Wafer cleaning device capable of preventing wafer surface from being damaged
By using a motor-driven active and auxiliary roller in conjunction with an electric slide rail slider, the wafer is rotated for cleaning and high-pressure gas nozzles move for cleaning and drying. This solves the problem of surface damage caused by wafer cleaning devices and improves cleaning efficiency and safety.
Patent Information
- Application Number
- CN202520025798.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-01-07
- Publication Date
- 2025-12-26
- Estimated Expiration
- 2035-01-07
AI Technical Summary
Existing wafer cleaning equipment is prone to damaging the wafer surface during the cleaning process, which affects subsequent processing.
The system employs motor-driven active and auxiliary rollers in conjunction with electric slide rails and sliders to achieve wafer rotation cleaning and high-pressure gas nozzle movement cleaning and drying, avoiding direct contact that could cause damage.
It achieves efficient cleaning and drying of wafer surfaces, avoids surface damage, and improves cleaning effect and ease of operation.
Smart Images
Figure CN223728735U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to wafer technical field especially is related to a wafer cleaning device of preventing wafer surface damage. BACKGROUND
[0002] Wafer is the short name of semiconductor crystal wafer, is usually cylindrical semiconductor crystal thin slice, is used in integrated circuit process as the substrate of carrier, and the main purpose of wafer cleaning is to remove the pollutants on the wafer surface and inside, to ensure the purity and performance of wafer, wafer will contact various organic matters, particles and metals in the manufacturing process, these pollutants will affect the performance and yield of wafer, and cleaning is an important process step in wafer manufacturing process.
[0003] The prior art in the above has the following defects: when the existing wafer is subjected to surface cleaning operation, the cleaning mechanism directly acts on the wafer surface, which will cause surface damage, scratches, and will affect the subsequent processing and use. UTILITY MODEL CONTENT
[0004] The utility model discloses a wafer cleaning device of preventing wafer surface damage.
[0005] To achieve the above object, the utility model provides the following technical scheme:
[0006] A wafer cleaning device of preventing wafer surface damage, including the base, the inside of the base is opened with the water draining groove, the inside of the base is fixedly connected with the support seat, the outer side of the support seat is fixedly connected with the mounting plate, the outer side of the mounting plate is fixedly connected with the motor, the active rubber roller and the auxiliary rubber roller are installed between the mounting plate, the bottom of the base is fixedly connected with the water collecting hopper on the outside of the water draining groove, the outer side of the water collecting hopper is fixedly connected with the water outlet pipe, and the outer side of the base is provided with the control panel.
[0007] By adopting the above technical scheme, the water draining groove is increased at the lower end of the base, the water draining groove can drain water from the inside of the base during cleaning, and the motor and the active rubber roller are increased, which can drive the wafer located at the upper end to rotate and start cleaning, facilitating operation.
[0008] Further, one side of the inside of the base is fixedly connected with the first electric sliding rail, the other side of the inside of the base is fixedly connected with the second electric sliding rail, the outer side of the first electric sliding rail is installed with the first electric sliding block, the outer side of the first electric sliding block is fixedly connected with the support, the outer side of the support is fixedly connected with the water tank, one side of the outer side of the water tank is fixedly connected with the spray head, and the other side of the outer side of the water tank is fixedly connected with the water pipe.
[0009] By adopting the above technical scheme, the electric sliding rail and the electric sliding block can drive the cleaning structure and the air jet structure to move, clean and blow air to the outer side of the wafer, and facilitate operation.
[0010] Further, the outer side of the second electric sliding rail is provided with a second electric sliding block, the outer side of the second electric sliding block is fixedly connected with a connecting pipe, one end of the outer side of the connecting pipe is fixedly connected with a high-pressure gas nozzle, and the other end of the outer side of the connecting pipe is fixedly connected with an air pipe.
[0011] By adopting the above technical scheme, the high-pressure gas nozzle can jet air to the cleaned wafer to blow away the moisture on the surface.
[0012] Further, the output end of the motor is fixedly connected with one end of the driving rubber roller, the other end of the driving rubber roller is rotatably connected with the mounting plate through a bearing, and the auxiliary rubber roller is rotatably connected with the mounting plate through a bearing.
[0013] By adopting the above technical scheme, the driving rubber roller can drive the wafer to rotate, facilitating cleaning and air blowing operation.
[0014] Further, the first electric sliding rail and the first electric sliding block are slidingly connected, the second electric sliding rail and the second electric sliding block are slidingly connected, and the control panel is electrically connected with the motor, the first electric sliding rail, the first electric sliding block, the second electric sliding rail and the second electric sliding block.
[0015] By adopting the above technical scheme, better control and adjustment can be facilitated.
[0016] In summary, the beneficial technical effects of the utility model are as follows:
[0017] 1. The motor, the driving rubber roller and the auxiliary rubber roller are adopted, the motor drives the driving rubber roller to rotate, and the auxiliary rubber roller on the outer side is used in cooperation, so that the wafer can be driven to rotate, efficient cleaning of the outer side of the wafer can be realized, and the effect of facilitating operation is achieved.
[0018] 2. The electric sliding rail and the electric sliding block are adopted, the first electric sliding rail and the first electric sliding block drive the nozzle to move, the second electric sliding rail and the second electric sliding block drive the high-pressure gas nozzle to move, cleaning can be first performed, air jet treatment can be performed after cleaning is completed, the moisture on the surface can be blown away, and the effect of efficient cleaning is achieved. DRAWINGS
[0019] Figure 1 The utility model is a whole structure schematic Figure 1 ;
[0020] Figure 2 The utility model is a whole structure schematic Figure 2 ;
[0021] Figure 3 It is the three-dimensional structure schematic view of the base of the utility model;
[0022] Figure 4 It is the three-dimensional structure schematic view of the support seat of the utility model;
[0023] Figure 5 It is the three-dimensional structure schematic view of the inside of the base of the utility model Figure 1 ;
[0024] Figure 6 It is the three-dimensional structure schematic view of the inside of the base of the utility model Figure 2 .
[0025] In the drawing, 1, base; 2, drain groove; 3, support seat; 4, mounting plate; 5, motor; 6, driving rubber roller; 7, auxiliary rubber roller; 8, water collecting hopper; 9, water outlet pipe; 10, control panel; 11, first electric sliding rail; 12, first electric sliding block; 13, support; 14, water tank; 15, spray head; 16, water pipe; 17, second electric sliding rail; 18, second electric sliding block; 19, connecting pipe; 20, high-pressure gas nozzle; 21, gas pipe. DETAILED DESCRIPTION
[0026] The utility model will be further explained in detail in connection with the drawings.
[0027] Refer to Figures 1-6The utility model provides a kind of wafer cleaning device for preventing wafer surface damage, including base 1, the inside of base 1 is opened with drain groove 2, the inside of base 1 is fixedly connected with support seat 3, support seat 3 outside is fixedly connected with mounting plate 4, the outside of mounting plate 4 is fixedly connected with motor 5, active rubber roller 6 and auxiliary rubber roller 7 are installed between mounting plate 4, the bottom of base 1 is fixedly connected with water collecting hopper 8 outside drain groove 2, water collecting hopper 8 outside is fixedly connected with water outlet pipe 9, the outside of base 1 is provided with control panel 10, one side of the inside of base 1 is fixedly connected with first electric slide rail 11, the other side of the inside of base 1 is fixedly connected with second electric slide rail 17, the outside of first electric slide rail 11 is installed with first electric sliding block 12, the outside of first electric sliding block 12 is fixedly connected with support 13, the outside of support 13 is fixedly connected with water tank 14, one side of water tank 14 outside is fixedly connected with shower head 15, the other side of water tank 14 outside is fixedly connected with water pipe 16, the outside of second electric slide rail 17 is installed with second electric sliding block 18, the outside of second electric sliding block 18 is fixedly connected with connecting pipe 19, one end of connecting pipe 19 outside is fixedly connected with high pressure gas nozzle 20, the other end of connecting pipe 19 outside is fixedly connected with gas pipe 21, drain groove 2 is increased in the lower end of base 1, drain groove 2 can be discharged from the inside of base 1 when washing, increase motor 5 and active rubber roller 6 simultaneously, can drive wafer located in upper end to rotate, start to wash, convenient operation, electric slide rail and electric sliding block can drive cleaning structure and air jet structure to move, the outside of wafer is washed and is blown, convenient operation, by high pressure gas nozzle 20 can be jetted after the wafer of washing, the moisture on surface is blown away.
[0028] As Figures 1-6 The utility model discloses a kind of wafer cleaning device for preventing wafer surface damage, including base 1, the inside of base 1 is opened with drain groove 2, the inside of base 1 is fixedly connected with support seat 3, support seat 3 outside is fixedly connected with mounting plate 4, the outside of mounting plate 4 is fixedly connected with motor 5, active rubber roller 6 and auxiliary rubber roller 7 are installed between mounting plate 4, the bottom of base 1 is fixedly connected with water collecting hopper 8 outside drain groove 2, water collecting hopper 8 outside is fixedly connected with water outlet pipe 9, the outside of base 1 is provided with control panel 10, one side of the inside of base 1 is fixedly connected with first electric slide rail 11, the other side of the inside of base 1 is fixedly connected with second electric slide rail 17, the outside of first electric slide rail 11 is installed with first electric sliding block 12, the outside of first electric sliding block 12 is fixedly connected with support 13, the outside of support 13 is fixedly connected with water tank 14, one side of water tank 14 outside is fixedly connected with shower head 15, the other side of water tank 14 outside is fixedly connected with water pipe 16, the outside of second electric slide rail 17 is installed with second electric sliding block 18, the outside of second electric sliding block 18 is fixedly connected with connecting pipe 19, one end of connecting pipe 19 outside is fixedly connected with high pressure gas nozzle 20, the other end of connecting pipe 19 outside is fixedly connected with gas pipe 21, drain groove 2 is increased in the lower end of base 1, drain groove 2 can be discharged from the inside of base 1 when washing, increase motor 5 and active rubber roller 6 simultaneously, can drive wafer located in upper end to rotate, start to wash, convenient operation, electric slide rail and electric sliding block can drive cleaning structure and air jet structure to move, the outside of wafer is washed and is blown, convenient operation, by high pressure gas nozzle 20 can be jetted after the wafer of washing, the moisture on surface is blown away.
[0029] The utility model discloses a kind of wafer cleaning device for preventing wafer surface damage, including base 1, the inside of base 1 is opened with drain groove 2, the inside of base 1 is fixedly connected with support seat 3, support seat 3 outside is fixedly connected with mounting plate 4, the outside of mounting plate 4 is fixedly connected with motor 5, active rubber roller 6 and auxiliary rubber roller 7 are installed between mounting plate 4, the bottom of base 1 is fixedly connected with water collecting hopper 8 outside drain groove 2, water collecting hopper 8 outside is fixedly connected with water outlet pipe 9, the outside of base 1 is provided with control panel 10, one side of the inside of base 1 is fixedly connected with first electric slide rail 11, the other side of the inside of base 1 is fixedly connected with second electric slide rail 17, the outside of first electric slide rail 11 is installed with first electric sliding block 12, the outside of first electric sliding block 12 is fixedly connected with support 13, the outside of support 13 is fixedly connected with water tank 14, one side of water tank 14 outside is fixedly connected with shower head 15, the other side of water tank 14 outside is fixedly connected with water pipe 16, the outside of second electric slide rail 17 is installed with second electric sliding block 18, the outside of second electric sliding block 18 is fixedly connected with connecting pipe 19, one end of connecting pipe 19 outside is fixedly connected with high pressure gas nozzle 20, the other end of connecting pipe 19 outside is fixedly connected with gas pipe 21, drain groove 2 is increased in the lower end of base 1, drain groove 2 can be discharged from the inside of base 1 when washing, increase motor 5 and active rubber roller 6 simultaneously, can drive wafer located in upper end to rotate, start to wash, convenient operation, electric slide rail and electric sliding block can drive cleaning structure and air jet structure to move, the outside of wafer is washed and is blown, convenient operation, by high pressure gas nozzle 20 can be jetted after the wafer of washing, the moisture on surface is blown away.
[0030] The embodiments of the present embodiment are the preferred embodiments of the present utility model, not limited to the protection scope of the present utility model, so: all equivalent changes made according to the structure, shape, principle of the present utility model should be covered in the protection scope of the present utility model.
Claims
1. A wafer cleaning device for preventing damage to the wafer surface, comprising a base (1), characterized in that: The inside of the base (1) is provided with a drain groove (2), the inside of the base (1) is fixedly connected with a support seat (3), the outer side of the support seat (3) is fixedly connected with a mounting plate (4), the outer side of the mounting plate (4) is fixedly connected with a motor (5), the mounting plate (4) is installed with a driving rubber roller (6) and an auxiliary rubber roller (7), the bottom of the base (1) is fixedly connected with a water collecting bucket (8) outside the drain groove (2), the outer side of the water collecting bucket (8) is fixedly connected with a water outlet pipe (9), and the outer side of the base (1) is provided with a control panel (10).
2. The wafer cleaning apparatus for preventing wafer surface damage according to claim 1, wherein: One side of the inside of the base (1) is fixedly connected with a first electric sliding rail (11), the other side of the inside of the base (1) is fixedly connected with a second electric sliding rail (17), the outer side of the first electric sliding rail (11) is installed with a first electric sliding block (12), the outer side of the first electric sliding block (12) is fixedly connected with a support (13), the outer side of the support (13) is fixedly connected with a water tank (14), one side of the outer side of the water tank (14) is fixedly connected with a spray head (15), and the other side of the outer side of the water tank (14) is fixedly connected with a water pipe (16).
3. The wafer cleaning apparatus for preventing wafer surface damage according to claim 2, wherein: The outer side of the second electric sliding rail (17) is installed with a second electric sliding block (18), the outer side of the second electric sliding block (18) is fixedly connected with a connecting pipe (19), one end of the outer side of the connecting pipe (19) is fixedly connected with a high-pressure gas nozzle (20), and the other end of the outer side of the connecting pipe (19) is fixedly connected with an air pipe (21).
4. The wafer cleaning apparatus for preventing wafer surface damage according to claim 1, wherein: The output end of the motor (5) is fixedly connected with one end of the driving rubber roller (6), the other end of the driving rubber roller (6) is rotatably connected with the mounting plate (4) through a bearing, and the auxiliary rubber roller (7) and the mounting plate (4) are rotatably connected through a bearing.
5. The wafer cleaning apparatus for preventing wafer surface damage according to claim 3, wherein: The first electric sliding rail (11) and the first electric sliding block (12) are slidably connected, the second electric sliding rail (17) and the second electric sliding block (18) are slidably connected, and the control panel (10) is electrically connected with the motor (5), the first electric sliding rail (11), the first electric sliding block (12), the second electric sliding rail (17) and the second electric sliding block (18).