Packaging structure for preventing glue overflow of PCB coil

Abstract

The utility model provides a packaging structure for preventing glue overflow of a PCB coil. The packaging structure comprises a frame main body, and a plurality of base islands, pins, the PCB coil and a plastic packaging layer which are arranged on the frame main body. The base islands are connected with the pins, the front surfaces of the base islands comprise mounting areas and half-etching areas, the half-etching areas are formed at the edges of the front surfaces of the base islands, and the half-etching areas and the mounting areas have height difference to form a stepped structure; the PCB coil is arranged in a mounting area on the front surface of the base island through an adhesive, the base island is not arranged below the middle part of the PCB coil, and the half-etching area is a glue overflowing area; and the PCB coil and the base island are coated by the plastic packaging layer. In the packaging structure disclosed by the utility model, when the PCB coil is mounted, redundant adhesive overflows towards the half-etching region; and after a plastic packaging layer of the packaging structure is formed in the later period, the phenomenon of layering of the packaging structure is avoided, the quality of the packaging structure is ensured, the efficiency is high, the packaging period of a product can be shortened, and the packaging cost of the product can be reduced.

Description

TECHNICAL FIELD

[0001] The utility model belongs to the technical field of semiconductor packaging, especially relates to a packaging structure for preventing PCB coil glue overflow. BACKGROUND

[0002] The lead frame is a key structural member for realizing the electrical connection between the internal circuit lead-out end of the PCB coil and the external lead by means of bonding material (gold wire, aluminum wire, copper wire), forming an electrical circuit, and plays a role of bridge connecting the external wire. With the rapid development of the semiconductor industry, the integration is getting higher and higher, and the types of devices placed in the package are also diversified.

[0003] The coil is an important electronic component, which is usually used for processing and regulating current signals in the PCB (Printed Circuit Board) circuit, and mainly functions to store and regulate current, and its principle is related to electromagnetic induction and inductance. In the lead frame packaging product, in order to ensure that the function of the coil is not affected, there is no metal lead frame directly below the coil, so the conventional lead frame cannot be used for packaging.

[0004] The conventional packaging structure with a PCB coil is shown in Figure 1 , wherein the frame body 1 is provided with a base island 2, the base island 2 is connected with the pin 4, and the PCB coil 3 is placed on the upper surface of the base island 2. As shown in Figure 2 , there is no base island 2 below the middle part of the PCB coil 3, and when the PCB coil 3 is pasted with glue 6, the glue 6 is easy to overflow and accumulate towards the middle part of the PCB coil 3, so that the plastic encapsulating material 5 is not combined ideally, resulting in the phenomenon of delamination of the product and the like.

[0005] In the prior art, in order to solve the problem, the adhesive is replaced by DAF (Die Attach Film) film. Using the DAF film to paste the PCB coil will not cause the glue overflow problem, but will increase the packaging cost.

[0006] Therefore, a new packaging structure is needed to solve the problem of glue overflow when pasting the PCB coil. SUMMARY

[0007] The utility model discloses a packaging structure for preventing PCB coil glue overflow, the PCB coil is arranged on the front surface of the base island through the adhesive, and the excess adhesive will overflow to the half-etching area;After the plastic encapsulating layer of the packaging structure is formed, the phenomenon of delamination of the packaging structure will not occur, and the quality of the packaging structure is ensured.

[0008] To achieve the above object, the utility model provides a kind of packaging structure for preventing PCB coil overflow glue, it includes frame main body and the multiple base islands, pin, PCB coil and plastic envelope layer being set on frame main body.Base island is connected with pin, base island front includes mounting area and half etching area, and half etching area is formed at the edge of base island front, and half etching area and mounting area have height difference, and form stepped structure;PCB coil is set in the mounting area of base island front by adhesive, and there is no base island below the middle of PCB coil, and half etching area is overflow glue area;Plastic envelope layer covers PCB coil and base island.

[0009] In some embodiments, the width of the half-etched area is 0.1mm-0.2mm.

[0010] In some embodiments, the ratio of the depth of the half-etched area to the height of the frame main body is 1:2. The width and depth of the half-etched area provide sufficient overflow glue area for the adhesion of the PCB coil and the base island, preventing delamination of the packaging structure and ensuring the quality of the packaging structure.

[0011] In some embodiments, the pin is disposed at the edge of the frame main body.

[0012] Compared with the prior art, the utility model has the following beneficial effects:

[0013] In the packaging structure disclosed by the utility model, a half-etched area is formed at the edge of the base island front, and the PCB coil is set in the mounting area of the base island front by adhesive. The excess adhesive will overflow into the half-etched area. Since the half-etched area provides sufficient overflow glue area, the adhesive will not accumulate towards the middle of the PCB coil. After the plastic envelope layer of the packaging structure is formed, delamination of the packaging structure will not occur, ensuring the quality of the packaging structure.

[0014] Furthermore, the adhesive is used to adhere the PCB coil and the base island, which is efficient and can shorten the packaging cycle and cost of the product. BRIEF DESCRIPTION OF DRAWINGS

[0015] Figure 1 A schematic diagram of the packaging structure in the background art is shown.

[0016] Figure 2 Another schematic diagram of the packaging structure in the background art is shown.

[0017] Figure 3 A schematic diagram of the packaging structure in the utility model is shown.

[0018] Figure 4 Another schematic diagram of the packaging structure in the utility model is shown.

[0019] Appendix mark:

[0020] Frame body 1, base island 2, mounting area 201, half-etching area 202, pin 4, PCB coil 3, plastic sealing layer 5, adhesive 6. DETAILED DESCRIPTION

[0021] In order to make the purpose, technical scheme and advantages of the utility model more clear, the technical scheme of the application will be described clearly and completely below with reference to the drawings.

[0022] The utility model provides a kind of packaging structure for preventing PCB coil overflow glue, it includes frame body 1 and the multiple base islands 2, pin 4, PCB coil 3 and plastic sealing layer 5 being set on frame body 1.

[0023] According to actual packaging demand, as shown in Figure 3 And Figure 4 Multiple base islands 2 are set on one side of frame body 1.Base island 2 is connected with pin 4, and pin 4 is distributed around the edge of frame body 1.

[0024] Each base island 2 front includes mounting area 201 and half-etching area 202, and half-etching area 202 is formed at the edge of base island 2 front, and half-etching area 202 and mounting area 201 have height difference, forming stepped structure.When rear PCB coil 3 is pasted on the mounting area 201 of base island 2 front by adhesive 6, the half-etching area 202 of base island 2 front is overflow glue area.

[0025] As described above, PCB coil 3 is directly set on the mounting area 201 of required base island 2 front by adhesive 6, and ensure that there is no base island 2 under the middle of PCB coil 3, because base island 2 is made of metal material, and metal material cannot exist under the middle of PCB coil 3, so as to avoid affecting the function of PCB coil 3, so PCB coil 3 is mounted on the mounting area 201 of multiple base islands 2 front.

[0026] Plastic sealing layer 5 covers PCB coil 3 and base island 2.

[0027] In the embodiment, the width of half-etching area 202 is set between 0.1mm-0.2mm, and the depth of half-etching area 202 is 1:2 compared with the height of frame body 1.The reasonable setting of the width and depth of half-etching area 202 provides enough overflow glue area for the pasting of PCB coil 3 and base island 2, so that the packaging structure does not appear delamination phenomenon, and the quality of packaging structure is guaranteed.

[0028] In the preparation of the packaging structure described in the embodiment, the PCB coil 3 is arranged on the mounting area 201 of the front surface of the base island 2 through the adhesive 6, and the excess adhesive 6 will overflow to the half-etching area 202 of the front surface of the base island 2; since the half-etching area 202 provides a sufficient overflow area, the adhesive 6 will not accumulate in the middle direction of the PCB coil 3, nor overflow to the position outside the base island 2, and after the plastic sealing layer 5 of the packaging structure is formed, the problem of insufficient bonding force of the plastic sealing material at the adhesive 6 accumulation position is reduced, so that the packaging structure will not appear delamination phenomenon, thereby ensuring the quality of the packaging structure.

[0029] And the adhesive 6 is used to paste the PCB coil 3 and the base island 2, which is realized under the current processing technology, has low process risk and high efficiency, can shorten the packaging cycle and cost of the product, and makes the packaging structure of the utility model have strong manufacturability.

[0030] In addition, in the implementation of the utility model, the number of the base island 2 and the PCB coil 3 can be set according to the needs of the integrated circuit, and the overall structure of the base island 2 and the PCB coil 3 arranged on the frame body 1 is not limited by the number, so as to ensure the diversity of the packaging structure, which can be in the form of SOP, QFP and the like.

[0031] The above is only the preferred embodiment of the utility model, and is not used to limit the utility model, and the utility model can have various modifications and changes for the person skilled in the art. Any modification, equivalent replacement, improvement and the like made within the spirit and principle of the utility model should be included in the protection scope of the utility model.

Claims

1. A packaging structure for preventing overflow of glue for a PCB coil, characterized by, The application relates to a frame body and a plurality of base islands, pins, PCB coils and plastic sealing layers arranged on the frame body, wherein the base islands are connected with the pins, the front surface of the base islands comprises a mounting area and a half-etching area, the half-etching area is formed at the edge of the front surface of the base islands, the half-etching area and the mounting area have a height difference, and a stepped structure is formed; the PCB coils are arranged on the mounting area of the front surface of the base islands through adhesive, and the middle part of the PCB coils is free of the base islands, the half-etching area is a glue overflow area; and the plastic sealing layer covers the PCB coils and the base islands.

2. The encapsulation structure for preventing overflow of glue on a PCB coil according to claim 1, wherein, The width of the half-etching area is 0.1-0.2 mm.

3. The encapsulation structure for preventing overflow of glue on a PCB coil according to claim 2, wherein, The depth of the half-etching area is 1:2 of the height of the frame body.

4. The encapsulation structure for preventing glue overflow of a PCB coil according to claim 2 or 3, characterized in that, The pins are arranged at the edge of the frame body.

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