Refrigeration device and microbial incubator

Abstract

The utility model provides a refrigeration device and a microbial incubator, and the refrigeration device comprises a semiconductor refrigeration sheet and a cold dissipation device; a first cold head is arranged on the refrigeration face of the semiconductor refrigeration piece, a first flow channel is formed in the first cold head, the interior of the first flow channel is used for containing a heat exchange medium, and the first cold head is used for enabling the heat exchange medium in the first flow channel to conduct heat exchange with the refrigeration face of the semiconductor refrigeration piece. The cold dissipation device comprises a heat dissipation pipe, heat dissipation fins in contact with the heat dissipation pipe and a cold end fan, and a second flow channel is formed in the heat dissipation pipe; the first flow channel is communicated with the second flow channel through a first hose; the radiating fins are used for exchanging heat with the heat exchange medium in the second flow channel; and the cold end fan is used for enabling air to pass through the cooling fins for heat exchange.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of microbial culture, in particular, to a refrigeration device and a microbial incubator. BACKGROUND

[0002] Microbial examination of drugs is a necessary means to ensure drug quality and reduce clinical adverse reactions. For high-risk sterile preparations, sterile examination is of great significance in its production, circulation and supervision. There are many microbial examination methods, and the most commonly used is still culture method, but different microorganisms have different growth temperature ranges, and a single culture temperature cannot detect all types of microorganisms, so generally two or more than two temperature ranges are required for microbial culture and detection to comprehensively detect the microorganisms in the sample. In order to cover more types of microbial detection, the sterile examination method and limit detection method of Chinese Pharmacopoeia also require pharmaceutical manufacturers to detect microorganisms at two temperature ranges of 20-25℃ and 30-35℃.

[0003] The temperature range of 30-35℃ is relatively easy to obtain in a laboratory environment, and only needs to be heated to obtain; the temperature range of 20-25℃ or even lower is relatively difficult to obtain, because the laboratory temperature is generally set at 23-27℃ and is unstable, so a refrigeration device needs to be added outside the culture space to control the stable temperature.

[0004] At present, most microbial culture equipment uses a compressor for refrigeration, and the microbial incubator (including refrigeration) such as Boshen BSC-150 uses a built-in compressor, and the sterile examination system such as Incubator Mod Dual-T of Meril uses an external refrigeration system.

[0005] The above two types of microbial culture equipment not only occupy a large space, but also have low refrigeration efficiency. CONTENT OF THE UTILITY MODEL

[0006] The purpose of the present application is to provide a microbial incubator with a refrigeration device, which occupies a smaller space and has higher refrigeration efficiency.

[0007] The embodiments of the present application are implemented as follows:

[0008] In a first aspect, the embodiments of the present application provide a refrigeration device, comprising a semiconductor refrigeration sheet and a heat dissipation device; a first cold head is arranged on the refrigeration surface of the semiconductor refrigeration sheet, a first flow channel is arranged inside the first cold head, and the first flow channel is used to accommodate a heat exchange medium; and the first cold head is used to exchange heat between the heat exchange medium in the first flow channel and the refrigeration surface of the semiconductor refrigeration sheet.

[0009] The cold-dissipating device comprises a heat-dissipating pipe, a heat-dissipating fin in contact with the heat-dissipating pipe, and a cold-end fan, the heat-dissipating pipe is provided with a second flow channel; the first flow channel and the second flow channel are communicated through a first hose; the heat-dissipating fin is used for heat exchange with the heat exchange medium in the second flow channel; and the cold-end fan is used for making air pass through the heat-dissipating fin for heat exchange.

[0010] In the above technical solution, the semiconductor refrigeration sheet is used for refrigeration, the cold quantity is exchanged with the heat exchange medium in the first cold head, and then the heat exchange medium is sent to the cold-dissipating device through the hose, the heat exchange medium is exchanged with the heat-dissipating fin in the cold-dissipating device, the temperature of the heat-dissipating fin is reduced, and then the air current is made to pass through the heat-dissipating fin through the cold-end fan, so that the air current with low temperature is formed to realize refrigeration.

[0011] Since the semiconductor refrigeration sheet is used for refrigeration, the refrigeration process does not need to rely on a large device such as a compressor, and therefore the refrigeration device provided in the above technical solution occupies a small volume.

[0012] In some optional embodiments, a water pump is further arranged to drive the heat exchange medium to circulate in the first hose.

[0013] In some optional embodiments, the cold-dissipating device comprises a plurality of heat-dissipating pipes arranged side by side, each of the heat-dissipating pipes has the second flow channel, and the heat-dissipating fins are alternately arranged with the heat-dissipating pipes; and the two sides of the heat-dissipating fin are in contact with one of the heat-dissipating pipes.

[0014] In the above technical solution, the cold-dissipating device comprises a plurality of heat-dissipating pipes, the heat exchange medium can pass through the second flow channel in the heat-dissipating pipe, and the two sides of the heat-dissipating fin are in contact with one of the heat-dissipating pipes, so that the heat-dissipating fin can obtain more cold quantity and has high refrigeration efficiency.

[0015] In some optional embodiments, the heat-dissipating pipe is a flat structure, and the heat-dissipating fin is in contact with a large surface of the heat-dissipating pipe.

[0016] In the above technical solution, the heat-dissipating pipe is a flat structure, and the heat-dissipating fin is in contact with a large surface of the heat-dissipating pipe, so that the contact area between the heat-dissipating pipe and the heat-dissipating fin is large, the heat exchange efficiency between the heat-dissipating fin and the heat exchange medium is increased, the heat-dissipating fin obtains more cold quantity, and good refrigeration effect is achieved.

[0017] In some optional embodiments, the heat-dissipating fin is a wave-shaped structure, the wave crest of the heat-dissipating fin is in contact with one of the heat-dissipating pipes, and the wave trough of the heat-dissipating fin is in contact with the other heat-dissipating pipe.

[0018] The heat dissipation fin is arranged between the two heat dissipation pipes in a wave shape, has a long length, a large surface area, and a large contact area with the airflow generated by the cold end fan, so that a better refrigeration effect is achieved.

[0019] In some optional embodiments, at least one cold end fan is arranged along the extension direction of the heat dissipation pipe.

[0020] In some optional embodiments, the heating surface of the semiconductor refrigeration fin is provided with a second cold head, and a heat dissipation device is connected to the second cold head through a second hose.

[0021] In the above technical solution, the heat generated by the semiconductor refrigeration fin can be removed through the second cold head and the heat dissipation device connected to the second cold head.

[0022] In some optional embodiments, the heat dissipation device and the heat dissipation device have the same structure.

[0023] In a second aspect, the embodiments of the present application provide a microorganism incubator, which comprises a box body, a refrigeration device provided in the first aspect, a culture chamber arranged in the box body, and a semiconductor refrigeration fin arranged outside the culture chamber; the heat dissipation device is detachably arranged in the culture chamber; a water receiving device is further arranged in the culture chamber and below the heat dissipation device.

[0024] Since the heat dissipation device is detachably arranged in the culture chamber, the installation position of the heat dissipation device in the culture chamber can be conveniently changed, and the refrigeration effect is adjusted. In addition, in the microorganism incubator provided in the above technical solution, the heat exchange medium is first used for heat exchange with the refrigeration fin, and then used for heat exchange with the heat dissipation fin, and the cold end fan is used to diffuse the cold energy on the heat dissipation fin to the culture chamber. In the above technical solution, the heat exchange medium and the cold end fan are combined to perform refrigeration. Since the heat exchange medium has a large specific heat capacity, it can carry a large amount of cold energy, so that the refrigeration efficiency in the above technical solution is higher. By arranging the water receiving device below the heat dissipation device, the condensed water dripping from the heat dissipation pipe and the heat dissipation fin in the heat dissipation device can be collected, so as to improve the problem that the electronic components are damaged.

[0025] In some optional embodiments, the culture chamber is at least one, the number of semiconductor refrigeration fins is consistent with the number of culture chambers, and each first cold head is connected to one heat dissipation device through a mutually independent first hose.

[0026] In the above technical solution, when there are multiple culture chambers, one semiconductor refrigerating sheet is arranged for each culture chamber for temperature adjustment, and each culture chamber is connected with an independent first hose to one cooling device, which is convenient for adjusting the installation position of the cooling device in each culture chamber and adjusting the refrigeration temperature in each culture chamber.

[0027] In some optional embodiments, the second cold head is connected in series through a pipeline, and the second cold head is connected to the same heat dissipation device.

[0028] In the above technical solution, the second cold head on all semiconductor refrigerating sheets is connected in series to the same heat dissipation device, which can reduce the cost. BRIEF DESCRIPTION OF DRAWINGS

[0029] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings needed in the embodiments will be briefly introduced as follows. It should be understood that the following drawings only show some embodiments of the present application, and therefore should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can also be obtained without creative labor.

[0030] Figure 1 The schematic diagram of the microbial incubator provided by an embodiment of the present application is shown in the figure.

[0031] Figure 2 The schematic diagram of the microbial incubator provided by another embodiment of the present application is shown in the figure.

[0032] Figure 3 The schematic diagram of the cooling device provided by an embodiment of the present application is shown in the figure.

[0033] Figure legend: 100 - box body; 200 - culture chamber; 300 - semiconductor refrigerating sheet; 410 - first cold head; 420 - second cold head; 510 - cooling device; 511 - heat dissipation pipe; 512 - heat dissipation fin; 513 - cold end fan; 520 - heat dissipation device; 610 - first hose; 620 - second hose; 700 - water pump; 800 - water receiving device. DETAILED DESCRIPTION

[0034] In order to make the purpose, technical solutions and advantages of the embodiments of the present application more clear, the technical solutions in the embodiments of the present application will be described clearly and completely below in combination with the drawings in the embodiments of the present application. Obviously, the described embodiments are some embodiments of the present application, but not all embodiments. The components of the embodiments of the present application described and shown in the drawings here can be arranged and designed in various different configurations.

[0035] Therefore, the following detailed description of the embodiments of the application provided in the accompanying drawings is not intended to limit the scope of the application claimed, but merely represents selected embodiments of the application. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the application without creative labor fall within the scope of the application.

[0036] It should be noted that similar reference numbers and letters represent similar items in the following drawings, and therefore, once an item is defined in one drawing, it does not need to be further defined and explained in subsequent drawings.

[0037] In the description of the application, it should be noted that the terms "center", "upper", "lower", "vertical", "horizontal", "inner", "outer", etc. indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, or the orientation or positional relationship when the product of the application is usually placed, and are only for the convenience of describing the application and simplifying the description, and do not indicate or imply that the indicated device or element must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the application. In addition, the terms "first", "second", "third", etc. are only used to distinguish the description and cannot be understood as indicating or implying relative importance.

[0038] In addition, the terms "horizontal", "vertical", "overhanging", etc. do not mean that the components must be absolutely horizontal or overhanging, but can be slightly inclined. For example, "horizontal" only means that its direction is more horizontal relative to "vertical", and does not mean that the structure must be completely horizontal, but can be slightly inclined.

[0039] In the description of the application, it should also be noted that unless otherwise explicitly specified and limited, the terms "provided", "mounted", "connected", "connected" should be broadly understood, for example, it can be fixedly connected, or it can be detachably connected, or integrally connected; it can be directly connected, or indirectly connected through an intermediate medium; it can be the communication between two elements inside. For those of ordinary skill in the art, the specific meaning of the above terms in the application can be understood according to the specific circumstances.

[0040] The embodiments of the application provide a refrigeration device and a microbial incubator, such as Figure 1 With Figure 2As shown, the device includes a box 100 and a refrigeration device, the refrigeration device includes a semiconductor refrigeration sheet 300 and a first cold head 410. The box 100 is provided with a culture chamber 200 and the semiconductor refrigeration sheet 300. The box 100 can be understood as the shell of the microbial incubator, and the culture chamber 200 is an independent and sealable cavity in the box 100, which is used to place the microbial culture dish for incubation. The semiconductor refrigeration sheet 300 is a device with lower temperature on one side and higher temperature on the other side after being powered on, such as the prior art disclosed in CN201655855U, CN212585241U and CN118368963A.

[0041] The semiconductor refrigeration sheet 300 is located outside the culture chamber 200, which can be provided on the box 100 or other structures. The refrigeration surface of the semiconductor refrigeration sheet 300 is provided with the first cold head 410, and the inside of the first cold head 410 is provided with a first flow channel for accommodating a heat exchange medium. It is not difficult to understand that the first cold head 410 is used to exchange heat between the heat exchange medium in the first flow channel and the refrigeration surface of the semiconductor refrigeration sheet 300. Therefore, preferably, the first cold head 410 is made of a material with good thermal conductivity, such as a metal material; of course, the first cold head 410 can also include other materials in addition to metal materials.

[0042] The culture chamber 200 is provided with a heat dissipation device 510, which includes a heat dissipation pipe 511, a heat dissipation fin 512 in contact with the heat dissipation pipe 511, and a cold end fan 513. The heat dissipation pipe 511 is provided with a second flow channel. The second flow channel is in communication with the first flow channel through the first hose 610. That is, the heat exchange medium carrying cold energy after heat exchange with the semiconductor refrigeration fin 300 in the first cold head 410 can flow into the heat dissipation pipe 511, and then the cold energy is transmitted to the heat dissipation fin 512 through the heat dissipation pipe 511. The cold end fan 513 makes air pass through the heat dissipation fin 512 to form a low-temperature air flow, and then the cold energy is circulated in the culture chamber 200, thereby adjusting the temperature in the culture chamber 200. The heat exchange medium can be water or other commonly used heat exchange medium types. The heat exchange medium has a large specific heat capacity, so it can carry more cold energy from the refrigeration surface of the semiconductor refrigeration fin 300 to the heat dissipation device 510. Using the heat exchange medium to carry cold energy and then dissipating the cold energy to the culture chamber 200 through the heat dissipation fin 512 and the cold end fan 513 can have a higher refrigeration efficiency. In addition, the first hose 610 is flexible, and the heat dissipation device 510 is detachably installed in the culture chamber 200, so it is convenient to adjust the installation position of the heat dissipation device 510 in the culture chamber 200, and has higher flexibility in space configuration and higher space utilization. The specific way of detachable installation of the heat dissipation device 510 can be through threaded fasteners or other ways.

[0043] Further, the heat dissipation device 510 in the culture chamber 200 can be vertically arranged as shown in Figure 1 , or horizontally arranged as shown in Figure 2 , wherein the horizontal arrangement means that the heat dissipation pipe 511 extends in the horizontal direction, and the vertical arrangement means that the heat dissipation pipe 511 extends in the vertical direction. As shown in Figure 2 , the heat dissipation device 510 can be arranged near the top of the culture chamber 200; or as shown in Figure 1 , arranged near the bottom of the side of the culture chamber 200.

[0044] Further, a water pump 700 can also be provided in the first hose 610 to drive the heat exchange medium in the first hose 610 to move, so that the heat exchange medium in the first cold head 410 can enter the heat dissipation device 510.

[0045] Further, as shown in Figure 3As shown, the cooling device 510 includes multiple heat dissipation pipes 511 arranged side by side. Each heat dissipation pipe 511 has a second flow channel, meaning that each heat dissipation pipe 511 is interconnected, and the heat exchange medium can flow through each heat dissipation pipe 511 along the second flow channel. The heat dissipation pipes 511 and heat sinks 512 are alternately arranged, and each side of the heat sink 512 contacts one heat dissipation pipe 511. In the embodiment where each side of the heat sink 512 contacts one heat dissipation pipe 511, either both sides of the heat sink 512 or both sides of the heat sink 512 can contact the heat dissipation pipe 511. It will be readily understood by those skilled in the art that in the embodiment where both sides of the heat sink 512 contact the heat dissipation pipe 511, through holes or notches can be provided in the heat sink 512 to create a channel for airflow from one side of the heat sink 512 to the other after the two sides of the heat sink 512 contact the heat dissipation pipe 511.

[0046] Furthermore, the heat pipe 511 is a flat structure, and the heat sink 512 has a large surface area in contact with the heat pipe 511, which increases the heat exchange efficiency between the heat sink 512 and the heat exchange medium, allowing the heat sink 512 to obtain more cooling capacity. As a result, more cooling capacity is dissipated into the culture chamber 200 under the action of the cold end fan 513, thus achieving a better cooling effect.

[0047] Furthermore, the heat sink 512 has a wavy structure, with the crest side of the heat sink 512 contacting the heat pipe 511 and the trough side contacting the heat pipe 511. For example... Figure 3 In some of the embodiments shown, the surface of the heat sink 512 is curved into a wavy shape. One side of the heat sink 512 contacts a heat dissipation pipe 511 and forms a channel for airflow through the heat dissipation pipe 511; the other side of the heat sink 512 contacts another heat dissipation pipe 511 and forms a channel for airflow through the heat dissipation pipe 511. In this embodiment, because the heat sink 512 is wavy, its actual length is relatively long and its surface area is relatively large, resulting in a larger contact area with the airflow generated by the cold-end fan 513, which can better dissipate cold energy into the incubation chamber 200.

[0048] In some other embodiments, the heat sink 512 may also be zigzag-shaped, that is, the heat sink 512 in this embodiment may be formed by bending a planar sheet structure along a fold line in the plane.

[0049] Further, at least one cold end fan 513 is arranged along the extending direction of the heat dissipation pipe 511. The number of the cold end fan 513 can be one, two or more, and the number of the cold end fan 513 can be reasonably selected according to the actual size of the heat dissipation pipe 511 and the actual size of the cold end fan 513.

[0050] In some embodiments, the heating surface of the semiconductor refrigeration sheet 300 is provided with a second cold head 420, and the second cold head 420 is connected with a heat dissipation device 520 through a second hose 620. The second device can be used to take away the heat generated by the semiconductor refrigeration sheet 300 to reduce the influence on the temperature in the culture chamber 200. It is not difficult to understand that the second cold head 420 can also be provided with a heat exchange medium to exchange heat with the heating surface of the semiconductor refrigeration sheet 300. The structure of the second cold head 420 can be consistent with or inconsistent with the structure of the first cold head 410, and the structure of the heat dissipation device 520 can be consistent with or inconsistent with the structure of the heat dissipation device 510. It is not difficult to understand that the second hose 620 is flexible, and the route of the second hose 620 can be arranged. In other embodiments, a rigid pipe can be used to connect the second cold head 420 and the heat dissipation device 520.

[0051] In some embodiments, the number of the culture chamber 200 in the box 100 is at least one, and the number of the culture chamber 200 can be one, two or more. Correspondingly, the number of the semiconductor refrigeration sheet 300 is consistent with the number of the culture chamber 200, and the first cold head 410 arranged on the refrigeration surface of each semiconductor refrigeration sheet 300 is connected with a heat dissipation device 510 through a first hose 610 independent of each other. Further, each first hose 610 is provided with a water pump 700. That is, each culture chamber 200 is provided with a semiconductor refrigeration sheet 300 and a heat dissipation device 510 to independently adjust the temperature.

[0052] In some embodiments, the second cold head 420 arranged on the heating surface of the plurality of semiconductor refrigeration sheets 300 is connected in series through a pipe, and the second cold head 420 is connected with the same heat dissipation device 520. The plurality of second cold heads 420 connected to the same heat dissipation device 520 can reduce the cost. Further, only one water pump 700 can be arranged on the circulation pipeline of the heat exchange medium in the second cold head 420.

[0053] In some embodiments, a water receiving device 800 is further arranged in the culture chamber 200, and the water receiving device 800 is arranged below the heat dissipation device 510. It is understood that the temperature of the heat dissipation pipe 511 and the heat dissipation fins 512 can be low during the operation of the heat dissipation device 510, and thus the water vapor in the culture chamber 200 can condense on the heat dissipation pipe 511 and the heat dissipation fins 512, and then form liquid water. The liquid water can gather and then drip downward, and thus the electronic components can be damaged. Since the water receiving device 800 is arranged below the heat dissipation device 510, the dripping liquid water can be collected, and thus the problem of damage to the electronic components can be improved.

[0054] Further, a flow guide groove can be arranged in the water receiving device 800, or a flow guide pipe can be connected to the water receiving device 800, so that the water in the water receiving device 800 can be discharged from the culture chamber 200.

[0055] In some embodiments, the water receiving device 800 can also be detachable, so that the position of the water receiving device 800 can be changed correspondingly after the installation position of the heat dissipation device 510 is adjusted.

[0056] The above only describes the preferred embodiments of the present application and is not intended to limit the present application. Various modifications and changes can be made by those skilled in the art based on the spirit and principles of the present application. Any modification, equivalent replacement, improvement, etc. made within the spirit and principles of the present application shall be included in the protection scope of the present application.

Claims

1. A refrigeration apparatus, characterized by comprising: The semiconductor refrigerating sheet and the heat dissipating device are included. The refrigerating surface of the semiconductor refrigerating sheet is provided with a first cold head, and the first cold head is internally provided with a first flow channel for containing heat exchange medium, and the first cold head is used for heat exchange between the heat exchange medium in the first flow channel and the refrigerating surface of the semiconductor refrigerating sheet. The heat dissipating device includes a heat dissipation pipe, a heat dissipation fin in contact with the heat dissipation pipe, and a cold end fan, and the heat dissipation pipe is internally provided with a second flow channel; the first flow channel and the second flow channel are communicated through a first hose, and the first hose is provided with a water pump; the heat dissipation fin is used for heat exchange with the heat exchange medium in the second flow channel; and the cold end fan is used for making air pass through the heat dissipation fin for heat exchange.

2. The refrigeration appliance of claim 1, wherein, The heat dissipating device includes a plurality of parallel heat dissipation pipes, each of which has the second flow channel, and the heat dissipation fins are alternately arranged with the heat dissipation pipes; and each of the two sides of the heat dissipation fin is in contact with one of the heat dissipation pipes.

3. The refrigeration appliance of claim 2, wherein, The heat dissipation pipe is a flat structure, and the heat dissipation fin is in contact with a larger surface of the heat dissipation pipe.

4. The refrigeration appliance of claim 3, wherein, The heat dissipation fin is a wave-shaped structure, and the wave crest of the heat dissipation fin is in contact with one side of the heat dissipation pipe, and the wave trough is in contact with the other side of the heat dissipation pipe.

5. The refrigeration appliance of claim 2, wherein, At least one cold end fan is arranged along the extension direction of the heat dissipation pipe.

6. The refrigeration appliance of any of claims 1-5, wherein, The heating surface of the semiconductor refrigerating sheet is provided with a second cold head, and the second cold head is connected with a heat dissipation device through a second hose.

7. The refrigeration appliance of claim 6, wherein, The heat dissipating device and the heat dissipation device have the same structure.

8. A microbiological incubator, characterized in that The box is internally provided with a culture chamber, and the semiconductor refrigerating sheet is located outside the culture chamber; and the heat dissipating device is detachably arranged in the culture chamber. The culture chamber is further provided with a water receiving device, and the water receiving device is arranged below the heat dissipating device.

9. A microbiological incubator according to claim 8, characterised in that The culture chamber is at least one, and the number of semiconductor refrigerating sheets is consistent with the number of culture chambers; each first cold head is connected with one heat dissipating device through mutually independent first hoses.

10. The microbiological incubator according to claim 9, characterized in that The second cold head is connected with the same heat dissipation device through a pipeline.

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