Wafer heating device of gluing developer

Abstract

The utility model discloses a wafer heating device of a gluing developer, which comprises a developer main body and a heating box, a heating adjusting assembly is arranged at the lower end in the heating box, and a cooling assembly is arranged at the upper end of the heating box. According to the chemical reaction device, the heating adjusting assembly is installed, when the heating temperature is high, the heating plates on the two sides can be in the vertical state by rotating the motor, then the developing temperature is controlled through the cooling assembly, and it is ensured that chemical reaction is conducted under the proper condition; the first electromagnet and the second electromagnet can be powered on, the second electromagnet is separated from the annular clamping groove and magnetically attracts the first electromagnet after being powered on, the rotating shaft can be driven by the rotating motor to rotate, and therefore the heating plate is turned over, the first electromagnet and the second electromagnet are powered off, and the second electromagnet is restored under the action of the spring. And the heating plate is clamped into the annular clamping groove again to limit the rotating shaft, so that the heating plate is not easy to shake, and the subsequent blowing cooling efficiency is improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of gluing developing machine, concretely to a gluing developing machine wafer heating device. BACKGROUND

[0002] The developing machine is a kind of printing processing equipment, which can complete the processes of developing, washing, gluing and drying by semi-automatic or automatic procedure, and the wafer needs to be heated by heating device in drying link to remove the solvent penetrated into the inside of plate material in developing process.

[0003] The prior art discloses a heating plate for gluing developing machine with temperature can be quickly adjusted, and relates to the technical field of developing machine heating plate, which comprises a cover and a temperature control mechanism.

[0004] The above technical scheme controls the rotation of the second motor when the temperature is too high, so that the heating net is separated from the heating net, and the heating net is rotated by the fan to blow and cool down, but the wind blown during the cooling process makes the heating net shake, which is not stable enough, and the heating net can cause certain obstruction, affecting the efficiency of fan blowing and cooling. UTILITY MODEL CONTENTS

[0005] The utility model aims at providing a gluing developing machine wafer heating device to solve the problems in the above background.

[0006] To achieve the above object, the utility model provides the following technical scheme: a gluing developing machine wafer heating device, which comprises a developing machine main body and a heating box.

[0007] The heating adjusting assembly comprises a mounting frame, rotating shafts are rotatably connected to the left and right ends of the front and rear sides of the mounting frame, heating plates are fixedly connected between the rotating shafts at the left and right ends, electromagnets one are fixedly connected to the outer walls of the rotating shafts on one side, springs are arranged around the side of the electromagnets one close to the rotating shafts, electromagnets two are arranged on the other side of the springs, fixed circular plates are fixedly connected to the outer surfaces of one side of the heating box and outside the rotating shafts, annular clamping grooves are formed in the outer sides of the fixed circular plates, and the annular clamping grooves and the electromagnets two are clamped.

[0008] In the technical scheme, when the heating plate needs to be rotated to be in a vertical state, the electromagnet one and the electromagnet two are powered on, the electromagnet two is separated from the annular clamping groove and magnetically attracts the electromagnet one, the rotating motor drives the rotating shaft to rotate, the heating plate is turned over, the power supply of the electromagnet one and the electromagnet two is disconnected, the electromagnet two is restored under the action of the spring and clamped into the annular clamping groove to limit the rotating shaft, and the heating plate is not easy to shake, and the efficiency of subsequent blowing and cooling is improved.

[0009] As a further preferred aspect of the technical scheme, the electromagnet one is provided with a positioning frame on the side close to the fixed circular plate.

[0010] In the technical scheme, the rotating shaft drives the electromagnet one to rotate, and the positioning frame rotates on the fixed circular plate to support the electromagnet one and improve the stability of the rotation of the electromagnet one.

[0011] As a further preferred aspect of the technical scheme, the other side of the rotating shaft penetrates the heating box and is provided with a rotating motor, and the rotating motor is electrically connected with an external power supply.

[0012] As a further preferred aspect of the technical scheme, the cooling assembly comprises a hollow plate arranged above the inside of the heating box, a serpentine heat exchange pipe arranged in the hollow plate, the serpentine heat exchange pipe penetrating the heating box at both ends, a water outlet pipe connected to one end of the serpentine heat exchange pipe through a flange, and a water inlet pipe connected to the other end of the serpentine heat exchange pipe through a flange.

[0013] In the technical scheme, the water pump in the water tank can flow cold water into the serpentine heat exchange pipe, and the fan can reduce the temperature of the blown air, thereby further improving the cooling efficiency.

[0014] As a further preferred aspect of the technical scheme, the heating box is provided with a support at the upper end, the support is provided with a water tank at the top side and the middle, one end of the water tank is connected with the water outlet pipe, a valve is arranged on the water outlet pipe, and the other end of the water tank is connected with the water inlet pipe.

[0015] As a further preferred aspect of the technical scheme, the hollow plate is provided with a cylinder at the left end and the right end of the top side, and the cylinder is bolted with a filter screen at the top side.

[0016] In the technical scheme, the filter screen is arranged to prevent impurities from entering the developing machine.

[0017] As a further preferred aspect of the technical scheme, the cylinder is internally provided with a fan, and the fan is electrically connected with an external power supply.

[0018] The present application provides a kind of gluing developing machine wafer heating device, with the following beneficial effects:

[0019] (1) The utility model discloses a heating adjusting assembly is installed, when the heating temperature is higher, can make the heating plate of both sides be in vertical state through the rotation motor, and then control the temperature of development through the cooling assembly, ensure that chemical reaction is carried out under the suitable condition, when the heating plate needs to rotate and be in vertical state, can power on electromagnet no. 1 and electromagnet no. 2, after power on, make electromagnet no. 2 from annular clamping groove and magnetize electromagnet no. 1, can drive the rotation of the pivot through the rotation motor, to make the heating plate overturn, and disconnect the electricity of electromagnet no. 1 and electromagnet no. 2, electromagnet no. 2 restores under the action of spring, and reinserts annular clamping groove and limits the pivot, and then make the heating plate not easy to sway, improve the efficiency of subsequent air blowing cooling.

[0020] (2) The utility model discloses a cooling assembly is installed, and the water pump in the water tank can make cold water flow into the serpentine heat exchange pipe, and the temperature of the air blown is reduced through the fan, further improve the efficiency of cooling, and the filter screen is set up to avoid the influence of impurities into the developing machine. BRIEF DESCRIPTION OF DRAWINGS

[0021] Figure 1 It is the overall structure schematic view of the utility model;

[0022] Figure 2 It is the partial section view of the utility model;

[0023] Figure 3 It is the structure schematic view of heating adjusting assembly of the utility model;

[0024] Figure 4 It is the enlarged view of A of the utility model;

[0025] In the drawing: 1, developing machine main body;2, heating box;3, heating adjusting assembly;4, cooling assembly;31, installation frame;32, heating plate;33, rotation motor;34, pivot;341, electromagnet no. 1;342, positioning frame;343, spring;344, electromagnet no. 2;35, fixed circular plate;351, annular clamping groove;41, hollow plate;42, serpentine heat exchange pipe;43, support;44, water tank;45, water outlet pipe;46, water inlet pipe;47, cylinder;48, filter screen;49, fan. DETAILED DESCRIPTION

[0026] The technical scheme in the embodiment of the utility model will be clearly and completely described in combination with the drawings in the embodiment of the utility model.

[0027] The utility model provides technical scheme: as Figure 1 And Figure 2As shown in this embodiment, a wafer heating device for a coating and developing machine includes a developing machine body 1 and a heating chamber 2. A heating adjustment component 3 is installed at the lower end of the heating chamber 2, and a cooling component 4 is installed at the upper end of the heating chamber 2.

[0028] like Figure 3 and Figure 4 As shown, the heating adjustment assembly 3 includes a mounting frame 31. Rotary shafts 34 are rotatably connected to both the left and right ends of the front and rear sides of the mounting frame 31. Heating plates 32 are fixedly connected between the left and right ends of the rotating shafts 34. Electromagnets 341 are fixedly connected to the outer wall of one rotating shaft 34. A rotating motor 33 is installed on the other rotating shaft 34, passing through the heating box 2. The rotating motor 33 is electrically connected to an external power source. Springs 343 are arranged around the side of the electromagnets 341 near the rotating shaft 34. Electromagnets 344 are arranged on the other side of the springs 343. Fixed circular plates 35 are fixedly connected to the outer surface of one side of the heating box 2, located outside the rotating shaft 34. Annular slots 351 are opened on the outer side of each fixed circular plate 35, engaging with the electromagnets 344. A positioning frame 342 is arranged on the side of the electromagnets 341 near the fixed circular plate 35, rotatably connected to the outer surface of the fixed circular plate 35. By installing the heating adjustment assembly 3, the heating plates 32... The wafer well inside the developing machine body 1 is heated. However, when the temperature sensor inside the developing machine body 1 detects a temperature higher than the preset temperature, the temperature sensor model is PT100. The heating plates 32 on both sides can be made vertical by rotating the motor 33. Then, the developing temperature is controlled by the cooling component 4 to ensure that the chemical reaction takes place under suitable conditions. When the heating plate 32 needs to be rotated to a vertical position, electromagnet 1 341 and electromagnet 2 344 can be energized. After being energized, electromagnet 2 344 disengages from the annular slot 351 and magnetically attracts electromagnet 1 341. The rotating shaft 34 can then be rotated by rotating the motor 33, thereby causing the heating plate 32 to flip and disconnecting the power to electromagnet 1 341 and electromagnet 2 344. Electromagnet 2 344 returns to its original position under the action of the spring 343 and re-enters the annular slot 351 to limit the rotation shaft 34, thereby making the heating plate 32 less prone to shaking and improving the efficiency of subsequent air blowing and cooling.

[0029] like Figure 1 and Figure 2As shown, the cooling assembly 4 comprises a hollow plate 41 arranged above the inside of the heating box 2, a serpentine heat exchange pipe 42 is arranged in the inside of the hollow plate 41, the two ends of the serpentine heat exchange pipe 42 pass through the heating box 2, one end of the serpentine heat exchange pipe 42 is connected with a water outlet pipe 45 through a flange, the other end of the serpentine heat exchange pipe 42 is connected with a water inlet pipe 46 through a flange, a support 43 is arranged at the upper end of the heating box 2, a water tank 44 is arranged at the top side of the support 43, copper heat dissipation fins are arranged at the rear end of the water tank 44, the water in the water tank 44 can be cooled to facilitate the use of the water, one end of the water tank 44 is connected with the water outlet pipe 45, a valve is arranged on the water outlet pipe 45, the other end of the water tank 44 is connected with the water inlet pipe 46, a cylinder 47 is arranged at each of the left end and the right end of the top side of the hollow plate 41, a filter screen 48 is bolted on the top side of the cylinder 47, a fan 49 is installed in the inside of the cylinder 47, and the fan 49 is electrically connected with an external power supply; by installing the cooling assembly 4, the water pump in the water tank 44 can make cold water flow into the serpentine heat exchange pipe 42, the fan 49 can make the blown air lower in temperature, the cooling efficiency is further improved, and the filter screen 48 can prevent impurities from entering the developing machine and affecting the machine.

[0030] The utility model provides a kind of wafer heating device of gluing developing machine, specific working principle is as follows: the wafer well inside developing machine main body 1 is heated by heating plate 32, but when the temperature sensor inside developing machine main body 1 detects higher than preset temperature, can make the heating plate 32 of two sides by rotating motor 33 be in vertical state, subsequent air blowing cooling is facilitated, that is, electromagnet one 341 and electromagnet two 344 are electrified, after electrification, electromagnet two 344 is separated from annular clamping groove 351 and magnetically attracts electromagnet one 341, it can be driven rotation by rotating motor 33 to make shaft 34 rotate, so that heating plate 32 overturns, and the electricity of electromagnet one 341 and electromagnet two 344 is disconnected, electromagnet two 344 is restored under the action of spring 343, and re-clamps into annular clamping groove 351 to limit shaft 34, so that heating plate 32 is not easy to sway;Then start the water pump in water tank 44 to make the cold water in water tank 44 enter serpentine heat exchange pipe 42 by water outlet pipe 45, and re-flow into water tank 44 by water inlet pipe 46, while starting fan 49 to blow towards serpentine heat exchange pipe 42, and the inside of developing machine main body 1 is cooled by heat exchange, when temperature sensor detects suitable temperature, cooling can be stopped;Electromagnet one 341 and electromagnet two 344 can be electrified again to make heating plate 32 overturn and be in initial parallel state.

[0031] Although the embodiments of the utility model have been shown and described, it can be understood by those skilled in the art that various changes, modifications, replacements and variations can be made to these embodiments without departing from the principles and spirits of the utility model, and the scope of the utility model is defined by the appended claims and their equivalents.

Claims

1. A wafer heating device of a gum coating developing machine, comprising a developing machine main body (1) and a heating box (2), characterized in that: The heating tank (2) is internally provided with a heating and adjusting assembly (3), and the upper end of the heating tank (2) is provided with a cooling assembly (4). The heating and adjusting assembly (3) comprises a mounting frame (31), the left and right ends of the front and back sides of the mounting frame (31) are rotationally connected with rotating shafts (34), the rotating shafts (34) at the left and right ends are fixedly connected with heating plates (32), the outer walls of the rotating shafts (34) on one side are fixedly connected with electromagnets (341), the side, close to the rotating shaft (34), of the electromagnet (341) is provided with springs (343) around, the other side of the spring (343) is provided with electromagnets (344), the outer surface of one side of the heating tank (2) and located outside the rotating shaft (34) is fixedly connected with fixed circular plates (35), the outer sides of the fixed circular plates (35) are provided with annular clamping grooves (351), and the annular clamping grooves (351) and the electromagnets (344) are clamped.

2. The wafer heating device of claim 1, wherein: The side, close to the fixed circular plate (35), of the electromagnet (341) is provided with positioning frames (342), and the positioning frames (342) and the outer surfaces of the fixed circular plates (35) are rotationally connected.

3. The wafer heating device for a coating and developing machine according to claim 1, characterized in that: The rotating shafts (34) on the other side pass through the heating tank (2) and are provided with rotating motors (33), and the rotating motors (33) and the external power supply are electrically connected.

4. The wafer heating device for a coating and developing machine according to claim 1, characterized in that: The cooling assembly (4) comprises a hollow plate (41), the hollow plate (41) is arranged above the inside of the heating tank (2), the hollow plate (41) is internally provided with a serpentine heat exchange pipe (42), the serpentine heat exchange pipe (42) passes through the heating tank (2) at both ends, one end of the serpentine heat exchange pipe (42) is connected with a water outlet pipe (45) through a flange, and the other end of the serpentine heat exchange pipe (42) is connected with a water inlet pipe (46) through a flange.

5. The wafer heating device for a coating and developing machine according to claim 1, characterized in that: The upper end of the heating tank (2) is provided with a support (43), the top side of the support (43) is provided with a water tank (44), one end of the water tank (44) is connected with the water outlet pipe (45), the water outlet pipe (45) is provided with a valve, and the other end of the water tank (44) is connected with the water inlet pipe (46).

6. The wafer heating device of claim 4, wherein: The left and right ends of the top side of the hollow plate (41) are provided with cylinders (47), and the top sides of the cylinders (47) are bolted with filter screens (48).

7. The wafer heating device of claim 6, wherein: The cylinders (47) are internally provided with fans (49), and the fans (49) are electrically connected with the external power supply.

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