Intelligent glasses main body and intelligent glasses device

Abstract

The embodiment of the utility model discloses an intelligent glasses main body and an intelligent glasses device. According to the specific implementation scheme, the intelligent glasses main body comprises a glasses frame, and the heat conductivity coefficient of the glasses frame is greater than 80W / m.K; the optical system support is located on the side, used for facing a user, of the mirror frame, the optical system support comprises a first installation part and a second installation part, and the first installation part is installed on the mirror frame; the main board is located on the side, used for facing a user, of the mirror frame, and the main board and the second mounting part are oppositely arranged; the chip is clamped between the mainboard and the second installation part, the power consumption of the chip is larger than 0.7 W, and heat generated by the chip is conducted to the mirror frame at least sequentially through the second installation part and the first installation part to be dissipated.

Description

TECHNICAL FIELD

[0001] The present disclosure relates to the field of heat dissipation, and in particular, to an intelligent glasses body and an intelligent glasses device. BACKGROUND

[0002] At present, the application of intelligent glasses is more and more extensive. The intelligent glasses may include, for example, augmented reality (AR) glasses. It can be understood that the intelligent glasses can be used for content display, such as displaying movie pictures, game pictures, web pages, etc. SUMMARY

[0003] According to one aspect of the present disclosure, an intelligent glasses body is provided, comprising: a frame, the thermal conductivity of the frame being greater than 80 W / m·K; an optical system support, the optical system support being located on a side of the frame for facing a user, the optical system support comprising a first mounting portion and a second mounting portion, the first mounting portion being mounted to the frame; a mainboard, the mainboard being located on the side of the frame for facing the user, the mainboard being arranged opposite to the second mounting portion; a chip, the chip being clamped between the mainboard and the second mounting portion, the power consumption of the chip being greater than 0.7 W, and the heat generated by the chip being conducted to the frame for heat dissipation at least through the second mounting portion and the first mounting portion in sequence.

[0004] According to another aspect of the present disclosure, an intelligent glasses device is provided, comprising: the above-mentioned intelligent glasses body; a first rotating mechanism and a second rotating mechanism; a first temple and a second temple, the first temple being mounted to the optical system support in the intelligent glasses body through the first rotating mechanism, the second temple being mounted to the optical system support in the intelligent glasses body through the second rotating mechanism, and the heat generated by the chip in the intelligent glasses body being conducted to the optical system support and then to the first rotating mechanism and the second rotating mechanism for heat dissipation. BRIEF DESCRIPTION OF DRAWINGS

[0005] Figure 1 is an assembly structure schematic diagram of the intelligent glasses body provided by some example embodiments of the present disclosure in one perspective.

[0006] Figure 2 is an assembly structure schematic diagram of the intelligent glasses body provided by some example embodiments of the present disclosure in another perspective.

[0007] Figure 3 is an exploded structure schematic diagram of the intelligent glasses body provided by some example embodiments of the present disclosure.

[0008] Figure 4 is a cross-sectional structure schematic diagram of the intelligent glasses body provided by some example embodiments of the present disclosure.

[0009] Figure 5is a structural schematic diagram of a frame in some example embodiments of the present disclosure.

[0010] Figure 6 is an assembly structural schematic diagram of a smart glasses device in some example embodiments of the present disclosure from one perspective.

[0011] Figure 7 is an assembly structural schematic diagram of a smart glasses device in some example embodiments of the present disclosure from another perspective.

[0012] Figure 8 is a schematic diagram of a heat conduction path of a chip in some example embodiments of the present disclosure.

[0013] In the figure, 10, frame; 12, optical system support; 122, first mounting portion; 124, second mounting portion; 14, mainboard; 16, chip; 18, first heat-conducting pad; 20, second heat-conducting pad; 22, protective lens; 30, rear shell; 32, heat insulation pad; 40, first rotating mechanism; 401, rotating shaft support; 403, rotating shaft housing; 405, spring support; 407, rotating shaft cam; 409, injection molded metal piece; 50, second rotating mechanism; 60, first temple; 70, second temple. DETAILED DESCRIPTION

[0014] In the following, example embodiments according to the present disclosure will be described in detail with reference to the accompanying drawings. It is obvious that the described embodiments are only a part of the embodiments of the present disclosure, and not all the embodiments of the present disclosure, and it should be understood that the present disclosure is not limited by the example embodiments described herein.

[0015] In the description of the present disclosure, the orientation or positional relationship indicated by the terms "upper", "lower", "left", "right", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present disclosure and simplifying the description, and does not indicate or imply that the device referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation of the present disclosure.

[0016] In the description of the present disclosure, unless otherwise explicitly specified and limited, the terms "mounting", "connection", "fixing", etc. should be understood broadly, for example, can be fixedly connected, can be detachably connected, or integrally connected; can be mechanically connected, or electrically connected; can be directly connected, or indirectly connected through an intermediate medium. For those skilled in the art, the specific meaning of the above terms in the present disclosure can be understood according to the specific circumstances.

[0017] Exemplary Overview

[0018] Smart glasses refer to wearable glasses devices with an operating system, which can realize various functions through software installation.

[0019] Generally, a chip is arranged in the smart glasses. For example, a chip related to content display, a chip related to audio playback, etc. can be arranged in the smart glasses. The chip is usually arranged in the temple of the smart glasses. If the chip has large power consumption, the temple part will be seriously heated, and the local temperature of the temple is prone to be too high, which is difficult to meet the use requirements. Therefore, it is necessary to take certain measures to improve the heat dissipation performance of the smart glasses.

[0020] Exemplary Structure

[0021] Embodiments of the present disclosure provide a smart glasses body and a smart glasses device. The smart glasses body can be a core component in the smart glasses device, used to realize various functions of the smart glasses device. The smart glasses device can include a smart glasses body and a wearing structure arranged for the convenience of users. The wearing structure can include a temple.

[0022] The smart glasses body will be introduced first.

[0023] As shown in Figures 1-4 The smart glasses body can include a frame 10, an optical system support 12, a mainboard 14 and a chip 16. The optical system support 12 can be located on the side of the frame 10 facing the user. The optical system support 12 can include a first mounting portion 122 and a second mounting portion 124. The first mounting portion 122 can be mounted to the frame 10. The mainboard 14 can be located on the side of the frame 10 facing the user. The mainboard 14 and the second mounting portion 124 can be oppositely arranged. The chip 16 can be clamped between the mainboard 14 and the second mounting portion 124. The heat generated by the chip 16 can be conducted to the frame 10 for heat dissipation at least in sequence through the second mounting portion 124 and the first mounting portion 122.

[0024] In some optional embodiments of the present disclosure, the frame 10 can have a large thermal conductivity. The thermal conductivity of the frame 10 can be greater than 80 W / m·K. For example, the thermal conductivity of the frame 10 can be 85 W / m·K, 90 W / m·K, 95 W / m·K, 100 W / m·K, etc., which will not be listed one by one here.

[0025] In some optional embodiments of the present disclosure, the first mounting portion 122 and the second mounting portion 124 can be formed respectively and then assembled together to form a complete optical system support 12. Alternatively, the first mounting portion 122 and the second mounting portion 124 can be integrally formed to form a complete optical system support 12. Optionally, the first mounting portion 122 and the second mounting portion 124 can have an included angle therebetween. For example, the first mounting portion 122 and the second mounting portion 124 can be perpendicular or substantially perpendicular.

[0026] It should be noted that the optical system support 12 can be a support structure for mounting an optical system. The optical system can also be referred to as an optical machine. The optical system can emit light rays that can form a display image and process the light rays so that the light rays are projected to the eyes of a user wearing the smart glasses device, thereby enabling the user to see the display image.

[0027] In some optional embodiments of the present disclosure, the main board 14 can include a substrate and various circuit structures disposed on the substrate. The substrate can be, for example, a printed circuit board (PCB), a flexible printed circuit (FPC), or the like.

[0028] In some optional embodiments of the present disclosure, the chip 16 can have a large power consumption, and the chip 16 can belong to a high-power chip. The power consumption of the chip 16 can be greater than 0.7 W. For example, the power consumption of the chip 16 can be 0.8 W, 0.9 W, 1.0 W, 1.2 W, and the like, which will not be listed one by one here. For example, the chip 16 is a display chip that can provide a display function (the display chip generally has a high power consumption), rather than an audio processing chip with a lower power consumption.

[0029] In actual installation, the optical system support 12 and the main board 14 can be located on the same side of the frame 10, for example, both of them are located on the side of the frame 10 for facing the user. The first mounting portion 122 of the optical system support 12 can be mounted on the frame 10 by screwing, clamping, or the like. The second mounting portion 124 of the optical system support 12 can be parallel or substantially parallel to the main board 14. The main board 14 can be mounted on the second mounting portion 124 by screwing, clamping, or the like. One surface of the chip 16 can be closely attached to the main board 14, and the other surface of the chip 16 can be closely attached to the second mounting portion 124, so that the chip 16 can be clamped between the main board 14 and the second mounting portion 124.

[0030] In the embodiments of the present disclosure, the chip 16 can not be disposed in the temple, but be clamped between the main board 14 and the second mounting portion 124. Since the first mounting portion 122 and the second mounting portion 124 belong to different components of the optical system support 12, the first mounting portion 122 is mounted on the frame 10, and the heat generated by the chip 16 can be conducted along the first path as follows: chip 16→second mounting portion 124→first mounting portion 122→frame 10. Since the frame 10 has a large thermal conductivity coefficient, and compared with the long and narrow temple, the frame 10 generally has a larger heat dissipation area, the heat conducted to the frame 10 can be quickly dissipated to the external environment. In this way, even if the chip 16 belongs to a high-power chip, the present scheme can achieve good heat dissipation effect, ensure the heat dissipation performance of the smart glasses main body, and meet the use requirements.

[0031] In some optional embodiments of the present disclosure, the smart glasses body can further include a first heat-conducting pad 18 and a second heat-conducting pad 20. The first heat-conducting pad 18 can be clamped between the chip 16 and the second mounting portion 124. The second heat-conducting pad 20 can be clamped between the first mounting portion 122 and the frame 10. The heat generated by the chip 16 can be conducted to the frame 10 in sequence through the first heat-conducting pad 18, the second mounting portion 124, the first mounting portion 122, and the second heat-conducting pad 20 for heat dissipation.

[0032] Optionally, the first heat-conducting pad 18 can be a heat-conducting silica gel pad with good heat-conducting performance. One surface of the first heat-conducting pad 18 can be tightly attached to the chip 16, and the other surface of the first heat-conducting pad 18 can be tightly attached to the second mounting portion 124.

[0033] Optionally, the second heat-conducting pad 20 can be a heat-conducting silica gel pad with good heat-conducting performance. One surface of the second heat-conducting pad 20 can be tightly attached to the first mounting portion 122, and the other surface of the first mounting portion 122 can be tightly attached to the frame 10. The number of the second heat-conducting pads 20 can be two, for example, and the two second heat-conducting pads 20 can be arranged side by side along the length direction of the first mounting portion 122.

[0034] Since the first heat-conducting pad 18 is clamped between the chip 16 and the second mounting portion 124, the first mounting portion 122 and the second mounting portion 124 belong to different components of the optical system support 12, the first mounting portion 122 is mounted to the frame 10, and the second heat-conducting pad 20 is clamped between the first mounting portion 122 and the frame 10, the heat generated by the chip 16 can be conducted according to the second path as follows: chip 16→first heat-conducting pad 18→second mounting portion 124→first mounting portion 122→second heat-conducting pad 20→frame 10. Since the first heat-conducting pad 18 and the second heat-conducting pad 20 have good heat-conducting performance, the heat generated by the chip 16 can be efficiently conducted to the frame 10 through the second path. Since the frame 10 has a large heat-conducting coefficient and a larger heat dissipation area than the long and narrow temple, the heat conducted to the frame 10 can be quickly dissipated to the external environment. In this way, even if the chip 16 is a high-power chip, the present scheme can achieve good heat dissipation effect, ensure the heat dissipation performance of the smart glasses body, and meet the use requirements.

[0035] In some optional embodiments of the present disclosure, the smart glasses body can further include a protective lens 22. The protective lens 22 can be located on the side of the frame 10 away from the user. The protective lens 22 can be mounted to the frame 10. After the heat generated by the chip 16 is conducted to the frame 10, it can be conducted to the protective lens 22 through the frame 10 for heat dissipation.

[0036] Optionally, the material used to make the protective lens 22 can be plastic. The protective lens 22 can be installed on the frame 10 by screwing, clamping, pasting, or the like. The number of the protective lens 22 can be two, one of which can be installed on the left frame portion of the frame 10, and the other of which can be installed on the right frame portion of the frame 10. In an optional example, as shown in FIG. 1, the area P1 of the left frame portion of the frame 10 can be in direct contact with one protective lens 22, and the area P2 of the right frame portion of the frame 10 can be in direct contact with the other protective lens 22. Figure 5

[0037] It should be noted that the protective lens 22 is located on the side of the frame 10 away from the user, that is, the protective lens 22 can be located on the side of the frame 10 close to the external environment. In this way, the protective lens 22 can protect the eyes of the user and the smart glasses device, for example, to prevent wind, dust, and the like. In addition, after the heat generated by the chip 16 is conducted to the frame 10 according to the first path or the second path described above, a part of the heat can be dissipated to the external environment through the frame 10, and the other part of the heat can be further conducted to the protective lens 22 and dissipated to the external environment through the protective lens 22. In this way, it is beneficial to increase the heat dissipation area and improve the heat dissipation effect, thereby better ensuring the heat dissipation performance of the smart glasses body.

[0038] In some optional embodiments of the present disclosure, the smart glasses body can further include a rear shell 30. The rear shell 30 can be located on the side of the frame 10 facing the user. The rear shell 30 can be installed on the frame 10. The rear shell 30 can cover the main board 14 and the optical system support 12. The heat generated by the chip 16 can also be conducted to the main board 14 and radiated to the rear shell 30 through the main board 14 for heat dissipation.

[0039] In actual installation, the optical system support 12, the main board 14, and the rear shell 16 can be located on the same side of the frame 10, for example, on the side of the frame 10 facing the user. The rear shell 30 can be installed on the frame 10 by screwing, clamping, or the like. In the installed state of the rear shell 30, the rear shell 30 can provide a covering space to cover the main board 14 and the optical system support 12. In this way, the rear shell 30 can play a sealing and shielding role, and the user cannot see the main board 14 and the optical system support 12 from the appearance of the product. Since the chip 16 is clamped between the main board 14 and the second mounting portion 124, in addition to being conducted according to the first path or the second path described above, the heat generated by the chip 16 can also be conducted to the main board 14 and further radiated to the rear shell 30 through the main board 14 for heat dissipation. In this way, it is beneficial to increase the heat dissipation area and improve the heat dissipation effect, thereby better ensuring the heat dissipation performance of the smart glasses body.

[0040] ​In some optional embodiments of the present disclosure, the chip 16 can be arranged on the first surface of the mainboard 14. The smart glasses body can further include a heat insulation film 32. The heat insulation film 32 can be arranged on the second surface of the mainboard 14 opposite to the first surface. The arrangement position of the heat insulation film 32 on the second surface corresponds to the arrangement position of the chip 16 on the first surface. The rear shell 30 can further cover the heat insulation film 32.

[0041] Optionally, the first surface can be Figure 3 、 Figure 4 the lower surface of the mainboard 14 in FIG. 1, and the second surface can be Figure 3 、 Figure 4 the upper surface of the mainboard 14 in FIG. 1. The arrangement position of the heat insulation film 32 on the second surface can be referred to as a first position, and the arrangement position of the chip 16 on the first surface can be referred to as a second position. The correspondence between the first position and the second position can be understood as follows: if the first position is projected onto the first surface, the projection position obtained can be the same or substantially the same as the second position; or if the second position is projected onto the second surface, the projection position obtained can be the same or substantially the same as the first position.

[0042] Optionally, the heat insulation film 32 can include but is not limited to a metal heat insulation film, a composite heat insulation film, a ceramic heat insulation film, and the like, which will not be listed one by one here.

[0043] In the mounted state of the rear shell 30, the rear shell 30 can provide a covering space to cover the mainboard 14, the optical system support 12 and the heat insulation film 32. Since the chip 16 is clamped between the mainboard 14 and the second mounting portion 124, the heat generated by the chip 16 can be conducted from the first surface to the second surface of the mainboard 14, and then radiated to the rear shell 30 after passing through the heat insulation film 32 for heat dissipation, in addition to the first path or the second path described above. In this way, the heat insulation film 32 can play a heat insulation role, which is conducive to avoiding excessive heat radiated to the rear shell 30, thereby avoiding the temperature of the rear shell 30 being too high. Generally, the rear shell 30 is close to the forehead of the user, and by controlling the temperature of the rear shell 30, the user can be avoided from being affected.

[0044] In some optional embodiments of the present disclosure, the frame 10 and the optical system support 12 can be made of a first material, and the rear shell 30 can be made of a second material. The thermal conductivity of the first material can be greater than that of the second material.

[0045] Optionally, the first material used to make the frame 10 and the optical system support 12 can be magnesium alloy. It can be appreciated that magnesium alloy has low density and large thermal conductivity. The thermal conductivity of magnesium alloy can be, for example, 90 W / m K. The second material used to make the rear shell 30 can be plastic. The thermal conductivity of plastic can be in the range of 0.2 W / m K to 0.5 W / m K. The thermal conductivity of plastic can be, for example, 0.2 W / m K or 0.4 W / m K.

[0046] Since the frame 10 and the optical system support 12 are made of materials with high thermal conductivity, the heat generated by the chip 16 can be rapidly conducted to the frame 10 and dissipated to the external environment according to the first path or the second path described above, thereby achieving good heat dissipation effect. Generally, the rear shell 30 is close to the forehead of the user, and since the rear shell 30 is made of a material with relatively low thermal conductivity, it is beneficial to control the temperature of the rear shell 30 and avoid affecting the user.

[0047] The intelligent glasses device will be described below.

[0048] The intelligent glasses device can include the intelligent glasses body in any of the embodiments described above, and can further include Figure 3 the first rotating mechanism 40 and the second rotating mechanism 50 shown in the figure, and the first temple 60 and the second temple 70 shown in the figure. The first rotating mechanism 40, the second rotating mechanism 50, the first temple 60, and the second temple 70 can constitute the wearing structure described above. Figure 6 、 Figure 7 The first rotating mechanism 40, the second rotating mechanism 50, the first temple 60, and the second temple 70 can constitute the wearing structure described above.

[0049] The first temple 60 can be mounted to the optical system support 12 in the intelligent glasses body through the first rotating mechanism 40. The second temple 70 can be mounted to the optical system support 12 in the intelligent glasses body through the second rotating mechanism 50. The heat generated by the chip 16 in the intelligent glasses body can be conducted to the first rotating mechanism 40 and the second rotating mechanism 50 through the optical system support 12 for heat dissipation.

[0050] In some optional embodiments of the present disclosure, the first rotating mechanism 40 can be a hinge assembly for realizing the rotatable connection between the first temple 60 and the optical system support 12. The hinge assembly can include, for example, Figure 3 the shaft support 401, the shaft housing 403, the spring support 405, the shaft cam 407, and the injection molded metal piece 409 shown in the figure. The shaft support 401, the shaft housing 403, and the injection molded metal piece 409 can be made of stainless steel material.

[0051] In some optional embodiments of the present disclosure, the second rotating mechanism 50 can be a hinge assembly for realizing the rotatable connection between the second temple 70 and the optical system support 12. The composition of the hinge assembly is described above, and will not be repeated here.

[0052] It should be noted that in order to fit different head shapes, the material used to make the first temple 60 and the second temple 70 needs to ensure that the first temple 60 and the second temple 70 can be flexibly deformed. In addition, since the first temple 60 and the second temple 70 need to be in contact with the user's ears, the thermal conductivity of the material used to make the first temple 60 and the second temple 70 should not be too large.

[0053] Since the first temple 60 is installed on the optical system support 12 through the first rotating mechanism 40, and the second temple 70 is installed on the optical system support 12 through the second rotating mechanism 50, the heat generated by the chip 16 can not only be conducted to the frame 10 according to the first path described above and dissipated to the external environment through the frame 10, but also can be conducted according to the third path as follows: chip 16→optical system support 12→first rotating mechanism 40 / second rotating mechanism 50. Since the first rotating mechanism 40 and the second rotating mechanism 50 both include some metal parts, these metal parts have good heat conduction performance, so that the heat conducted to the first rotating mechanism 40 and the second rotating mechanism 50 can be quickly dissipated to the external environment. In this way, by introducing the first rotating mechanism 40 and the second rotating mechanism 50, on the one hand, the first temple 60 and the second temple 70 can be installed, and on the other hand, it is beneficial to increase the heat dissipation area and improve the heat dissipation effect, thereby better guaranteeing the heat dissipation performance of the smart glasses device.

[0054] In some optional embodiments of the present disclosure, the first rotating mechanism 40 and the second rotating mechanism 50 can be in contact with the second mounting portion 124 in the optical system support 12 in the smart glasses body, respectively, and the heat generated by the chip 16 in the smart glasses body can be conducted to the first rotating mechanism 40 and the second rotating mechanism 50 for heat dissipation after passing through the first heat-conducting pad 18 and the second mounting portion 124 in the smart glasses body, respectively.

[0055] Since the first rotating mechanism 40 and the second rotating mechanism 50 are in contact with the second mounting portion 124 respectively, the second mounting portion 124 can directly conduct heat with the first rotating mechanism 40, and the second mounting portion 124 can also directly conduct heat with the second rotating mechanism 50. In addition, the first heat-conducting pad 18 can be arranged between the chip 16 and the second mounting portion 124, and the heat generated by the chip 16 can be conducted along the fourth path: chip 16→first heat-conducting pad 18→second mounting portion 124→first rotating mechanism 40 / second rotating mechanism 50. Since the first heat-conducting pad 18 has good heat-conducting effect, the heat generated by the chip 16 can be efficiently conducted to the first rotating mechanism 40 and the second rotating mechanism 50 through the fourth path, which is conducive to ensuring the heat dissipation effect.

[0056] In some optional embodiments of the present disclosure, the distance between the chip 16 and the first rotating mechanism 40 in the smart glasses body is different from the distance between the chip 16 and the second rotating mechanism 50.

[0057] Optionally, the distance between the chip 16 and the first rotating mechanism 40 can be less than the distance between the chip 16 and the second rotating mechanism 50, that is, the chip 16 can be arranged close to the first rotating mechanism 40 (which can also be considered as close to the first temple 60). Of course, the chip 16 can also be arranged close to the second rotating mechanism 50 (which can also be considered as close to the second temple 70).

[0058] Generally, in order to facilitate the user to wear, leave space for the user's nose, the middle part of the frame 10 needs to be thinned as much as possible, and the middle part of the frame 10 is not suitable for arranging the chip 16. Therefore, the chip 16 can be arranged close to one side of the temple, which can be consistent with the overall design of the smart glasses device.

[0059] In some optional embodiments of the present disclosure, the ratio of the sum of the effective heat dissipation areas of the frame 10 and the protective lens 22 in the smart glasses body to the total effective heat dissipation area of the smart glasses device is in the following ratio range: [0.55, 0.7].

[0060] Optionally, the sum of the effective heat dissipation areas of the frame 10 and the protective lens 22 in the smart glasses body can be represented as S1, and the total effective heat dissipation area of the smart glasses device can be represented as S2, and the ratio of S1 to S2 can be 0.55, 0.60, 0.65, 0.70, etc., which will not be listed one by one here.

[0061] In an optional example, the sum of the effective heat dissipation areas of the frame 10 and the protective lens 22 can be 6400mm 2 . Among them, the number of protective lenses 22 can be two, and the effective heat dissipation area of a single protective lens 22 can be 2200mm 2The effective heat dissipation area of the rear shell 30 can be 2000mm 2 The first rotating mechanism 40 and the second rotating mechanism 50 can be a hinge assembly respectively, and the sum of the effective heat dissipation areas of the two hinge assemblies can be 1100mm 2 For the hinge assembly as the first rotating mechanism 40, the effective heat dissipation area of the rotating shaft shell 403 included in the hinge assembly can be 400mm 2 The effective heat dissipation area of the injection molded metal piece 409 included in the hinge assembly can be 150mm 2 In this way, the total effective heat dissipation area of the smart glasses device can be 9500mm 2 The heat generated by the chip 16 can be conducted in several paths as shown in the following. Figure 8

[0062] It should be noted that the areas of the frame 10 and the protective lens 22 that are in direct contact with the external environment are large, and these areas can be effectively utilized, for example, the ratio of S1 to S2 is in the value range of [0.55, 0.7]. In this way, after the heat generated by the chip 16 is conducted to the frame 10 through the first path or the second path described above, it can be quickly dissipated to the external environment through the frame 10 and the protective lens 22, so as to achieve good heat dissipation effect.

[0063] The inventor found through computer simulation that if the power consumption of the chip 16 is 0.85W, and the scheme in the related art is adopted, the chip 16 is placed in the temple, a heat spreader is additionally added outside the temple, and a heat insulation film is additionally added inside the temple, the maximum temperature inside the temple is 44.4℃, and the maximum temperature outside the temple is 52.9℃. If the smart glasses device provided by the embodiment of the present disclosure is used to manufacture the frame 10, and the material of the frame 10 is magnesium alloy, the maximum temperature of the frame 10 is 37.7℃, and the maximum temperature of the top surface of the rear shell 30 is 35℃. Obviously, compared with the related art, the embodiment of the present disclosure can achieve better heat dissipation effect and better meet the use requirements.

[0064] It should be noted that the various optional embodiments and optional implementation manners disclosed above can be flexibly selected and combined as needed to achieve corresponding functions and effects, and the present disclosure does not enumerate one by one.

[0065] The basic principles of the present disclosure are described above in combination with specific embodiments, but it should be noted that the advantages, advantages, effects and the like mentioned in the present disclosure are only examples and not limitations, and these advantages, advantages, effects and the like cannot be considered as the must-have of each embodiment of the present disclosure. In addition, the specific details disclosed above are only for the purpose of example and for the purpose of understanding, and not for the purpose of limitation, and the above details do not limit the present disclosure to the must-use specific details.

[0066] ​The various embodiments described in this specification are presented purely by way of example and for purposes of illustration only. Each of the various embodiments highlights certain features of the others that differ from the others. To avoid duplicating information, reference can be made to other sections of this specification for more detailed description of any of the features of the various embodiments.

[0067] Those skilled in the art will appreciate that various modifications and changes can be made to the present disclosure without departing from the spirit and scope of the application. It is to be understood that the present disclosure is not to be limited to the particular embodiments set forth in the above description as such embodiments can vary. Also, in order to obtain a broader and more generic disclosure to cover various modifications and changes, each of the various embodiments can be presented purely by way of example and for purposes of illustration only.

Claims

1. An intelligent eyewear body, characterized by, The intelligent glasses main body comprises: a mirror frame, a thermal conductivity of the mirror frame is greater than 80 W / m·K; an optical system support, the optical system support is located on a side of the mirror frame for facing a user, the optical system support comprises a first mounting portion and a second mounting portion, and the first mounting portion is mounted to the mirror frame; a main board, the main board is located on the side of the mirror frame for facing the user, and the main board is arranged opposite to the second mounting portion; a chip, the chip is clamped between the main board and the second mounting portion, a power consumption of the chip is greater than 0.7 W, and heat generated by the chip is conducted to the mirror frame for heat dissipation after passing through the second mounting portion and the first mounting portion in sequence.

2. The smart eyewear body of claim 1, wherein, Further comprising: a first heat-conducting pad, the first heat-conducting pad is clamped between the chip and the second mounting portion; a second heat-conducting pad, the second heat-conducting pad is clamped between the first mounting portion and the mirror frame; wherein the heat generated by the chip is conducted to the mirror frame for heat dissipation after passing through the first heat-conducting pad, the second mounting portion, the first mounting portion and the second heat-conducting pad in sequence.

3. The smart eyewear body of claim 1, wherein, Further comprising: a protective lens, the protective lens is located on a side of the mirror frame for being away from the user, the protective lens is mounted to the mirror frame, and the heat generated by the chip is conducted to the protective lens for heat dissipation after being conducted to the mirror frame.

4. The smart eyewear body of any one of claims 1-3, wherein, Further comprising: a rear shell, the rear shell is located on the side of the mirror frame for facing the user, the rear shell is mounted to the mirror frame, the rear shell covers the main board and the optical system support, and the heat generated by the chip is also conducted to the main board and radiated to the rear shell for heat dissipation through the main board.

5. The smart eyewear body of claim 4, wherein, The chip is arranged on a first surface of the main board. The intelligent glasses main body further comprises: a heat insulation film, the heat insulation film is arranged on a second surface of the main board opposite to the first surface, a setting position of the heat insulation film on the second surface corresponds to a setting position of the chip on the first surface, and the rear shell further covers the heat insulation film.

6. The smart eyewear body of claim 4, wherein, The mirror frame and the optical system support are made of a first material, the rear shell is made of a second material, and a thermal conductivity of the first material is greater than that of the second material.

7. An intelligent eyewear device, characterized in that, The intelligent glasses main body comprises: the intelligent glasses main body according to any one of claims 1-6; first and second rotating mechanisms; first and second temple legs, the first temple leg is mounted to the optical system support in the intelligent glasses main body through the first rotating mechanism, the second temple leg is mounted to the optical system support in the intelligent glasses main body through the second rotating mechanism, and the heat generated by the chip in the intelligent glasses main body is conducted to the first and second rotating mechanisms for heat dissipation after being conducted to the optical system support.

8. The smart glasses device of claim 7, wherein, The first and second rotating mechanisms are respectively in contact with the second mounting portion in the optical system support in the intelligent glasses main body, and the heat generated by the chip in the intelligent glasses main body is conducted to the first and second rotating mechanisms for heat dissipation after passing through the first heat-conducting pad in the intelligent glasses main body and the second mounting portion in sequence.

9. The smart glasses device of claim 7, wherein, The distance between the chip in the smart glasses body and the first rotating mechanism is different from the distance between the chip and the second rotating mechanism.

10. The smart glasses device of claim 7, wherein, The ratio of the sum of the effective heat dissipation areas of the frame and the protective lens in the smart glasses body to the total effective heat dissipation area of the smart glasses device is within the following ratio range: [0.55, 0.7].

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