Semiconductor packaging assembly and circuit board assembly

Abstract

The utility model provides a semiconductor packaging assembly and a circuit board assembly, which comprise a semiconductor body, the semiconductor body is provided with a pair of auxiliary installation mechanisms, each auxiliary installation mechanism comprises a vertical plate, a transverse plate, a rotating rod, a top plate and an auxiliary rod, and the vertical plate is vertically arranged on the side surface of the semiconductor body and is in contact with the side surface of the semiconductor body. According to the utility model, the pair of auxiliary installation mechanisms is arranged on the semiconductor body, so that the semiconductor body can be installed from the two sides of the short edge of the semiconductor body through the auxiliary installation mechanisms when the semiconductor body is installed on the base; and through cooperation of a rotating rod in the auxiliary installation mechanism and a sleeve on the printed circuit board, a vertical guiding effect can be achieved in the installation process of the semiconductor body, direct contact with the pins of the semiconductor body is avoided in the process, and therefore the pins are prevented from being damaged when the semiconductor body is installed.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of semiconductor packaging, specifically to semiconductor packaging assembly and circuit board assembly. BACKGROUND

[0002] Usually, the chip is fixed on the printed circuit board after forming the semiconductor packaging structure by packaging, and the conventional semiconductor packaging structure includes a plastic package body, a bare core pad, a chip, a bonding wire and a pin, wherein the bare core pad, the chip and the bonding wire are wrapped in the plastic package body, the pin extends from the plastic package body to the outside of the plastic package body, and the bonding wire is connected with the chip and the pin respectively.

[0003] For the DIP packaged chip, the base needs to be welded on the surface of the printed circuit board before installation, and then the pin of the chip is inserted into the chip socket of the base, but the pin of the DIP packaged chip is very small and thin, and needs to be installed vertically, and in the prior art, two fingers are usually used to pinch the middle segment of the chip before plugging and unplugging the DIP packaged chip, and then the chip is installed, but this method is easy to touch the pin, thereby damaging the pin during installation, and the whole DIP packaged chip cannot be used. SUMMARY

[0004] The utility model aims at providing semiconductor packaging assembly and circuit board assembly to solve the problems in the above background.

[0005] To achieve the above purpose, the utility model provides the following technical scheme:

[0006] The semiconductor packaging assembly comprises a semiconductor body, a pair of auxiliary installation mechanisms are arranged on the semiconductor body, the auxiliary installation mechanism comprises a vertical plate, a horizontal plate, a rotating rod, a top plate and an auxiliary rod, the vertical plate is vertically arranged on the side surface of the semiconductor body and is in contact with the side surface of the semiconductor body, the horizontal plate is fixedly connected to the top of the vertical plate, the rotating rod penetrates and is rotatably connected to the center of the horizontal plate, the top plate is fixedly installed on the top of the rotating rod, and the two auxiliary rods are symmetrically hinged to the two sides of the vertical plate.

[0007] Preferably, the two ends of the auxiliary rod and the two ends of the top plate are arc surfaces, and the auxiliary rod and the top plate are parallel to each other.

[0008] Preferably, a recess is arranged at the middle part of the bottom of the semiconductor body, a limiting plate is fixedly connected to the bottom of the vertical plate, the limiting plate is clamped in the recess, and the bottom of the limiting plate is flush with the bottom of the semiconductor body.

[0009] Preferably, the two limiting plates are connected by a pair of telescopic rods, and the pair of telescopic rods are accommodated in the recess.

[0010] The utility model also provides a circuit board assembly, including printed circuit board and a plurality of base that are arranged at intervals and are welded on the printed circuit board, the top of each base is installed semiconductor package component.

[0011] Preferably, the surface of the printed circuit board is provided with a sleeve.

[0012] Compared with the prior art, the utility model has the beneficial effects that:

[0013] The utility model sets up a pair of auxiliary installation mechanism on the semiconductor body, can install from the both sides of the short side of semiconductor body when the semiconductor body is installed on the base, and can play vertical guiding role to the installation process of semiconductor body through the cooperation of the sleeve on the printed circuit board and the rotating rod in the auxiliary installation mechanism, the above process does not directly contact the pin of semiconductor body, thereby preventing damaging the pin when installing semiconductor body. BRIEF DESCRIPTION OF DRAWINGS

[0014] Figure 1 It is the connecting structure schematic view of semiconductor body and base of the utility model;

[0015] Figure 2 It is the main body structure schematic view of auxiliary installation mechanism of the utility model;

[0016] Figure 3 It is the bottom structure schematic view of semiconductor body of the utility model;

[0017] Figure 4 It is the main body structure schematic view of printed circuit board of the utility model.

[0018] In the drawing: 1, semiconductor body;2, vertical board;3, horizontal board;4, rotating rod;5, top plate;6, auxiliary rod;7, recess;8, limit board;9, telescopic rod;10, printed circuit board;11, base;12, sleeve. DETAILED DESCRIPTION

[0019] The technical scheme in the embodiments of the utility model will be described clearly and completely below in conjunction with the drawings in the embodiments of the utility model, and obviously, the described embodiments are only part of the embodiments of the utility model, not all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by the person skilled in the art without creative labor are within the protection scope of the utility model.

[0020] Please refer to Figures 1-4The utility provides a circuit board assembly, including printed circuit board 10 and the multiple base 11 that is arranged at interval and is welded on printed circuit board 10, the top of each base 11 is installed semiconductor package assembly, semiconductor package assembly includes semiconductor body 1, a pair of auxiliary installation mechanism is arranged on semiconductor body 1, auxiliary installation mechanism includes vertical plate 2, horizontal plate 3, rotating lever 4, top plate 5 and auxiliary rod 6, vertical plate 2 is vertically arranged in the side of semiconductor body 1 and is in contact with the side of semiconductor body 1, horizontal plate 3 is fixedly connected to the top of vertical plate 2, rotating lever 4 is connected to the center position of horizontal plate 3 and is rotated, top plate 5 is fixedly installed on the top of rotating lever 4, two auxiliary rods 6 are symmetrically hinged on the two sides of vertical plate 2, and the surface of printed circuit board 10 is provided with sleeve 12.

[0021] Please refer to Figure 1 、 2 and 4, when the semiconductor body 1 is inserted into the base 11, the bottom end of the rotating lever 4 is placed on the top of the sleeve 12, then the pins of the semiconductor body 1 are pre-inserted into the insertion slot of the base 11, and the vertical state of the rotating lever 4 is maintained, then the bottom of the top plate 5 is in contact with the top surface of the semiconductor body 1 and simultaneously presses the two top plates 5, the top plate 5 can transmit the pressure to the top of the semiconductor body 1, so that the pins of the semiconductor body 1 are inserted into the insertion slot of the base 11, and in the above process, the bottom end of the rotating lever 4 is vertically lowered and slowly enters the inside of the sleeve 12, because the rotating lever 4 always maintains a vertical state during movement, and the bottom of the top plate 5 is always in contact with the top of the semiconductor body 1, so the semiconductor body 1 can also be vertically lowered until it is installed on the surface of the base 11.

[0022] It should be noted that in the above process, the pins of the semiconductor body 1 are not touched during the installation process of the semiconductor body 1, so that the deformation of the pins under stress can be prevented, and the pins always maintain a vertical movement state during insertion and removal, which can further prevent the pins from being damaged.

[0023] In this embodiment, if the installation between the semiconductor body 1 and the base 11 does not match, the semiconductor body 1 needs to be removed from the surface of the base 11 and installed on the correct base 11, when the semiconductor body 1 is removed from the surface of the base 11, the rotating lever 4 is rotated, so that the rotating lever 4 drives the top plate 5 to rotate synchronously, so that the top plate 5 is perpendicular to the side surface of the semiconductor body 1, then the two auxiliary rods 6 are rotated by 90°, so that the two auxiliary rods 6 maintain a parallel state, then the thumb holds the top plate 5 still, the index finger slowly increases the force from the bottom of the auxiliary rod 6, so that the auxiliary rod 6 drives the horizontal plate 3 to move on the surface of the rotating lever 4, at this time the horizontal plate 3 can drive the semiconductor body 1 to move upwards synchronously through the vertical plate 2, so that the semiconductor body 1 is separated from the surface of the base 11.

[0024] The two ends of the auxiliary rod 6 and the two ends of the top plate 5 are arc-shaped, and the auxiliary rod 6 and the top plate 5 are parallel to each other.

[0025] Please refer to Figure 2 Since the auxiliary rod 6 needs to be lifted through the side of the index finger during use, the arc-shaped end of the auxiliary rod 6 can prevent scratching the index finger, and the other end of the auxiliary rod 6 is the hinge with the vertical plate 2, which can be freely rotated after being arc-shaped.

[0026] It should be noted that the auxiliary rod 6 is used for disassembling the semiconductor body 1 as a structure synchronized with the semiconductor body 1, and the height of the rotating rod 4 is unchanged when the semiconductor body 1 is disassembled. The height of the auxiliary rod 6 is changed on the surface of the rotating rod 4 to achieve the disassembly of the semiconductor body 1, so the auxiliary rod 6 needs to be parallel to the top plate 5 to facilitate force application.

[0027] The middle part of the bottom of the semiconductor body 1 is provided with a groove 7, and the bottom of the vertical plate 2 is fixedly connected with a limiting plate 8. The limiting plate 8 is clamped in the groove 7, and the bottom of the limiting plate 8 is flush with the bottom of the semiconductor body 1. The two limiting plates 8 are connected by a pair of telescopic rods 9, and the telescopic rods 9 are accommodated in the groove 7.

[0028] Please refer to Figure 2 and 3 In this embodiment, the limiting plate 8 is added to the bottom of the vertical plate 2, which can be clamped in the groove 7. The telescopic rod 9 between the two limiting plates 8 can adjust the horizontal distance between the two limiting plates 8, so that the two limiting plates 8 can adapt to different sizes of semiconductor bodies 1. When the semiconductor body 1 is removed, the vertical plate 2 will be vertically lifted under the driving of the auxiliary rod 6. At this time, the vertical plate 2 can lift the semiconductor body 1 upward from the inside of the groove 7 through the limiting plate 8 and the telescopic rod 9, so that the semiconductor body 1 can gradually separate from the inside of the base 11. Moreover, since the groove 7 is located in the middle of the semiconductor body 1, the force on both sides of the semiconductor body 1 is the same, and the pins on both sides can be separated from the slot of the base 11 under the same force.

[0029] It should be noted that normally the surface of the base 11 is provided with a through slot for easy heat dissipation. In this embodiment, the groove 7 at the bottom of the semiconductor body 1 is used to accommodate the limiting plate 8 and the telescopic rod 9. However, the cross section of the telescopic rod 9 is circular, so the telescopic rod 9 cannot completely fill the inside of the groove 7. At this time, the semiconductor body 1 can dissipate heat through the groove 7, the gap between the groove 7 and the telescopic rod 9, and the gap between the telescopic rod 9 and the through slot of the base 11.

[0030] It should be known that the one end of the telescopic rod 9 is connected with the limiting plate 8 in a plug-in type, the one end of the telescopic rod 9 is fixed in the inside of the limiting plate 8 through the friction force, after the semiconductor body 1 is installed on the base 11, the telescopic rod 9 can be gradually elongated to the maximum degree through the way of laterally pulling one of the limiting plates 8, finally the telescopic rod 9 can be made to fall off from the side of one of the limiting plates 8 through continuously pulling the limiting plate 8, so as to take off the two auxiliary installation mechanisms from the side of the semiconductor body 1, finally the sleeve 12 is taken away, so that the printed circuit board 10 can be normally used.

[0031] Although the embodiments of the present application have been shown and described, it should be understood by those ordinary skilled in the art that various changes, modifications, replacements and variations can be made to the embodiments without departing from the principles and spirits of the present application, the scope of the present application is defined by the appended claims and their equivalents.

Claims

1. A semiconductor package assembly for encapsulation of a semiconductor body (1), characterized in that: The semiconductor body (1) is provided with a pair of auxiliary mounting mechanisms, which comprises a vertical plate (2), a horizontal plate (3), a rotating rod (4), a top plate (5) and an auxiliary rod (6), the vertical plate (2) is vertically arranged on the side of the semiconductor body (1) and is in contact with the side of the semiconductor body (1), the horizontal plate (3) is fixedly connected to the top of the vertical plate (2), the rotating rod (4) is penetratingly and rotatably connected to the central part of the horizontal plate (3), the top plate (5) is fixedly installed on the top of the rotating rod (4), and two auxiliary rods (6) are symmetrically hinged to the two sides of the vertical plate (2).

2. The semiconductor package assembly of claim 1, wherein: Both ends of the auxiliary rod (6) and both ends of the top plate (5) are arc-shaped, and the auxiliary rod (6) and the top plate (5) are parallel to each other.

3. The semiconductor package assembly of claim 1, wherein: The middle part of the bottom of the semiconductor body (1) is provided with a groove (7), the bottom of the vertical plate (2) is fixedly connected with a limiting plate (8), the limiting plate (8) is clamped in the inside of the groove (7), and the bottom of the limiting plate (8) is flush with the bottom of the semiconductor body (1).

4. The semiconductor package assembly of claim 3, wherein: The two limiting plates (8) are connected by a pair of telescopic rods (9), and the telescopic rods (9) are accommodated in the inside of the groove (7).

5. A circuit board assembly, characterized by It comprises a printed circuit board (10) and a plurality of bases (11) spaced apart and welded on the printed circuit board (10), the top of each base (11) is installed with a semiconductor packaging assembly, and the semiconductor packaging assembly is the semiconductor packaging assembly of any one of claims 1-4.

6. The circuit board assembly of claim 5, wherein: The surface of the printed circuit board (10) is provided with a sleeve (12).

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