Light-emitting module and vehicle lamp

Abstract

The utility model provides a light-emitting module and a car lamp, and relates to the technical field of lighting. The light-emitting module comprises a substrate, a semiconductor laser chip, a fluorescent layer and a lens. The plurality of semiconductor laser chips are arranged on the substrate, and the plurality of semiconductor laser chips are arranged in an array; the fluorescent layer covers one side, deviating from the substrate, of the semiconductor laser chip; the lenses are in one-to-one correspondence with the semiconductor laser chips, and the lenses are located on the sides, away from the corresponding semiconductor laser chips, of the fluorescent layers. The semiconductor laser chip can realize single-sided light emission, and the light source has the advantages of high collimation and small divergence angle, and does not diverge at a relatively long distance, so that good independent light spots can be formed. And the far-end illumination light spots do not coincide with one another without arranging a reflecting and shading structure, so that the technological process is simplified, and the manufacturing cost is reduced.

Description

TECHNICAL FIELD

[0001] The utility model relates to lighting technical field especially relates to a light emitting module and car light. BACKGROUND

[0002] With the development of the automobile industry, in order to comply with the demand of intelligent driving, the car light industry has developed matrix type headlamp. The light emitting module of the matrix type headlamp is composed of a plurality of LED chips arranged in a rectangular array, and is matched with components such as intelligent module, control module and power module. Compared with ordinary car light (such as LED light, xenon lamp, etc.), the matrix type headlamp can automatically turn on, turn off and adjust the array LED light source according to the road conditions (such as meeting, uphill and turning, etc.), and can also automatically switch the high and low beam, automatically adjust the light source height, and the light source can transmit the light signal according to the demand of the driver.

[0003] The matrix type headlamp has high requirements for the light emitting module, which needs to ensure that a single LED chip realizes single-sided light emission, the light spot formed by irradiation at a distance is a standard rectangle, and there is no overlapping light mixing between adjacent LED chips. Therefore, it is usually necessary to set a reflection layer, a partition plate and other reflection and shading structures between the LED chips, which has a complex process flow and high manufacturing cost. SUMMARY

[0004] In order to solve the problems existing in the prior art, one of the purposes of the utility model is to provide a light emitting module.

[0005] The utility model provides the following technical scheme:

[0006] A light emitting module, comprising a substrate, a semiconductor laser chip, a fluorescent layer and a lens;

[0007] The semiconductor laser chip is arranged on the substrate and is provided with a plurality of semiconductor laser chips arranged in an array.

[0008] The fluorescent layer covers one side of the semiconductor laser chip away from the substrate.

[0009] The lens is provided with a plurality of lenses corresponding to the semiconductor laser chips one by one, and the lens is located on one side of the fluorescent layer away from the corresponding semiconductor laser chip.

[0010] As a further optional scheme of the light emitting module, the fluorescent layer is provided with a plurality of fluorescent layers corresponding to the semiconductor laser chips one by one, and the fluorescent layer covers one side of the corresponding semiconductor laser chip away from the substrate.

[0011] As a further optional scheme of the light emitting module, the thickness of the fluorescent layer is H, and H is greater than or equal to 100 microns.

[0012] As a further optional solution to the light emitting module, the semiconductor laser chip is a vertical cavity surface emitting laser or a photonic crystal surface emitting laser.

[0013] As a further optional solution to the light emitting module, the substrate comprises a base material layer and a conductive layer which are stacked, and the semiconductor laser chip is electrically connected with the conductive layer.

[0014] As a further optional solution to the light emitting module, the conductive layer comprises a first conductive layer and a second conductive layer, and the first conductive layer, the base material layer and the second conductive layer are stacked in sequence.

[0015] The first conductive layer is electrically connected with the semiconductor laser chip and the second conductive layer respectively, and the second conductive layer is used for electrically connecting with an external circuit.

[0016] As a further optional solution to the light emitting module, the first conductive layer comprises a first conductive part and a second conductive part, and the first conductive part and the second conductive part are arranged in pairs and correspond to the semiconductor laser chip one by one, and the first conductive part and the second conductive part are electrically connected with the corresponding semiconductor laser chip.

[0017] As a further optional solution to the light emitting module, the base material layer is provided with an electrical connecting piece, and the first conductive part and the second conductive part are connected with the second conductive layer through the electrical connecting piece respectively.

[0018] As a further optional solution to the light emitting module, the first conductive layer further comprises a third conductive part, and the third conductive part is arranged at the outer periphery of the base material layer, and the third conductive part is electrically connected with the second conductive layer, and the third conductive part is used for electrically connecting with an external circuit.

[0019] Another object of the utility model is to provide a car light.

[0020] The utility model provides the following technical scheme:

[0021] A car light comprises the light emitting module.

[0022] The embodiment of the utility model has the following beneficial effects:

[0023] The arrayed semiconductor laser chips emit light and irradiate on the fluorescent layer respectively from the side away from the substrate, excite the fluorescent substance in the fluorescent layer to form light of other colors, the light of different colors mixes to emit white light, and the white light is focused by the corresponding lens to form illumination light spots at the far end.

[0024] In order to make the above-mentioned purpose, characteristics and advantages of the utility model more obvious and easy to understand, the following preferred embodiments are taken as an example, and the accompanying drawings are described in detail as follows. BRIEF DESCRIPTION OF DRAWINGS

[0025] In order to more clearly illustrate the technical scheme of the embodiments of the utility model, the following will briefly introduce the drawings needed to be used in the embodiments, it should be understood that the following drawings only show some embodiments of the utility model, therefore should not be regarded as the limitation to the scope, for the ordinary skilled person in the art, under the premise of not paying the creative labor, can also obtain other related drawings according to these drawings.

[0026] Figure 1 Fig. 1 shows the overall structure schematic diagram of a light emitting module provided by the embodiments of the utility model;

[0027] Figure 2 Fig. 2 shows the positional relationship schematic diagram of a semiconductor laser chip and a third conductive part in a light emitting module provided by the embodiments of the utility model.

[0028] Main element symbol explanation:

[0029] 100-substrate; 110-substrate layer; 111-electricity connecting piece; 120-conductive layer; 121-first conductive layer; 1211-first conductive part; 1212-second conductive part; 1213-third conductive part; 122-second conductive layer; 200-semiconductor laser chip; 300-fluorescent layer; 400-lens. DETAILED DESCRIPTION

[0030] The embodiments of the utility model will be described in detail below, the examples of the embodiments are shown in the drawings, wherein the same or similar reference signs represent the same or similar elements or elements with the same or similar functions throughout. The embodiments described below by referring to the drawings are exemplary, only for explaining the utility model, and cannot be understood as the limitation to the utility model.

[0031] It should be noted that when an element is referred to as being "on" another element, it can be directly on the other element or intervening elements can also be present. In contrast, when an element is referred to as being "directly on" another element, there are no intervening elements present. Like terms are used to describe like elements in the figures and the description.

[0032] In the present application, unless otherwise explicitly specified and limited, the terms "mounting", "connecting", "connecting", "fixing" and the like should be understood in a broad sense, for example, it can be fixedly connected, or it can be detachably connected, or it can be integrated; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the internal communication of two elements or the interaction relationship between two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0033] In addition, the terms "first", "second" are only for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features. Therefore, the features defined as "first", "second" can explicitly or implicitly include one or more of the features. In the description of the present application, the meaning of "multiple" is two or more, unless otherwise explicitly specified and limited.

[0034] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as understood by one of ordinary skill in the art to which this application belongs. The terms used in the specification of the template herein are only for the purpose of describing the specific embodiments, and are not intended to limit the present application. The term "and / or" used herein includes any and all combinations of one or more related listed items.

[0035] In the related art, there are mainly three ways to realize single-sided light emission of a single LED chip:

[0036] First, made by semiconductor process, LED chips are separated by silicon walls, which block the lateral transmission of LED light sources, realizing single-sided light emission of LED;

[0037] Second, made by semiconductor process, a reflective layer is plated on the side of the LED chip other than the front light-emitting surface using thin film deposition process, and the LED chip is soldered on the substrate to realize single-sided light emission of the LED;

[0038] Thirdly, the LED chip is welded on the substrate by a packaging process, and a white wall (containing titanium oxide, calcium oxide and other light reflecting substances) is manufactured between the LED chips by a dispensing process to realize single-side light emission.

[0039] The above-mentioned process flow is complex and the manufacturing cost is high.

[0040] Embodiment

[0041] In view of the problems in the related art, please refer to Figure 1 The embodiment provides a light-emitting module, in particular, a matrix light-emitting module. The light-emitting module comprises a substrate 100, a plurality of semiconductor laser chips 200, a fluorescent layer 300 and a plurality of lenses 400.

[0042] The semiconductor laser chips 200 are arranged on the substrate 100 and are arranged in an array.

[0043] Correspondingly, the fluorescent layer 300 covers the side of the semiconductor laser chips 200 away from the substrate 100.

[0044] In addition, the lenses 400 are arranged in an array and correspond to the semiconductor laser chips 200 one by one, and the lenses 400 are located on the side of the fluorescent layer 300 away from the corresponding semiconductor laser chips 200.

[0045] When the light-emitting module works, the plurality of semiconductor laser chips 200 arranged in an array emit light on the fluorescent layer 300 on the side away from the substrate 100, excite the fluorescent substances in the fluorescent layer 300 to form light of other colors, mix the light of different colors to emit white light, and focus the white light through the corresponding lenses 400 to form illumination light spots at a far end. Since the semiconductor laser chips 200 can realize single-side light emission, the light source has the advantages of high collimation and small divergence angle, and will not diverge at a far distance, so that a good independent light spot can be formed. Without setting a reflection and shading structure, the illumination light spots at the far end can not coincide with each other, the process flow is simplified, and the manufacturing cost is reduced.

[0046] In some embodiments, the substrate 100 comprises a base material layer 110 and a conductive layer 120 arranged in a stack, and the semiconductor laser chips 200 are electrically connected to the conductive layer 120.

[0047] In use, an external circuit supplies power to the semiconductor laser chips 200 through the conductive layer 120 to make the semiconductor laser chips 200 emit light.

[0048] Further, the conductive layer 120 comprises a first conductive layer 121 and a second conductive layer 122, and the first conductive layer 121, the base material layer 110 and the second conductive layer 122 are arranged in a stack.

[0049] The first conductive layer 121 is electrically connected with the semiconductor laser chip 200 and the second conductive layer 122 respectively, and the second conductive layer 122 is used to be electrically connected with an external circuit.

[0050] It can be understood that the first conductive layer 121 is arranged on the side of the substrate layer 110 facing the semiconductor laser chip 200, so as to facilitate the electrical connection of each semiconductor laser chip 200. The second conductive layer 122 is arranged on the side of the substrate layer 110 away from the semiconductor laser chip 200, and does not interfere with the semiconductor laser chip 200 while being electrically connected with the external circuit, and the arrangement of the semiconductor laser chip 200 is not affected by the wiring between the external circuit.

[0051] Specifically, the first conductive layer 121 includes a first conductive part 1211 and a second conductive part 1212. The first conductive part 1211 and the second conductive part 1212 are arranged in pairs and correspond to the semiconductor laser chip 200 one by one, and the first conductive part 1211 and the second conductive part 1212 are electrically connected with the corresponding semiconductor laser chip 200.

[0052] The first conductive part 1211 and the second conductive part 1212 correspond to the semiconductor laser chip 200 one by one means that each semiconductor laser chip 200 is provided with a first conductive part 1211 and a second conductive part 1212 corresponding thereto.

[0053] For example, the first conductive part 1211 is connected with the positive electrode of the external circuit through the second conductive layer 122, the second conductive part 1212 is connected with the negative electrode of the external circuit through the second conductive layer 122, and a complete loop is formed between the corresponding semiconductor laser chip 200 and the external circuit.

[0054] At this time, the external circuit can drive each semiconductor laser chip 200 respectively, so as to realize the individual control of each semiconductor laser chip 200.

[0055] Optionally, an electrical connecting piece 111 is provided on the substrate layer 110, and the first conductive part 1211 and the second conductive part 1212 are connected with the second conductive layer 122 through the electrical connecting piece 111 respectively.

[0056] It can be understood that the first conductive part 1211 and the second conductive part 1212 are connected with the second conductive layer 122 through the electrical connecting piece 111 provided on the substrate layer 110 respectively, which can simplify the wiring layout and avoid mutual interference between lines.

[0057] During processing, a plurality of through holes can be formed on the substrate layer 110, and then a conductive material is plated on the hole wall of the through hole to form the electrical connecting piece 111; or conductive slurry is injected into the through hole, and the electrical connecting piece 111 is formed after the conductive slurry is solidified.

[0058] Please combine Figure 2 Further, the first conductive layer 121 further comprises a third conductive part 1213, which is arranged at the outer periphery of the substrate layer 110. The third conductive part 1213 is electrically connected with the second conductive layer 122, and is used to electrically connect with external circuit.

[0059] It can be understood that the third conductive part 1213 is arranged at the outer periphery of the substrate layer 110, i.e. at the periphery of the first conductive part 1211 and the second conductive part 1212, which provides an additional bonding area for electrically connecting with external circuit without affecting the arrangement of the semiconductor laser chip 200, and is more convenient for wiring.

[0060] In some embodiments, the semiconductor laser chip 200 is a vertical cavity surface emitting laser or a photonic crystal surface emitting laser.

[0061] Taking the vertical cavity surface emitting laser as an example, the light beam is emitted from the output hole of the vertical cavity surface emitting laser. The light beam can be concentrated on the front surface of the vertical cavity surface emitting laser, i.e. the surface on the side of the vertical cavity surface emitting laser away from the substrate 100, by controlling the position arrangement of the output hole.

[0062] On this basis, the lens 400 can make the far-end irradiation spot of the vertical cavity surface emitting laser a rectangular spot. At the same time, each vertical cavity surface emitting laser is arranged in a rectangular array, so that the light beam emitted by the entire light-emitting module is rectangular, meeting the design requirements of the matrix type headlamp.

[0063] In the present embodiment, the fluorescent layer 300 adopts a fluorescent glass sheet formed by mixing and calcining fluorescent powder and glass.

[0064] Exemplarily, the concentration of the fluorescent powder is 14%, and the color temperature of the white light obtained by color conversion and mixing of the fluorescent layer 300 is 6500K.

[0065] Optionally, the thickness of the fluorescent layer 300 is H, and H≥100μm.

[0066] When the thickness of the fluorescent layer 300 is greater than 100μm, the fluorescent layer 300 has sufficient strength and is not easy to break, thereby ensuring the product yield.

[0067] Exemplarily, the thickness of the fluorescent layer 300 is 150μm.

[0068] Further, the fluorescent layer 300 is provided in plurality and corresponds to the semiconductor laser chip 200 one by one, and the fluorescent layer 300 covers the side of the corresponding semiconductor laser chip 200 away from the substrate 100.

[0069] At this time, the plurality of fluorescent layers 300 are also arranged in an array and are independent of each other, which can reduce the lateral propagation of light inside the fluorescent layer 300 and improve the light beam quality.

[0070] In summary, the above light emitting module uses the semiconductor laser chip 200 to replace the conventional LED chip, and the plurality of semiconductor laser chips 200 arranged in an array emit light from the side away from the substrate 100 and irradiate on the fluorescent layer 300, excite the fluorescent substance in the fluorescent layer 300 to form light of other colors, mix the light of different colors to emit white light, and focus the white light through the respective corresponding lens 400 to form an illumination spot at a far end. Since the semiconductor laser chip 200 can realize single-sided light emission, and the light source has the advantages of high collimation and small divergence angle, it will not diverge at a far distance, thereby being able to form a good independent spot. Without setting the reflection and shading structure, the far-end illumination spots can also be made not to coincide, which simplifies the process flow and reduces the manufacturing cost.

[0071] The embodiment also provides a vehicle lamp, in particular a matrix headlamp, which comprises the above light emitting module.

[0072] In all examples shown and described herein, any specific values should be interpreted as merely exemplary and not as a limitation, and thus other examples of the example embodiments can have different values.

[0073] It should be noted that like reference numerals and letters refer to like items in the following drawings, and thus, once an item is defined in one drawing, it need not be further defined and explained in subsequent drawings.

[0074] The above-described embodiments only express several implementation manners of the present application, and the description is relatively specific and detailed, but it should not be understood as a limitation on the scope of the present application. It should be pointed out that for ordinary skilled in the art, without departing from the concept of the present application, a number of modifications and improvements can be made, which all belong to the protection scope of the present application.

Claims

1. A light emitting module, characterized in that The substrate, the semiconductor laser chip, the fluorescent layer and the lens are included. The semiconductor laser chip is arranged on the substrate and is provided in plurality. The fluorescent layer covers the side of the semiconductor laser chip away from the substrate. The lens is provided in plurality and corresponds to the semiconductor laser chip one by one.

2. The light emitting module of claim 1, wherein, The fluorescent layer is provided in plurality and corresponds to the semiconductor laser chip one by one.

3. The light emitting module of claim 1, wherein, The thickness of the fluorescent layer is H, and H≥100μm.

4. The light emitting module of claim 1, wherein, The semiconductor laser chip is a vertical cavity surface emitting laser or a photonic crystal surface emitting laser.

5. The light emitting module of any one of claims 1-4, wherein, The substrate includes a substrate layer and a conductive layer arranged in stack, and the semiconductor laser chip is electrically connected with the conductive layer.

6. The light emitting module of claim 5, wherein, The conductive layer includes a first conductive layer and a second conductive layer, and the first conductive layer, the substrate layer and the second conductive layer are arranged in stack. The first conductive layer is electrically connected with the semiconductor laser chip and the second conductive layer respectively, and the second conductive layer is used for electrically connecting with an external circuit.

7. The light emitting module of claim 6, wherein, The first conductive layer includes a first conductive part and a second conductive part, and the first conductive part and the second conductive part are arranged in pair and correspond to the semiconductor laser chip one by one.

8. The light emitting module of claim 7, wherein, The first conductive part and the second conductive part are electrically connected with the corresponding semiconductor laser chip.

9. The light emitting module of claim 7, wherein, The substrate layer is provided with an electrical connecting member, and the first conductive part and the second conductive part are connected with the second conductive layer through the electrical connecting member respectively.

10. A vehicle lamp characterized by The first conductive layer further includes a third conductive part, and the third conductive part is arranged on the outer periphery of the substrate layer. The third conductive part is electrically connected with the second conductive layer and is used for electrically connecting with an external circuit. The light emitting module includes the light emitting module of any one of claims 1-9.

Images