Inspection device for built-in heating wire of semiconductor product

Abstract

The utility model provides an inspection device for a built-in heating wire of a semiconductor product. The inspection device comprises a device body and a cover plate, the device body is provided with an assembling groove; the assembling groove comprises a cover plate placing groove and a heating wire placing groove which are sequentially arranged from top to bottom; the assembly clearance between the heating wire placing groove and the heating wire with the standard shape is less than or equal to 0.1 mm; the cover plate is arranged in the cover plate placing groove; the upper surface of the cover plate is flush with the upper surface of the device body. The inspection device for the built-in heating wire of the semiconductor product provided by the utility model can effectively inspect the appearance of the heating wire at the earlier stage of processing, thereby avoiding the abnormity caused by poor supplied material of the heating wire, and improving the assembly stability of the heating wire and the welding processing reliability of the heating wire.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of semiconductor processing, specifically relates to a kind of semiconductor product built-in heating wire's testing device. BACKGROUND

[0002] In the production process of semiconductor shower, the assembly of built-in heating wire is an important link. However, since the heating wire needs to be closely matched with the heating wire built-in cavity to ensure the stability and reliability of the welding process, high assembly accuracy is required.

[0003] However, the existing actual production process often cannot guarantee that the shape of the heating wire completely meets the assembly requirements. Specifically, due to the influence of factors such as structure and shape size, the built-in heating wire is prone to deformation or bending during processing and assembly, which leads to the phenomenon that the heating wire may not be installed or not installed in place during actual assembly, thereby affecting the reliability and consistency of the product.

[0004] Therefore, in order to improve the assembly accuracy of the heating wire, it is necessary to develop a device specially used for inspecting the shape of the heating wire to verify its assembly effect in advance and ensure that it can be assembled in place and meet the use requirements during formal processing. SUMMARY

[0005] In view of the deficiencies in the prior art, the purpose of the utility model is to provide a semiconductor product built-in heating wire testing device, which can effectively test the shape of the heating wire in the early stage of processing, avoid abnormalities caused by poor incoming heating wire, and improve the stability of heating wire assembly and the reliability of heating wire welding processing.

[0006] To achieve this purpose, the utility model adopts the following technical solutions:

[0007] The utility model provides a kind of semiconductor product built-in heating wire's testing device, the testing device includes device body and cover plate;

[0008] The device body is provided with an assembly groove;

[0009] The assembly groove includes cover plate placing groove and heating wire placing groove arranged in sequence from top to bottom;

[0010] The assembly gap between the heating wire placing groove and the standard shape heating wire is ≤0.1mm;

[0011] The cover plate is arranged in the cover plate placing groove;

[0012] The upper surface of the cover plate is flush with the upper surface of the device body.

[0013] The utility model provides a testing device, the device body is provided with the assembly groove, the lower part of assembly groove is heating wire placing groove, is used for placing heating wire, through the control heating wire placing groove and the assembly gap of standard appearance heating wire (that is, the heating wire that meets the appearance of processing requirement, can assemble well in the heating wire built -in cavity of semiconductor product, and the welding effect meets the use requirement) is within 0.1mm, can guarantee the detection precision of heating wire appearance, in addition, through the setting cover plate is convenient for the fixation and transfer of heating wire, further improves the detection efficiency.

[0014] In the utility model, the assembly gap of heating wire placing groove and standard appearance heating wire is less than or equal to 0.1mm, for example, it can be 0.1mm, 0.09mm, 0.08mm, 0.07mm, 0.06mm or 0.05mm, but is not limited to the listed values, and other values not listed in the value range are also applicable.

[0015] In the utility model, the material of the testing device is not particularly limited, and any commonly used material in the art can be used, for example, it can be 6061 aluminum alloy.

[0016] Preferably, the standard appearance heating wire is an open ring.

[0017] Preferably, the heating wire placing groove is an open ring groove.

[0018] Preferably, the radial section of the standard appearance heating wire is circular.

[0019] Preferably, the bottom of the radial section of the open ring groove is arc-shaped.

[0020] Preferably, the depth of the heating wire placing groove is equal to the diameter of the standard appearance heating wire.

[0021] In the utility model, by setting the depth of the heating wire placing groove to be equal to the diameter of the standard appearance heating wire, the height of the heating wire can be further detected to determine whether it meets the requirements of the heating wire built-in cavity. If it meets the requirements, the cover plate can be stably covered in the cover plate placing groove, and the upper surface of the cover plate is flush with the upper surface of the device body. If it does not meet the requirements, the upper surface of the cover plate cannot be flush with the upper surface of the device body, and the heating wire does not meet the processing requirements.

[0022] Preferably, the width of the radial section of the cover plate placing groove is greater than the width of the radial section of the heating wire placing groove.

[0023] Preferably, the cover plate placing groove is in communication with the heating wire placing groove.

[0024] Preferably, the cover plate placing groove and the cover plate are both open rings, and the cover plate is embedded in the cover plate placing groove.

[0025] Preferably, the radial section of the cover plate and the cover plate placing groove is rectangular.

[0026] The operation process of the inspection device for the built-in heating wire shape of the semiconductor product is as follows:

[0027] (1) Place the heating wire to be detected in the heating wire placing groove of the device body, pay attention to the placement direction and position of the heating wire, ensure that it is tightly matched with the heating wire placing groove, observe the state of the heating wire in the placing groove, if the heating wire can be smoothly placed, it indicates that the shape of the heating wire meets the processing requirements; if it cannot be placed, the shape of the heating wire cannot meet the processing requirements;

[0028] (2) Place the cover plate in the cover plate placing groove, press the cover plate gently, so that it is tightly combined with the device body, observe whether the upper surface of the cover plate is flush with the upper surface of the device body, if it is flush, it indicates that the height of the heating wire meets the requirements of the heating wire built-in cavity, if it cannot be flush, it indicates that the shape of the heating wire cannot meet the processing requirements, and the heating wire needs to be adjusted or reassembled. For the heating wire with the required shape, the fixed action of the cover plate can conveniently transfer the heating wire and the device to other processes or equipment for subsequent processing or assembly, thereby improving the detection and production efficiency.

[0029] Compared with the prior art, the utility model has the following beneficial effects:

[0030] (1) The inspection device for the built-in heating wire of the semiconductor product can effectively detect the shape of the heating wire in the early processing stage, avoid assembly problems caused by unqualified heating wire shape size, improve the yield in the product production process, and reduce the risk of rework.

[0031] (2) The inspection device for the built-in heating wire of the semiconductor product can further ensure that the heating wire matches the heating wire built-in cavity of the semiconductor product in the actual processing process by controlling the assembly precision of the heating wire placing groove and the standard shape heating wire, improve the assembly precision and the reliability of welding, and reduce the occurrence of welding defects.

[0032] (3) The inspection device for the built-in heating wire of the semiconductor product can quickly detect the shape of the heating wire, and can improve the detection efficiency. BRIEF DESCRIPTION OF DRAWINGS

[0033] Figure 1 The structure diagram of the device body provided in the utility model embodiment 1.

[0034] Figure 2 The top view of the device body provided in the utility model embodiment 1.

[0035] Figure 3 Structure diagram of the cover plate provided for the embodiment 1 of the utility model;

[0036] Figure 4 The overhead view of the cover plate provided for the embodiment 1 of the utility model;

[0037] Figure 5 For Figure 2 Structure diagram of the section A-A;

[0038] In the figure: 1-device body; 2-cover plate; 3-cover plate placing groove; 4-heating wire placing groove. DETAILED DESCRIPTION

[0039] It should be understood that, in the description of the utility model, the orientation or positional relationship indicated by the terms "center", "longitudinal", "lateral", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer" and the like is the orientation or positional relationship shown based on the drawings, and is only for the convenience of describing the utility model and simplifying the description, and therefore cannot be understood as indicating or implying that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the utility model.

[0040] It should be noted that, in the description of the utility model, unless otherwise explicitly specified and limited, the terms "arrangement", "connection", "connection" should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, or integrally connected; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the communication inside two elements. For ordinary skilled in the art, the specific meaning of the above terms in the utility model can be understood through specific circumstances.

[0041] The technical solutions of the utility model will be further described below in combination with the drawings and through specific embodiments.

[0042] Embodiment 1

[0043] The embodiment provides a kind of semiconductor product built-in heating wire's inspection device, the inspection device includes device body and cover plate, wherein device body is as shown in Figure 1 、 Figure 2 And Figure 5 As shown in Figure 3 And Figure 4As shown, the device body 1 is provided with an assembly groove, which includes a cover plate placing groove 3 and a heating wire placing groove 4 arranged in sequence from top to bottom, the assembly gap between the heating wire placing groove 4 and the standard profile heating wire is 0.1 mm, the cover plate 2 is arranged in the cover plate placing groove 3, the upper surface of the cover plate 2 is flush with the upper surface of the device body 1, the standard profile heating wire is an open ring, the heating wire placing groove 4 is an open ring groove, the radial section of the standard profile heating wire is circular, the bottom of the radial section of the open ring groove is circular arc, the depth of the heating wire placing groove 4 is equal to the diameter of the standard profile heating wire, the width of the radial section of the cover plate placing groove 3 is greater than that of the heating wire placing groove 4, the cover plate placing groove 3 and the heating wire placing groove 4 are communicated, the cover plate placing groove 3 and the cover plate 2 are both open rings, the cover plate 2 is embedded in the cover plate placing groove 3, and the radial sections of the cover plate 2 and the cover plate placing groove 3 are both rectangular.

[0044] Embodiment 2

[0045] The embodiment provides a kind of semiconductor product built-in heating wire inspection device, the inspection device includes device body and cover plate, the device body is provided with assembly groove, the assembly groove includes by upper to lower in sequence Cover plate placing groove and heating wire placing groove, the assembly gap between the heating wire placing groove and the standard profile heating wire is 0.05 mm, the cover plate is arranged in the cover plate placing groove, the upper surface of the cover plate is flush with the upper surface of the device body, the standard profile heating wire is open ring, the heating wire placing groove is open ring groove, the radial section of the standard profile heating wire is circular, the bottom of the radial section of the open ring groove is circular arc, the depth of the heating wire placing groove is equal to the diameter of the standard profile heating wire, the width of the radial section of the cover plate placing groove is greater than that of the heating wire placing groove, the cover plate placing groove and the heating wire placing groove are communicated, the cover plate placing groove and the cover plate are both open rings, the cover plate is embedded in the cover plate placing groove, and the radial sections of the cover plate and the cover plate placing groove are both rectangular.

[0046] Embodiment 3

[0047] The embodiment provides a kind of semiconductor product built-in heating wire's testing device, described testing device includes device body and cover plate, the device body is provided with assembly slot, the assembly slot includes by upper to lower sequentially arranged cover plate placement slot and heating wire placement slot, the assembly gap of heating wire placement slot and standard outline heating wire is 0.04mm, the cover plate is placed in cover plate placement slot, the upper surface of the cover plate is flush with the upper surface of device body, the standard outline heating wire is open ring, the heating wire placement slot is open ring groove, the radial section of the standard outline heating wire is circular, the bottom of the radial section of the open ring groove is circular arc, the depth of the heating wire placement slot is equal to the diameter of standard outline heating wire, the width of the radial section of the cover plate placement slot is greater than the width of the radial section of the heating wire placement slot, the cover plate placement slot is communicated with heating wire placement slot, the cover plate placement slot and cover plate are all open ring, the cover plate is embedded in cover plate placement slot, the radial section of the cover plate and cover plate placement slot is all rectangular.

[0048] The operation process of the testing device provided in embodiments 1-3 for the shape inspection of the built-in heating wire of the semiconductor product is as follows:

[0049] (1) place the heating wire to be detected in the heating wire placement slot of the device body, pay attention to the placement direction and position of the heating wire, ensure that it is tightly matched with the heating wire placement slot, observe the state of the heating wire in the placement slot, if the heating wire can be placed smoothly, it indicates that the shape of the heating wire meets the processing requirements; if it cannot be placed, the shape of the heating wire cannot meet the processing requirements;

[0050] (2) place the cover plate in the cover plate placement slot, gently press the cover plate to make it tightly combined with the device body, observe whether the upper surface of the cover plate is flush with the upper surface of the device body, if flush, it indicates that the height of the heating wire meets the requirements of the heating wire built-in cavity, if it cannot be flush, it indicates that the shape of the heating wire cannot meet the processing requirements, and the heating wire needs to be adjusted or reassembled. For the heating wire with the required shape, the heating wire can be conveniently transferred to other processes or equipment together with the device through the fixing action of the cover plate, for subsequent processing or assembly, to improve the detection and production efficiency.

[0051] In summary, the testing device for the built-in heating wire of the semiconductor product can effectively inspect the shape of the heating wire in the early stage of processing, avoid the abnormality caused by the bad incoming heating wire, and improve the stability of the heating wire assembly and the reliability of the heating wire welding processing.

[0052] The applicant declares that the above description is only a specific embodiment of the present application, but the protection scope of the present application is not limited thereto, and it should be understood by those skilled in the art that any changes or replacements within the technical scope disclosed by the present application can be easily thought out by any person skilled in the art, and all of them fall within the protection scope and disclosure scope of the present application.

Claims

1. A testing device for semiconductor products with built-in heating wires, characterized in that, The testing device includes a device body and a cover plate; The device body is provided with an assembly slot; The assembly slot includes a cover plate placement slot and a heating wire placement slot arranged sequentially from top to bottom; The assembly gap between the heating wire placement slot and the standard-shaped heating wire is ≤0.1mm; The cover plate is disposed in the cover plate placement groove; The upper surface of the cover plate is flush with the upper surface of the device body.

2. The inspection device for semiconductor products with built-in heating wires according to claim 1, characterized in that, The standard-shaped heating wire is an open ring.

3. The inspection device for semiconductor products with built-in heating wires according to claim 2, characterized in that, The heating wire placement groove is an open annular groove.

4. The inspection device for semiconductor products with built-in heating wires according to claim 3, characterized in that, The radial cross-section of the standard-shaped heating wire is circular.

5. The inspection device for semiconductor products with built-in heating wires according to claim 4, characterized in that, The bottom of the radial section of the open annular groove is arc-shaped.

6. The inspection device for semiconductor products with built-in heating wires according to claim 5, characterized in that, The depth of the heating wire placement groove is equal to the diameter of the standard-shaped heating wire.

7. The inspection device for semiconductor products with built-in heating wires according to claim 1, characterized in that, The width of the radial section of the cover plate placement groove is greater than the width of the radial section of the heating wire placement groove.

8. The inspection device for semiconductor products with built-in heating wires according to claim 7, characterized in that, The cover plate placement slot is connected to the heating wire placement slot.

9. The inspection device for semiconductor products with built-in heating wires according to claim 8, characterized in that, Both the cover plate placement groove and the cover plate are open annular shapes. The cover plate is embedded in the cover plate placement groove.

10. The inspection device for semiconductor products with built-in heating wires according to claim 9, characterized in that, Both the cover plate and the cover plate placement groove have rectangular radial sections.

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