Contact type desktop ultraviolet exposure device
By employing a UV-LED collimating light source module and an automatic leveling mechanism in ultraviolet lithography equipment, the collimation and multi-layer alignment problems of desktop equipment have been solved, improving lithography accuracy and pattern resolution while reducing equipment cost and size.
Patent Information
- Application Number
- CN202520436024.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-13
- Publication Date
- 2025-12-26
- Estimated Expiration
- 2035-03-13
AI Technical Summary
Existing desktop ultraviolet lithography equipment suffers from problems such as insufficient collimation, difficulty in multi-layer alignment, non-uniform contact between the mask and the wafer in contact exposure leading to pattern distortion, and low efficiency of manual leveling.
The system employs a UV-LED collimated light source module and an automatic leveling mechanism (a combination of a hemispherical and bowl-shaped structure), along with a modular design, to improve lithography accuracy and uniformity while reducing equipment size and cost.
It achieves high-precision multi-layer alignment, improves graphic resolution, reduces scrap rate, reduces equipment size by more than 40%, and reduces costs by 40%.
Smart Images
Figure CN223728133U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to photoetching equipment technical field especially relates to a contact type desktop ultraviolet exposure device. BACKGROUND
[0002] Traditional ultraviolet photoetching machine is bulky, high cost, and alignment precision depends on complex optical system. The existing desktop equipment has problems such as insufficient collimation, difficult multilayer alignment, and the like, and the non-uniform contact between the mask and the wafer in contact exposure can easily lead to pattern distortion, and manual leveling is low in efficiency, therefore, an ultraviolet photoetching device with compact structure, high automation degree and supporting high-precision multilayer alignment is urgently needed. SUMMARY
[0003] PROBLEMS TO BE SOLVED
[0004] In view of the deficiencies in the prior art, the utility model provides a contact type desktop ultraviolet exposure device, which solves the technical problems of the existing desktop equipment, such as insufficient collimation, difficult multilayer alignment, and the like, and the non-uniform contact between the mask and the wafer in contact exposure can easily lead to pattern distortion, and manual leveling is low in efficiency.
[0005] TECHNICAL SCHEME
[0006] To achieve the above purpose, the utility model realizes the following technical scheme:
[0007] A contact type desktop ultraviolet exposure device, comprising a base, a photoetching plate adsorption device and a wafer adsorption device, the base is provided with an exposure head, the inside is equipped with UV-LED collimating light source module, the exposure head is arranged above the photoetching plate adsorption device, the base is provided with a sliding table, the sliding table is installed with X / Y / Z / R displacement table, the base is installed with X / Y displacement table, the X / Y displacement table is installed with microscope and CCD, the UV-LED collimating light source module includes UV-LED lamp pearl array and array type collimating lens, the emission wavelength is 365nm, the light collimation is less than or equal to 2°, the collimating lens is Fresnel lens or microlens array, the wafer adsorption device is fixed on the X / Y / Z / R displacement table, for adjusting wafer orientation, the photoetching plate adsorption device is installed on the sliding table, for switching again alignment and photoetching position, the wafer adsorption device is equipped with automatic leveling mechanism, the automatic leveling mechanism includes semicircle ball and bowl structure, the semicircle ball is located in the bowl structure, adopts semicircle ball and bowl structure cooperation, for fine adjustment photoetching plate and wafer contact surface.
[0008] Preferably, the wafer adsorption device fixes the silicon wafer by vacuum adsorption, and the photoetching plate adsorption device fixes the mask by vacuum adsorption.
[0009] Preferably, two vacuum control buttons are arranged on the base and used for controlling vacuum on and off of the photomask suction device and the wafer suction device respectively.
[0010] Preferably, a microscopic imaging display screen is mounted on the base and used for displaying alignment marks of the wafer and the photomask.
[0011] Preferably, an exposure control screen is arranged below the microscopic imaging display screen and mounted on the base, and used for controlling exposure time and exposure energy of the exposure head.
[0012] Preferably, the resolution of the camera in the microscope and the CCD is greater than or equal to 5 million pixels, and a coaxial light source is provided to support real-time image presentation.
[0013] Beneficial effects
[0014] The exposure head of the contact type desktop ultraviolet exposure device adopts a collimated light source module to reduce optical diffraction error and improve pattern resolution, an automatic leveling mechanism (half-sphere and bowl structure cooperation) ensures uniformity of contact type exposure, reduces waste rate, modular design reduces equipment volume, and cost is reduced by more than 40%, and double-layer and above photolithography process is supported, and alignment accuracy is less than or equal to 5 mu m. BRIEF DESCRIPTION OF DRAWINGS
[0015] The above description is only a summary of the technical scheme of the present application, in order to more clearly understand the technical means of the present application, and the content of the specification can be implemented, the following is a preferred embodiment of the present application and the detailed description of the drawings.
[0016] Figure 1 It is the structure diagram of the contact type desktop ultraviolet exposure device of the present application.
[0017] Legend: 1, base; 11, photomask suction device; 12, bowl structure; 2, exposure head; 3, wafer suction device; 4, sliding table; 5, X / Y / Z / R displacement table; 6, X / Y displacement table; 7, microscopic imaging display screen; 8, exposure control screen; 9, vacuum control button. DETAILED DESCRIPTION
[0018] The contact type desktop ultraviolet exposure device provided by the embodiment of the present application effectively solves the problems of insufficient collimation, difficult multi-layer alignment and the like of the existing desktop devices, non-uniform contact between the mask and the wafer in contact type exposure easily leads to pattern distortion, and manual leveling is low in efficiency, the exposure head of the contact type desktop ultraviolet exposure device adopts a collimated light source module to reduce optical diffraction error and improve pattern resolution, an automatic leveling mechanism (half-sphere and bowl structure cooperation) ensures uniformity of contact type exposure, reduces waste rate, modular design reduces equipment volume, and cost is reduced by more than 40%, and double-layer and above photolithography process is supported, and alignment accuracy is less than or equal to 5 mu m.
[0019] Embodiment: As Figure 1 shown, the technical scheme in the embodiment of the application effectively solves the technical problems that the existing desktop devices have the problems of insufficient collimation, difficult multi-layer alignment, non-uniform contact between the mask and the wafer in contact exposure, which easily leads to pattern distortion, and low efficiency of manual leveling, and the overall idea is as follows:
[0020] In view of the problems in the prior art, the utility model provides a kind of contact type desktop ultraviolet exposure device, including base 1, photolithography plate adsorption device 11 and wafer adsorption device 3, and exposure head 2 is provided on base 1, UV-LED collimating light source module is arranged in it, exposure head 2 is arranged in the upper of photolithography plate adsorption device 11, slide 4 is provided on base 1, X / Y / Z / R displacement table 5 is installed on slide 4, X / Y displacement table 6 is installed on base 1, microscope and CCD are installed on X / Y displacement table 6, UV-LED collimating light source module includes UV-LED lamp pearl array and array collimating lens, and emission wavelength is 365nm, light collimation degree is less than or equal to 2 °, collimating lens is Fresnel lens or microlens array, wafer adsorption device 3 is fixed on X / Y / Z / R displacement table 5, for adjusting wafer orientation, photolithography plate adsorption device 11 is installed on slide 4, for again alignment and the switching of photolithography position, automatic leveling mechanism is arranged in wafer adsorption device 3, and automatic leveling mechanism includes semicircle ball and bowl structure 12, semicircle ball is located in bowl structure 12, and semicircle ball is used for fine adjustment of the contact surface of photolithography plate and wafer with bowl structure 12 cooperation, wafer adsorption device 3 is fixed silicon piece by vacuum adsorption, photolithography plate adsorption device 11 is fixed mask by vacuum adsorption, two vacuum control buttons 9 are provided on base 1 for controlling the vacuum on-off of photolithography plate adsorption device 11 and wafer adsorption device 3, microscope imaging display screen 7 is installed on base 1, for showing the alignment mark of wafer and photolithography plate, exposure control screen 8 is arranged below microscope imaging display screen 7 and installed on base 1 for controlling the exposure time and exposure energy of exposure head 2, the resolution of camera in microscope and CCD is greater than or equal to 5 million pixels, and coaxial light source is equipped to support real-time image presentation;
[0021] The exposure head 2 is internally provided with a UV-LED collimating light source module adopting a 365nm UV-LED array, a collimating lens is arranged in front of each lamp bead, the overall collimation degree is ≤2°, and the uniformity is >90%. The wafer adsorption device 3 is fixed by vacuum adsorption, the photomask plate adsorption device 11 is fixed by vacuum adsorption, the wafer adsorption device 3 is fixed on the X / Y / Z / R displacement table 5, in the alignment process, the wafer position is adjusted, the wafer alignment mark and the photomask plate alignment mark can be aligned, the X / Y / Z / R displacement table 5 is slidably installed on the sliding table 4, the wafer alignment and the exposure position switching are realized, the photomask plate adsorption device 11 is installed on the sliding table 4, and is used for re-alignment and photolithography position switching. Microscopes and CCDs are arranged, the photomask plate and the wafer alignment mark on the wafer are observed, if the wafer size is small, one set of microscopes / CCDs can be used, if the wafer size is large, one set of microscopes / CCDs can be added, and the microscopes and the CCDs are installed on the X / Y displacement table 6. In the alignment process, the position of the microscope can be adjusted, and better imaging is realized.
[0022] The semicircle ball and the bowl-shaped structure 12 are matched to finely adjust the contact surface of the photomask plate and the wafer, and ensure that the parallelism error is ≤5μm.
[0023] Working principle:
[0024] In the first step, the exposure head 2 is internally provided with a UV-LED collimating light source module adopting a 365nm UV-LED array, a collimating lens is arranged in front of each lamp bead, the overall collimation degree is ≤2°, and the uniformity is >90%. The wafer adsorption device 3 is fixed by vacuum adsorption, the photomask plate adsorption device 11 is fixed by vacuum adsorption, the wafer adsorption device 3 is fixed on the X / Y / Z / R displacement table 5, in the alignment process, the wafer position is adjusted, the wafer alignment mark and the photomask plate alignment mark can be aligned, the X / Y / Z / R displacement table 5 is slidably installed on the sliding table 4, the wafer alignment and the exposure position switching are realized, the photomask plate adsorption device 11 is installed on the sliding table 4, and is used for re-alignment and photolithography position switching. Microscopes and CCDs are arranged, the photomask plate and the wafer alignment mark on the wafer are observed, if the wafer size is small, one set of microscopes / CCDs can be used, if the wafer size is large, one set of microscopes / CCDs can be added, and the microscopes and the CCDs are installed on the X / Y displacement table 6. In the alignment process, the position of the microscope can be adjusted, and better imaging is realized.
[0025] In the second step, the semicircle ball and the bowl-shaped structure 12 are matched to finely adjust the contact surface of the photomask plate and the wafer, and ensure that the parallelism error is ≤5μm.
[0026] Finally, it should be noted that: apparently, the above embodiments are merely examples for clearly illustrating the utility model, and are not limited to the implementation. For ordinary skilled in the art, on the basis of the above description, other different forms of changes or variations can be made. Here, it is not necessary and impossible to exhaust all the implementation. The obvious changes or variations derived from it are still within the protection scope of the utility model.
Claims
1. A contact type desktop UV exposure device, comprising a base (1), a photomask plate suction device (11) and a wafer suction device (3), characterized in that: The base (1) is provided with an exposure head (2), which is internally provided with a UV-LED collimating light source module. The exposure head (2) is arranged above a photolithography plate adsorption device (11). The base (1) is provided with a sliding table (4). The sliding table (4) is installed with an X / Y / Z / R displacement table (5). The base (1) is installed with an X / Y displacement table (6). The X / Y displacement table (6) is installed with a microscope and a CCD. The UV-LED collimating light source module comprises a UV-LED lamp bead array and an array collimating lens. The emission wavelength is 365 nm, and the collimating degree of light is less than or equal to 2°. The collimating lens is a Fresnel lens or a microlens array. The wafer adsorption device (3) is fixed on the X / Y / Z / R displacement table (5) and is used for adjusting the orientation of the wafer. The photolithography plate adsorption device (11) is installed on the sliding table (4) and is used for realignment and switching of the photolithography position. The wafer adsorption device (3) is internally provided with an automatic leveling mechanism. The automatic leveling mechanism comprises a semicircle ball and a bowl structure (12). The semicircle ball is located in the bowl structure (12). The semicircle ball and the bowl structure (12) are matched to finely adjust the contact surface between the photolithography plate and the wafer.
2. The contact-type desktop UV exposure apparatus according to claim 1, wherein: The wafer adsorption device (3) is fixed by vacuum adsorption. The photolithography plate adsorption device (11) is fixed by vacuum adsorption.
3. The contact-type desktop UV exposure apparatus according to claim 2, wherein: The base (1) is provided with two vacuum control buttons (9) for controlling the vacuum on-off of the photolithography plate adsorption device (11) and the wafer adsorption device (3).
4. The contact-type desktop UV exposure apparatus according to claim 3, wherein: The base (1) is installed with a microscopic imaging display screen (7) for displaying the alignment marks of the wafer and the photolithography plate.
5. The contact-type desktop UV exposure apparatus according to claim 4, wherein: The base (1) is installed with an exposure control screen (8) below the microscopic imaging display screen (7) for controlling the exposure time and exposure energy of the exposure head (2).
6. The contact-type desktop UV exposure apparatus according to claim 5, wherein: The camera in the microscope and the CCD has a resolution of more than or equal to 5 million pixels and is equipped with a coaxial light source to support real-time image presentation.