Efficient heat dissipation intensive bus duct

Abstract

The utility model provides a high-efficiency heat dissipation intensive bus duct, which comprises a top plate, a bottom plate, conducting strips, a heat conduction and heat dissipation plate and heat dissipation fins, the heat conduction and heat dissipation plate is in a continuous right-angle bending wave shape, the surface and the bottom surface of the heat conduction and heat dissipation plate are respectively provided with an accommodating groove for accommodating the conducting strips, and the heat conduction and heat dissipation plate is internally provided with a continuously bent cooling flow channel. The two sets of heat dissipation fins are oppositely arranged on the two sides of the heat conduction and dissipation plate, and the top plate and the bottom plate are installed on the top and the bottom of the heat conduction and dissipation plate correspondingly. When the bus duct is assembled, the conductive sheets are placed in the accommodating grooves, then the heat dissipation fins are installed on the two sides of the heat conduction and heat dissipation plate, the top plate and the bottom plate are installed on the upper side and the lower side of the heat conduction and heat dissipation plate, assembly of the bus duct is completed, the cooling flow channels in the heat conduction and heat dissipation plate can sequentially flow through the groove walls, close to the conductive sheets, of the accommodating grooves, and effective heat dissipation of the densely-installed conductive sheets is achieved. According to the invention, a liquid cooling mode is adopted, so that the bus duct can still carry out effective heat dissipation under the conditions of high power load and high environment temperature.

Description

TECHNICAL FIELD

[0001] The utility model relates to the bus duct field, especially intensive bus duct of high -efficient heat dissipation. BACKGROUND

[0002] With the continuous growth of power demand and the increasing requirement of energy efficiency, intensive bus duct as a kind of efficient, safe and reliable electric energy transmission equipment, has been widely used in large buildings, factories, data centers and other occasions. Intensive bus duct with its high current-carrying capacity, compact structure design, excellent heat dissipation performance and high protection level, meets the demand of modern power system for large current, high power electric energy distribution and transmission.

[0003] However, in the practical application of intensive bus duct, the heat dissipation problem has been the key factor restricting its performance improvement and long-term stable operation. The traditional heat dissipation design often adopts natural convection or forced air cooling, but these methods have limited heat dissipation effect under high power load and high environmental temperature conditions, which easily leads to the temperature rise of bus duct, and further affects the operation efficiency and safety of the equipment. UTILITY MODEL CONTENT

[0004] (I) Technical problem to be solved

[0005] In order to solve the above problems of the prior art, the utility model provides an intensive bus duct of high -efficient heat dissipation.

[0006] (II) Technical scheme

[0007] In order to achieve the above purpose, the utility model adopts the main technical scheme including:

[0008] An intensive bus duct of high -efficient heat dissipation, comprising a top plate, a bottom plate, a conductive sheet, a heat-conducting heat dissipation plate and a heat dissipation fin;

[0009] The heat-conducting heat dissipation plate is in the form of continuous right-angle bending wave, the surface and the bottom surface of the heat-conducting heat dissipation plate are formed with accommodating grooves accommodating the conductive sheet, and the heat-conducting heat dissipation plate is provided with a continuous bending cooling flow channel;

[0010] The heat dissipation fin is provided with two groups, and is oppositely arranged on the two sides of the heat-conducting heat dissipation plate;

[0011] The top plate and the bottom plate are respectively installed on the top and the bottom of the heat-conducting heat dissipation plate.

[0012] Preferably, the heat-conducting heat dissipation plate surface is provided with a liquid inlet pipe communicated with the cooling flow channel, and the back surface of the heat-conducting heat dissipation plate is provided with a liquid outlet pipe communicated with the cooling flow channel.

[0013] Preferably, the cooling flow channel circulates cooling liquid.

[0014] Preferably, the top of the heat dissipation fin is provided with a positioning groove, and the two ends of the heat conduction heat dissipation plate outwardly extending are provided with positioning protrusions corresponding to the positioning groove.

[0015] Preferably, the surface of the conductive sheet is wrapped with an epoxy resin insulation layer.

[0016] Preferably, the top plate and the bottom plate are provided with insulation pad strips corresponding to the accommodating grooves on the side close to the heat conduction heat dissipation plate.

[0017] (Three) beneficial effects

[0018] The beneficial effects of the utility model lie in: adopting the above technical scheme, the conductive sheet is put into the accommodating groove, then the heat dissipation fin is installed on the two sides of the heat conduction heat dissipation plate, the top plate and the bottom plate are installed on the upper and lower two sides of the heat conduction heat dissipation plate, the assembly of the bus duct is completed, the cooling flow channel in the heat conduction heat dissipation plate can flow through the accommodating groove wall close to each conductive sheet in turn, and the densely installed conductive sheet is effectively cooled, and the liquid cooling mode is adopted, so that the bus duct can still be effectively cooled under the condition of high power load and high ambient temperature. BRIEF DESCRIPTION OF DRAWINGS

[0019] Figure 1 It is a structure diagram of a high-efficiency heat dissipation intensive bus duct Figure One ;

[0020] Figure 2 It is a structure diagram of a high-efficiency heat dissipation intensive bus duct Figure Two ;

[0021] Figure 3 It is a structure diagram of a heat conduction heat dissipation plate

[0022] Figure 4 It is a structure diagram of a high-efficiency heat dissipation intensive bus duct

[0023]

Explanation of the drawings

[0024] 1, heat conduction heat dissipation plate

[0025] 11, cooling flow channel, 12, liquid inlet pipe, 13, liquid outlet pipe

[0026] 2, conductive sheet

[0027] 3, heat dissipation fin

[0028] 4, top plate

[0029] 5, bottom plate

[0030] 6, insulation pad strip DETAILED DESCRIPTION

[0031] In order to better explain the utility model, so as to facilitate understanding, below, by specific implementation, the utility model is described in detail in conjunction with the drawings.

[0032] Please refer to Figures 1 to 4 The utility model provides a kind of high-efficiency heat dissipation dense bus duct, including top plate 4, bottom plate 5, conducting sheet 2, heat-conducting heat-dissipation plate 1 and heat-dissipation fin 3;

[0033] Heat-conducting heat-dissipation plate 1 is continuous right-angle bending wave shape, and the surface of heat-conducting heat-dissipation plate 1 is formed with the accommodating groove accommodating conducting sheet 2, and continuously bending cooling flow channel 11 is arranged in heat-conducting heat-dissipation plate 1;

[0034] Heat-dissipation fin 3 is provided with two groups, and is oppositely arranged on the two sides of heat-conducting heat-dissipation plate 1;

[0035] Top plate 4 and bottom plate 5 are respectively installed on the top and bottom of heat-conducting heat-dissipation plate 1;

[0036] When using, conducting sheet 2 is placed into accommodating groove, and then heat-dissipation fin 3 is installed on the two sides of heat-conducting heat-dissipation plate 1, and top plate 4 and bottom plate 5 are installed on the upper and lower two sides of heat-conducting heat-dissipation plate 1, to complete the assembly of bus duct, and cooling flow channel 11 in heat-conducting heat-dissipation plate 1 can flow through the groove wall of the accommodating groove close to each conducting sheet 2 in turn, to realize effective heat dissipation of densely installed conducting sheet 2, and the liquid cooling mode is used to enable bus duct to still be effectively cooled under high-power load and high ambient temperature conditions.

[0037] In the embodiment, the surface of heat-conducting heat-dissipation plate 1 is provided with liquid inlet pipe 12 communicated with cooling flow channel 11, and the back of heat-conducting heat-dissipation plate 1 is provided with liquid outlet pipe 13 communicated with cooling flow channel 11;

[0038] When adjacent bus ducts are butted, the liquid inlet pipe 12 and liquid outlet pipe 13 of heat-conducting heat-dissipation plate 1 in adjacent bus ducts are also butted through the conduit, and the cooling liquid in cooling liquid storage tank can be transported into heat-conducting heat-dissipation plate 1 of bus duct by conveying pump, and finally backflows into cooling liquid storage tank, to realize circulating cooling, and cooling liquid storage tank can cool the cooling liquid.

[0039] In the embodiment, cooling liquid circulates in cooling flow channel 11.

[0040] In the embodiment, the top of heat-dissipation fin 3 is provided with positioning groove, and the bottom of the two ends of heat-conducting heat-dissipation plate 1 extending outward is provided with positioning protrusion corresponding to the positioning groove, to facilitate the rapid installation of heat-dissipation fin 3 and heat-conducting heat-dissipation plate 1.

[0041] In the embodiment, the surface of conducting sheet 2 is wrapped with epoxy resin insulating layer.

[0042] In the embodiment, the top plate 4 and the bottom plate 5 are provided with the insulating pad strip 6 corresponding to the accommodating groove near the side of the heat-conducting heat-dissipating plate 1, so as to ensure the insulation effect.

[0043] The working principle of the utility model is as follows:

[0044] The conductive sheet 2 is placed into the accommodating groove, and then the heat-dissipating fin 3 is installed on both sides of the heat-conducting heat-dissipating plate 1, and the top plate 4 and the bottom plate 5 are installed on the upper and lower sides of the heat-conducting heat-dissipating plate 1, so that the assembly of the bus duct is completed.

[0045] The circuit and electronic components and modules involved are all prior art, and the skilled in the art can realize them without further description, and the content protected by the utility model does not involve the improvement of software and methods.

[0046] The above is only an embodiment of the utility model, and does not limit the patent range of the utility model, and any equivalent transformation or direct or indirect application in the related technical field by using the content of the utility model specification and drawings is also included in the patent protection range of the utility model.

[0047] In addition, it should be understood that, although the present specification is described in terms of embodiments, not every embodiment contains only one independent technical solution, and the description of the specification is only for the sake of clarity, and the skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can be combined appropriately to form other embodiments that can be understood by the skilled in the art.

Claims

1. A high-efficiency heat dissipation dense bus duct, characterized in that, The heat-conducting and radiating plate is in a continuous straight-angle bending wave shape, and the surface and the bottom surface of the heat-conducting and radiating plate are formed with accommodating grooves for accommodating the conductive sheet, and the heat-conducting and radiating plate is provided with a continuous bending cooling flow channel. The heat-conducting and radiating plate is in a continuous straight-angle bending wave shape, and the surface and the bottom surface of the heat-conducting and radiating plate are formed with accommodating grooves for accommodating the conductive sheet, and the heat-conducting and radiating plate is provided with a continuous bending cooling flow channel. The heat-conducting and radiating plate is in a continuous straight-angle bending wave shape, and the surface and the bottom surface of the heat-conducting and radiating plate are formed with accommodating grooves for accommodating the conductive sheet, and the heat-conducting and radiating plate is provided with a continuous bending cooling flow channel. The heat-conducting and radiating plate is in a continuous straight-angle bending wave shape, and the surface and the bottom surface of the heat-conducting and radiating plate are formed with accommodating grooves for accommodating the conductive sheet, and the heat-conducting and radiating plate is provided with a continuous bending cooling flow channel.

2. The high efficient heat dissipation dense bus duct according to claim 1, characterized in that, The heat-conducting and radiating plate is in a continuous straight-angle bending wave shape, and the surface and the bottom surface of the heat-conducting and radiating plate are formed with accommodating grooves for accommodating the conductive sheet, and the heat-conducting and radiating plate is provided with a continuous bending cooling flow channel.

3. The high efficient heat dissipation dense bus duct according to claim 1, characterized in that, The heat-conducting and radiating plate is in a continuous straight-angle bending wave shape, and the surface and the bottom surface of the heat-conducting and radiating plate are formed with accommodating grooves for accommodating the conductive sheet, and the heat-conducting and radiating plate is provided with a continuous bending cooling flow channel.

4. The high efficient heat dissipation dense bus duct according to claim 1, characterized in that, The heat-conducting and radiating plate is in a continuous straight-angle bending wave shape, and the surface and the bottom surface of the heat-conducting and radiating plate are formed with accommodating grooves for accommodating the conductive sheet, and the heat-conducting and radiating plate is provided with a continuous bending cooling flow channel.

5. The high efficient heat dissipation dense bus duct according to claim 1, characterized in that, The heat-conducting and radiating plate is in a continuous straight-angle bending wave shape, and the surface and the bottom surface of the heat-conducting and radiating plate are formed with accommodating grooves for accommodating the conductive sheet, and the heat-conducting and radiating plate is provided with a continuous bending cooling flow channel.

6. The high efficient heat dissipation dense bus duct according to claim 1, characterized in that, The heat-conducting and radiating plate is in a continuous straight-angle bending wave shape, and the surface and the bottom surface of the heat-conducting and radiating plate are formed with accommodating grooves for accommodating the conductive sheet, and the heat-conducting and radiating plate is provided with a continuous bending cooling flow channel. The heat-conducting and radiating plate is in a continuous straight-angle bending wave shape, and the surface and the bottom surface of

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