Fixing device for wafer surface processing

Abstract

The utility model discloses a fixing device for wafer surface processing, which comprises an inner cylinder, the top of the inner cylinder is fixedly connected with a carrier plate, the middle of the carrier plate is uniformly provided with air exhaust holes, the bottom of the inner cylinder is fixedly connected with a circular bottom plate, the circumference of the side surface of the inner cylinder is fixedly connected with an annular bottom plate, and the circumference of the annular bottom plate is fixedly connected with an outer cylinder. An annular hole is formed between the inner wall of the top of the outer cylinder and the outer wall of the carrier plate, a cavity is formed between the inner wall of the outer cylinder and the outer wall of the inner cylinder, a circular groove used for containing a wafer is formed between the upper end of the outer cylinder and the carrier plate, spraying mechanisms are symmetrically arranged on the two sides of the outer cylinder, and a rotary cleaning device is rotationally arranged above the outer cylinder. According to the utility model, the bottom surface of the circular groove on the carrier plate is cleaned through the spraying mechanism and the rotary cleaning device, and the circumferential edge and the middle of the wafer in contact with the carrier plate are adsorbed and fixed through the annular hole and the air exhaust hole successively, so that the air tightness between the vacuum groove and the wafer is enhanced, and the firmness of fixation is improved.

Description

TECHNICAL FIELD

[0001] The utility model belongs to wafer processing technical field especially relates to a fixing device for wafer surface processing. BACKGROUND

[0002] Wafer and its surface processing are the core part in the semiconductor manufacturing process, directly influence the performance, reliability and yield of final chip, wafer is usually made of single crystal silicon circular sheet, after a series of complex processing steps on the surface to realize the construction of circuit, these surface processing steps mainly include photoetching, etching, deposition, doping etc., the premise of these processing is to need to fix wafer, and the reliability of wafer fixing device is crucial.

[0003] However, the prior art has some problems: the commonly used wafer fixing method is to use vacuum chuck to fix wafer, and if there is dust and other impurities on the surface of vacuum chuck, it will cause poor air tightness between the contact surface of vacuum chuck and wafer, resulting in wafer not being fixed firmly and sliding or falling, therefore we propose a fixing device for wafer surface processing. UTILITY MODEL CONTENTS

[0004] In view of the problems existing in the prior art, the utility model aims at providing a fixing device for wafer surface processing, which sprays high-concentration alcohol through the spraying mechanism and rotates the cleaning device to clean the contact surface between the circular groove bottom in the middle of the carrier plate and the wafer, ensures the cleaning of the contact surface, avoids contaminating the wafer, then first fixes the wafer edge through the annular hole, ensures the air tightness of the middle part of the wafer, then fixes the middle part of the wafer in contact with the circular groove bottom through the air suction hole, enhances the air tightness between the vacuum groove and the wafer, thereby improving the firmness of the fixing.

[0005] The utility model is realized in this way, a fixing device for wafer surface processing, including inner cylinder, the inner cylinder top fixedly connected with the carrier plate, the carrier plate middle evenly is equipped with the air suction hole, the inner cylinder bottom fixedly connected with the circular bottom plate, the inner cylinder side surface circumference fixedly connected with the annular bottom plate, the annular bottom plate circumference fixedly connected with the outer cylinder, the outer cylinder top inner wall with the carrier plate outer wall between being provided with the annular hole, the outer cylinder inner wall with the inner cylinder outer wall between being provided with the cavity, the outer cylinder upper end with the carrier plate between being provided with the circular groove for placing wafer, the outer cylinder both sides symmetry is provided with the spraying mechanism, the outer cylinder top rotatably provided with the rotating cleaning device.

[0006] Optionally, the spraying mechanism includes a spray head, the spray head is fixedly connected with the outer side of the outer cylinder, the spray head is connected with a conveying pipe below, and the conveying pipe is connected with a storage barrel below.

[0007] Optionally, the side surface of the inner cylinder and the outer cylinder is fixedly connected with an air extraction pipe, and the two groups of air extraction pipes are respectively penetrated through the cylinder wall of the inner cylinder and the outer cylinder.

[0008] Optionally, one side of the outer cylinder is provided with a fixed plate, one side of the fixed plate is rotatably connected with a rotating plate, one end of the rotating plate is rotatably connected with a rotating rod, one end of the rotating rod is fixedly connected with the rotating cleaning device, and the other end of the rotating rod is provided with a servo motor.

[0009] Optionally, a locking groove is formed in the rotating plate, a first locking rod is rotatably connected with the upper end edge of the carrier plate, and a second locking rod is rotatably connected with the fixed plate.

[0010] Optionally, the first locking rod and the second locking rod are penetrated through the locking groove, the rotating plate and the carrier plate are clamped and connected through the first locking rod and the locking groove, and the rotating plate and the fixed plate are clamped and connected through the second locking rod and the locking groove.

[0011] Optionally, the outer wall radius of the inner cylinder is equal to the inner wall radius of the annular hole, and the radius of the circular groove is greater than the outer wall radius of the annular hole.

[0012] Compared with the prior art, the utility model has the advantages that:

[0013] 1. The circular groove bottom and the wafer contact surface are cleaned by the spraying mechanism and the rotating cleaning device, the circular groove bottom surface is ensured to be clean, the wafer is prevented from being polluted, and the wafer and the circular groove bottom contact surface are ensured to be tightly attached.

[0014] 2. The wafer edge is first fixed by air extraction and adsorption through the annular hole, the air tightness of the wafer and the circular groove bottom contact middle part is ensured, then the wafer and the circular groove bottom contact middle part are fixed by air extraction and adsorption through the air extraction hole, the air tightness between the contact surface and the wafer is enhanced, and the fixing firmness is improved.

[0015] Other features and advantages of the utility model will become apparent from the following detailed description of exemplary embodiments thereof, with reference to the drawings. BRIEF DESCRIPTION OF DRAWINGS

[0016] Figure 1 is the structural schematic view provided by the utility model;

[0017] Figure 2 is the outer cylinder and the inner cylinder schematic view provided by the utility model;

[0018] Figure 3It is the bottom schematic view of the outer cylinder and the inner cylinder provided by the utility model,

[0019] Figure 4 It is the cross section schematic view of the outer cylinder and the inner cylinder provided by the utility model,

[0020] Figure 5 It is the schematic view of the spraying mechanism provided by the utility model,

[0021] Figure 6 It is the schematic view of the rotary cleaning device provided by the utility model.

[0022] In the figure: 1, outer cylinder;110, carrier plate;111, circular groove;112, air extraction hole;113, annular hole;120, first locking rod;130, annular bottom plate;2, inner cylinder;210, circular bottom plate;3, spraying mechanism;310, spraying head;320, conveying pipe;330, storage barrel;4, fixed plate;410, second locking rod;420, rotating plate;430, servo motor;440, rotary cleaning device;450, rotating rod;5, air extraction pipe. DETAILED DESCRIPTION

[0023] In order to further understand the utility model content, characteristics and efficacy of the utility model, the following examples are cited, and the following is described in detail with the help of the drawings.

[0024] As Figures 1 to 6 Indicated, the utility model embodiment provides a kind of fixing device for wafer surface processing, including inner cylinder 2, inner cylinder 2 top is fixedly connected with carrier plate 110, carrier plate 110 middle is evenly provided with air extraction hole 112, inner cylinder 2 bottom is fixedly connected with circular bottom plate 210, inner cylinder 2 side circumference is fixedly connected with annular bottom plate 130, annular bottom plate 130 circumference is fixedly connected with outer cylinder 1, and annular hole 113 is arranged between the outer wall of carrier plate 110 and the inner wall of outer cylinder 1 top, and cavity is arranged between the outer wall of inner cylinder 2 and the inner wall of outer cylinder 1, and circular groove 111 for placing wafer is arranged between the upper end of outer cylinder 1 and carrier plate 110, and spraying mechanism 3 is symmetrically arranged on the both sides of outer cylinder 1, and rotary cleaning device 440 is rotatably arranged above outer cylinder 1;

[0025] It needs to be explained that, first, the edge of wafer is fixed by air suction through annular hole 113, to ensure the air tightness of the middle part of wafer and circular groove 111 bottom contact, then the middle part is fixed by air suction through air extraction hole 112, to ensure the air tightness between the contact surface of wafer and circular groove 111 bottom, and the fixing of wafer is more firm.

[0026] The embodiment of the application, preferably, the spraying mechanism 3 comprises a spraying head 310, the spraying head 310 is fixedly connected with the outside of the outer cylinder 1, a conveying pipe 320 is connected below the spraying head 310, and a storage barrel 330 is connected below the conveying pipe 320;

[0027] It should be noted that the storage barrel 330 stores high-concentration alcohol, the high-concentration alcohol is sent to the spraying head 310 by a liquid pump in the storage barrel 330, and the bottom surface of the circular groove 111 is sprayed and cleaned, so that the bottom surface of the circular groove 111 is cleaned, and the wafer is prevented from being polluted.

[0028] The embodiment of the application, preferably, the side surfaces of the inner cylinder 2 and the outer cylinder 1 are fixedly connected with two groups of air extraction pipes 5, one end of the two groups of air extraction pipes 5 penetrates the cylinder wall of the inner cylinder 2 and the outer cylinder 1 respectively;

[0029] It should be noted that the air extraction pipe 5 on the outer cylinder 1 is connected with a vacuum pump, the wafer is adsorbed and fixed on the bottom surface of the circular groove 111 by the vacuum pump through the annular hole 113, the air tightness of the middle part of the wafer in contact with the bottom of the circular groove 111 is ensured, the air extraction pipe 5 on the inner cylinder 2 is connected with another group of vacuum pumps, the vacuum pumps extract air from the middle part of the wafer in contact with the bottom of the circular groove 111 through the air extraction hole 112, and the firmness of the fixing is improved.

[0030] The embodiment of the application, preferably, the outer cylinder 1 is provided with a fixed plate 4 on one side, the fixed plate 4 is rotatably connected with a rotating plate 420 on one side, the rotating plate 420 is rotatably connected with a rotating rod 450 at one end, the rotating rod 450 is fixedly connected with a rotary cleaning device 440 at one end, and the rotating rod 450 is provided with a servo motor 430 at the other end; the servo motor 430 is fixedly connected with the rotating plate 420, and the output shaft of the servo motor 430 is fixedly connected with the rotating rod 450;

[0031] It should be noted that the rotary cleaning device 440 is placed on the fixed plate 4 through the rotating plate 420, in use, the first locking rod 120 is rotated, the rotating plate 420 is rotated by hand, the rotary cleaning device 440 is placed in the circular groove 111, the bottom of the rotary cleaning device 440 is attached to the bottom of the circular groove 111, the servo motor 430 is started to rotate the rotary cleaning device 440 to wipe the high-concentration alcohol sprayed by the spraying head 310, the rotary cleaning device 440 can be made of soft materials such as sponge or cotton, so as to avoid scratches on the wafer surface, and a soft sleeve can be added outside when cotton is used to prevent cotton fibers from adhering to the wafer surface.

[0032] The embodiment of the application preferably, the rotating plate 420 is provided with a locking groove, the first locking rod 120 is rotatably connected to the upper end edge of the carrier plate 110, and the second locking rod 410 is rotatably connected to the fixed plate 4; the first locking rod 120 and the second locking rod 410 penetrate the locking groove, the rotating plate 420 is clamped and connected with the carrier plate 110 through the first locking rod 120 and the locking groove, and the rotating plate 420 is clamped and connected with the fixed plate 4 through the second locking rod 410 and the locking groove.

[0033] It should be noted that the second locking rod 410 is transversely clamped with the locking groove by rotating the second locking rod 410, so that the rotating plate 420 is fixed on the fixed plate 4, the stable placement of the rotating cleaning device 440 is realized, the rotating cleaning device 440 is placed into the circular groove 111 and is attached to the bottom surface of the circular groove 111 by rotating the second locking rod 410 again during use, at this time, the rotating plate 420 is fixed by rotating the first locking rod 120, so that the rotating cleaning device 440 does not jump up and down when the servo motor 430 rotates, and the wiping and cleaning effect is affected, the high-concentration alcohol sprayed by the spraying head 310 is cleaned by the rotating cleaning device 440, the high-concentration alcohol is easy to evaporate and does not easily pollute the wafer, and the cleaning of the bottom surface of the circular groove 111 is ensured through the wiping and cleaning of the rotating cleaning device 440.

[0034] The embodiment of the application preferably, the outer wall radius of the inner cylinder 2 is equal to the inner wall radius of the annular hole 113, and the radius of the circular groove 111 is greater than the outer wall radius of the annular hole 113.

[0035] It should be noted that the annular hole 113 communicates the circular groove 111 and the cavity between the outer cylinder 1 and the inner cylinder 2, the vacuum pump connected outside draws air in the cavity and the annular hole 113 through the air suction pipe 5, so that the wafer edge is adsorbed and fixed, the air tightness between the wafer and the contact part of the carrier plate 110 is improved, and in order to adsorb and fix the wafer edge, the radius of the circular groove 111 needs to be set to be greater than the outer wall radius of the annular hole 113.

[0036] Although the embodiments of the utility model have been shown and described, it can be understood by those skilled in the art that various changes, modifications, replacements and variations can be made to these embodiments without departing from the principles and spirits of the utility model, and the scope of the utility model is defined by the appended claims and their equivalents.

Claims

1. A fixing device for wafer surface processing, comprising an inner cylinder (2), characterized in that: The inner cylinder (2) top fixedly connected with the carrier plate (110), the carrier plate (110) middle evenly provided with the air extraction hole (112), the inner cylinder (2) bottom fixedly connected with the circular bottom plate (210), the inner cylinder (2) side circumference fixedly connected with the annular bottom plate (130), the annular bottom plate (130) circumference fixedly connected with the outer cylinder (1), the outer cylinder (1) top inner wall and the carrier plate (110) outer wall between the annular hole (113) is arranged, the outer cylinder (1) inner wall and the inner cylinder (2) outer wall between the cavity is arranged, the outer cylinder (1) upper end and the carrier plate (110) between the circular groove (111) for placing wafer is arranged, the outer cylinder (1) both sides symmetrically provided with the spraying mechanism (3), the outer cylinder (1) above rotationally arranged with the rotary cleaning device (440).

2. The fixing device for wafer surface processing according to claim 1, wherein: The spraying mechanism (3) includes a spray head (310), the spray head (310) is fixedly connected with the outer side of the outer cylinder (1), the spray head (310) is connected with the conveying pipe (320) below, the conveying pipe (320) is connected with the storage barrel (330) below.

3. The fixing device for wafer surface processing according to claim 2, wherein: The side of the inner cylinder (2) and the outer cylinder (1) is fixedly connected with the air extraction pipe (5), and the air extraction pipe (5) is respectively penetrated through the cylinder wall of the inner cylinder (2) and the outer cylinder (1) at one end.

4. The fixing device for wafer surface processing according to claim 3, wherein: One side of the outer cylinder (1) is provided with a fixed plate (4), one side of the fixed plate (4) is rotatably connected with a rotating plate (420), one end of the rotating plate (420) is rotatably connected with a rotating rod (450), one end of the rotating rod (450) is fixedly connected with the rotary cleaning device (440), the other end of the rotating rod (450) is provided with a servo motor (430), the servo motor (430) is fixedly connected with the rotating plate (420), and the output shaft of the servo motor (430) is fixedly connected with the rotating rod (450).

5. The apparatus of claim 4, wherein: The rotating plate (420) is provided with a locking groove, and the first locking rod (120) is rotatably connected to the edge of the upper end of the carrier plate (110). The second locking rod (410) is rotatably connected to the fixed plate (4).

6. The apparatus of claim 5, wherein: The first locking rod (120) and the second locking rod (410) penetrate the locking groove, and the rotating plate (420) and the carrier plate (110) are connected by the first locking rod (120) and the locking groove, and the rotating plate (420) and the fixed plate (4) are connected by the second locking rod (410) and the locking groove.

7. The apparatus of claim 1, wherein: The outer wall radius of the inner cylinder (2) is equal to the inner wall radius of the annular hole (113), and the radius of the circular groove (111) is greater than the outer wall radius of the annular hole (113).

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