorption center bias.
2. The sequencing chip positioning device of claim 1, wherein, First vertical centering assembly includes the first magnet, the second magnet that symmetry is arranged relative to the longitudinal center axis of stage; Second vertical centering assembly includes the third magnet, the fourth magnet that symmetry is arranged relative to the longitudinal center axis of sequencing chip, the third magnet, the fourth magnet are correspondingly arranged with first magnet, second magnet respectively, and have magnetic centering adsorption force with first magnet, second magnet respectively; The longitudinal center axis of stage is parallel with the longitudinal center axis of sequencing chip; The center line of first magnet and second magnet is perpendicular to first direction, and is parallel with second direction.
3. The sequencing chip positioning device of claim 2, wherein, The third magnet and the first magnet constitute the first pair of magnets, and the fourth magnet and the second magnet constitute the second pair of magnets; The centering characteristics of the second pair of magnets are consistent with the centering characteristics of the first pair of magnets; When sequencing chip abuts with first horizontal direction positioning assembly, second horizontal direction positioning assembly, the distance from the magnet center of first magnet to first horizontal direction positioning assembly is less than the distance from the magnet center of third magnet to first horizontal direction positioning assembly, and the distance from the magnet center of second magnet to first horizontal direction positioning assembly is greater than the distance from the magnet center of fourth magnet to first horizontal direction positioning assembly.
4. The sequencing chip positioning device of claim 3, wherein, When second vertical centering assembly and first vertical centering assembly are in the position of magnetic adsorption center bias, the third magnet has first magnetic centering bias force relative to the first magnet, the fourth magnet has second magnetic centering bias force relative to the second magnet, and the direction of second magnetic centering bias force is parallel with the direction of first magnetic centering bias force.
5. The sequencing chip positioning device of claim 2, wherein, The first containing groove and the second containing groove are arranged on the stage, and the first containing groove and the second containing groove are arranged on the stage respectively to contain the first magnet and the second magnet; The first magnet and the second magnet are protrudingly arranged, and the protruding height of the first magnet and the second magnet is consistent; The shell is provided with first through hole and second through hole, the first through hole includes adjacent first hole section and second hole section, the inner diameter of first hole section is greater than the inner diameter of second hole section, the third magnet is installed in first hole section, and the inner diameter of second hole section is less than the outer diameter of first magnet. The second through hole comprises a third hole section and a fourth hole section adjacent to each other, the third hole section has a larger inner diameter than the fourth hole section, the fourth magnet is installed in the third hole section, and the inner diameter of the fourth hole section is smaller than the outer diameter of the second magnet; The second hole section and the fourth hole section have a length H, and 0.3mm≤H≤0.5mm.
6. The sequencing chip positioning device of claim 2, wherein, The object table comprises a first area and a second area protruding from the first area, and the first horizontal direction positioning assembly is arranged in the first area; The second area is provided with a chip matching area, the first horizontal direction positioning assembly is arranged on a first side of the chip matching area, and the second horizontal direction positioning assembly is arranged on a second side of the chip matching area; The first magnet and the second magnet are arranged on a third side and a second side of the chip matching area respectively, the third side is opposite to the second side, and the first side is adjacent to the second side.
7. The sequencing chip positioning device of claim 6, wherein, The shell is provided with an open groove, and the open cavity is located in the open groove; the opening of the open groove is located on the side of the shell close to the object table; The chip pressing plate is provided with two chip pressing plates, the two chip pressing plates are symmetrically arranged with respect to the transverse center axis of the sequencing chip, and the distance between the two chip pressing plates is greater than the length of the second area in the longitudinal direction of the chip matching area; The open cavity and the open groove are provided with a clamping protrusion, and the chip pressing plate is provided with a clamping groove matched with the clamping protrusion; Both sides of the open groove are provided with a limiting groove, and the length of the limiting groove is greater than the length of the second area in the longitudinal direction of the chip matching area.
8. The sequencing chip positioning device of claim 1, wherein, The sequencing chip comprises a chip bottom plate and a chip body arranged on the top of the chip bottom plate, and the length and width of the chip bottom plate are greater than the length and width of the chip body; The chip bottom plate is tightly pressed against the first horizontal direction positioning assembly and the second horizontal direction positioning assembly under the action of the magnetic attraction force in the magnetic pair.
9. The sequencing chip positioning device of claim 8, wherein, The side of the open cavity away from the object table is provided with a chip cover plate, and the chip cover plate has a transparent area matched with the chip body.
10. A genetic sequencing system characterized by, The sequencing chip positioning device comprises the sequencing chip positioning device according to any one of claims 1-9. The sequencing chip positioning device comprises the sequencing chip positioning device according to any one of claims 1-9.