Circulating air cooling box for semiconductor cooling

Abstract

The utility model discloses a circulating air cooling box for semiconductor cooling, and belongs to the technical field of semiconductor processing, the circulating air cooling box comprises a main body module and a rapid cooling module, the main body module comprises a cooling box, a storage plate is slidably connected between the two sides of the inner wall of the cooling box, and a sealing door is hinged to one side of the front end face of the cooling box; the rapid cooling module comprises a circular groove formed in the top of the cooling box, the top of the cooling box is fixedly connected with an air inlet barrel, the top of the air inlet barrel is fixedly connected with an air inlet filter screen, and a cooling assembly is arranged between the rear end face of the cooling box and the interior of the circular groove. Through the arrangement of the cooling assembly, the air inlet assembly, the air outlet assembly and the driving assembly, when the machine cools a semiconductor, entering air can be cooled, so that the cooling effect on the semiconductor is improved, a good heat dissipation effect can still be achieved when the environment temperature is high, and then the heat dissipation efficiency is improved.

Description

TECHNICAL FIELD

[0001] The application relates to the technical field of semiconductor processing, in particular to a circulating air cooling box for semiconductor cooling. BACKGROUND

[0002] Semiconductor parts are key components of various semiconductor devices and electronic products, are manufactured based on the unique electrical characteristics of semiconductor materials, and play an important role in the modern scientific and technological field. After existing semiconductor products are packaged and enter the baking process, the products need to be cooled, so a circulating air cooling box is usually used to cool the semiconductor in the cooling link.

[0003] According to the search, a semiconductor air cooling device is disclosed in patent No. CN219120828U, which comprises a cooling cabinet body, the inside of the cooling cabinet body is provided with a hollow structure, and the surface of one side of the cooling cabinet body is provided with an opening, the inner walls of the two sides of the cooling cabinet body are provided with air outlet fans, the air outlet fans are respectively located on the two sides of the opening, and an ion fan is installed at the top end of the inner wall of the cooling cabinet body, and an air outlet is further arranged at the top end of the cooling cabinet body, the air outlet is in communication with the inner wall of the cooling cabinet body, the inner walls of the cooling cabinet body on the two sides of the opening are provided with at least two mounting grooves, the mounting grooves penetrate the outer wall of the cooling cabinet body, and a support frame is arranged outside the mounting grooves on the outer wall of the cooling cabinet body, the air outlet fan is fixedly installed on the support frame, and the air outlet end of the air outlet fan is inserted into the mounting groove.

[0004] For the related technology in the above, the air cooling device can realize air cooling and heat dissipation of the semiconductor parts, but has certain limitations. In the case that the ambient temperature is high or the temperature is high in summer, although the air cooling and heat dissipation has certain cooling effect, the effect is extremely limited, and it is difficult to realize rapid heat dissipation only by the continuous blowing of the fan. In this case, the heat dissipation period of the semiconductor is long, thereby affecting the overall heat dissipation efficiency and prolonging the overall operation time. Therefore, a circulating air cooling box for semiconductor cooling is proposed. Content of the utility model

[0005] In order to solve the above problems, the application provides a circulating air cooling box for semiconductor cooling, which adopts the following technical scheme:

[0006] The utility model provides a kind of semiconductor cooling circulating air cooling box, including main module and rapid cooling module, the main module includes cooling box, slidingly connected with the article board between the inner wall of cooling box two sides, the front end surface of cooling box one side is hinged with sealing door, the rapid cooling module includes the round groove of opening in cooling box top, the top of cooling box is fixedly connected with air inlet tube, the top of air inlet tube is fixedly connected with air inlet filter screen, cooling box rear end surface and the inside of round groove between being provided with cooling assembly, cooling assembly and the inside of air inlet tube are provided with air inlet assembly, the both sides of cooling box are provided with air outlet groove, the inside of two air outlet grooves is provided with air outlet assembly, the both sides of cooling box are provided with dust screen, two dust screens are located the outside of two air outlet grooves respectively, the both sides of cooling box inner wall are provided with drive assembly, two air outlet assemblies are connected with drive assembly, drive assembly is connected with cooling assembly.

[0007] Further, the cooling assembly includes a cooling liquid tank fixedly connected to the rear end surface of the cooling box, the bottom of the cooling liquid tank is fixedly connected with a hollow tank, the cooling liquid tank is fixedly connected with a disc type heat pipe, both ends of the disc type heat pipe are connected with the cooling liquid tank, the outer surface of the disc type heat pipe extends into the inside of the round groove, the inside of the cooling liquid tank is installed with a delivery pump, the output end of the delivery pump is fixedly connected with one end of the disc type heat pipe, the outer surface of the disc type heat pipe is fixedly connected with a plurality of first heat conduction fins, and the plurality of first heat conduction fins are located in the inside of the round groove.

[0008] Further, the cooling assembly further includes a semiconductor refrigeration fin fixedly connected to the top of the inner wall of the hollow tank, the top of the semiconductor refrigeration fin is fixedly connected with a plurality of second heat conduction fins, the plurality of second heat conduction fins extend into the inside of the cooling liquid tank, one side of the hollow tank is fixedly connected with a first mounting plate, the inside of the first mounting plate is rotatably connected with a heat dissipation fan rod, one end of the heat dissipation fan rod is fixedly connected with a link rod, one end of the link rod is fixedly connected with a first linkage roller, and the outer surface of the first linkage roller is transmissionally connected with a first transmission belt.

[0009] Further, the air inlet assembly includes a first fixed plate fixedly connected to the inside of the air inlet tube, the inside of the first fixed plate is rotatably connected with an air inlet fan blade rod, the top end of the air inlet fan blade rod is fixedly connected with a small bevel gear, the inside of the air inlet tube is rotatably connected with a long rod, the outer surface of the long rod is fixedly connected with a large bevel gear, the outer surface of the large bevel gear is meshed with the outer surface of the small bevel gear, one end of the long rod extends to the outside of the air inlet tube, and one end of the long rod is fixedly connected with a small transmission roller.

[0010] Further, the air inlet assembly further comprises a first motor fixedly connected to the rear end surface of the cooling liquid tank, an output shaft of the first motor extends to the inside of the cooling liquid tank, a large transmission roller and a plurality of stirring pieces are fixedly connected to the outer surface of the output shaft of the first motor, the plurality of stirring pieces are located in the inside of the cooling liquid tank, and the second transmission belt is in transmission connection between the outer surface of the large transmission roller and the outer surface of the small transmission roller.

[0011] Further, the driving assembly comprises a transverse rod rotationally connected between the inner walls of the cooling tank, one side of the cooling tank is fixedly connected with a second motor, an output shaft of the second motor is fixedly connected with one end of the transverse rod, the other end of the transverse rod extends to the outside of the cooling tank and is fixedly connected with a third linkage roller, and the first transmission belt is in transmission connection between the outer surfaces of the third linkage roller and the first linkage roller.

[0012] Further, the air outlet assembly comprises a second mounting plate fixedly connected to the inside of one of the air outlet grooves, the second mounting plate is rotationally connected with an air outlet fan blade rod, the outer surfaces of the air outlet fan blade rod and the transverse rod are both fixedly connected with second linkage rollers, and the third transmission belt is in transmission connection between the outer surfaces of the two second linkage rollers.

[0013] To sum up, the present application has the following beneficial technical effects:

[0014] (1) The present application is provided with a cooling assembly, an air inlet assembly, an air outlet assembly and a driving assembly, so that when the machine cools the semiconductor, the entering air can be cooled, thereby improving the cooling effect of the semiconductor, so that better heat dissipation effect can still be achieved when the ambient temperature is high, thereby improving the heat dissipation efficiency;

[0015] (2) The present application is provided with a first motor and stirring pieces, so that the heating surface of the semiconductor refrigeration piece can be cooled, thereby improving the working effect of the refrigeration surface, and indirectly improving the cooling effect of the cooling liquid and the cooling effect of the semiconductor;

[0016] (3) The present application is provided with a first transmission belt, a heat dissipation fan rod and a semiconductor refrigeration piece, so that the cooling liquid in the cooling liquid tank can be stirred, thereby making the cooling liquid in the cooling liquid tank more uniform, and indirectly improving the working effect of the machine. BRIEF DESCRIPTION OF DRAWINGS

[0017] Fig. 1 It is a front end surface structure schematic view of the present application;

[0018] Fig. 2 It is a rear end surface structure schematic view of the present application;

[0019] Fig. 3Structure diagram of air outlet assembly of the present application;

[0020] Fig. 4 Structure diagram of air inlet assembly of the present application;

[0021] Fig. 5 Structure diagram of cooling liquid tank of the present application;

[0022] Fig. 6 Structure diagram of cooling assembly of the present application.

[0023] Explanation of figure numbers:

[0024] 100, main module; 110, cooling tank; 120, storage plate; 130, sealing door;

[0025] 200, rapid cooling module; 210, air inlet cylinder; 220, air inlet filter screen; 230, cooling assembly; 231, cooling liquid tank; 232, hollow tank; 233, delivery pump; 234, disc type heat conduction pipe; 235, first heat conduction sheet; 236, semiconductor refrigeration sheet; 237, second heat conduction sheet; 238, first mounting plate; 239, heat dissipation fan rod; 2310, connecting rod; 2311, first linkage roller; 2312, first transmission belt; 240, air inlet assembly; 241, first mounting plate; 242, air inlet fan blade rod; 243, small bevel gear; 244, long rod; 245, large bevel gear; 246, first motor; 247, large transmission roller; 248, small transmission roller; 249, second transmission belt; 2410, stirring sheet; 250, dustproof screen; 260, air outlet assembly; 261, first mounting plate; 262, air outlet fan blade rod; 263, second linkage roller; 264, third transmission belt; 270, driving assembly; 271, second motor; 272, transverse rod; 273, third linkage roller. DETAILED DESCRIPTION

[0026] The technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application; obviously, the described embodiments are only some of the embodiments of the present application, but not all the embodiments of the present application, and all other embodiments obtained by those of ordinary skill in the art based on the embodiments in the present application without creative labor fall within the scope of protection of the present application.

[0027] In the description of the present application, it should be noted that the terms "upper", "lower", "inner", "outer", "top / bottom end" and the like indicate the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application. In addition, the terms "first", "second" are only for the purpose of description, and cannot be understood as indicating or implying relative importance.

[0028] In the description of the present application, it should be noted that unless otherwise explicitly specified and limited, the terms "mounting", "provided with", "sleeved / connected", "connected" and the like should be broadly understood, for example, "connected" can be fixedly connected, or can be detachably connected, or integrally connected; can be mechanically connected, or can be electrically connected; can be directly connected, or can be indirectly connected through an intermediate medium, or can be internal communication of two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0029] The following will be described in detail in combination with the accompanying drawings Figs. 1-6 The present application will be further described in detail.

[0030] Please refer to Figs. 1-6 A semiconductor cooling circulating air cooling box, comprising a main body module 100 and a rapid cooling module 200, the main body module 100 comprising a cooling box 110, the two sides of the inner wall of the cooling box 110 are slidingly connected with a storage plate 120, one side of the front end face of the cooling box 110 is hingedly connected with a sealing door 130, the rapid cooling module 200 comprises a circular groove opened at the top of the cooling box 110, the top of the cooling box 110 is fixedly connected with an air inlet cylinder 210, the top of the air inlet cylinder 210 is fixedly connected with an air inlet filter screen 220, the rear end face of the cooling box 110 and the inside of the circular groove are provided with a cooling assembly 230, the cooling assembly 230 and the inside of the air inlet cylinder 210 are provided with an air inlet assembly 240, both sides of the cooling box 110 are provided with air outlet grooves, both inside of the two air outlet grooves are provided with air outlet assemblies 260, both sides of the cooling box 110 are provided with dustproof screens 250, both dustproof screens 250 are located outside of the two air outlet grooves, the two sides of the inner wall of the cooling box 110 are provided with a driving assembly 270, both air outlet assemblies 260 are connected with the driving assembly 270, the driving assembly 270 is connected with the cooling assembly 230.

[0031] In use, the worker opens the cooling assembly 230 and the air inlet assembly 240, the air inlet assembly 240 will achieve air supply to the inside of the air inlet barrel 210, the air will pass through the cooling assembly 230 before entering the cooling box 110, the cooling assembly 230 will cool the air, so that the air can be sent into the inside of the cooling box 110 after cooling, improve the cooling effect of the semiconductor, the driving assembly 270 simultaneously opens the driving assembly 270 which will simultaneously drive two air outlet assemblies 260, the two air outlet assemblies 260 will quickly exhaust the air, so as to accelerate the air flow, so as to further improve the heat dissipation effect.

[0032] The cooling assembly 230 comprises a cooling liquid tank 231 fixedly connected to the rear end surface of the cooling box 110, the bottom of the cooling liquid tank 231 is fixedly connected with a hollow tank 232, a disc type heat conducting pipe 234 is fixedly connected to the cooling liquid tank 231, both ends of the disc type heat conducting pipe 234 are connected with the cooling liquid tank 231, the outer surface of the disc type heat conducting pipe 234 extends to the inside of the circular groove, a conveying pump 233 is installed in the inside of the cooling liquid tank 231, the output end of the conveying pump 233 is fixedly connected with one end of the disc type heat conducting pipe 234, the outer surface of the disc type heat conducting pipe 234 is fixedly connected with a plurality of first heat conducting fins 235, the plurality of first heat conducting fins 235 are located in the inside of the circular groove, the cooling assembly 230 further comprises a semiconductor refrigeration fin 236 fixedly connected to the top of the inner wall of the hollow tank 232, the top of the semiconductor refrigeration fin 236 is fixedly connected with a plurality of second heat conducting fins 237, the plurality of second heat conducting fins 237 extend to the inside of the cooling liquid tank 231, one side of the hollow tank 232 is fixedly connected with a first mounting plate 238, a heat dissipation fan rod 239 is rotatably connected to the inside of the first mounting plate 238, one end of the heat dissipation fan rod 239 is fixedly connected with a connecting rod 2310, one end of the connecting rod 2310 is fixedly connected with a first linkage roller 2311, the outer surface of the first linkage roller 2311 is drivingly connected with a first transmission belt 2312, the air inlet assembly 240 comprises a first fixed plate 241 fixedly connected to the inside of the air inlet cylinder 210, a heat dissipation fan blade rod 242 is rotatably connected to the inside of the first fixed plate 241, the top end of the heat dissipation fan blade rod 242 is fixedly connected with a small bevel gear 243, a long rod 244 is rotatably connected to the inside of the air inlet cylinder 210, the outer surface of the long rod 244 is fixedly connected with a large bevel gear 245, the outer surface of the large bevel gear 245 is engaged with the outer surface of the small bevel gear 243, one end of the long rod 244 extends to the outside of the air inlet cylinder 210, one end of the long rod 244 is fixedly connected with a small transmission roller 248, the air inlet assembly 240 further comprises a first motor 246 fixedly connected to the rear end surface of the cooling liquid tank 231, the output shaft of the first motor 246 extends to the inside of the cooling liquid tank 231, the outer surface of the output shaft of the first motor 246 is fixedly connected with a large transmission roller 247 and a plurality of stirring fins 2410, the plurality of stirring fins 2410 are located in the inside of the cooling liquid tank 231, the outer surface of the large transmission roller 247 is drivingly connected with the outer surface of the small transmission roller 248 through a second transmission belt 249.

[0033] The semiconductor refrigerating sheet 236, the conveying pump 233 and the first motor 246 are turned on. The first motor 246 will accelerate the small transmission roller 248 through the large transmission roller 247 and the second transmission belt 249. The small transmission roller 248 will drive the long rod 244 and the large bevel gear 245 to rotate. When the large bevel gear 245 rotates, the small bevel gear 243 will rotate. The small bevel gear 243 will drive the air inlet fan blade rod 242 to rotate to achieve air supply to the inside of the air inlet cylinder 210. The semiconductor refrigerating sheet 236 cools the cooling liquid in the cooling liquid tank 231 through the plurality of second heat-conducting sheets 237. The low-temperature cooling liquid will be pumped into the disc heat-conducting pipe 234 by the conveying pump 233 to flow, and the cooling liquid returns to the cooling liquid tank 231 to be cooled again, thereby realizing circulation. The disc heat-conducting pipe 234 and the first heat-conducting sheet 235 conduct heat to the low-temperature cooling liquid. The air will pass through the first heat-conducting sheet 235 and the disc heat-conducting pipe 234 before entering the cooling box 110. The first heat-conducting sheet 235 and the disc heat-conducting pipe 234 will cool the air, so that the air can be sent into the cooling box 110 after being cooled, thereby improving the cooling effect of the semiconductor.

[0034] The driving assembly 270 includes a transverse rod 272 rotatably connected between the inner walls of the cooling box 110. One side of the cooling box 110 is fixedly connected with a second motor 271. The output shaft of the second motor 271 is fixedly connected with one end of the transverse rod 272. The other end of the transverse rod 272 extends to the outside of the cooling box 110 and is fixedly connected with a third linkage roller 273. The first transmission belt 2312 is transmissionally connected between the outer surfaces of the third linkage roller 273 and the first linkage roller 2311. The air outlet assembly 260 includes a second mounting plate 261 fixedly connected inside one of the air outlet grooves. The second mounting plate 261 is rotatably connected with an air outlet fan blade rod 262. The outer surfaces of the two second linkage rollers 263 are fixedly connected with the air outlet fan blade rod 262 and the outer surface of the transverse rod 272. The third transmission belt 264 is transmissionally connected between the outer surfaces of the two second linkage rollers 263.

[0035] The second motor 271 is opened at the same time, the second motor 271 will drive the horizontal rod 272 to rotate, the horizontal rod 272 will drive the two air outlet fan blades 262 through the two third transmission belts 264 when rotating, the two air outlet fan blades 262 will rotate, thereby discharging hot air from both sides, and further accelerating air flow, so as to further improve the heat dissipation effect, when the horizontal rod 272 rotates, the first transmission belt 2312 will drive the connecting rod 2310, the connecting rod 2310 drives the heat dissipation fan rod 239 to rotate, the heat dissipation fan rod 239 blows air to dissipate heat on the heating surface of the semiconductor refrigeration piece 236, thereby improving the refrigeration working effect of the semiconductor refrigeration piece 236, at the same time, when the output shaft of the small bevel gear 243 rotates, the cooling liquid in the cooling liquid tank 231 inside will be stirred by the stirring piece 2410, so that the cooling liquid in the cooling liquid tank 231 can be more uniform, thereby indirectly improving the machine working effect.

[0036] The implementation principle of the embodiment of the application is as follows: in use, the worker opens the semiconductor refrigerating sheet 236, the delivery pump 233 and the first motor 246, the first motor 246 will accelerate the small transmission roller 248 through the large transmission roller 247 and the second transmission belt 249, the small transmission roller 248 will drive the long rod 244 and the large bevel gear 245 to rotate, the large bevel gear 245 will drive the small bevel gear 243 to rotate when rotating, the small bevel gear 243 will drive the air inlet fan blade rod 242 to rotate to achieve air supply to the inside of the air inlet cylinder 210, the semiconductor refrigerating sheet 236 cools the cooling liquid in the cooling liquid tank 231 through the plurality of second heat-conducting sheets 237, the low-temperature cooling liquid will be pumped into the disc-shaped heat-conducting pipe 234 by the delivery pump 233 to flow, and the cooling liquid returns to the inside of the cooling liquid tank 231 to be cooled again, thereby realizing circulation, while the disc-shaped heat-conducting pipe 234 and the first heat-conducting sheet 235 conduct heat to the low-temperature cooling liquid, the air will pass through the first heat-conducting sheet 235 and the disc-shaped heat-conducting pipe 234 before entering the cooling box 110, the first heat-conducting sheet 235 and the disc-shaped heat-conducting pipe 234 will cool the air, so that the air can be sent into the inside of the cooling box 110 after being cooled, thereby improving the cooling effect of the semiconductor, the second motor 271 is simultaneously opened, the second motor 271 will drive the transverse rod 272 to rotate, the transverse rod 272 will drive the two air outlet fan blade rods 262 through the two third transmission belts 264 when rotating, the two air outlet fan blade rods 262 will rotate, thereby discharging hot air from both sides, thereby accelerating air flow and further improving the heat dissipation effect, when the transverse rod 272 rotates, the first transmission belt 2312 will drive the connecting rod 2310 to rotate, the connecting rod 2310 drives the heat dissipation fan rod 239 to rotate, the heat dissipation fan rod 239 blows air to dissipate heat from the heating surface of the semiconductor refrigerating sheet 236, thereby improving the refrigeration working effect of the semiconductor refrigerating sheet 236, and when the output shaft of the small bevel gear 243 rotates, the stirring sheet 2410 will stir the cooling liquid in the cooling liquid tank 231, thereby making the cooling liquid in the cooling liquid tank 231 more uniform, thereby indirectly improving the machine working effect.

[0037] The above are preferred embodiments of the application, and do not limit the protection scope of the application, therefore: equivalent changes made according to the structure, shape, principle of the application should be covered within the protection scope of the application.

Claims

1. A circulating air cooling tank for semiconductor cooling, comprising a main body module (100) and a rapid cooling module (200), characterized in that: The main module (100) includes a cooling box (110), the two sides of the inner wall of the cooling box (110) are slidably connected with a storage plate (120), and one side of the front end face of the cooling box (110) is hingedly connected with a sealing door (130); The rapid cooling module (200) includes a circular groove formed in the top of the cooling box (110), the top of the cooling box (110) is fixedly connected with an air inlet cylinder (210), the top of the air inlet cylinder (210) is fixedly connected with an air inlet filter screen (220), a cooling assembly (230) is arranged between the rear end face of the cooling box (110) and the inside of the circular groove, an air inlet assembly (240) is arranged between the cooling assembly (230) and the inside of the air inlet cylinder (210), air outlet grooves are formed in the two sides of the cooling box (110), air outlet assemblies (260) are arranged in the two air outlet grooves, dust screens (250) are installed on the two sides of the cooling box (110), the two dust screens (250) are located outside the two air outlet grooves respectively, a driving assembly (270) is arranged between the two sides of the inner wall of the cooling box (110), the two air outlet assemblies (260) are connected with the driving assembly (270), and the driving assembly (270) is connected with the cooling assembly (230).

2. The circulating air-cooled box for cooling a semiconductor according to claim 1, characterized by: The cooling assembly (230) includes a cooling liquid tank (231) fixedly connected to the rear end face of the cooling box (110), the bottom of the cooling liquid tank (231) is fixedly connected with a hollow tank (232), the cooling liquid tank (231) is fixedly connected with a disc type heat conducting pipe (234), the two ends of the disc type heat conducting pipe (234) are connected with the cooling liquid tank (231), the outer surface of the disc type heat conducting pipe (234) extends to the inside of the circular groove, the inside of the cooling liquid tank (231) is provided with a conveying pump (233), the output end of the conveying pump (233) is fixedly connected with one end of the disc type heat conducting pipe (234), and the outer surface of the disc type heat conducting pipe (234) is fixedly connected with a plurality of first heat conducting fins (235).

3. The circulating air-cooled box for cooling a semiconductor according to claim 2, characterized in that: The cooling assembly (230) further includes a semiconductor refrigeration fin (236) fixedly connected to the top of the inner wall of the hollow tank (232), a plurality of second heat conducting fins (237) are fixedly connected to the top of the semiconductor refrigeration fin (236), the plurality of second heat conducting fins (237) extend to the inside of the cooling liquid tank (231), one side of the hollow tank (232) is fixedly connected with a first mounting plate (238), the inside of the first mounting plate (238) is rotatably connected with a heat dissipation fan rod (239), one end of the heat dissipation fan rod (239) is fixedly connected with a connecting rod (2310), one end of the connecting rod (2310) is fixedly connected with a first linkage roller (2311), and the outer surface of the first linkage roller (2311) is transmissionally connected with a first transmission belt (2312).

4. The circulating air-cooled box for cooling a semiconductor according to claim 3, characterized in that: The air inlet assembly (240) comprises a first fixed plate (241) fixedly connected inside the air inlet cylinder (210), the inside of the first fixed plate (241) is rotatably connected with an air inlet fan blade rod (242), the top end of the air inlet fan blade rod (242) is fixedly connected with a small bevel gear (243), the inside of the air inlet cylinder (210) is rotatably connected with a long rod (244), the outer surface of the long rod (244) is fixedly connected with a large bevel gear (245), the outer surface of the large bevel gear (245) is engaged with the outer surface of the small bevel gear (243), one end of the long rod (244) extends to the outside of the air inlet cylinder (210), and one end of the long rod (244) is fixedly connected with a small transmission roller (248).

5. The circulating air-cooled box for cooling a semiconductor according to claim 4, characterized in that: The air inlet assembly (240) further comprises a first motor (246) fixedly connected to the rear end face of the cooling liquid tank (231), the output shaft of the first motor (246) extends to the inside of the cooling liquid tank (231), the outer surface of the output shaft of the first motor (246) is fixedly connected with a large transmission roller (247) and a plurality of stirring pieces (2410), the plurality of stirring pieces (2410) are located in the inside of the cooling liquid tank (231), and the outer surface of the large transmission roller (247) is in transmission connection with the outer surface of the small transmission roller (248) through a second transmission belt (249).

6. The circulating air-cooled box for cooling a semiconductor according to claim 5, characterized in that: The driving assembly (270) comprises a transverse rod (272) rotatably connected between the inner walls of the cooling tank (110), one side of the cooling tank (110) is fixedly connected with a second motor (271), the output shaft of the second motor (271) is fixedly connected with one end of the transverse rod (272), the other end of the transverse rod (272) extends to the outside of the cooling tank (110) and is fixedly connected with a third linkage roller (273), and the first transmission belt (2312) is in transmission connection between the outer surfaces of the third linkage roller (273) and the first linkage roller (2311).

7. The circulating air-cooled box for cooling a semiconductor according to claim 6, characterized in that: The air outlet assembly (260) comprises a second mounting plate (261) fixedly connected inside one of the air outlet grooves, the inside of the second mounting plate (261) is rotatably connected with an air outlet fan blade rod (262), the outer surfaces of the air outlet fan blade rod (262) and the transverse rod (272) are fixedly connected with a second linkage roller (263), and the outer surfaces of the two second linkage rollers (263) are in transmission connection with a third transmission belt (264).

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