Thin chip multi-step ejection mechanism

Abstract

The utility model relates to the technical field of semiconductor packaging, in particular to a thin chip multi-step ejection mechanism, which comprises an ejector pin module and an ejector pin replacement module, the ejector pin module comprises a lifting assembly and a crystal grain ejection assembly, the lifting assembly drives the crystal grain ejection assembly to lift, and the ejector pin replacement module is used for replacing the crystal grain ejection assembly. The crystal grain ejection assembly comprises a rack, a three-stage ejector pin top cap assembly and a three-stage ejector pin driving assembly, the three-stage ejector pin top cap assembly and the three-stage ejector pin driving assembly are arranged on the rack, three sets of ejector pins which are sequentially arranged outwards are arranged in the three-stage ejector pin top cap assembly, and the three-stage ejector pin driving assembly comprises three sets of ejector pin driving shafts corresponding to the ejector pins; the ejector pin replacing module comprises a base, an ejector pin cap replacing Y-axis guide rail, an eight-station rotating disc, an ejector pin cap replacing assembly, a rotating motor and a code scanning gun, the ejector pin cap replacing Y-axis guide rail is arranged on the base, the eight-station rotating disc is arranged on the eight-station rotating disc and rotates through the rotating motor, and the ejector pin cap replacing assembly is arranged on the eight-station rotating disc; the code scanning gun is arranged on the rear side of the base.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of semiconductor packaging relates to a thin chip multi -step mechanism. BACKGROUND

[0002] With the high -speed development of semiconductor industry, chip is also developing towards miniaturization, precision, and the precision requirement of various packaging equipment such as FCDFN, FCQFN, BGA, Fan -out is also higher and higher.According to the production process of wafer, wafer is into detection and packaging link after segmentation, and the segmentation of wafer is completed on the film in the film frame, when wafer segmentation is completed, the transmission of the die needs to be first taken off from the film, and the die needs to be first partially peeled off from the film by the mechanism when the die is picked up and then picked up by the picking arm.Because the die is pasted on the film, the picking arm is difficult to take off the die directly, so the device is used to separate the die from the film partially, and then the die is picked up by the vacuum arm, for the thickness of thin chip ≤100um, the ordinary single-step needle mechanism has great risk to make the chip break.

[0003] Therefore, in order to solve the above technical problems, a thin chip multi -step mechanism needs to be designed. INVENTION CONTENTS

[0004] The utility model discloses a thin chip multi -step mechanism to solve the prior art problems.

[0005] The utility model discloses a thin chip multi -step mechanism to solve the prior art problems.

[0006] Further improvement, the three-stage needle top cap assembly includes a needle cap, an outer needle, a middle needle and an inner needle, the three-stage needle drive assembly includes Z1 motor, Z2 motor, Z3 motor, inner needle shaft, middle needle shaft and outer needle shaft, the inner needle shaft is arranged at the upper end of Z1 motor and pushes the inner needle to move upwards, the middle needle shaft is arranged at the upper end of Z2 motor and pushes the middle needle to move upwards, and the outer needle shaft is arranged at the upper end of Z3 motor and pushes the outer needle to move upwards.

[0007] Further improvement, the grain ejection assembly further comprises left and right micro-adjustment motors and front and rear micro-adjustment motors, and the left and right micro-adjustment motors and the front and rear micro-adjustment motors are symmetrically arranged on the rack.

[0008] Further improvement, the replacement needle module further comprises a replacement needle top cap Y-axis negative limit, a replacement needle top cap Y-axis zero point, a replacement needle top cap Y-axis positive limit and a replacement needle top cap Y-axis motor, the replacement needle top cap Y-axis negative limit is arranged on the front side of the replacement needle top cap Y-axis guide rail, the replacement needle top cap Y-axis zero point is arranged on the rear side of the replacement needle top cap Y-axis guide rail, the replacement needle top cap Y-axis positive limit is arranged on the rear side of the replacement needle top cap Y-axis zero point, and the replacement needle top cap Y-axis motor is arranged on one side of the replacement needle top cap Y-axis guide rail and drives the eight-station turntable to slide on the replacement needle top cap Y-axis guide rail through a lead screw transmission.

[0009] Further improvement, the lifting assembly comprises a lifting guide rail, a large Z lifting motor, a lifting lead screw, a lower limit switch, a zero point switch, an upper limit switch and a compressed air electromagnetic valve assembly, the large Z lifting motor is arranged at the lower end of the lifting guide rail, the large Z lifting motor is connected with the lower end of the lifting lead screw, the lifting guide rail is provided with a sliding table, the lifting lead screw is connected with the sliding table, the grain ejection assembly is arranged on the sliding table, the zero point switch is arranged on the lower side end of the lifting guide rail, the lower limit switch is arranged below the zero point switch, and the upper limit switch is arranged on the upper side end of the lifting guide rail.

[0010] Compared with the prior art, the thin chip multi-step ejection mechanism has the following advantages:

[0011] By increasing the contact area of the needle, the chip is prevented from being broken when the needle-shaped needle ejects the chip, and the accuracy and stability of the chip pickup are improved. By switching between vacuum and compressed gas, the pickup and placement time of the needle cap multi-membrane is improved, the speed of the chip pickup is greatly improved, and the traditional needle single-step ejection structure is also compatible. The high-speed single-step ejection advantage is considered, and the thin chip is also adapted, and the working efficiency of the entire packaging equipment is improved. Eight kinds of needle needle cap automatic replacement, improve the automation efficiency of the equipment, and the code scanning and replacement of the needle needle cap prevent errors, greatly improve the practicability and operability of the equipment. BRIEF DESCRIPTION OF DRAWINGS

[0012] Figure 1 It is the overall structure schematic view of the utility model

[0013] Figure 2 It is the structure schematic view of the thimble module in the utility model

[0014] Figure 3 It is the structure schematic view of the grain ejection assembly in the utility model

[0015] Figure 4 It is Figure 3 Structure schematic view of another perspective

[0016] Figure 5 It is Figure 3 Structure schematic view of the inside

[0017] Figure 6 It is the structure schematic view of the multi-step thimble and thimble cap in the utility model

[0018] Figure 7 It is the structure schematic view of the thimble module replacement in the utility model

[0019] Figure 8 It is Figure 7 Structure schematic view of another perspective

[0020] Figure 9 It is the structure schematic view of the thimble lifting flow chart in the utility model

[0021] In the drawing, 1-large Z lifting motor, 2-lower limit switch, 3-origin switch, 4-lifting screw, 5-upper limit switch, 6-grain ejection assembly, 7-lifting guide rail, 8-compressed air electromagnetic valve assembly, A1-Z1 motor, A2-Z2 motor, A3-Z3 motor, A4-bearing guide, A5-left and right micro-motion adjustment motor, A6-front and rear micro-motion adjustment motor, A7-thimble cap, A8-innermost thimble shaft, A9-middle thimble shaft, A10-outer thimble shaft, A11-thimble cap replacement assembly, A12-eight-station turntable, A11-thimble cap replacement assembly, A13-replacement thimble Y-axis negative limit, A14-replacement thimble Y-axis zero point, A15-replacement thimble Y-axis positive limit, A16-replacement thimble Y-axis motor, A17-scan code gun, A18-replacement thimble Y-axis guide rail, A19-rotary motor, B1-thimble cap, B2-outer thimble, B3-middle thimble, B4-innermost thimble, C-frame, D1-thimble module, D2-replacement thimble module. DETAILED DESCRIPTION

[0022] In the description of the utility model, it needs to explain, the term "center", "upper", "lower", "left", "right", "vertical", "horizontal", "internal", "external" and so on indicate the orientation or position relation is based on the orientation or position relation shown in the drawing, only for the convenience of describing the utility model and simplifying the description, and not indicate or imply that the device or element must have a particular orientation, with a particular orientation structure and operation, therefore cannot be understood as the limitation of the utility model.

[0023] In the description of the utility model, it needs to explain, unless otherwise explicitly provided and limited, the term "installation", "connection", "connection" should be broad understanding, for example, can be fixed connection, can also be detachable connection, or integrally connected. For ordinary skilled in the art, the specific meaning of the above terms in the utility model can be understood according to the specific circumstances.

[0024] The following will be combined with the embodiment and the drawing Figures 1-9 The technical scheme of the utility model is further described.

[0025] Example 1

[0026] A thin chip multi-step ejector mechanism, characterized by comprising: ejector module D1 and replacement ejector module D2, the ejector module D1 includes lifting assembly and grain ejecting assembly 6, the grain ejecting assembly 6 is driven to lift by lifting assembly, the grain ejecting assembly 6 includes rack C and three-stage ejector cap assembly A7 and three-stage ejector drive assembly arranged on the rack C, the three-stage ejector cap assembly A7 is internally provided with three groups of ejectors arranged outwardly, the three-stage ejector drive assembly includes three groups of ejector drive shafts corresponding to the ejectors, the replacement ejector cap Y-axis guide rail A18 of replacement ejector module D2, eight-station turntable A12, ejector cap replacement assembly A11, rotary motor A19 and code scanning gun A17 are included in the replacement ejector module D2, the replacement ejector cap Y-axis guide rail A18 is arranged on the base, the eight-station turntable A12 is arranged on the eight-station turntable A12 and rotates through the rotary motor A19, the ejector cap replacement assembly A11 is arranged on the eight-station turntable A12, and the code scanning gun A17 is arranged on the rear side of the base.

[0027] As a further preferred embodiment, the three-stage needle top cap assembly A7 comprises a needle cap B1, an outer needle B2, a middle needle B3 and an inner needle B4, the three-stage needle driving assembly comprises a Z1 motor A1, a Z2 motor A2, a Z3 motor A3, an inner needle shaft A8, a middle needle shaft A9 and an outer needle shaft A10, the inner needle shaft A8 is arranged at the upper end of the Z1 motor A1 and pushes the inner needle B4 upward, the middle needle shaft A9 is arranged at the upper end of the Z2 motor A2 and pushes the middle needle B3 upward, and the outer needle shaft A10 is arranged at the upper end of the Z3 motor A3 and pushes the outer needle B2 upward.

[0028] As a further preferred embodiment, the grain ejection assembly 6 further comprises left and right micro-adjustment motors A5 and front and rear micro-adjustment motors A6, which are symmetrically arranged on the rack C.

[0029] As a further preferred embodiment, the replacement needle module D2 further comprises a replacement needle top cap Y-axis negative limit A13, a replacement needle top cap Y-axis zero point A14, a replacement needle top cap Y-axis positive limit A15 and a replacement needle top cap Y-axis motor A16, the replacement needle top cap Y-axis negative limit A13 is arranged on the front side of the replacement needle top cap Y-axis guide rail A18, the replacement needle top cap Y-axis zero point A14 is arranged on the rear side of the replacement needle top cap Y-axis guide rail A18, the replacement needle top cap Y-axis positive limit A15 is arranged on the rear side of the replacement needle top cap Y-axis zero point A14, and the replacement needle top cap Y-axis motor A16 is arranged on one side of the replacement needle top cap Y-axis guide rail A18 and drives the eight-station turntable A12 to slide on the replacement needle top cap Y-axis guide rail A18 through screw transmission.

[0030] As a further preferred embodiment, the lifting assembly comprises a lifting guide rail 7, a large Z lifting motor 1, a lifting screw 4, a lower limit switch 2, a zero switch 3, an upper limit switch 5 and a compressed air electromagnetic valve assembly 6, the large Z lifting motor 1 is arranged at the lower end of the lifting guide rail 7, the large Z lifting motor 1 is connected to the lower end of the lifting screw 4, the lifting guide rail 7 is provided with a sliding table, the lifting screw 4 is connected to the sliding table, and the grain ejection assembly 6 is arranged on the sliding table, the zero switch 3 is arranged on the lower side end of the lifting guide rail 7, the lower limit switch 2 is arranged below the zero switch 3, and the upper limit switch 5 is arranged on the upper side end of the lifting guide rail 7.

[0031] As shown in Figures 1-9 The use principle of the utility model is as follows:

[0032] 1. Device initialization and chip positioning:

[0033] 1-1. Equipment initialization: Before the start of the lifting action, the system will initialize the position of the pins, the force application device, the sensors, etc. Multi-step lifting A1, A2, A3, to ensure that the equipment is in normal working condition.

[0034] 1-2. Chip positioning: The combination of the blue film and the chip is fixed in the working area of the equipment, and the pins are aligned with the bottom of the chip (usually the edge area of the chip), to ensure the accuracy of the force application point.

[0035] 2. Simultaneous lifting: B2, B3, B4 are lifted simultaneously (initially should be adjusted to make B2, B3, B4 three flat), the purpose is to slightly lift the chip at the same time, so that it starts to separate from the blue film.

[0036] 3. Step-by-step separation: The outermost pin B2 first descends to separate the chip and the blue film; the middle layer pin B3 descends to separate the chip and the blue film; the innermost pin B4 descends to separate the chip and the blue film;

[0037] 4. Pin reset and chip transfer:

[0038] 4-1. Pin reset: After the lifting action is completed, the pins are reset to the initial position, ready for the next operation;

[0039] 4-2. Chip transfer: The lifted chip is transferred to the next process, such as inspection, packaging, by a robot or conveyor belt;

[0040] 5. Automatic replacement of pin cap:

[0041] 5-1. Pin cap anti-stupid scanning: A12: Rotate the motor to the scanning position for scanning, and rotate to the required position for replacement when replacing;

[0042] 5-2. Remove the pin cap: The pin Z-axis descends to the replacement pin cap position, A16: The replacement pin cap Y-axis motor (including lead screw) rotates to move to the appropriate position, A12: The rotary motor rotates the turntable to rotate, and the pin cap assembly on the pin shaft is removed;

[0043] 5-3. Replace the pin cap A16: Replace the pin cap Y-axis motor (including lead screw) to rotate the turntable to the replacement pin cap position, A12: Rotate the rotary motor to rotate the turntable to replace the required pin cap assembly.

[0044] The structure assembly is specially developed according to the problems encountered in the thin chip pickup process, the mechanism avoids the chip rupture caused by the needle-shaped ejector pin ejecting the chip by increasing the contact area of the ejector pin, and the accuracy and stability of the chip pickup are increased, the pickup and placement time of the ejector pin cap multi-thin film is improved through the switching of vacuum and compressed gas, the speed of the chip pickup is greatly improved, and the traditional needle-shaped single-step ejection structure is also compatible, the advantages of high-speed single-step ejection are considered, the thin chip is adapted, and the working efficiency of the whole packaging equipment is improved. Eight kinds of ejector pin ejector pin cap automatic replacement, improve the automation efficiency of the equipment, and the code scanning and replacement of the ejector pin ejector pin cap prevent errors, greatly improve the practicability and operability of the equipment.

[0045] The above describes the preferred embodiments of the present application. It should be understood that those skilled in the art can make many modifications and changes without creative labor according to the concept of the present application. Therefore, any technical solution obtained by logical analysis, reasoning or limited experiment on the basis of the prior art according to the concept of the present application shall be within the protection scope defined by the claims.

Claims

1. A thin die multi-step pick-and-place mechanism, characterized by, The application relates to a needle module and a replacement needle module. The three-stage needle cap assembly comprises a needle cap, an outer needle, a middle needle and an inner needle, the three-stage needle driving assembly comprises a Z1 motor, a Z2 motor, a Z3 motor, an inner needle shaft, a middle needle shaft and an outer needle shaft, the inner needle shaft is arranged at the upper end of the Z1 motor and pushes the inner needle to move upwards, the middle needle shaft is arranged at the upper end of the Z2 motor and pushes the middle needle to move upwards, and the outer needle shaft is arranged at the upper end of the Z3 motor and pushes the outer needle to move upwards.

2. A thin die multi-step bonder as claimed in claim 1, wherein, The grain ejection assembly further comprises left and right micro-motion adjusting motors and front and rear micro-motion adjusting motors, and the left and right micro-motion adjusting motors and the front and rear micro-motion adjusting motors are symmetrically arranged on the rack.

3. A thin die multi-step bonder as in claim 1, wherein, The replacement needle module further comprises a replacement needle cap Y-axis negative limit, a replacement needle cap Y-axis zero point, a replacement needle cap Y-axis positive limit and a replacement needle cap Y-axis motor, the replacement needle cap Y-axis negative limit is arranged on the front side of the replacement needle cap Y-axis guide rail, the replacement needle cap Y-axis zero point is arranged on the rear side of the replacement needle cap Y-axis guide rail, the replacement needle cap Y-axis positive limit is arranged on the rear side of the replacement needle cap Y-axis zero point, and the replacement needle cap Y-axis motor is arranged on one side of the replacement needle cap Y-axis guide rail and drives the eight-station turntable to slide on the replacement needle cap Y-axis guide rail through a screw transmission.

4. The thin die multi-step bonder of claim 1 wherein, The lifting assembly comprises a lifting guide rail, a large Z lifting motor, a lifting screw, a lower limit switch, a zero point switch, an upper limit switch and a compressed air electromagnetic valve assembly, the large Z lifting motor is arranged at the lower end of the lifting guide rail, the large Z lifting motor is connected with the lower end of the lifting screw, a sliding table is arranged on the lifting guide rail, the lifting screw is connected with the sliding table, the grain ejection assembly is arranged on the sliding table, the zero point switch is arranged on the lower side end of the lifting guide rail, the lower limit switch is arranged below the zero point switch, and the upper limit switch is arranged on the upper side end of the lifting guide rail.

5. A thin die multi-step bonder as recited in claim 1, wherein, ​

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