Cascade sheet of annular pseudo three-dimensional topological optimization micro-channel

Abstract

The invention discloses a cascade sheet of an annular pseudo three-dimensional topological optimization micro-channel, which relates to the technical field of fusion reactors and comprises a cover plate, a heat-resistant ring, a heat sink assembly and a water inlet and outlet assembly. When the cascade piece works, a high-density plasma beam passes through a plasma discharge channel in the middle of the heat-resistant ring, and the heat-resistant ring can restrain the plasma beam and maintain the stability of an electric arc; meanwhile, after entering the heat sink assembly through the water inlet pipe, a cooling medium is shunted to the manifold shunting ring through the water isolation ring, then enters the water inlet area and a water inlet channel in the water inlet area, then enters the topological optimization micro-channel through the micro-channel water inlet flow channel for enhanced heat exchange, then is converged into the water outlet channel through the micro-channel water outlet flow channel, and flows out of the water outlet pipe; a large amount of thermal load deposited on the inner wall of the plasma discharge channel is taken away. The heat dissipation effect of the cascading sheet is remarkably improved, and the rapid and efficient cooling requirement of the cascading sheet in a high heat load scene can be met.

Description

Technical Field

[0001] This invention relates to the field of fusion reactor technology, specifically to a cascaded sheet of a toroidal pseudo-three-dimensional topology-optimized microchannel. Background Technology

[0002] Magnetic confinement fusion is considered one of the important ways to solve energy problems in the future. When a magnetic confinement fusion device is running, the boundary plasma of the fusion reactor interacts with the first wall material. The impact point of the divertor target plate will face extremely high particle flux and steady-state heat load, which will cause complex physical and chemical reactions in the first wall material, typically including erosion, sputtering, changes in surface morphology, and vacancy defects. These physicochemical reactions will seriously affect the service life of the fusion reactor material and become a key bottleneck restricting the long-term stable operation of the fusion device.

[0003] Because fusion device experiments are expensive and discharge conditions are stringent, a cascaded arc plasma source linear plasma device capable of generating high-density plasma beams is typically used as an experimental platform for plasma-material interactions in order to facilitate and quickly study the interaction between fusion reactor boundary plasma and materials.

[0004] The cascade plate is the core component of a cascaded arc plasma source linear plasma device, primarily responsible for confining the plasma beam, stabilizing the arc, and removing the deposited heat load within the plasma discharge channel. When the cascaded arc source operates at high power, the deposited heat load inside the cascaded plate's discharge channel can reach 10 MW / m². 2 However, in the existing cascade design, only a simple flow channel is used for cooling, which has low cooling efficiency and cannot effectively remove the high heat load. This not only affects the service life of the cascade itself, but also limits the operating power and experimental reliability of the cascaded arc plasma source. It is urgent to optimize the cooling structure inside the cascade to meet the high-efficiency cooling requirements under high heat load.

[0005] Therefore, existing technologies for cascaded plates and related topological cooling structures have the following main shortcomings. Chinese patent application CN113727507A discloses a multi-channel arc plasma source cascaded copper plate water-cooling device, which forms intersecting water-cooling channels by drilling holes in the sidewalls of the copper plates or uses diffusion welding to weld grooved copper plates. However, this method is only designed for low-temperature plasma sources, has a low heat load, and mainly focuses on the temperature control of the sealing ring. It does not employ topology optimization methods, and its cooling efficiency is insufficient to meet the 10MW / m² cooling requirements of fusion reactors. 2Ultra-high heat load requirements. Chinese patent application CN118198836A discloses a jet cooling heat sink with topology-optimized vein-inspired flow channels for thin-film lasers. Cooling is achieved through a circular jet region and radial topological flow channels. However, this structure is designed for the heat load of the outer surface of a rectangular plane, and the flow channels are planar rather than three-dimensional ring-shaped, making it unsuitable for the heat load scenarios of the cylindrical inner surface inside cascaded wafers. Chinese patent application CN120432203A discloses a high heat load testing target plate device based on pseudo-three-dimensional topology optimization, employing a three-layer structure of a microchannel heat sink plate, a manifold plate, and inlet / outlet water plates. However, its microchannels are planar and lack annular hierarchical structures such as water-blocking rings and manifold distribution rings, failing to solve the problem of uniform distribution of cooling medium on the cylindrical inner surface. Chinese patent application CN117612749A discloses a fusion reactor divertor cooling device based on topology optimization. Its technical solution addresses the heat load problem of the outer surface region of the rectangular plane of the divertor target plate by enhancing heat exchange through micro-rib array channels in the same plane. However, this device is only suitable for the rectangular outer surface to bear high heat load, and cannot cope with the scenario of the inner surface of the component being subjected to high heat load. It cannot solve the heat load problem of the cylindrical inner surface inside the cascaded discharge channel.

[0006] Therefore, none of the above technical solutions can achieve efficient cooling of the high heat load of the cylindrical discharge channel inside the fusion reactor cascade, and there are problems such as low cooling efficiency, mismatch of flow channel structure, and poor flow uniformity. Summary of the Invention

[0007] To address the technical problems of low cooling efficiency and poor cooling effect caused by the simple cooling channel design of existing cascaded wafers, this invention provides a cascaded wafer with an annular pseudo-three-dimensional topology-optimized microchannel, which significantly improves the heat dissipation effect of the cascaded wafer and can meet the rapid and efficient cooling requirements of cascaded wafers under high heat load scenarios. Simultaneously, this invention adopts an outside-to-inside structural design, using an internal annular topology-optimized microchannel to enhance heat transfer, effectively solving the heat load problem inside the cascaded wafer.

[0008] To achieve the above objectives, the present invention adopts the following technical solution:

[0009] A cascaded sheet of annular pseudo-three-dimensional topology-optimized microchannels, characterized in that it comprises a cover plate constituting an integral sheet structure, a heat-resistant ring, a heat sink assembly, and an inlet / outlet water assembly; a plasma discharge channel is formed in the middle of the heat-resistant ring; the heat sink assembly includes a water-proof ring, a manifold distribution ring, and a microchannel ring arranged sequentially from the outside to the inside; the heat-resistant ring is fitted inside the microchannel ring of the heat sink assembly, the heat sink assembly is fitted inside the inlet / outlet water assembly, and the cover plate covers the top of the inlet / outlet water assembly; the annular outer surface of the microchannel ring is provided with a topology-optimized microchannel having a pseudo-three-dimensional topology structure; the inlet / outlet water assembly... The water outlet assembly includes a base plate and an inlet pipe and an outlet pipe mounted on the base plate; a heat sink assembly is mounted above the base plate; a through hole is provided in the center of the cover plate, through which a heat-resistant ring and a microchannel ring pass, and their upper surfaces are flush with the cover plate; a square wave-shaped manifold distribution plate is arranged around the outside of the manifold distribution ring, thereby dividing it into multiple inlet and outlet areas, each with an inlet channel and an outlet channel respectively; the cooling medium enters through the inlet pipe, is diverted to the inlet area of ​​the manifold distribution ring by the water-blocking ring, enters the inlet channel, flows through the topology-optimized microchannel, and then flows into the outlet channel through the microchannel ring, and flows out from the outlet pipe, thereby achieving three-dimensional staggered movement in the cascaded plate.

[0010] Furthermore, the heat-resistant ring is provided with an outwardly protruding heat-resistant ring welding boss, the plasma discharge channel is a circular through hole, the diameter of the plasma discharge channel is 5~10mm, and the height of the heat-resistant ring welding boss is 2~5mm.

[0011] Furthermore, the annular outer surface of the microchannel ring is provided with multiple microchannel inlet channels, microchannel outlet channels, and topology-optimized microchannels. The microchannel inlet channels, microchannel outlet channels, and topology-optimized microchannels are arranged in a circular array on the outer circumferential surface of the microchannel ring relative to the central axis of the microchannel ring. The width of the topology-optimized microchannel is 0.2~0.5mm, and the depth is 0.2~1mm.

[0012] Furthermore, multiple microchannel inlet baffles are provided on both sides of the microchannel inlet channel, and multiple microchannel outlet baffles are provided on both sides of the microchannel outlet channel. The sides of the microchannel inlet baffles and the microchannel outlet baffles are convex outwards in a trapezoidal shape.

[0013] Furthermore, a square toothed manifold diverter plate is provided around the outer side of the manifold diverter ring. The manifold diverter plate divides the manifold diverter ring into multiple water inlet zones and water outlet zones. Water inlet channels and water outlet channels are respectively provided in the water inlet zones and water outlet zones.

[0014] Furthermore, the water-proof ring is provided with arc-shaped flow channels on both the inlet and outlet sides. The surface of the arc-shaped flow channel is a smoothly transitioning arc shape, which is thin in the middle and gradually thickens towards both sides.

[0015] Furthermore, the inner surface of the microchannel ring is provided with an inner microchannel ring, and the upper and lower ends are provided with outwardly protruding microchannel ring welding bosses.

[0016] Furthermore, the lower surface of the cover plate is welded to the upper surface of the manifold diversion ring and the upper surface of the microchannel ring, and the side surface of the cover plate is welded to the inner surface of the base plate.

[0017] Furthermore, both the inlet pipe and the outlet pipe are welded to the base plate. The inlet pipe is aligned with the thinnest position of the arc flow channel on the inlet side of the water-proof ring, and the outlet pipe is aligned with the thinnest position of the arc flow channel on the outlet side of the water-proof ring.

[0018] Furthermore, the number of water inlet zones is the same as the number of water outlet zones, the water inlet channel is located at the center of the corresponding water inlet zone, and the water outlet channel is located at the center of the corresponding water outlet zone.

[0019] Beneficial effects:

[0020] 1. Addressing the challenge that existing technologies struggle to handle 10MW / m². 2 To address the drawbacks of ultra-high heat loads, this invention employs a pseudo-three-dimensional topology-optimized microchannel, significantly increasing the heat transfer area compared to traditional fixed-section channels, thereby enhancing heat transfer. Simulation verification shows that at 10MW / m²... 2 Under heat load, the highest temperature of the inner wall of the heat-resistant ring is only 594.9℃, which is far lower than the recrystallization temperature of tungsten materials (1200℃), fundamentally meeting the rapid and efficient cooling requirements under high heat load scenarios of cascaded plates.

[0021] 2. To address the problem that existing planar flow channels cannot match the heat load scenarios of cascaded cylindrical inner surfaces, this invention innovatively adopts an annular hierarchical structure (water-proof ring, manifold distribution ring, and microchannel ring) from the outside to the inside. The water-proof ring's arc flow channel achieves initial flow diversion, and the square toothed distribution plate of the manifold distribution ring divides multiple circumferential array inlet and outlet water zones, ensuring that the cooling medium is evenly distributed to each topology-optimized microchannel in the circumferential and radial directions, thus completely solving the problem of uniform cooling of the heat load on the cylindrical inner surface.

[0022] 3. Existing technologies suffer from poor flow uniformity and large pressure drop losses. The topology-optimized microchannel of this invention employs a circumferential array layout of microchannel rings and a trapezoidal baffle structure, achieving a maximum flow velocity of 3.2 m / s within the microchannel with uniform velocity distribution, while simultaneously controlling the inlet and outlet pressure drop below 16880 Pa. This flow optimization improves heat exchange efficiency and reduces pump power consumption, achieving a balance between high efficiency and energy saving.

[0023] 4. To address the issues of low cooling efficiency in traditional designs leading to limited lifespan and insufficient operating power of cascaded components, this invention integrates the cover plate, heat-resistant ring, heat sink assembly, and water inlet / outlet assemblies into a single sheet structure using vacuum brazing technology. This results in a highly sealed and compact structure. Efficient cooling reduces thermal stress, directly extending the service life of the cascaded components. Simultaneously, the improved heat dissipation capacity removes the limitation imposed by heat load on the operating power of the cascaded arc plasma source, enhancing the reliability and scalability of the experimental platform.

[0024] 5. Unlike existing rectangular planar surface heat load solutions, this invention is specifically designed for heat load scenarios in cylindrical discharge channels within cascaded wafers. Through precise matching between the inner ring of the microchannel ring and the outer surface of the heat-resistant ring, efficient heat transfer from the plasma confinement region to the topology-optimized microchannel is achieved, filling a technological gap in this niche field and providing a customized high-performance cooling solution for the cascaded arc plasma source of magnetic confinement fusion devices.

[0025] 6. This invention forms a nested annular structure by layering the water-proof ring, dividing the manifold distribution ring circumferentially, and allowing the microchannel ring to enter and exit axially. This allows the cooling medium to pass through each layer of components radially from the outside to the inside. While being distributed to the flow channel in a circumferential rotation, it enters from the top side (inlet area) and exits from the bottom side (outlet area) axially. Combined with the three-dimensional undulating layout of the topology-optimized microchannel, a three-dimensional staggered motion of upper layer inlet and lower layer outlet, radial cross-layer, and circumferential rotation is formed, which avoids short-circuit mixing of inlet and outlet water and achieves efficient and uniform cooling in high heat load areas.

[0026] In summary, the circular plasma discharge channel of the heat-resistant ring of this invention is used to confine the plasma beam and maintain arc stability. After the cooling medium enters the heat sink assembly through the inlet pipe, it is diverted to the manifold distribution ring via the water-blocking ring, then enters the inlet area and its inlet channel. Subsequently, it passes through the microchannel inlet channel of the microchannel ring and enters the topology-optimized microchannel for enhanced heat transfer. Then, it flows through the microchannel outlet channel of the microchannel ring and merges into the outlet channel, finally flowing out from the outlet pipe to remove the large amount of heat load deposited on the inner wall of the plasma discharge channel. Compared with traditional fixed-section channels, the topology-optimized microchannel of this invention has a larger specific surface area, which can effectively increase the heat transfer area, enhance heat dissipation efficiency, improve the uniformity of cooling medium flow, and reduce pressure drop loss. The synergistic effect of these advantages significantly improves the heat dissipation effect of the cascaded plate, meeting the rapid and efficient cooling requirements of the cascaded plate under high heat load scenarios. Attached Figure Description

[0027] Figure 1 This is an exploded view of a cascaded sheet of a ring-shaped pseudo-three-dimensional topology-optimized microchannel according to an embodiment of the present invention;

[0028] Figure 2 This is an isometric side view of a cascaded sheet of a ring-shaped pseudo-three-dimensional topology-optimized microchannel according to an embodiment of the present invention;

[0029] Figure 3 This is a partial oblique top-view sectional view of a cascaded sheet of a ring-shaped pseudo-three-dimensional topology-optimized microchannel according to an embodiment of the present invention.

[0030] Figure 4 yes Figure 3 A magnified view of the area circled in the middle;

[0031] Figure 5 This is a partial oblique top-view cross-sectional view of a cascaded sheet of a ring-shaped pseudo-three-dimensional topology-optimized microchannel according to an embodiment of the present invention.

[0032] Figure 6 yes Figure 5 A magnified view of the area circled in the middle;

[0033] Figure 7a This is a front view of the water-proof ring in a cascaded sheet of a ring-shaped pseudo-three-dimensional topology-optimized microchannel according to an embodiment of the present invention;

[0034] Figure 7b This is a left view of the water-proof ring in a cascaded sheet of a ring-shaped pseudo-three-dimensional topology-optimized microchannel according to an embodiment of the present invention.

[0035] Figure 7c This is an isometric side view of the water-proof ring in a cascaded sheet of a ring-shaped pseudo-three-dimensional topology-optimized microchannel according to an embodiment of the present invention;

[0036] Figure 8a This is a front view of the manifold splitting ring in a cascaded sheet of a ring-shaped pseudo-three-dimensional topology-optimized microchannel according to an embodiment of the present invention;

[0037] Figure 8b This is a left view of the manifold splitting ring in a cascaded sheet of a ring-shaped pseudo-three-dimensional topology-optimized microchannel according to an embodiment of the present invention.

[0038] Figure 8c This is an isometric side view of a manifold splitting ring in a cascaded sheet of a ring-shaped pseudo-three-dimensional topology-optimized microchannel according to an embodiment of the present invention;

[0039] Figure 9a This is a front view of the microchannel ring in a cascaded sheet of a ring-shaped pseudo-three-dimensional topology-optimized microchannel according to an embodiment of the present invention;

[0040] Figure 9b This is a left view of the microchannel ring in a cascaded sheet of a ring-shaped pseudo-three-dimensional topology-optimized microchannel according to an embodiment of the present invention;

[0041] Figure 9c This is an isometric side view of a microchannel ring in a cascaded sheet of a ring-shaped pseudo-three-dimensional topology-optimized microchannel according to an embodiment of the present invention;

[0042] Figure 10a This is a front view of a heat-resistant ring in a cascaded sheet of a ring-shaped pseudo-three-dimensional topology-optimized microchannel according to an embodiment of the present invention;

[0043] Figure 10b This is a left view of a heat-resistant ring in a cascaded sheet of a ring-shaped pseudo-three-dimensional topology-optimized microchannel according to an embodiment of the present invention.

[0044] Figure 10c This is an isometric side view of a heat-resistant ring in a cascaded sheet of a ring-shaped pseudo-three-dimensional topology-optimized microchannel according to an embodiment of the present invention;

[0045] Figure 11 This is a temperature distribution diagram simulated from a cascaded sheet of a ring-shaped pseudo-three-dimensional topology-optimized microchannel according to an embodiment of the present invention.

[0046] Figure 12 This is a pressure distribution diagram simulated from a cascaded sheet of a ring-shaped pseudo-three-dimensional topology-optimized microchannel according to an embodiment of the present invention.

[0047] Figure 13 This is a velocity distribution diagram simulated from a cascaded sheet of a ring-shaped pseudo-three-dimensional topology-optimized microchannel according to an embodiment of the present invention.

[0048] In the figure, the reference numerals are as follows: 1. Cover plate; 2. Heat-resistant ring; 21. Welding boss of heat-resistant ring; 22. Plasma discharge channel; 3. Heat sink assembly; 31. Microchannel ring; 311. Inner ring of microchannel ring; 312. Welding boss of microchannel ring; 313. Topology-optimized microchannel; 314. Microchannel inlet channel; 315. Microchannel inlet baffle; 316. Microchannel outlet channel; 317. Microchannel outlet baffle; 32. Manifold diversion ring; 321. Manifold diversion plate; 322. Inlet area; 323. Outlet area; 324. Inlet channel; 325. Outlet channel; 33. Water-proof ring; 331. Arc channel; 4. Inlet and outlet assembly; 41. Inlet pipe; 42. Base plate; 43. Outlet pipe. Detailed Implementation

[0049] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the invention. Furthermore, the technical features involved in the various embodiments of this invention described below can be combined with each other as long as they do not conflict with each other.

[0050] In the description of this invention, it should be understood that the term "topology-optimized microchannel" used in this invention refers to a flow channel designed using a pseudo-3D (P3D) topology optimization method. The pseudo-3D topology optimization method is a type of topology optimization method. Topology optimization is an optimization design method that automatically allocates fluid-solid materials within the design domain under the drive of objective functions and constraints to produce an optimal flow channel distribution. When performing topology optimization design, the pseudo-3D topology optimization method further considers the heat exchange between the thermal fluid layer and the solid layer, as well as the influence of interlayer thermoviscous dissipation, and has the advantages of smaller calculation errors and higher accuracy. A pseudo-3D microchannel (such as the topology-optimized microchannel 313 of this invention) is strictly defined topologically as follows: although it presents a multi-layered three-dimensional layout, all channels can still be arranged in a two-dimensional plane in terms of topological structure, that is, there is no true spatial intersection between channels. The specific process of designing the flow channel distribution using the pseudo-3D topology optimization method and the basic concepts of pseudo-3D microchannels are existing technologies and will not be elaborated here.

[0051] like Figures 1-2 As shown, a cascaded sheet of a ring-shaped pseudo-three-dimensional topology-optimized microchannel according to an embodiment of the present invention includes a cover plate 1, a heat-resistant ring 2, a heat sink assembly 3, and an inlet / outlet water assembly 4 arranged sequentially. The heat-resistant ring 2 is fitted inside the heat sink assembly 3, and the heat sink assembly 3 is fitted inside the inlet / outlet water assembly 4. The opening size of the cover plate 1 and the inlet / outlet water assembly 4 are the same. A through hole is provided in the center of the cover plate 1. After the heat-resistant ring 2 and the heat sink assembly 3 are fitted, they are inserted into the through hole and are flush with the surface of the through hole, so that the cover plate 1, the heat-resistant ring 2, the heat sink assembly 3, and the inlet / outlet water assembly 4 form an integral sheet structure. The heat sink assembly 3 includes a water-proof ring 33, a manifold distribution ring 32, and a microchannel ring 31 from the outside to the inside. The microchannel ring 31 is provided with a pseudo-three-dimensional microchannel (i.e., the topology-optimized microchannel 313 of the present invention). The water-proof ring 33 separates the cooling medium flowing into and out of the heat sink. The water-blocking ring 33 has an arc flow channel 331 on its inlet and outlet sides to distribute the cooling medium from the inlet pipe 41 to the manifold distribution ring 32 with less flow resistance. The inlet and outlet water assembly 4 includes a base plate 42 and an inlet pipe 41 and an outlet pipe 43 disposed thereon.

[0052] like Figures 3-6 , Figures 8a-8c , Figures 9a-9cAs shown, the outer surface of the microchannel ring 31 is designed with multiple microchannel inlet channels 314, microchannel outlet channels 316, and topology-optimized microchannels 313; the microchannel inlet channels 314, microchannel outlet channels 316, and topology-optimized microchannels 313 are arranged in a circular array relative to the central axis on the outer circumferential surface of the microchannel ring 31. Multiple microchannel inlet baffles 315 are provided on both sides of the microchannel inlet channels 314; multiple microchannel outlet baffles 317 are provided on both sides of the microchannel outlet channels 316. The inner surface of the microchannel ring 31 is provided with an inner microchannel ring 311, and microchannel ring welding bosses 312 are provided at both the upper and lower ends. The inner microchannel ring 311 is used to cooperate with the heat-resistant ring 2 to achieve sealing and heat transfer. The manifold distribution ring 32 is surrounded circumferentially by a manifold distribution plate 321, forming multiple inlet areas 322 and outlet areas 323 of the same size. The manifold diverter plate 321 has a square, wavy structure. The inlet area 322 and the outlet area 323 are arranged in a circular array around the central axis of the manifold diverter ring 32. The inlet area 322 and the outlet area 323 are respectively provided with an inlet channel 324 and an outlet channel 325. The inlet channel 324 and the outlet channel 325 are respectively located at the center of their respective inlet area 322 and outlet area 323, and are parallel to the height direction of the square teeth. The number of inlet areas 322, outlet areas 323, inlet channels 324 and outlet channels 325 are the same.

[0053] Preferably, the two sides of the microchannel inlet baffle 315 and the microchannel outlet baffle 317 are convex trapezoidal; the width of the topology-optimized microchannel 313 is 0.2~0.5mm and the depth is 0.2~1mm.

[0054] Figures 7a-7c As shown, the upper and lower surfaces of the water-proof ring 33 are provided with arc-shaped flow channels 331 on opposite sides, namely the inlet and outlet sides. The thinnest points of the two arc-shaped flow channels 331 are aligned with the inlet pipe 41 and the outlet pipe 43, respectively. The surface of the arc-shaped flow channel 331 is a smoothly transitioning arc shape, thin in the middle and gradually thickening towards both sides. The processing procedure for the arc-shaped flow channels 331 on the inlet and outlet sides is as follows: First, the upper and lower planes of the ring to be processed are processed. Then, using the lower plane of the ring as a positioning reference, the inlet side of the upper plane is processed first to form the arc-shaped flow channel 331 on the inlet and outlet sides. Figure 7c The upper left shows a smoothly transitioning arc-shaped flow channel 331 (occupying half of the upper plane), thinner in the middle and thicker at both ends. The workpiece is then reversed, using the upper plane as a positioning reference, and the outlet side of the lower plane is machined to form the same arc-shaped flow channel 331 (occupying half of the lower plane). Finally, the two ends of the arc-shaped flow channel 331 on the inlet side connect to half of the upper plane, and the two ends of the arc-shaped flow channel 331 on the outlet side connect to half of the lower plane, ultimately forming the following... Figure 7c The structure shown.

[0055] like Figures 10a-10c As shown, the heat-resistant ring 2 has a plasma discharge channel 22 machined in the middle to confine the plasma beam and maintain arc stability; the heat-resistant ring 2 is made of tungsten material with high melting point and low sputtering rate; the plasma discharge channel 22 of the heat-resistant ring 2 has a circular cross-section with a diameter of 5~10mm; the heat-resistant ring 2 has a heat-resistant ring welding boss 21 with a height of 2~5mm.

[0056] Therefore, in an embodiment of the present invention, a cascaded sheet of a ring-shaped pseudo-three-dimensional topology-optimized microchannel is provided from the outside to the inside as follows: a base plate 42, a water-proof ring 33, a manifold diversion ring 32, a microchannel ring 31, a heat-resistant ring 2, and a cover plate 1. The upper surface of the base plate 42 is welded to the lower surfaces of the manifold diversion ring 32 and the microchannel ring 31, and the inner surface of the base plate 42 is welded to the outer surface of the water-proof ring 33. The inner surface of the water-proof ring 33 is welded to the outer surface of the manifold diversion ring 32. The inner surface of the manifold diversion ring 32 is welded to the outer surface of the microchannel ring 31. The inner surface of the microchannel ring 31 is welded to the outer surface of the heat-resistant ring 2. The lower surface of the cover plate 1 is welded to the upper surface of the manifold diversion ring 32 and the upper surface of the microchannel ring 31, and the side surface of the cover plate 1 is welded to the inner surface of the base plate 42. The inlet pipe 41 and the outlet pipe 43 are connected to the base plate 42 by welding.

[0057] Preferably, the welding is vacuum brazing to ensure the sealing of the flow channel and the connection strength.

[0058] Preferably, the water-proof ring 33 is made of oxygen-free copper to have better thermal conductivity.

[0059] Preferably, the arc flow channel 331 is precision milled to ensure a smooth surface.

[0060] Preferably, the manifold shunt ring 32 is made of oxygen-free copper to provide better thermal conductivity.

[0061] Preferably, the length of the water inlet channel 324 and the water outlet channel 325 is 8mm~12mm and the width is 0.5~2mm.

[0062] Preferably, the water inlet channel 324 and the water outlet channel 325 are manufactured by wire cutting, precision carving, or plasma cutting.

[0063] Preferably, the microchannel ring 31 is made of oxygen-free copper to provide better thermal conductivity.

[0064] Preferably, the topology-optimized microchannel 313, microchannel inlet channel 314, microchannel inlet baffle 315, microchannel outlet channel 316, and microchannel outlet baffle 317 are manufactured by precision machining.

[0065] Preferably, the cover plate 1 and the bottom plate 42 are made of high-strength 316L material.

[0066] Preferably, the inlet pipe 41 and the outlet pipe 43 are made of high-strength 316L material.

[0067] The working process of this invention is as follows: the cooling medium enters the heat sink assembly 3 through the water inlet pipe 41, is diverted by the water-blocking ring 33 to each water inlet area 322 in the manifold diversion ring 32, and then enters the water inlet channel 324. Subsequently, it enters the topology-optimized microchannel 313 through the microchannel inlet channel 314 of the microchannel ring 31 for enhanced heat exchange, and then flows out through the microchannel outlet channel 316 of the microchannel ring 31, merges into the outlet channel 325, and finally flows out from the outlet pipe 43, thereby realizing three-dimensional staggered motion in the cascaded plate.

[0068] The cascaded annular pseudo-three-dimensional topology-optimized microchannel of the present invention was simulated using finite element method software, with the cooling water inlet flow rate set to 2 L / min and the inlet water temperature set to 25 °C. A plasma discharge channel 22 inside the heat-resistant ring 2 was subjected to a flow rate of 10 MW / m². 2 A uniformly distributed heat load was used to simulate the bombardment of a high-density plasma beam on the inner wall of the cascaded plates. The simulation results are as follows: Figures 11-13 As shown, the highest surface temperature of the inner wall of the heat-resistant ring 2 made of tungsten material is 594.9℃, which is lower than its recrystallization temperature of 1200℃. The maximum flow velocity in the microchannel reaches 3.2m / s, the flow velocity distribution is relatively uniform, and the pressure drop of the inlet and outlet water is kept below 16880Pa, which is relatively small.

[0069] When the cascaded plate is working, the high-density plasma beam passes through the plasma discharge channel 22 in the middle of the heat-resistant ring 2. The heat-resistant ring 2 can confine the plasma beam and maintain the stability of the electric arc. At the same time, the cooling medium enters the heat sink assembly 3 through the water inlet pipe 41, and is then diverted to the manifold diversion ring 32 by the water-proof ring 33. It then enters the water inlet area 322 and the water inlet channel 324 therein. Subsequently, it enters the topology-optimized microchannel 313 through the microchannel water inlet channel 314 of the microchannel ring 31 for enhanced heat exchange. Then, it flows into the water outlet channel 325 through the microchannel water outlet channel 316 of the microchannel ring 31 and flows out from the water outlet pipe 43 to remove the large amount of heat load deposited on the inner wall of the plasma discharge channel 22.

[0070] Those skilled in the art will readily understand that the above description is merely a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention should be included within the scope of protection of the present invention.

Claims

1. A cascaded sheet of annular pseudo-three-dimensional topology-optimized microchannels, characterized in that, The system comprises a cover plate forming an integral sheet structure, a heat-resistant ring, a heat sink assembly, and an inlet / outlet water assembly. A plasma discharge channel is located at the center of the heat-resistant ring. The heat sink assembly includes a water-proof ring, a manifold distribution ring, and a microchannel ring arranged sequentially from the outside to the inside. The heat-resistant ring is fitted inside the microchannel ring of the heat sink assembly, which is then fitted inside the inlet / outlet water assembly. The cover plate covers the top of the inlet / outlet water assembly. The annular outer surface of the microchannel ring has topology-optimized microchannels with a pseudo-three-dimensional topology structure. The inlet / outlet water assembly includes a base plate and an inlet pipe and an outlet pipe mounted on the base plate. The heat sink assembly is located above the base plate; the cover plate has a through hole in the middle, through which the heat-resistant ring and the microchannel ring pass, and their upper surfaces are flush with the cover plate; a square wave-shaped manifold distribution plate is arranged around the outside of the manifold distribution ring, thereby dividing it into multiple water inlet and water outlet areas with water inlet and water outlet channels respectively; the cooling medium enters through the water inlet pipe, is diverted to the water inlet area of ​​the manifold distribution ring through the water-blocking ring, enters the water inlet channel, flows through the topology-optimized microchannel, and then flows into the water outlet channel through the microchannel ring and out from the water outlet pipe, thereby realizing three-dimensional staggered movement in the cascaded plate.

2. The cascaded sheet of a ring-shaped pseudo-three-dimensional topology-optimized microchannel according to claim 1, characterized in that, The heat-resistant ring is provided with an outwardly protruding heat-resistant ring welding boss, the height of which is 2~5mm.

3. The cascaded sheet of a ring-shaped pseudo-three-dimensional topology-optimized microchannel according to claim 1, characterized in that, The annular outer surface of the microchannel ring is provided with multiple microchannel inlet channels, microchannel outlet channels, and topology-optimized microchannels. The microchannel inlet channels, microchannel outlet channels, and topology-optimized microchannels are arranged in a circular array on the outer circumferential surface of the microchannel ring relative to the central axis of the microchannel ring. The width of the topology-optimized microchannel is 0.2~0.5mm and the depth is 0.2~1mm.

4. The cascaded sheet of a ring-shaped pseudo-three-dimensional topology-optimized microchannel according to claim 3, characterized in that, The microchannel inlet channel has multiple microchannel inlet baffles on both sides, and the microchannel outlet channel has multiple microchannel outlet baffles on both sides. The sides of the microchannel inlet baffles and the microchannel outlet baffles are convex outwards in a trapezoidal shape.

5. The cascaded sheet of a ring-shaped pseudo-three-dimensional topology-optimized microchannel according to claim 1, characterized in that, The plasma discharge channel is a circular through hole with a diameter of 5-10 mm.

6. The cascaded sheet of a ring-shaped pseudo-three-dimensional topology-optimized microchannel according to claim 1, characterized in that, The water-proof ring has arc-shaped flow channels on both the inlet and outlet sides. The surface of the arc-shaped flow channel is a smoothly transitioning arc shape, which is thin in the middle and gradually thickens towards both sides.

7. The cascaded sheet of a ring-shaped pseudo-three-dimensional topology-optimized microchannel according to claim 1, characterized in that, The inner surface of the microchannel ring is provided with an inner microchannel ring, and the upper and lower ends are provided with outwardly protruding microchannel ring welding bosses.

8. The cascaded sheet of a ring-shaped pseudo-three-dimensional topology-optimized microchannel according to claim 1, characterized in that, The lower surface of the cover plate is welded to the upper surface of the manifold diversion ring and the upper surface of the microchannel ring, and the side surface of the cover plate is welded to the inner surface of the base plate.

9. The cascaded sheet of a ring-shaped pseudo-three-dimensional topology-optimized microchannel according to claim 6, characterized in that, Both the inlet pipe and the outlet pipe are welded to the base plate. The inlet pipe is aligned with the thinnest point of the arc flow channel on the inlet side of the water-proof ring, and the outlet pipe is aligned with the thinnest point of the arc flow channel on the outlet side of the water-proof ring.

10. A cascaded sheet of annular pseudo-three-dimensional topology-optimized microchannels according to claim 5, characterized in that, The number of water inlet zones is the same as the number of water outlet zones. The water inlet channel is located at the center of the corresponding water inlet zone, and the water outlet channel is located at the center of the corresponding water outlet zone.

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