Radiating device packaging structure and server comprising same

Abstract

The utility model relates to the technical field of cooling of electronic devices, in particular to a heat dissipation device packaging structure and a liquid cooling server comprising the heat dissipation device packaging structure. The utility model aims to solve the problem of low cooling efficiency. The first purpose of the utility model is to provide a heat dissipation device packaging structure comprising a heat dissipation device which comprises a heat dissipation part and a heat conduction substrate which are in heat conduction connection. The lower end face of the frame body abuts against the upper surface of the heat conduction substrate, and a heat dissipation part is arranged in the inner space of the frame body. The second purpose of the utility model is to provide a liquid cooling server, which comprises a box body, a spraying plate, a heating device and a packaging structure of the heat dissipation device, the box body is provided with an upward opening, the heating device is arranged in the box body, the upper surface of the heating device is in heat conduction contact with the lower surface of the heat conduction substrate, and the spraying plate covers the opening; a spraying unit is arranged on the surface, facing the interior of the box body, of the spraying plate and sprays cooling liquid towards the interval between the inner surface, facing the frame body, of the spraying unit and the heat dissipation part.

Description

Technical Field

[0001] This utility model relates to the field of server cooling technology, and more specifically, to a heat dissipation device packaging structure and a server including the same. Background Technology

[0002] Some CPU heatsink designs have metal-encased top and bottom surfaces, with only the edges exposed. Therefore, liquid cooling sprays can only reach the top metal surface of the CPU heatsinks and cannot penetrate them, resulting in low heat exchange and inefficient CPU cooling. Full immersion cooling, on the other hand, would require submerging the entire server motherboard to reach the CPU heatsink fins.

[0003] Therefore, it is necessary to improve the heat dissipation structure of CPUs or similar heat-generating devices. Utility Model Content

[0004] The present invention aims to overcome at least one of the defects of the prior art and provide a heat dissipation device packaging structure and a server including the same, to solve the problem of low liquid cooling efficiency.

[0005] The first aspect of this utility model is to provide a heat dissipation device packaging structure, including: a heat dissipation device, the heat dissipation device including a heat dissipation part and a heat-conducting substrate connected in a thermally conductive manner, the heat dissipation part being disposed on the upper surface of the heat-conducting substrate;

[0006] A frame that runs vertically through the body, with its lower end face abutting against the upper surface of the thermally conductive substrate, and the heat dissipation part disposed within the internal space of the frame, with a gap between the inner surface of the frame and the heat dissipation part.

[0007] In this design, the frame is vertically continuous, with an upper and lower opening. The lower opening abuts against the thermally conductive substrate. Externally sprayed coolant is introduced into the frame through the upper opening. The coolant at least accumulates in the space between the inner surface of the frame and the heat dissipation unit, allowing the coolant to immerse at least a portion of the heat dissipation unit. Simultaneously, the coolant can directly contact the upper surface of the thermally conductive substrate for liquid cooling heat exchange. After heat exchange, the heated coolant overflows from the upper surface of the frame or seeps out through the gap between the lower surface of the frame and the upper surface of the thermally conductive substrate. The externally sprayed low-temperature coolant continuously replenishes the internal space of the frame, creating a coolant circulation within the frame. This significantly improves the heat exchange level between the sprayed coolant and the heat dissipation device. Furthermore, when the packaging structure of this design is within a spray liquid cooling system, immersion liquid cooling of the heat dissipation device within the packaging structure can be achieved without altering the spray structure, significantly improving cooling efficiency.

[0008] In some embodiments, the side of the frame is provided with an outlet hole for coolant to be discharged.

[0009] In some embodiments, a coolant drain gap is provided between the lower end face of the frame and the upper surface of the thermally conductive substrate for coolant to seep out.

[0010] In some embodiments, the heat dissipation part includes an upper heat-conducting plate and a plurality of fins, the upper ends of the plurality of fins being thermally connected to the lower surface of the upper heat-conducting plate, and the lower ends of the plurality of fins being thermally connected to the heat-conducting substrate.

[0011] The fins are spaced apart along their thickness direction, and coolant can pass between adjacent fins.

[0012] In this design, the coolant inside the frame can fully contact the fins. At the same time, the sprayed coolant can be directly sprayed onto the upper heat-conducting plate or the upper heat-conducting plate can be immersed in the coolant, which significantly improves the cooling rate of the heat dissipation components.

[0013] In some embodiments, the orthographic projection section of the heat dissipation part is cross-shaped, and the orthographic projection section of the internal space of the frame is rectangular.

[0014] In this design, the frame can be tightly fitted against the heat dissipation unit, thereby increasing the support strength of the frame. Furthermore, several gaps can be formed between the top opening of the frame and the heat dissipation unit, allowing external spray coolant to enter the frame through these gaps. Thus, with a relatively small internal space, the coolant can fully immerse the heat dissipation unit.

[0015] In some embodiments, the heat dissipation part is provided with an outer extension member extending outward relative to the orthographic projection section of the heat dissipation part around its periphery, and the lower end face of the frame is provided with an inner extension member extending inward around its periphery, and the inner extension member and the outer extension member are tightly fitted together.

[0016] In this design, the frame is close to the lower part of the heat sink, which can enhance the structural strength of the frame by leveraging the support of the heat sink. Furthermore, the internal space of the frame in this design only needs to be set to be slightly larger than the heat sink, which promotes miniaturization, reduces the amount of coolant required, and effectively reduces the overall load on the heat sink packaging structure.

[0017] In some embodiments, the frame includes a first shell and a second shell that are detachably connected, the first shell and the second shell cooperating to jointly enclose the heat dissipation section.

[0018] In some embodiments, the inner surface of the frame is provided with connecting components for fixing the heat dissipation unit.

[0019] In some embodiments, the inner surface of the frame is further provided with a guide component for directing coolant to the heat dissipation section.

[0020] The utility model discloses a second aspect is proposed a kind of liquid cooling server, including box, spray plate, heating device and the heat sink device package structure, the box is provided with open mouth upwards, the heating device is located in the box interior, the upper surface of the heating device is in thermal contact with the lower surface of the heat conducting substrate, the spray plate cover is set the open mouth;

[0021] The surface of the spray plate towards the box interior is provided with several spray units, and at least one spray unit is arranged between the inner surface of the frame body and the heat dissipation part.

[0022] Compared with the prior art, the utility model has the beneficial effects that: the frame body is abutted on the heat conducting substrate, a semi-closed containing space is formed in the frame body, the cooling liquid is introduced into the frame body through the upper opening of the frame body, and the cooling liquid is immersed in the heat dissipation part after being collected in the frame body, so as to improve the heat exchange level between the cooling liquid and the heat dissipation device; the inner extension member arranged in the frame body and the outer extension member arranged in the heat transfer device are tightly matched, so as to reduce the volume of the frame body, reduce the amount of cooling liquid required for immersion or partial immersion of the heat dissipation part, and thus reduce the overall load of the heat dissipation device package structure. BRIEF DESCRIPTION OF DRAWINGS

[0023] Figure 1 The structure of example 1 Figure 1 .

[0024] Figure 2 The structure of example 1 Figure 2 .

[0025] Figure 3 The partial structure diagram of example 1.

[0026] Figure 4 The structure of example 2 Figure 1 .

[0027] Figure 2 The structure of example 2 Figures 1-2 .

[0028] Reference signs: heat dissipation device package structure 10, heating device (not shown), heat dissipation part 110, fin 111, upper heat conducting plate 112, heat conducting substrate 120, outer extension member 130, frame body 200, upper opening 210, lower opening 220, liquid outlet hole 230, inner extension member 240, first shell 250, second shell 260, connecting member 300, box 20, open mouth 21, spray plate 30, spray unit 31. DETAILED DESCRIPTION

[0029] The accompanying drawings are for illustrative purposes only and should not be construed as limiting the scope of this invention. To better illustrate the following embodiments, some components in the drawings may be omitted, enlarged, or reduced, and do not represent the actual dimensions of the product. It is understandable to those skilled in the art that some well-known structures and their descriptions may be omitted in the drawings.

[0030] Example 1

[0031] like Figures 1-2 As shown, this embodiment proposes a heat dissipation device packaging structure, including a heat dissipation device and a frame 200. The heat dissipation device includes a heat dissipation part 110 and a heat-conducting substrate 120 connected in a thermally conductive manner. The heat dissipation part 110 is disposed on the upper surface of the heat-conducting substrate 120. The frame 200 has a vertically continuous structure, with its lower end face abutting against the upper surface of the heat-conducting substrate 120. The heat dissipation part 110 is disposed within the internal space of the frame 200, and a gap is left between the inner surface of the frame 200 and the heat dissipation part 110. In use, the lower surface of the heat-conducting substrate 120 makes thermal contact with the heat-generating device. Specifically, the heat-generating device can be a flat CPU, and the frame 200 is made of a material with good thermal conductivity, such as aluminum, copper, or other metal materials.

[0032] It is understood that the frame 200 is vertically continuous and has an upper opening 210 and a lower opening 220. The lower opening 220 abuts against the heat-conducting substrate 120. The externally sprayed coolant is introduced into the frame 200 through the upper opening 210. The coolant can at least gather in the space formed between the inner surface of the frame 200 and the heat dissipation part 110, so that the coolant can immerse at least a part of the heat dissipation part 110. At the same time, the coolant can also directly contact the upper surface of the heat-conducting substrate 120 for liquid cooling heat exchange. After heat exchange, the heated coolant overflows from the upper end surface of the frame 200 or seeps out from the gap between the lower end surface of the frame 200 and the upper surface of the heat-conducting substrate 120. The externally sprayed low-temperature coolant continuously replenishes the internal space of the frame 200, thereby forming a coolant circulation inside the frame 200. In this way, the heat exchange level between the sprayed coolant and the heat dissipation device can be significantly improved. Furthermore, when the heat dissipation device packaging structure of this embodiment is in the spray liquid cooling system, it can achieve immersion liquid cooling of the heat dissipation device in the packaging structure without changing the spray structure, thus significantly improving the cooling efficiency.

[0033] like Figures 1-2 As shown, the side of the frame 200 is provided with a coolant outlet hole 230 for discharging coolant. In a specific implementation, there are several coolant outlet holes 230. Preferably, the several coolant outlet holes 230 are set at different heights to ensure that the coolant can be discharged from the frame 200 under its own gravity.

[0034] In some embodiments, referring to FIG. 1, a liquid outlet gap is left between the lower end surface of the frame 200 and the upper surface of the heat-conducting base plate 120 for the cooling liquid to seep out. In this case, the liquid outlet hole 230 can not be provided. In a specific implementation, the lower end surface of the frame 200 abuts against the upper surface of the heat-conducting base plate 120, but the contact surface between the two is not sealed, so that a small liquid outlet gap is left between the lower end surface of the frame 200 and the upper surface of the heat-conducting base plate 120. Under the action of its own gravity, the cooling liquid can seep out of the frame 200 through the liquid outlet gap. Since the flow rate of the cooling liquid seepage is small, it is easy to realize that the flow rate of the cooling liquid introduced into the frame 200 is greater than the discharge flow rate, so that the cooling liquid can fill the internal space of the frame 200 and completely or partially immerse the heat-dissipating part 110.

[0035] Referring to Figures 1-2 , the heat-dissipating part 110 includes the upper heat-conducting plate 112 and a plurality of fins 111. The upper ends of the plurality of fins 111 are in heat-conducting connection with the lower surface of the upper heat-conducting plate 112, and the lower ends of the plurality of fins 111 are in heat-conducting connection with the heat-conducting base plate 120. The plurality of fins 111 are arranged in gaps along the thickness direction of the fins 111, and the cooling liquid can pass between adjacent fins 111. It can be understood that the cooling liquid in the frame 200 can be in full contact with the fins 111. At the same time, the sprayed cooling liquid can be directly sprayed onto the upper heat-conducting plate 112 or the upper heat-conducting plate 112 is immersed in the cooling liquid, which significantly improves the cooling rate of the heat-dissipating part 110.

[0036] Referring to Figures 2-3 , in order to reduce the internal space of the frame 200, the orthographic projection section of the heat-dissipating part 110 is in the shape of a "cross", and the orthographic projection section of the internal space of the frame 200 is in the shape of a rectangle. In this case, the inner surface of the frame 200 can be arranged in abutment with the outer surface of the heat-dissipating part 110, and the structural strength of the frame 200 is improved by the support of the heat-dissipating part 110. In addition, a plurality of gaps are formed between the periphery of the upper opening 210 of the frame 200 and the heat-dissipating part 110, and the sprayed cooling liquid from the outside can be introduced into the internal space of the frame 200 through the gaps, so that the cooling liquid can be fully immersed in the heat-dissipating part 110 based on the small internal space of the frame 200.

[0037] Referring to Figures 2-3 , the heat-dissipating part 110 is provided with an extension member 130 extending outward relative to the orthographic projection section of the heat-dissipating part 110, and the lower end surface of the frame 200 is provided with an inner extension member 240 extending inward. The inner extension member 240 and the extension member 130 are in abutting cooperation.

[0038] In use, the frame 200 can be supported by the heat dissipation part 110 to improve the structural strength of the frame 200, and the internal space of the frame 200 only needs to be slightly larger than the heat dissipation part 110, which facilitates the miniaturization design, reduces the demand for cooling liquid, and effectively reduces the overall load of the heat dissipation device packaging structure. With reference to Figure 2 , the extension member 130 specifically includes a connecting piece that extends outward relative to the normal projection section of the heat dissipation part 110, and more specifically, the connecting piece is a bolt that penetrates the heat-conducting substrate 120, and the heat dissipation device is fixed to the external equipment through the bolt. The extension member 240 specifically includes an arc-shaped part that extends inward relative to the lower opening 220 of the frame 200 and a structure connected thereto, and more specifically, the arc-shaped part is used to avoid the bolt, so that the extension member 240 and the extension member 130 can be tightly fitted.

[0039] With reference to Figure 2-3 , in order to facilitate disassembly and assembly, the frame 200 includes a first shell 250 and a second shell 260 that can be detachably connected, and the first shell 250 and the second shell 260 cooperate to collectively surround the heat dissipation part 110. With reference to Figure 2 , when the first shell 250 and / or the second shell 260 are provided with the extension member 240, the extension member 240 of the first shell 250 and the extension member 240 of the second shell 260 can be tightly fitted with the extension member 130 on the heat dissipation part 110 at a position corresponding thereto, which reduces the difficulty of installation and prevents the gap between the lower end surface of the frame 200 and the heat-conducting substrate 120 from being too large, which helps the cooling liquid to fill the inside of the frame 200. In a preferred embodiment, the connection between the first shell 250 and the second shell 260 is in a staggered fitting manner and is reinforced by screw connection, thereby improving the sealing performance of the connection and reducing the leakage of cooling liquid.

[0040] As shown in Figure 2 , in order to improve the connection stability between the heat dissipation part 110 and the frame 200, the inner surface of the frame 200 is provided with a connecting part 300 for fixing and connecting the heat dissipation part 110. Specifically, one end of the connecting part 300 is fixedly connected to one of the inner surfaces of the frame 200, and the other end of the connecting part 300 is fixedly connected to the heat dissipation part 110. More specifically, the fixing can be achieved by screw connection or the like.

[0041] In some embodiments, the frame 200 is further provided with a guide component for guiding the cooling liquid to the heat dissipation part 110. In a specific implementation, the position of the guide component corresponds to the spray opening of the external cooling liquid spraying device. In a preferred embodiment, the guide component can be a slope component, and the slope of the slope component is inclined towards the heat dissipation part 110. When the cooling liquid is sprayed onto the slope, the cooling liquid can be splashed towards the heat dissipation part 110. In a preferred embodiment, referring to Figures 4-5 The upper end surface of the connecting component 300 can also be provided in the form of a slope, and the position of the connecting component 300 corresponds to the spray opening, so that the connecting component 300 can have both the functions of fixing and guiding liquid.

[0042] Embodiment 2

[0043] As shown in Figures 1-5 , the present embodiment proposes a liquid-cooled server, which comprises a box 20, a spraying plate 30, a heat generating device, and a heat dissipation device packaging structure 10. The box 20 is provided with an open top 21 facing upwards. The heat generating device is arranged inside the box 20, and the upper surface of the heat generating device is in thermal contact with the lower surface of a heat-conducting substrate 120. The spraying plate 30 covers the open top 21. The surface of the spraying plate 30 facing the inside of the box 20 is provided with a plurality of spraying units 31. At least one spraying unit 31 sprays cooling liquid towards the space between the inner surface of the frame 200 and the heat dissipation part 100. In a specific implementation, the heat generating device is a CPU, which is arranged on the bottom surface inside the box 20. The heat dissipation device packaging structure 10 is arranged on the upper surface of the CPU, and the lower surface of the heat-conducting substrate 120 is in thermal contact with the upper surface of the CPU. In addition, in order to improve the liquid cooling effect, the spraying range of the spraying unit 31 can cover the upper opening 210 of the frame 200.

[0044] In addition, in some embodiments, according to actual needs, the heat dissipation device packaging structure 10 can be provided with a plurality of heat dissipation device packaging structures 10. At this time, the box 20 includes a plurality of frames 200, and the spraying plate 30 is provided with a spraying unit 31 corresponding to the position of the upper opening 210 of each frame 200, so that the cooling liquid can be sprayed towards each upper opening 210 through the spraying unit 31.

[0045] Reference ​In actual application, the spraying plate 30 is connected to the output end of an external cooling liquid supply device, the spraying plate 30 sprays the cooling liquid to the upper opening 210 of the frame 200 through the spraying unit 31, the small-aperture liquid outlet hole 230 is arranged to control the small liquid outlet flow, the cooling liquid is gathered in the frame 200 and fills the internal space of the frame 200 through the gap between the fins 111, the cooling liquid is immersed to the part of the heat dissipation part 100 and the part of the upper surface of the heat-conducting substrate 120 for liquid cooling, so that the heat dissipation efficiency is obviously improved. At the same time, other heat generating devices in the liquid-cooled server are cooled by spraying liquid cooling, so that different heat generating devices can be sprayed and cooled by liquid cooling based on a set of spraying liquid cooling system, the amount of cooling liquid is reduced, the cooling liquid load of the server is avoided to be too large, and the different heat generating devices can be efficiently cooled.

[0046] Obviously, the above embodiments of the utility model are only examples for clearly illustrating the technical scheme of the utility model, and are not a limitation on the specific embodiments of the utility model. Any modification, equivalent replacement and improvement made within the spirit and principle of the utility model claim should be included in the protection scope of the utility model claim.

Claims

1. A heat dissipating device package structure, characterized by, The application relates to a heat dissipation device and a heat dissipation device package structure. The heat dissipation device comprises a heat dissipation part and a heat conduction base plate, and the heat dissipation part is arranged on the upper surface of the heat conduction base plate. The lower end surface of the frame body abuts against the upper surface of the heat conduction base plate, and the internal space of the frame body is arranged with the heat dissipation part, and a gap is left between the inner surface of the frame body and the heat dissipation part.

2. The heat dissipating device package structure of claim 1, wherein, The side part of the frame body is provided with a liquid outlet hole for discharging the cooling liquid.

3. The heat dissipating device package structure of claim 1, wherein, A liquid outlet gap is left between the lower end surface of the frame body and the upper surface of the heat conduction base plate for seeping out the cooling liquid.

4. The heat dissipating device package structure of claim 1, wherein, The heat dissipation part comprises an upper heat conduction plate and a plurality of fins, the upper ends of the fins are in heat conduction connection with the lower surface of the upper heat conduction plate, and the lower ends of the fins are in heat conduction connection with the heat conduction base plate. The fins are arranged in gaps along the thickness direction of the fins, and the cooling liquid can pass through the gaps between the adjacent fins.

5. The heat dissipating device package structure according to any one of claims 1-4, wherein, The orthogonal projection section of the heat dissipation part is a "cross" shape, and the orthogonal projection section of the internal space of the frame body is a rectangle.

6. The heat dissipating device package structure according to any one of claims 1-4, wherein, The heat dissipation part is provided with an extension member extending outward relative to the orthogonal projection section of the heat dissipation part, and the lower end surface of the frame body is provided with an inner extension member extending inward, and the inner extension member and the extension member are in abutting connection.

7. The heat dissipating device package structure according to any one of claims 1-4, wherein, The frame body comprises a first shell and a second shell which are detachably connected, and the first shell and the second shell are connected to jointly surround the heat dissipation part.

8. The heat dissipating device package structure according to any one of claims 1-4, wherein, The inner surface of the frame body is provided with a connecting part for fixedly connecting the heat dissipation part.

9. The heat dissipating device package structure according to any one of claims 1-4, wherein, The inner surface of the frame body is further provided with a guiding part for guiding the cooling liquid to the heat dissipation part.

10. A liquid-cooled server, comprising: The application relates to a heat dissipation device and a heat dissipation device package structure. The surface of the spraying plate towards the internal space of the box body is provided with a plurality of spraying units, and at least one spraying unit sprays the cooling liquid towards the gap between the inner surface of the frame body and the heat dissipation part.

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