Electromagnetic shielding packaging structure

Abstract

The utility model relates to an electromagnetic shielding packaging structure and a lead frame, the lead frame comprises a base island area and a pin area located on the periphery of the base island area, the pin area comprises a first pin and a second pin bent upwards, the first pin is provided with a first bonding platform, the second pin is provided with a second bonding platform, and the first bonding platform is provided with a second bonding platform. The second bonding platform is higher than the first bonding platform; the chip is positioned on the surface of the base island region; a bonding wire is bonded between the surface of the chip and the first bonding platform of the lead frame; an electromagnetic shielding line is bonded between the second bonding platforms of the second pin, and the electromagnetic shielding line is higher than the chip and the corresponding bonding wire, so that electromagnetic shielding of the chip is realized; and the plastic package structure covers the lead frame, the chip, the bonding wires and the electromagnetic shielding wires. According to the electromagnetic shielding packaging structure, the second bonding platform of the second pin is higher than the first bonding platform of the first pin, so that interference cannot be generated between the electromagnetic shielding wire and the welding wire, and the electromagnetic shielding effect is good.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of semiconductor packaging, and in particular to an electromagnetic shielding packaging structure. BACKGROUND

[0002] With the vigorous development of the electronic industry, most electronic products are developing towards the goal of miniaturization and high speed, especially the development of the communication industry has universally applied communication devices in various electronic products. However, the above-mentioned electronic products need to use high-frequency radio frequency chips, and the radio frequency chips can be arranged adjacent to digital integrated circuits, digital signal processors or baseband chips, causing electromagnetic interference problems, so electromagnetic shielding treatment is necessary.

[0003] At present, the measures for suppressing electromagnetic interference of multi-mode products generally use metal shielding cover to suppress electromagnetic interference during chip packaging. If electromagnetic shielding is required for the traditional frame type packaging structure, a metal cover needs to be attached after plastic packaging, resulting in a relatively thick overall package size, a complex process of attaching the metal cover, and a high cost. When the electromagnetic shielding layer is formed by wire bonding, the wire bonding of the electromagnetic shielding layer is prone to interference with the wire bonding of the chip electrical connection. SUMMARY

[0004] The technical problem to be solved by the present application is to provide an electromagnetic shielding packaging structure to prevent interference between the leads of the electromagnetic shielding layer and the leads of the chip electrical connection, and to improve the electromagnetic shielding performance.

[0005] To this end, an embodiment of the present application provides an electromagnetic shielding packaging structure, comprising:

[0006] A lead frame, the lead frame comprising a base island region and a pin region located around the base island region, the pin region comprising a first pin and a second pin bent upward, the first pin having a first bonding platform, the second pin having a second bonding platform, the second bonding platform being higher than the first bonding platform;

[0007] A chip located on the surface of the base island region;

[0008] A wire is bonded between the surface of the chip and the first bonding platform of the lead frame;

[0009] An electromagnetic shielding wire is bonded between the second bonding platforms of the second pins, the electromagnetic shielding wire being higher than the chip and the corresponding wire, thereby achieving electromagnetic shielding of the chip;

[0010] A plastic packaging structure covering the lead frame, the chip, the wire and the electromagnetic shielding wire.

[0011] As an optional implementation, the second pin comprises a first stepped bending part and a second stepped bending part, one end of the first stepped bending part is connected with the lead frame pin area main body structure, and the stepped plane of the first stepped bending part is higher than the first bonding platform of the first pin; the second stepped bending part is connected with the other end of the first stepped bending part, the stepped plane of the second stepped bending part serves as the second bonding platform and is higher than the stepped plane of the first stepped bending part.

[0012] As an optional implementation, the stepped plane of the first stepped bending part is lower than the chip surface.

[0013] As an optional implementation, part of the stepped plane of the first stepped bending part is located in the cutting area of the discrete chip package structure, so that the second pin and the first pin of the cut discrete chip package structure are electrically isolated, and the back surface of the discrete chip package structure does not expose the second pin.

[0014] As an optional implementation, the first pin and the second pin are arranged in a spaced manner.

[0015] As an optional implementation, the lead frame is formed by a stamping process.

[0016] As an optional implementation, a third pin bent upward is further included, the third pin is a ground pin, the third pin is electrically connected with the second pin to realize electrical grounding of the electromagnetic shielding structure.

[0017] As an optional implementation, the third pin comprises a third bonding platform, a fourth bonding platform, and a connecting part connecting the third bonding platform and the fourth bonding platform, the fourth bonding platform is higher than the third bonding platform.

[0018] As an optional implementation, the projections of the third bonding platform and the fourth bonding platform on the plane where the lead frame is located do not overlap or partially overlap.

[0019] As an optional implementation, the fourth bonding platform of the third pin and the second bonding platform of the second pin are electrically connected through an electromagnetic shielding wire.

[0020] As an optional implementation, a wire is bonded between the chip surface and the third bonding platform of the third pin.

[0021] As an optional implementation, the electromagnetic shielding wire is connected from the second bonding platform of the second pin on one side of the chip to the second bonding platform of the second pin on the opposite side of the chip, across the chip and above the wire to realize electromagnetic shielding of the chip.

[0022] As an optional embodiment, the electromagnetic shielding lines are arranged above the chip to achieve electromagnetic shielding of the chip, and the electromagnetic shielding lines in the horizontal and vertical directions are in contact to achieve electrical connection of the entire mesh electromagnetic shielding line.

[0023] As an optional embodiment, the second bonding platform of part or all of the second pins on one side of the base island region is an integral whole.

[0024] As an optional embodiment, the surface of the second bonding platform of part or all of the second pins on one side of the base island region has a wire bonding strip, and the electromagnetic shielding line is bonded to the surface of the wire bonding strip.

[0025] As an optional embodiment, the wire bonding strip is fixed to the surface of the second bonding platform of the second pin by a bonding or adhesive process, or the wire bonding strip is integrally formed with the lead frame.

[0026] The technical solution of the present application has the following advantages:

[0027] The electromagnetic shielding package structure described above has electromagnetic shielding lines bonded between the second bonding platforms of the second pins. Since the second pins are bent upward, the second bonding platforms of the second pins are higher than the first bonding platforms of the first pins, so the electromagnetic shielding lines do not interfere with the wire bonds. By using the upwardly bent second pins and the electromagnetic shielding lines, electromagnetic shielding can be formed not only directly above the chip but also on the side of the chip (the second pins as part of the electromagnetic shielding structure cover the chip directly above and on the side), and the electromagnetic shielding effect is good. BRIEF DESCRIPTION OF DRAWINGS

[0028] Figure 1 is a cross-sectional structure schematic diagram of an electromagnetic shielding package structure of an embodiment;

[0029] Figure 2 is a top view structure schematic diagram of a lead frame of an embodiment of the electromagnetic shielding package structure;

[0030] Figure 3 is a side view structure schematic diagram of the lead frame of Figure 2 ;

[0031] Figure 4 is a side view structure schematic diagram of a third pin;

[0032] Figure 5 is a side view structure schematic diagram of a first pin and a second pin;

[0033] Figure 6 is a schematic diagram of wire bonding on the lead frame of Figure 2 ;

[0034] Figure 7 yes Figure 2 A schematic diagram of bonding electromagnetic shielding wires on a lead frame;

[0035] Figure 8 yes Figure 2 A schematic diagram of bonding wires and electromagnetic shielding wires on the lead frame;

[0036] Figure 9 This is a top view of a lead frame with wire bonding strips according to one embodiment;

[0037] Figure 10 This is a cross-sectional schematic diagram of an electromagnetic shielding packaging structure with wire bonding strips according to an embodiment.

[0038] Figure 11 This is a top view schematic diagram of an electromagnetic shielding packaging structure with lead bonding strips according to an embodiment. Detailed Implementation

[0039] The specific embodiments of this application will be described in detail below with reference to the accompanying drawings. In describing the embodiments of this application in detail, for ease of explanation, the schematic diagrams may be partially enlarged without adhering to the general scale, and the schematic diagrams are merely examples and should not limit the scope of protection of this application. Furthermore, in actual manufacturing, the three-dimensional spatial dimensions of length, width, and depth should be included.

[0040] This application first provides an electromagnetic shielding packaging structure, and the manufacturing direction is described in detail below with reference to the accompanying drawings.

[0041] First, refer to Figures 1-8 ,in Figure 1 This is a cross-sectional schematic diagram of an electromagnetic shielding encapsulation structure according to one embodiment. Figure 2 This is a top view schematic diagram of an embodiment of the lead frame of an electromagnetic shielding encapsulation structure. Figure 3 yes Figure 2 A side view of the lead frame structure. Figure 4 This is a side view of the third pin. Figure 5 This is a side view of the structure of the first and second pins. Figure 6 yes Figure 2 A schematic diagram of bonding wires on the lead frame. Figure 7 yes Figure 2 A schematic diagram of bonding electromagnetic shielding wires to the lead frame. Figure 8 yes Figure 2 A schematic diagram of bonding wires and electromagnetic shielding wires on the lead frame.

[0042] The electromagnetic shielding encapsulation structure includes:

[0043] A lead frame 100, the lead frame 100 comprising a base island region 10 and a pin region around the base island region, the pin region comprising a first pin 20, a second pin 30 bent upward and a third pin 40 bent upward, the first pin 20 having a first bonding platform 201, the second pin 30 having a second bonding platform 301, the third pin 40 comprising a third bonding platform 402 and a fourth bonding platform 401, the second bonding platform 301 and the fourth bonding platform 401 being higher than the first bonding platform 201 and the third bonding platform 402;

[0044] A chip 15 located on the surface of the base island region 10;

[0045] A wire 23 is bonded between the surface of the chip 15 and the first bonding platform 201 of the first pin 20;

[0046] An electromagnetic shielding wire 33 is bonded between the second bonding platforms 301 of the second pin 30, the electromagnetic shielding wire 33 being higher than the chip 15 and the corresponding wire 23, so as to realize electromagnetic shielding of the chip;

[0047] The third pin 40 is a ground pin, the fourth bonding platform 401 of the third pin 40 is electrically connected to the second bonding platform 301 of the second pin 30 through the electromagnetic shielding wire 33, so as to realize electrical grounding of the electromagnetic shielding structure;

[0048] A plastic encapsulation structure 50 covering the lead frame 100, the chip 15, the wire 23 and the electromagnetic shielding wire 33.

[0049] Specifically, please refer to Figure 2 and Figure 3 , Figure 2 is a top view structural schematic diagram of an embodiment of a lead frame of an electromagnetic shielding packaging structure, Figure 3 is Figure 2 a side view structural schematic diagram of the lead frame of

[0050] The lead frame 100 comprises a base island region 10 and a pin region around the base island region, the base island region 10 is connected to the pin region through connecting parts located at four corners, the pin region comprises a first pin 20, a second pin 30 bent upward, in this embodiment, the pin region is located around the base island region, and the second pin 30 of the corresponding pin region is also located around the base island region, and the electromagnetic shielding wire 33 is crossly arranged above the chip to realize electromagnetic shielding of the chip in four directions.

[0051] In other embodiments, the pin region can also be located only on both sides of the base island region 10, and the second pin 20 of the pin region is also located only on both sides of the base island region 10, and the electromagnetic shielding line 33 is connected from the second bonding platform 301 of the second pin 30 on one side of the chip to the second bonding platform 301 of the second pin 30 on the opposite side of the chip, achieving the arrangement of a single horizontal or vertical electromagnetic shielding line.

[0052] In this embodiment, please refer to Figure 2 , the pin region includes a first pin 20, an upwardly bent second pin 30, an upwardly bent third pin 40, and a pin region main structure 28, the pin region main structure 28 is connected with the first pin 20, the second pin 30, and the third pin 40 respectively and the first pin 20, the second pin 30, and the third pin 40 are arranged in isolation, and the first pin 20, the second pin 30, and the third pin 40 are arranged on one side of the pin region main structure close to the base island region, and when the electromagnetic shielding package structure is cut along the cutting line 27 to form a discrete chip package structure, the pin region main structure and part of the first pin, part of the second pin, and part of the third pin are cut off, and the remaining first pin, second pin, and third pin are arranged separately.

[0053] In this embodiment, please refer to Figure 6 , the bottom surface of the first pin 20 is flush with the bottom surface of the base island region 10 of the lead frame, and the solder wire 23 is bonded between the chip 15 on the upper surface of the base island region 10 and the first bonding platform 201 of the first pin 20, and the first pin 20 is partially cut in the subsequent process to serve as the chip pin of the finally formed discrete chip package structure.

[0054] In this embodiment, the first pin and the upwardly bent second pin are arranged in isolation, which on the one hand allows the second pin 30 to be uniformly arranged around the electromagnetic shielding package structure, and the arrangement of the electromagnetic shielding line can be more uniform, and the electromagnetic shielding effect is better, and on the other hand, the upwardly bent second pin itself can serve as part of the electromagnetic shielding structure, and the uniformly arranged second pin can electromagnetically shield the side of the chip, so that the final electromagnetic shielding effect is better.

[0055] In this embodiment, the number of the first pin and the upwardly bent second pin can be adjusted as needed. For example, one first pin and one second pin can be arranged in isolation, or multiple first pins and one second pin can be arranged in isolation, or multiple first pins and multiple second pins can be arranged in isolation, etc.

[0056] In this embodiment, please refer to Figure 3 and Figure 5The upwardly bent second pin 30 comprises a first stepped bending portion 31 and a second stepped bending portion 32. One end of the first stepped bending portion 31 is connected with the pin area main body structure, and the stepped plane of the first stepped bending portion 31 is higher than the first bonding platform 201 of the first pin 20. The second stepped bending portion 32 is connected with the other end of the first stepped bending portion 31, and the stepped plane of the second stepped bending portion 32 serves as the second bonding platform 301 of the second pin 30 and is higher than the stepped plane of the first stepped bending portion 31. Since the second bonding platform 301 of the second pin 30 is higher than the stepped plane of the first stepped bending portion 31 and higher than the first bonding platform 201 of the first pin 20, the electromagnetic shielding line 33 formed by the second bonding platform 301 of the second pin 30 is higher than the chip 15 and the corresponding solder wire 23, electromagnetic shielding of the chip is realized, and the electromagnetic shielding line 33 and the solder wire 23 do not interfere with each other.

[0057] In the embodiment, the stepped plane of the first stepped bending portion 31 is located in the cutting area (outside the cutting line 27) of the discrete chip package structure, so that the second pin 30 and the first pin 20 of the cut discrete chip package structure are electrically isolated, and the back of the discrete chip package structure does not expose the second pin 30.

[0058] In the embodiment, the stepped plane of the first stepped bending portion of the second pin 30 is lower than the chip surface, and the upwardly bent second pin itself can serve as part of the electromagnetic shielding structure, so that the electromagnetic shielding structure including the second pin is above the chip, on the side of the chip and on the side surface of the chip, so that the final electromagnetic shielding effect is better.

[0059] In other embodiments, the stepped plane of the first stepped bending portion of the second pin can also be higher than or equal to the chip surface.

[0060] In other embodiments, the stepped bottom surface of the first stepped bending portion of the second pin can also be lower than the surface of the base island area of the lead frame 100, as long as the back of the cut discrete chip package structure does not expose the first stepped bending portion of the second pin.

[0061] In the embodiment, the lead frame 100 is formed by a metal stamping process, that is, the corresponding first pin and upwardly bent second pin and third pin are formed by a stamping process. In other embodiments, the lead frame can also be formed by other suitable processes, such as a metal casting process.

[0062] In an embodiment, the material of the lead frame 100 is copper alloy or iron-nickel alloy, in a specific embodiment, the copper alloy can be copper-iron alloy, copper-nickel-silicon alloy, copper-chromium alloy or copper-nickel-tin alloy. The lead frame 100 has good thermal and electrical conductivity, low thermal expansion coefficient, sufficient strength and high deformation resistance.

[0063] In the present embodiment, please refer to Figure 1 and Figure 5 , the stepped plane of the first stepped bending part 31 is located in the cutting area of the discrete chip package structure, so that the second pin 30 and the first pin 20 of the cut discrete chip package structure are electrically isolated, and because the stepped plane of the first stepped bending part 31 is higher than the first bonding platform 201 of the first pin, the back of the cut discrete chip package structure does not expose the second pin 30.

[0064] In the present embodiment, please refer to Figure 3 and Figure 4 , the lead frame 100 further comprises a third pin 40 bent upward, the third pin 40 comprises a third bonding platform 402, a fourth bonding platform 401, a connecting part 403 connecting the third bonding platform and the fourth bonding platform, the fourth bonding platform 401 is higher than the third bonding platform 402, the projection of the third bonding platform 402 and the fourth bonding platform 401 on the plane where the lead frame is located is adjacent and does not overlap. The fourth bonding platform 401 of the third pin 40 has the same height as the second bonding platform 301 of the second pin 30, the fourth bonding platform 401 of the third pin and the second bonding platform 301 of the second pin are electrically connected through the electromagnetic shielding wire, and the third pin 40 serves as the ground end of the electromagnetic shielding structure, the back of the cut discrete chip package structure exposes the bottom surface of the third pin 40, the third pin 40 is electrically grounded, realizing the electrical grounding of the electromagnetic shielding structure.

[0065] In the present embodiment, the third pin 40 also serves as the common ground end of the cut discrete chip package structure, the chip 15 is electrically connected to the third bonding platform 402 of the third pin 40 through the wire 23, realizing the electrical grounding of the chip ground end.

[0066] In other embodiments, the fourth bonding platform is located above the third bonding platform, so that the projection of the third bonding platform and the fourth bonding platform of the third pin on the plane where the lead frame is located can also partially overlap.

[0067] In other embodiments, one or more of the first pins serve as chip ground ends, the chip ground end and the electromagnetic shielding structure ground end of the discrete chip package structure are separated.

[0068] In the embodiment, the electromagnetic shielding wire is connected from the second bonding pad of the second lead on one side of the chip to the second bonding pad of the second lead on the opposite side of the chip, and electromagnetic shielding is achieved across the chip and the wire.

[0069] As an optional embodiment, please refer to Figure 7 and Figure 8 The electromagnetic shielding wire 23 is arranged across the chip 15 to achieve electromagnetic shielding of the chip 15, wherein by adjusting the wire bonding parameters of the electromagnetic shielding wire 23, the electromagnetic shielding wire 23 is in contact in the horizontal and vertical directions by tensioning the electromagnetic shielding wire 23, and the entire meshed electromagnetic shielding wire is electrically connected.

[0070] In other embodiments, the electromagnetic shielding wire can be connected from the second bonding pad of the second lead on one side of the chip to the second bonding pad of the second lead on the opposite side of the chip to achieve a single horizontal or vertical arrangement of the electromagnetic shielding wire.

[0071] Although the upwardly bent second lead and third lead have a certain deformation resistance, the size of the bonding pad of the second lead and third lead is small, and the process of directly bonding the electromagnetic shielding wire to the second bonding pad of the second lead and the fourth bonding pad of the third lead is relatively complex.

[0072] As an optional embodiment, please refer to Figures 9-11 , Figure 9 is a top view structural schematic diagram of a lead frame with a lead bonding strip of an embodiment, Figure 10 is a cross-sectional structural schematic diagram of an electromagnetic shielding packaging structure with a lead bonding strip of an embodiment, Figure 11 is a top view structural schematic diagram of an electromagnetic shielding packaging structure with a lead bonding strip of an embodiment, and the second bonding pad of part or all of the second lead on one side of the base island region is an integral whole. In the embodiment, the second bonding pad surface of the second lead 30 on the same side has a lead bonding strip 35, and the electromagnetic shielding wire 33 is bonded to the surface of the lead bonding strip 35. Since the size of the lead bonding strip is much larger than the size of the second bonding pad of the second lead and the fourth bonding pad of the third lead, the bonding of the electromagnetic shielding wire 33 to the surface of the lead bonding strip is more stable. Since the lead bonding strip 35 is introduced, the position and size of the second bonding pad of the second lead do not need to be considered, and the electromagnetic shielding wire can be bonded to any position on the surface of the lead bonding strip 35, so that the connection mode of the electromagnetic shielding wire can be more freely arranged, such as being more sparse or more dense, and the entire electromagnetic shielding structure is more stable.

[0073] In the embodiment, the material of the wire bonding strip 35 is the same as that of the lead frame, and in other embodiments, the material of the wire bonding strip 35 can be different from that of the lead frame, for example, a metal strip, which has certain conductive performance and is suitable as an electromagnetic shielding structure.

[0074] In the embodiment, the wire bonding strip 35 is fixed on the second bonding platform of the second pin 30 through a bonding or bonding process, and in other embodiments, the wire bonding strip can be integrally formed with the lead frame.

[0075] In the embodiment, the wire bonding strip is directly connected to the second bonding platform of the second pin and the fourth bonding platform of the third pin, realizing electrical connection of the electromagnetic shielding wire, the wire bonding strip, the second pin and the third pin, and realizing electrical grounding of the entire electromagnetic shielding structure.

[0076] In other embodiments, the wire bonding strip and the fourth bonding platform of the third pin can also be connected through the electromagnetic shielding wire, realizing electrical connection of the electromagnetic shielding wire, the wire bonding strip, the second pin and the third pin, and realizing electrical grounding of the entire electromagnetic shielding structure.

[0077] In the embodiment, each wire bonding strip is connected to the second bonding platform of all the second pins on one side, and in other embodiments, each wire bonding strip can be connected to part of the second pins on one side, or the wire bonding strips are integrally connected to form a wire bonding ring in a rectangular frame.

[0078] Although the application has been disclosed as above with reference to the preferred embodiments, it is not intended to limit the application, and any person skilled in the art can make possible changes and modifications to the technical solutions of the application by using the disclosed methods and technical contents without departing from the spirit and scope of the application. Therefore, any simple modification, equivalent change and modification made to the above embodiments according to the technical essence of the application, which does not deviate from the technical solutions of the application, falls within the protection scope of the technical solutions of the application.

Claims

1. An electromagnetic shielded package structure, characterized by, include: A lead frame, the lead frame including a base island region and a pin region surrounding the base island region, the pin region including a first pin and an upwardly bent second pin, the first pin having a first bonding platform, the second pin having a second bonding platform, the second bonding platform being higher than the first bonding platform; The chip located on the surface of the base island region; A bonding wire is bonded between the chip surface and the first bonding platform of the lead frame; An electromagnetic shielding line is bonded between the second bonding platforms of the second pin. The electromagnetic shielding line is higher than the chip and the corresponding bonding line to achieve electromagnetic shielding of the chip. A plastic encapsulation structure covering the lead frame, chip, bonding wire, and electromagnetic shielding wire.

2. The electromagnetic shield package structure of claim 1, wherein, The second pin includes a first stepped bend and a second stepped bend. One end of the first stepped bend is connected to the main structure of the lead frame pin area, and the stepped plane of the first stepped bend is higher than the first bonding platform of the first pin. The second stepped bend is connected to the other end of the first stepped bend, and the stepped plane of the second stepped bend serves as the second bonding platform and is higher than the stepped plane of the first stepped bend.

3. The electromagnetic shield package structure of claim 2, wherein, The stepped plane of the first stepped bend is lower than the chip surface.

4. The electromagnetic shield package structure of claim 2, wherein, A portion of the stepped plane of the first stepped bend is located in the cutting area of ​​the discrete chip package structure, which makes the second pin and the first pin of the cut discrete chip package structure electrically isolated, and the second pin is not exposed on the back of the discrete chip package structure.

5. The electromagnetic shield package structure of claim 1, wherein, The first pin and the second pin are spaced apart.

6. The electromagnetic shield package structure of claim 1, wherein, The lead frame is formed by a stamping process.

7. The electromagnetic shield package structure of claim 1, wherein, It also includes an upwardly bent third pin, which is a grounding pin and is electrically connected to the second pin to achieve electrical grounding of the electromagnetic shielding structure.

8. The electromagnetic shield package structure of claim 7, wherein, The third pin includes a third bonding platform, a fourth bonding platform, and a connecting portion connecting the third bonding platform and the fourth bonding platform, wherein the fourth bonding platform is higher than the third bonding platform.

9. The electromagnetic shield package structure of claim 8, wherein, The projections of the third bonding platform and the fourth bonding platform on the plane where the lead frame is located do not overlap or partially overlap.

10. The electromagnetic shield package structure of claim 8, wherein, The fourth bonding platform of the third pin is electrically connected to the second bonding platform of the second pin via an electromagnetic shielding wire.

11. The electromagnetic shield package structure of claim 8, wherein, A bonding wire is bonded between the chip surface and the third bonding platform of the third pin.

12. The electromagnetic shield package structure of claim 1, wherein, The electromagnetic shielding wire extends from the second bonding platform of the second pin on one side of the chip to the second bonding platform of the second pin on the opposite side of the chip, and crosses over the chip to achieve electromagnetic shielding of the chip.

13. The electromagnetic shield package structure of claim 1, wherein, The electromagnetic shielding wires are arranged in a crisscross pattern above the chip to achieve electromagnetic shielding of the chip, and the horizontal and vertical electromagnetic shielding wires are in contact to achieve electrical connection of the entire mesh electromagnetic shielding wires.

14. The electromagnetic shield package structure of claim 1, wherein, The second bonding platform, located on one side of the base island region, is a single unit for some or all of the second pins.

15. The electromagnetic shield package structure of claim 14, wherein, The second bonding platform surface of a portion or all of the second pins located on one side of the base island region has a wire bonding strip, and the electromagnetic shielding wire is bonded to the surface of the wire bonding strip.

16. The electromagnetic shield package structure of claim 15, wherein, The wire bonding bar is secured to the second bonding pad surface of the second pin by a bonding or adhesive process, or the wire bonding bar is integrally formed with the lead frame. The wire bonding bar is secured to the second bonding pad surface of the second pin by a bonding or adhesive process, or the wire bonding bar is integrally formed with the lead frame.

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