Waste gas treatment device and semiconductor equipment

Abstract

The utility model discloses a waste gas treatment device and semiconductor equipment, and relates to the technical field of waste gas treatment. The waste gas treatment device comprises a plasma torch which comprises a bottom plate and a torch main body arranged on the bottom plate, and the bottom plate is provided with a water cooling flow channel; the bottom plate temperature measuring piece is used for detecting the temperature of the bottom plate; and the water-cooling module is communicated with the water-cooling flow channel and is used for adjusting the flow of the coolant input into the water-cooling flow channel according to the detection result of the bottom plate temperature measuring piece. The waste gas treatment device provided by the utility model can accurately monitor the combustion condition of the plasma torch, prolongs the service life of the plasma torch, and has higher safety.

Description

TECHNICAL FIELD

[0001] The utility model relates to waste gas treatment technical field, specifically, waste gas treatment device and semiconductor equipment. BACKGROUND

[0002] In the field of semiconductor production, plasma torch is often used to treat waste gas. The plasma torch forms an ion flame (high-temperature plasma) by ionizing nitrogen, argon and other gases to degrade waste gas at high temperature, so that the waste gas meets the emission standard.

[0003] Because the temperature of the plasma flame is extremely high, the temperature of the plasma torch is high and difficult to accurately detect, which makes it difficult to accurately monitor the combustion condition inside the plasma torch and poses a risk of scalding maintenance personnel and causing a fire. SUMMARY

[0004] The utility model aims at providing a waste gas treatment device which can accurately monitor the combustion condition of the plasma torch, improve the service life of the plasma torch and has higher safety.

[0005] Another purpose of the utility model is to provide a semiconductor equipment which has a longer service life and higher safety.

[0006] The embodiment of the utility model provides a technical scheme:

[0007] A waste gas treatment device comprises:

[0008] The plasma torch comprises a bottom plate and a torch body arranged on the bottom plate, and the bottom plate has a water-cooling flow channel;

[0009] The bottom plate temperature measuring element is used to detect the temperature of the bottom plate;

[0010] The water-cooling module is in communication with the water-cooling flow channel and is used to adjust the coolant flow rate input into the water-cooling flow channel according to the detection result of the bottom plate temperature measuring element.

[0011] The waste gas treatment device provided by the embodiment of the utility model has the bottom plate of the plasma torch connected to the water-cooling module, which is cooled by the water-cooling module, so that the bottom plate can accurately and quickly respond to the temperature change of the plasma torch. The bottom plate temperature measuring element detects the temperature of the bottom plate, which can accurately monitor the combustion condition of the plasma torch. The water-cooling module adjusts the coolant flow rate according to the detection result of the bottom plate temperature measuring element, i.e. adjusts the heat dissipation capacity of the bottom plate, so as to accurately control the combustion condition of the plasma torch, control the temperature of the plasma torch and improve its service life and safety.

[0012] In an optional embodiment, the waste gas treatment device further comprises a reaction device arranged below the plasma torch and connected with the bottom plate, the reaction device having a reaction cavity for the waste gas to pass through, and the plasma flame generated by the plasma torch extending into the reaction cavity for high-temperature degradation of the waste gas.

[0013] The plasma torch generates a plasma flame, and the high-temperature plasma of the plasma flame performs high-temperature degradation on the waste gas passing through the reaction cavity.

[0014] In an optional embodiment, the waste gas treatment device further comprises an in-cavity temperature measuring element arranged in the reaction device for detecting the temperature in the reaction cavity.

[0015] The in-cavity temperature measuring element is arranged to assist the temperature measurement of the bottom plate temperature measuring element, which can prevent the bottom plate temperature measuring element from malfunctioning or detecting errors and further improve the detection and control accuracy of the temperature of the plasma torch.

[0016] In an optional embodiment, the in-cavity temperature measuring element extends into the reaction cavity from the side wall of the reaction device, and the end extending into the reaction cavity is aligned with the plasma flame generated by the plasma torch.

[0017] The end of the in-cavity temperature measuring element is aligned with the plasma flame, which can accurately detect the temperature of the high-temperature plasma entering the reaction cavity, and the detection result of the in-cavity temperature measuring element and the detection result of the bottom plate temperature measuring element can be combined to determine whether the plasma flame extending into the reaction cavity is eccentric.

[0018] In an optional embodiment, the in-cavity temperature measuring element is a thermocouple; and / or,

[0019] The bottom plate temperature measuring element (120) is an infrared temperature measuring instrument.

[0020] The infrared temperature measuring instrument realizes non-contact detection of the temperature of the bottom plate, and the detection result is more stable and reliable.

[0021] In an optional embodiment, the bottom plate has a plurality of temperature measuring portions, and the plurality of temperature measuring portions are distributed along the circumference of the bottom plate, and the bottom plate temperature measuring element is used to detect the temperature of the plurality of temperature measuring portions.

[0022] The plurality of temperature measuring portions arranged along the circumference of the bottom plate can further improve the accuracy of the temperature detection result, thereby further improving the accuracy of the temperature control.

[0023] In an optional embodiment, the water-cooling flow channel has a water inlet, and the water inlet is arranged at the outer edge of the bottom plate.

[0024] In an optional embodiment, the angle between the line connecting any of the temperature measuring portions and the center of the bottom plate and the line connecting the water inlet and the center of the bottom plate is greater than or equal to 45 degrees.

[0025] The temperature measuring portions are arranged in the area within 45 degrees on the left and right sides of the water inlet, so that the temperature detection accuracy is further improved.

[0026] In an optional embodiment, the torch body includes a torch cathode and a torch anode, and the waste gas treatment device further includes a power supply control module configured to adjust the current between the torch cathode and the torch anode.

[0027] The power supply control module can adjust the current between the torch cathode and the torch anode, so that the temperature can be reduced by reducing the input current when the temperature of the plasma torch is too high, and the input current can be increased when it is necessary to improve the degradation efficiency.

[0028] The embodiment of the utility model provides a semiconductor device, including preceding waste gas treatment device, waste gas treatment device includes: plasma torch, including bottom plate and set up on the bottom plate on torch body The bottom plate has water cooling flow channel;Bottom plate temperature measuring piece is used for detecting the temperature of the bottom plate;Water cooling module, with the water cooling flow channel intercommunication, for according to the detection result of bottom plate temperature measuring piece adjusts the coolant flow of input water cooling flow channel.

[0029] The semiconductor device provided by the embodiment of the utility model has the characteristics of longer service life and higher safety. BRIEF DESCRIPTION OF DRAWINGS

[0030] In order to more clearly illustrate the technical scheme of the embodiment of the utility model, the following will be briefly introduced. It should be understood that the following drawings only show some embodiments of the utility model, and therefore should not be regarded as limiting the scope. For those skilled in the art, other related drawings can also be obtained without creative labor.

[0031] Figure 1 The structure diagram of the waste gas treatment device provided by the embodiment of the utility model is shown in the figure.

[0032] Figure 2 The structure diagram of the connection structure of the reaction device and the cavity temperature measuring element is shown in the figure.

[0033] Figure 3 The structure diagram of the connection structure of the reaction device and the cavity temperature measuring element is shown in the figure. Figure 2 The sectional view along A-A.

[0034] Figure 4 Figure 1 is a structural schematic diagram of a connection structure of a plasma torch and a reaction device.

[0035] Figure 1 is a structural schematic diagram of a connection structure of a plasma torch and a reaction device. DETAILED DESCRIPTION

[0036] In order to make the purpose, technical scheme and advantages of the embodiments of the present application clearer, the technical scheme of the embodiments of the present application will be described clearly and completely below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, rather than all the embodiments. The components of the embodiments of the present application described and shown in the drawings can be arranged and designed in various different configurations.

[0037] Therefore, the following detailed description of the embodiments of the present application provided in the drawings is not intended to limit the scope of the claimed present application, but only represents selected embodiments of the present application. All other embodiments obtained by those of ordinary skill in the art based on the embodiments in the present application without creative labor are within the scope of protection of the present application.

[0038] It should be noted that: similar reference numerals and letters represent similar items in the following drawings, therefore, once an item is defined in one drawing, it does not need to be further defined and explained in subsequent drawings.

[0039] In the description of the present application, it should be understood that the terms "upper", "lower", "inner", "outer", "left", "right" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, or the orientation or positional relationship commonly used when the product of the present application is used, or the orientation or positional relationship commonly understood by those skilled in the art, and are only for the convenience of describing the present application and simplifying the description, and therefore cannot be understood as indicating or implying that the indicated device or element must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application.

[0040] In addition, the terms "first", "second" and the like are only used for differentiation in description, and cannot be understood as indicating or implying relative importance.

[0041] In the description of the utility model, still need explaining, unless another explicit provision and limitation, "arrange", "connect" and so on term should do broad sense understanding, for example, "connect" can be fixed connection, also can be detachable connection, or integrally connect, can be mechanical connection, also can be electrical connection, can be direct connection, also can pass through intermediate medium indirectly connect, can be two element inside intercommunication. For ordinary skilled person in the art, can understand the concrete meaning of above-mentioned term in the utility model according to specific circumstances.

[0042] The specific embodiments of the utility model will be described in detail below with reference to the drawings.

[0043] Embodiment

[0044] Please combine Figures 1 to 4 The waste gas treatment device 100 provided by the embodiment includes a device main body 160, a plasma torch 110, a reaction device 140 and a tail gas treatment system 170. The plasma torch 110, the reaction device 140 and the tail gas treatment system 170 are all arranged on the device main body 160.

[0045] The plasma torch 110 is arranged above the reaction device 140. The output end of the reaction device 140 is in communication with the input end of the tail gas treatment system 170. The plasma torch 110 is used to ionize the gas, such as nitrogen, to form a plasma flame 113. The high-temperature plasma of the plasma flame 113 and the waste gas enter the reaction device 140 together to realize high-temperature degradation of the waste gas. The gas after reaction and degradation is input into the tail gas treatment system 170. The tail gas treatment system 170 purifies and discharges the input gas.

[0046] In the embodiment, the tail gas treatment system 170 includes a water tank 171, a circulating pump 172, a scrubbing tower 173, an exhaust fan 174 and an exhaust pipe 175. The exhaust fan 174 drives the gas after degradation to flow from the reaction device 140 to the scrubbing tower 173 for washing, and then is discharged by the exhaust pipe 175. The water tank 171 and the scrubbing tower 173 are connected by a pipeline provided with the circulating pump 172. The water tank 171 supplies water to the scrubbing tower 173 through the circulating pump 172.

[0047] The plasma torch 110 includes a bottom plate 111 and a torch main body 112 arranged on the bottom plate 111. The reaction device 140 is arranged below the plasma torch 110 and is connected with the bottom plate 111. The reaction device 140 has a reaction cavity 141 for inputting waste gas. The plasma flame 113 generated by the plasma torch 110 extends into the reaction cavity 141 to be used for high-temperature degradation of the waste gas input into the reaction cavity 141.

[0048] The reaction device 140 is provided with a gas inlet 143 communicating with the reaction cavity 141, which is used to pass the exhaust gas into the reaction cavity 141. The bottom of the reaction device 140 is provided with an exhaust port 144, and the reaction cavity 141 communicates with the tail gas treatment system 170 through the exhaust port 144.

[0049] The torch body 112 includes a torch cathode and a torch anode, and the torch cathode and the torch anode are connected to an external power supply. In actual application, a discharge is generated between the torch cathode and the torch anode, so that the nitrogen gas passed in is ionized and decomposed under a strong current to form a plasma flame 113 extending into the reaction cavity 141, i.e., a high-temperature plasma flows downward into the reaction cavity 141.

[0050] The exhaust gas enters the reaction cavity 141 through the gas inlet 143 provided on the reaction device 140, and after being degraded by the high-temperature plasma flowing in, the exhaust gas flows downward into the tail gas treatment system 170 for further purification treatment.

[0051] Due to the high temperature of the ionization process, the temperature of the bottom plate 111 is high, and it is difficult to accurately detect and control, which has a high safety hazard, such as easy to scald the staff. In order to solve this problem, the exhaust gas treatment device 100 provided in the embodiment further includes a bottom plate temperature measuring member 120 and a water cooling module. The bottom plate temperature measuring member 120 is used to detect the temperature of the bottom plate 111. The bottom plate 111 of the plasma torch 110 has a water cooling flow channel, and the water cooling module communicates with the water cooling flow channel and is used to adjust the flow of the coolant input into the water cooling flow channel according to the detection result of the bottom plate temperature measuring member 120, wherein the coolant can be deionized water. The temperature of the bottom plate 111 of the plasma torch 110 is generally stable and uniform, and the temperature of the plasma torch 110 can be reflected according to the temperature of the bottom plate 111, so as to realize effective monitoring of the temperature of the plasma flame 113, increase the service life of the plasma torch 110, and reduce the safety hazard.

[0052] In the embodiment, the bottom plate 111 is made of metal material. Since the bottom plate 111 of the plasma torch 110 is connected to the water cooling module and is cooled and dissipated by the water cooling module, the bottom plate 111 can accurately and quickly respond to the temperature change of the plasma torch 110. The temperature of the bottom plate 111 is detected by the bottom plate temperature measuring member 120, so as to realize accurate detection of the temperature of the plasma torch 110. The water cooling module adjusts the flow of the coolant according to the detection result of the bottom plate temperature measuring member 120, i.e., adjusts the heat dissipation capacity of the bottom plate 111, so as to accurately control the temperature of the bottom plate 111, so as to keep the temperature of the bottom plate 111 within an ideal range and ensure the service life of the plasma torch 110.

[0053] In order to further improve the detection accuracy of the bottom plate temperature measuring part 120, the bottom plate temperature measuring part 120 provided in the embodiment is an infrared temperature measuring instrument, which is arranged on the device main body 160 to realize non-contact detection of the temperature of the bottom plate 111. In another embodiment, the bottom plate temperature measuring part 120 can be specifically selected according to the actual application condition.

[0054] In order to realize further accurate regulation of the temperature of the plasma torch 110, the waste gas treatment device 100 provided in the embodiment further comprises a power supply control module, which is used to adjust the current size between the torch cathode and the torch anode.

[0055] In actual application, the power supply control module outputs the set current value to reduce the proportion of ionized nitrogen atoms, and then adjusts the temperature of the plasma flame 113. That is, the power supply control module adjusts the current output value of the external power supply according to the safe temperature value, so as to achieve the effect of regulating the temperature of the plasma flame 113 of the plasma torch 110, prevent the temperature of the plasma flame 113 from being too high to affect the use safety of the waste gas treatment device 100 and the service life of the plasma torch 110, and also realize temperature control of the reaction cavity 141. For example, when the temperature of the reaction cavity 141 is relatively high (i.e., the temperature of the flame is relatively high), the current can be reduced in time to reduce the use cost of the equipment while ensuring the removal efficiency. In the case where the temperature of the reaction cavity 141 is reduced, a larger current and power output are required to increase the temperature of the reaction cavity 141 to ensure the removal efficiency of the waste gas.

[0056] In order to further improve the temperature detection accuracy of the bottom plate 111, in the embodiment, the bottom plate 111 has a plurality of temperature measuring parts 1111, which are distributed along the circumference of the bottom plate 111. The bottom plate temperature measuring part 120 is used to detect the temperature of the plurality of temperature measuring parts 1111. It can be understood that the temperature measuring part 1111 is a plurality of temperature measuring points for the bottom plate temperature measuring part 120 to detect the temperature of the bottom plate 111. By detecting the temperatures of different temperature measuring points of the bottom plate 111, the accuracy of temperature detection is improved, the temperature control effect is further improved, and the service life of the plasma torch 110 is ensured.

[0057] As a preferred, the plurality of temperature measuring parts 1111 are uniformly distributed along the circumference of the bottom plate 111. The bottom plate temperature measuring part 120 detects the temperature of the plurality of uniformly distributed temperature measuring parts 1111, which can further reduce the detection error and improve the accuracy of the detection result.

[0058] In fact, since the water cooling flow channel of the bottom plate 111 is connected to the water cooling module, in order to avoid that the temperature of the temperature measuring part 1111 is greatly affected, the specific position of the temperature measuring part 1111 on the bottom plate 111 needs to be reasonably arranged. Specifically, in the embodiment, the water cooling flow channel has a water inlet 1112 arranged at the outer edge of the bottom plate 111, and the temperature measuring part 1111 is kept away from the water inlet 1112. For example, as shown inFigure 4 In the example shown, in the same horizontal plane, the angle between the line connecting any temperature measuring portion 1111 and the center of the bottom plate 111 and the line connecting the water inlet 1112 and the center of the bottom plate 111 is greater than or equal to 45°.

[0059] In other words, the plurality of temperature measuring portions 1111 are all located in the area outside the 45° central angle on both sides of the water inlet 1112 on the bottom plate 111, and can be unaffected by the low temperature of the water inlet 1112, thereby improving the accuracy of the detection results of the bottom plate temperature measuring member 120.

[0060] In addition, in the embodiment, the exhaust gas treatment device 100 further comprises an in-cavity temperature measuring member 150, which is arranged in the reaction device 140 and is used to detect the temperature in the reaction cavity 141. Specifically, the side wall of the reaction device 140 is provided with a plug-in portion 142, and the in-cavity temperature measuring member 150 is plugged with the plug-in portion 142 and extends into the reaction cavity 141.

[0061] Since the plurality of temperature measuring portions 1111 detected by the bottom plate temperature measuring member 120 are outside the reaction cavity 141, and the in-cavity temperature measuring member 150 is closer to the plasma flame 113, the in-cavity temperature measuring member 150 can assist the bottom plate temperature measuring member 120 to detect the temperature of the plasma flame 113, so as to prevent the failure or false alarm of the bottom plate temperature measuring member 120.

[0062] Specifically, if the temperature measured by the in-cavity temperature measuring member 150 is within the normal range, and the temperature measured by the bottom plate temperature measuring member 120 decreases significantly, it can be judged that the bottom plate temperature measuring member 120 has a certain error, and the bottom plate temperature measuring member 120 can be repaired.

[0063] In the embodiment, the in-cavity temperature measuring member 150 is a thermocouple, which extends into the reaction cavity 141 from the side wall of the reaction device 140, and the end of the in-cavity temperature measuring member 150 extending into the reaction cavity 141 is aligned with the plasma flame 113. The detection result of the in-cavity temperature measuring member 150 can also reflect whether the plasma flame 113 is eccentric, so as to facilitate the maintenance personnel to respond quickly.

[0064] The specific parameters of the thermocouple can be determined by simulation method. The main factors affecting the simulation temperature include the current size of the input torch cathode and the torch anode, the nitrogen flow rate of the input plasma torch 110, the PCW water flow rate, and the shape of the reaction cavity 141. By setting the parameters of such influencing factors, the theoretical temperature value of the reaction cavity 141 is output. Then, referring to the simulation result, the probe position of the thermocouple is fixed, i.e. the distance of the thermocouple extending into the reaction cavity 141, and the temperature value of the actual point is measured. The distance and length of the thermocouple are set according to the simulation result, and the temperature value triggering interlocking is determined according to the actual temperature of the plant equipment operation.

[0065] A thermocouple is arranged in the reaction cavity 141 directly below the plasma flame 113. The degree of flame eccentricity is mainly determined by the temperature difference. When the temperature difference is too large, two obvious disadvantages will occur. One is that the temperature distribution of the bottom plate 111 is uneven, affecting the service life of the plasma torch 110. The second is that the temperature field distribution in the reaction cavity 141 is uneven, and the waste gas degradation effect is poor, resulting in waste gas that does not meet the emission standard.

[0066] In actual application, if the plasma flame 113 is normal, it is basically vertically downward and opposite to the end of the cavity temperature measuring element 150. The temperature detected by the cavity temperature measuring element 150 is the normal temperature, for example, 800℃. When the temperature detected by the cavity temperature measuring element 150 is lower than the normal temperature, for example, 750℃, if the bottom plate temperature measuring element 120 detects that the temperature of different temperature measuring parts 1111 on the bottom plate 111 is obviously different, that is, the temperature of the bottom plate 111 is uneven, it can be judged that the flame eccentricity occurs.

[0067] In actual application, the threshold value of the temperature difference can be set as the basis for eccentricity reminder. For example, when the set threshold value is 100℃, when the temperature difference is greater than 100℃, the eccentricity warning is triggered, reminding the maintenance personnel to maintain and repair, and the waste gas treatment device 100 can operate normally. When the temperature difference between the temperature value detected by the cavity temperature measuring element 150 and the preset normal temperature exceeds 200℃, the flame eccentricity is serious and the equipment can be shut down for manual intervention, such as replacing the torch or checking whether it is dust blockage to treat the dust blockage.

[0068] When the flame eccentricity occurs, the plasma torch 110 can be shut down and repaired or replaced, so that the temperature field distribution in the reaction cavity 141 is uniform, the normal operation of the waste gas treatment device 100 is ensured, and the waste gas degradation effect is improved. The temperature of the plasma torch 110 can also be adjusted to the ideal range by the water cooling module and the power control module to protect the plasma torch 110 and prolong its service life.

[0069] The waste gas treatment device 100 provided in the embodiment, in actual application, if the temperatures detected by the bottom plate temperature measuring element 120 and the cavity temperature measuring element 150 are within their respective normal ranges, the power control module maintains the current input electrode current, and the water cooling module maintains the current coolant flow.

[0070] If the temperatures detected by the bottom plate temperature measuring element 120 and the cavity temperature measuring element 150 are higher than their respective normal ranges, it indicates that the temperature is too high at this time. The input current can be reduced by the power control module to reduce the surface temperature of the torch body 112, and the temperature of the bottom plate 111 can be adjusted to a reasonable temperature range by increasing the coolant flow of the water cooling module.

[0071] It should be noted that, according to the actual application condition, the control of the water cooling module and the power control module can be triggered independently or synchronously. For example, when the temperature detected by the cavity temperature measuring element 150 and the bottom plate temperature measuring element 120 is lower than the normal range, it can be determined that the output conversion capability of the plasma torch 110 is reduced, and a low temperature alarm is triggered. The input current can be increased only by the power control module to maintain the temperature in a normal state.

[0072] The water cooling module can also be adjusted cooperatively, that is, the refrigeration effect is reduced by reducing the coolant flow to increase the temperature in the cavity. At this time, the control of the water cooling module and the power control module is triggered independently, which can avoid the phenomenon of redundancy caused by the rapid rise of the temperature in the reaction cavity 141.

[0073] As a preferred embodiment, when the temperature of the bottom plate 111 measured by the bottom plate temperature measuring element 120 is less than 30℃, and the temperature in the reaction cavity 141 measured by the cavity temperature measuring element 150 is less than 100℃ lower than the normal value, the power control module controls the input current to increase by 10%. In the case of increasing the input current by the power control module, the temperature of the bottom plate 111 can be too high, and at this time, the coolant flow to the bottom plate 111 can be increased by the water cooling module. When the detected temperature of the cavity temperature measuring element 150 and the bottom plate temperature measuring element 120 is within the corresponding normal range, the alarm is removed, and at this time, the current size and the coolant flow return to the default value.

[0074] In addition, in order to reduce the false alarm and wrong alarm caused by the fluctuation of the factory section supply, in the actual application, the high temperature alarm and the low temperature alarm can be triggered with a delay, for example, triggered with a delay of 3s to 10s.

[0075] In summary, the waste gas treatment device 100 provided by the embodiment can accurately monitor the combustion condition of the plasma torch 110, prolong the service life of the plasma torch 110, and has higher safety.

[0076] In addition, the embodiment also provides a semiconductor equipment including the waste gas treatment device 100. The semiconductor equipment can be a lithography machine, an etching machine, a vapor deposition equipment, etc., and the waste gas treatment device 100 can purify the waste gas generated by the semiconductor equipment to meet the emission standard and avoid air pollution.

[0077] Benefiting from the beneficial effects of the waste gas treatment device 100, the semiconductor equipment provided by the embodiment also has the characteristics of longer service life and higher safety.

[0078] The above merely describes preferred embodiments of the present application and is not intended to limit the present application. For those skilled in the art, the present application can have various modifications and changes. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. An exhaust gas treatment device, characterized by, The waste gas treatment device (100) comprises: a plasma torch (110) comprising a bottom plate (111) and a torch body (112) arranged on the bottom plate (111), wherein the bottom plate (111) has a water-cooling flow channel; a bottom plate temperature measuring element (120) for detecting the temperature of the bottom plate (111); a water-cooling module in communication with the water-cooling flow channel, for adjusting the flow rate of the coolant input into the water-cooling flow channel according to the detection result of the bottom plate temperature measuring element (120).

2. The exhaust treatment device of claim 1, wherein, The waste gas treatment device (100) further comprises a reaction device (140) arranged below the plasma torch (110) and connected with the bottom plate (111), wherein the reaction device (140) has a reaction cavity (141) for passing in waste gas, and the plasma flame (113) generated by the plasma torch (110) extends into the reaction cavity (141) for high-temperature degradation of the waste gas.

3. The exhaust treatment device of claim 2, wherein, The waste gas treatment device (100) further comprises an in-cavity temperature measuring element (150) arranged in the reaction device (140) for detecting the temperature in the reaction cavity (141).

4. The exhaust treatment device of claim 3, wherein, The in-cavity temperature measuring element (150) extends into the reaction cavity (141) from the side wall of the reaction device (140), and the end extending into the reaction cavity (141) is aligned with the plasma flame (113) generated by the plasma torch (110).

5. The exhaust treatment device of claim 3, wherein, The in-cavity temperature measuring element (150) is a thermocouple; and / or, The bottom plate temperature measuring element (120) is an infrared temperature measuring instrument.

6. The exhaust treatment device of claim 1, wherein, The bottom plate (111) has a plurality of temperature measuring portions (1111), and the plurality of temperature measuring portions (1111) are distributed along the circumference of the bottom plate (111), and the bottom plate temperature measuring element (120) is used for detecting the temperature of the plurality of temperature measuring portions (1111).

7. The exhaust treatment device of claim 6, wherein, The water-cooling flow channel has a water inlet (1112) arranged at the outer edge of the bottom plate (111).

8. The exhaust treatment device of claim 7, wherein, In the same horizontal plane, the included angle between the line connecting any temperature measuring portion (1111) and the center of the bottom plate (111) and the line connecting the water inlet (1112) and the center of the bottom plate (111) is greater than or equal to 45°.

9. The exhaust treatment device of claim 1, wherein, The torch body (112) comprises a torch cathode and a torch anode, and the waste gas treatment device (100) further comprises a power supply control module for adjusting the current size between the torch cathode and the torch anode.

10. A semiconductor device, characterized by comprising: The waste gas treatment device (100) comprises any one of claims 1-9. The waste gas treatment device (100) comprises any one of claims 1-9.

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