Semiconductor chip mounting equipment lead frame positioning carrier

Abstract

The utility model discloses a lead frame positioning carrier for semiconductor chip mounting equipment, which comprises a base, a first upright post and a second upright post, the first upright post and the second upright post are arranged on the base at an interval along the left-right direction, a bearing surface is formed on the upper surface of the base, and a first groove is formed in the side wall of the first upright post; a first groove is formed in the side wall of the first stand column, a first positioning face and a second positioning face which are perpendicular to each other are arranged on the inner wall of the first groove, a second groove is formed in the side wall of the second stand column, a third positioning face and a fourth positioning face which are perpendicular to each other are arranged on the inner wall of the second groove, the first positioning face is flush with the third positioning face, and the second positioning face and the fourth positioning face are oppositely arranged and flush with each other. The bearing surface, the first positioning surface, the second positioning surface, the third positioning surface and the fourth positioning surface enclose to form a positioning groove used for positioning the stacked lead frames, the peripheral side walls of the lead frames are positioned in a surface contact mode, the positioning effect is better, and use is more convenient.

Description

TECHNICAL FIELD

[0001] The utility model relates to a semiconductor equipment technical field, concretely relates to a semiconductor core equipment lead frame positioning carrier. BACKGROUND

[0002] The semiconductor core equipment is a kind of automatic equipment for mounting chip on lead frame, positioning carrier and manipulator are equipped on the semiconductor core equipment, in production, worker is positioned to the lead frame by being placed into positioning carrier to the lead frame of stack, and manipulator is used to take out the lead frame on positioning carrier piece by piece.But because the positioning effect of traditional positioning carrier setting is not good, it is not convenient to use, and the positioning effect is not good, it is not convenient to use. CONTENT OF UTILITY MODEL

[0003] The utility model provides a kind of semiconductor core equipment lead frame positioning carrier to the lack of prior art, it is positioned to the peripheral sidewall of lead frame using surface contact mode, positioning effect is better, it is more convenient to use.

[0004] To achieve the above object, the utility model adopts following technical scheme:

[0005] A kind of semiconductor core equipment lead frame positioning carrier, including base, and first column and second column are arranged on the base in left and right direction interval, the upper surface of the base is formed with supporting surface, the side wall of the first column is equipped with first groove, the inner wall of the first groove has first positioning surface and second positioning surface perpendicular to each other, the side wall of the second column is equipped with second groove, the inner wall of the second groove has third positioning surface and fourth positioning surface perpendicular to each other, the first positioning surface and third positioning surface are flush, the second positioning surface and fourth positioning surface are oppositely arranged and flush with each other, the supporting surface, first positioning surface, second positioning surface, third positioning surface and fourth positioning surface form positioning groove for positioning stacked lead frame.

[0006] By being arranged first column and second column on the base in left and right direction interval, the upper surface of the base is formed with supporting surface, the first column is provided with first positioning surface and second positioning surface perpendicular to each other, the second column is provided with third positioning surface and fourth positioning surface perpendicular to each other, the supporting surface, first positioning surface, second positioning surface, third positioning surface and fourth positioning surface form positioning groove, when using, the stacked lead frame is placed into positioning groove, the front sidewall of lead frame and first positioning and third positioning surface abut, the left sidewall of lead frame and second positioning surface abut, the right sidewall of lead frame and fourth positioning surface abut, and the positioning of lead frame can be completed, and positioning groove is open structure, it is convenient to place lead frame, therefore the peripheral sidewall of lead frame is positioned using surface contact mode, lead frame is more stable, positioning effect is better, it is more convenient to use.

[0007] In an embodiment of the present disclosure, the second column is adjustably mounted on the base to adjust the distance between the second positioning surface and the fourth positioning surface.

[0008] In an embodiment of the present disclosure, the base is provided with a long hole extending in the left-right direction, the column is connected with a connecting seat, the connecting seat is provided with a mounting hole, and the first screw is screwed with the nut through the mounting hole and the long hole in sequence, so that the second column is adjustably mounted on the base.

[0009] In an embodiment of the present disclosure, the connecting seat is an L-shaped connecting seat, the L-shaped connecting seat has a first connecting part extending horizontally and a second connecting part extending vertically, the mounting hole is arranged on the first connecting part, and the second connecting part is connected with the second column.

[0010] In an embodiment of the present disclosure, the second connecting part is detachably connected with the second column through the second screw.

[0011] In an embodiment of the present disclosure, the base is provided with a guide groove extending in the left-right direction, the lower end of the second column is provided with a guide part, the guide part extends into the guide groove, and the guide part is slidable along the guide groove.

[0012] In an embodiment of the present disclosure, the first column and the second column are arranged on the front side of the base.

[0013] In an embodiment of the present disclosure, the distance d between the second positioning surface and the fourth positioning surface is 120mm-310mm.

[0014] In an embodiment of the present disclosure, the width b1 of the first positioning surface in the left-right direction is 6mm-10mm.

[0015] In an embodiment of the present disclosure, the width b2 of the second positioning surface in the front-rear direction is 10mm-15mm.

[0016] The utility model discloses an obvious advantage and beneficial effect compared with prior art, specifically speaking, through setting up the first stand and second stand that separate along left and right directions on the base, the upper surface of base forms and supports the face, the first stand is provided with mutually perpendicular first locating surface and second locating surface, the second stand is provided with mutually perpendicular third locating surface and fourth locating surface, and the locating groove is surrounded to the face, the first locating surface, the second locating surface, the third locating surface and the fourth locating surface, when using, the lead frame that stacks is put into the locating groove, and the front side wall of lead frame and first locating and third locating surface abut, and the left side wall of lead frame and second locating surface abut, and the right side wall of lead frame and fourth locating surface abut, and the positioning of lead frame can be completed, and the locating groove is open type structure, and lead frame is put in conveniently, so the face contact mode is used to the positioning of the circumferential side wall of lead frame, and lead frame is more stable, and the positioning effect is better, and use is more convenient.

[0017] In order to more clearly set forth the structural features, technical means and the concrete purposes and functions reached by the utility model, the utility model will be further explained in detail below by combining with the drawings and specific embodiments: BRIEF DESCRIPTION OF DRAWINGS

[0018] Figure 1 It is the first view angle assembly structure schematic diagram of the embodiment of the utility model;

[0019] Figure 2 It is the second view angle assembly structure schematic diagram of the embodiment of the utility model;

[0020] Figure 3 It is the plan view of the embodiment of the utility model;

[0021] Figure 4 It is the use state front view schematic diagram of the embodiment of the utility model;

[0022] Figure 5 It is the use state plan schematic diagram of the embodiment of the utility model.

[0023] Brief description of drawings:

[0024] 10-base, 11-supports the face, 12-positioning groove, 13-long hole, 14-guide slot, 20-first stand, 21-first recess, 22-first locating surface, 23-second locating surface, 24-third screw, 30-second stand, 31-second recess, 32-third locating surface, 33-fourth locating surface, 34-connecting seat, 341-first connecting part, 342-second connecting part, 35-first screw, 36-second screw, 37-guide portion, 40-lead frame. Specific implementation

[0025] In the description of the utility model, it needs to explain, the term "center", "upper", "lower", "left", "right", "vertical", "horizontal", "internal", "external" and so on indicate the orientation or position relation based on the orientation or position relation shown in the drawing, only for the convenience of describing the utility model and simplifying the description, and not indicate or imply that the position or element must have a specific orientation, construct and operate in a specific orientation, therefore, it cannot be understood as the limitation of the utility model.

[0026] In the description of the utility model, it needs to explain, unless another explicit provision and limitation, the term "installation", "connection", "connect" should be broad sense, for example, can be fixed connection, can be detachable connection, or integrally connected, can be mechanical connection, can be electrical connection, can be directly connected, can be indirectly connected through the intermediate medium, can be the communication inside two elements. For ordinary skilled person in the art, the specific meaning of the above-mentioned term in the utility model can be understood according to the specific circumstances.

[0027] As Figures 1-5 The utility model discloses a semiconductor upper core equipment lead frame positioning carrier, including base 10, and first column 20 and second column 30 are arranged on the base 10 along the left and right direction interval.

[0028] The upper surface of base 10 forms with the support surface 11, first column 20 is installed on base 10 by third screw 24, the side wall of first column 20 is equipped with first recess 21, the inner wall of first recess 21 has the first locating surface 22 and the second locating surface 23 that are perpendicular to each other, the first locating surface 22 and the second locating surface 23 are perpendicular to the support surface 11, the side wall of second column 30 is equipped with second recess 31, the inner wall of second recess 31 has the third locating surface 32 and the fourth locating surface 33 that are perpendicular to each other, the first locating surface 22 and the third locating surface 32 are flush, the second locating surface 23 and the fourth locating surface 33 are oppositely arranged and flush with each other, the support surface 11, the first locating surface 22, the second locating surface 23, the third locating surface 32 and the fourth locating surface 33 enclose the positioning groove 12 for positioning stacked lead frame 40.

[0029] Second column 30 can be left and right adjustable installation on base 10, to adjust the interval of second locating surface 23 and fourth locating surface 33, by setting second left and right adjustable installation on base 10, so that the interval of first column 20 and second column 30 can be adjusted according to the requirement, that is, the interval of second locating surface 23 and fourth locating surface 33 can be adjusted, to adapt to lead frame 40 of different sizes, and the versatility is good.

[0030] The base 10 is provided with a long hole 13 extending along the left-right direction, the connecting seat 34 is connected with the second column, the connecting seat 34 is provided with a mounting hole (not shown), the first screw 35 is screwed with a nut (not shown) in sequence through the mounting hole and the long hole 13, so that the second column 30 can be adjustably installed on the base 10, specifically, the long hole 13 penetrates the upper and lower surfaces of the base 10.

[0031] It should be noted that the second column 30 is adjusted left and right by the cooperation of the screw and the long hole 13, and other structures can also be used to adjust the second column 30 left and right, such as a spring + screw structure, the spring pushes the second column 30 away from the first column 20, and the screw pushes the second column 30 close to the first column 20.

[0032] The connecting seat 34 is an L-shaped connecting seat 34, the L-shaped connecting seat 34 has a horizontally extending first connecting part 341 and a vertically extending second connecting part 342, the mounting hole is arranged on the first connecting part 341, and the second connecting part 342 is connected with the second column 30; the L-shaped connecting seat 34 is adopted, the structure is reasonably arranged, the space occupied is small, and the second column 30 and the base 10 are conveniently connected.

[0033] The second connecting part 342 is detachably connected with the second column 30 through the second screw 36.

[0034] The base 10 is provided with a guide groove 14 extending along the left-right direction, the lower end of the second column 30 is provided with a guide part 37, the guide part 37 extends into the guide groove 14, and the guide part 37 can slide along the guide groove 14.

[0035] The first column 20 and the second column 30 are arranged on the front side of the base 10.

[0036] The distance d between the second positioning surface 23 and the fourth positioning surface 33 is 120mm-310mm.

[0037] The width b1 of the first positioning surface 22 along the left-right direction is 6mm-10mm, preferably b1 is 8mm, and the width of the third positioning surface 32 along the left-right direction is the same as the width b1 of the first positioning surface 22 along the left-right direction.

[0038] The width b2 of the second positioning surface 23 along the front-rear direction is 10mm-15mm, preferably b2 is 13mm, and the width of the fourth positioning surface 33 along the front-rear direction is the same as the width b2 of the second positioning surface 23 along the front-rear direction; by arranging the second positioning surface 23 with the width b2 of 10mm-15mm, the second positioning surface 23 occupies less space in the left-right direction of the positioning groove 12, and it is convenient to put the stacked lead frame 40 into the positioning groove 12.

[0039] The use process of the utility model discloses: the worker puts the stacked lead frame 40 into the positioning groove 12, the lowermost lead frame 40 abuts with the bearing surface 11, the front side wall of lead frame 40 abuts with the first positioning surface 22 and the third positioning surface 32, the left side wall of lead frame 40 abuts with the second positioning surface 23, the right side wall of lead frame 40 abuts with the fourth positioning surface 33, so the positioning of lead frame 40 can be completed, and the lead frame 40 in the positioning groove 12 is taken out and transferred to the next station by the external mechanical hand subsequently.

[0040] In conclusion, the utility model discloses: the first column 20 and the second column 30 who are apart along the left and right directions are set up on the base 10, the upper surface of base 10 forms the bearing surface 11, the first column 20 is provided with the first positioning surface 22 and the second positioning surface 23 who are perpendicular to each other, the second column 30 is provided with the third positioning surface 32 and the fourth positioning surface 33 who are perpendicular to each other, the bearing surface 11, the first positioning surface 22, the second positioning surface 23, the third positioning surface 32 and the fourth positioning surface 33 enclose the positioning groove 12, when using, the stacked lead frame 40 is put into the positioning groove 12, the front side wall of lead frame 40 abuts with the first positioning and the third positioning surface 32, the left side wall of lead frame 40 abuts with the second positioning surface 23, the right side wall of lead frame 40 abuts with the fourth positioning surface 33, and the positioning of lead frame 40 can be completed, and the positioning groove 12 is open structure, and lead frame 40 is put in conveniently, therefore the face contact mode is used to the positioning of the circumferential side wall of lead frame 40, and lead frame 40 is more stable, and the positioning effect is better, and it is more convenient to use.

[0041] The above is only the preferred embodiment of the utility model, and does not limit the utility model, so any modification, equivalent replacement, improvement etc. of the above embodiment according to the technical actuality of the utility model still belongs to the range of the utility model technical scheme.

Claims

1. A lead frame positioning carrier for semiconductor wafer fabrication equipment, characterized in that, Includes a base, and a first column and a second column spaced apart on the base in the left-right direction; The upper surface of the base has a support surface. The side wall of the first column has a first groove. The inner wall of the first groove has a first positioning surface and a second positioning surface that are perpendicular to each other. The side wall of the second column has a second groove. The inner wall of the second groove has a third positioning surface and a fourth positioning surface that are perpendicular to each other. The first positioning surface and the third positioning surface are flush. The second positioning surface and the fourth positioning surface are opposite to each other and flush. The support surface, the first positioning surface, the second positioning surface, the third positioning surface and the fourth positioning surface form a positioning groove for positioning the stacked lead frame.

2. The semiconductor wafer mounting device lead frame positioning carrier according to claim 1, characterized in that, The second column can be adjusted left and right on the base to adjust the distance between the second positioning surface and the fourth positioning surface.

3. The semiconductor wafer mounting device lead frame positioning carrier according to claim 2, characterized in that, The base has an elongated hole extending in the left-right direction. The column is connected to a connecting seat, which has an installation hole. The first screw passes through the installation hole and the elongated hole in sequence and engages with the nut so that the second column can be adjusted and installed on the base.

4. The semiconductor wafer mounting device lead frame positioning carrier according to claim 3, characterized in that, The connector is an L-shaped connector, which has a horizontally extending first connector and a vertically extending second connector. The mounting hole is provided on the first connector, and the second connector is connected to the second column.

5. The semiconductor wafer mounting device lead frame positioning carrier according to claim 4, characterized in that, The second connecting part is detachably connected to the second column by a second screw.

6. The semiconductor wafer mounting device lead frame positioning carrier according to claim 2, characterized in that, The base is provided with a guide groove extending in the left and right direction, and the lower end of the second column is provided with a guide part, which extends into the guide groove and can slide along the guide groove.

7. The semiconductor wafer mounting device lead frame positioning carrier according to claim 1, characterized in that, The first and second pillars are both located on the front side of the base.

8. The semiconductor wafer mounting device lead frame positioning carrier according to claim 1, characterized in that, The distance d between the second positioning surface and the fourth positioning surface is 120mm to 310mm.

9. The semiconductor wafer mounting device lead frame positioning carrier according to claim 1, characterized in that, The width b1 of the first positioning surface in the left-right direction is 6mm to 10mm.

10. The semiconductor wafer mounting device lead frame positioning carrier according to claim 1, characterized in that, The width b2 of the second positioning surface along the front-to-back direction is 10mm to 15mm.

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