HDI adapter plate and circuit board with HDI adapter plate

Abstract

The utility model provides an HDI adapter plate, which is manufactured and formed by HDI technology and comprises a substrate, a first bonding pad and a second bonding pad, and the substrate is provided with a first substrate surface and a second substrate surface which are oppositely arranged; the first bonding pad is arranged on the first substrate surface, and the HDI adapter plate is connected with the chip through the first bonding pad; the first bonding pad is arranged on the first substrate surface, the second bonding pad is arranged on the second substrate surface, the second bonding pad is used for welding a circuit board, the first substrate surface of the HDI adapter plate is connected with the chip, the second substrate surface is connected with the circuit board, the chip is firstly in high-density interconnection with the HDI adapter plate, the HDI adapter plate is then connected with a common circuit board, and local HDI adapter plates are arranged at the positions of several needed chips. The whole circuit board does not need to be set as an HDI board, so that the processing cost of the circuit board is reduced; and the HDI adapter plate does not need a special processing technology, so that the processing is relatively simple, the cost is lower, and the processing steps are fewer.

Description

TECHNICAL FIELD

[0001] The utility model relates to chip technical field especially is related to a kind of HDI adapter plate, circuit board with HDI adapter plate. BACKGROUND

[0002] In the development of electronic industry today, electronic product, especially consumer electronics, puts forward higher and higher requirements to light and thin, so the size of PCB (Print Circut Borad) is required to be smaller and smaller.BGA packaging technology refers to ball grid array packaging, BGA packaging occupies larger area of substrate, cannot meet the demand of smaller area and thinner thickness of PCB, and the chip pad fan-out of BGA packaging, via-hole line-out is difficult.

[0003] In order to meet the demand of PCB light and thin and line-out, some PCBs are manufactured by using HDI technology.HDI (High Density Interconnector) is an advanced PCB manufacturing technology, and HDI board is a kind of circuit board with higher line distribution density using micro-blind hole technology.However, the cost of PCB manufactured by using HDI technology is higher, only a few IC devices need to be introduced into HDI board, and using HDI technology for the whole PCB will cause great cost waste.

[0004] In the prior art, a patent with application publication number CN108695295A discloses a chip conversion board, which comprises a board body, a first solder pad is arranged on the first substrate surface of the board body, a second solder pad is arranged on the second substrate surface of the board body, the first substrate surface and the second substrate surface are oppositely arranged, the first solder pad on the first substrate surface is used for connecting chip pins, the second solder pad on the second substrate surface is used for connecting printed circuit board, the first solder pad and the second solder pad are electrically connected to weld the chip with small pitch chip pins on the PCB with large pitch PCB pins, so that the impedance requirement can be realized without using high-cost and low-yield technology.However, when this technical scheme is implemented, two solder pads are arranged on the chip conversion board, the solder pads are electrically connected by compression, punching must be performed on the solder pads, the processing technology needs to be higher, the production steps are more complicated, and the production cost is increased. UTILITY MODEL CONTENTS

[0005] The utility model aims at providing HDI adapter plate, circuit board with HDI adapter plate, to solve the technical problems of high cost of whole HDI board and high process difficulty of ordinary conversion board in the prior art.

[0006] The utility model provides a kind of HDI adapter plate, including substrate, substrate has oppositely arranged first substrate face and second substrate face;First pad, be located on the first substrate face, the HDI adapter plate is connected with chip by the first pad;Second pad, it is located on the second substrate face, and the second pad is used to weld circuit board.

[0007] In some embodiments of the present application, a trace channel is formed in the substrate, one opening of the trace channel is provided on the first substrate face, and the other opening is provided on the second substrate face. The trace channel communicates the first substrate face and the second substrate face.

[0008] In some embodiments of the present application, a first hole is provided on the first substrate face, and the extension depth of the first hole is D1. The distance between the first substrate face and the second substrate face is D0.

[0009] A second hole is provided on the second substrate face. The extension depth of the second hole is D2. D1 < D0, and D2 < D0.

[0010] The first hole and the second hole are connected by a first channel. The first hole, the second hole, and the first channel collectively form a trace channel.

[0011] In some embodiments of the present application, the HDI adapter plate includes a shielding cover. The shielding cover is in a ring structure, and the chip is arranged in the internal space of the shielding cover.

[0012] In some embodiments of the present application, the HDI adapter plate includes a filter circuit. The filter circuit is provided on the first substrate face.

[0013] In some embodiments of the present application, the HDI adapter plate includes a crystal oscillator. The crystal oscillator is arranged on the first substrate face.

[0014] In some embodiments of the present application, the HDI adapter plate further includes a capacitor. The capacitor is arranged on the second substrate face.

[0015] In some embodiments of the present application, the projection of the capacitor on the first substrate face at least partially falls on the chip.

[0016] The application further provides a circuit board with an HDI adapter plate, comprising: at least one HDI adapter plate, comprising a substrate, the substrate having oppositely arranged first and second substrate surfaces; the first substrate surface is provided with a first pad, the first pad being connected with a chip; a second pad is provided on the second substrate surface; a circuit board is provided with a first circuit board side surface opposite to the second substrate surface, the first circuit board side surface is provided with a welding area, the welding area being opposite to the second pad and being welded and fixed, so that the signal of the chip is transmitted to the circuit board through the HDI adapter plate.

[0017] In some embodiments of the application, a through hole is provided on the circuit board, the through hole being located at the center position of the welding area; the HDI adapter plate further comprises a capacitor, the capacitor being arranged at the middle position of the second substrate surface; the through hole is opposite to the capacitor and is used for accommodating the capacitor.

[0018] The HDI adapter plate of the application has at least the following positive effects:

[0019] The HDI adapter plate is made of HDI technology, comprising: a substrate, the substrate having oppositely arranged first and second substrate surfaces; a first pad is provided on the first substrate surface, the HDI adapter plate being connected with a chip through the first pad; a second pad is provided on the second substrate surface, the second pad being used for welding a circuit board; the first substrate surface of the HDI adapter plate is connected with the chip, and the second substrate surface is connected with the circuit board; the chip is first connected with the HDI adapter plate through high-density interconnection, and then the HDI adapter plate is connected with a common circuit board; only a local HDI adapter plate needs to be arranged at a chip that needs to be connected, instead of arranging the entire circuit board as an HDI board, thereby reducing the processing cost of the circuit board; the HDI adapter plate does not need special processing technology, and is simple to process, low in cost and less in processing steps; arranging a filter circuit, a capacitor, a crystal oscillator and a shielding cover on the HDI adapter plate can meet the power supply requirement of the chip, and the chip does not need to be connected to an external crystal oscillator and then connected to the HDI adapter plate, and can meet the EMC requirement of the electronic device, so that the transmission between the chip and the local HDI board is more stable, and the risk of poor signal transmission quality caused by only connecting the chip is reduced. BRIEF DESCRIPTION OF DRAWINGS

[0020] In order to more clearly illustrate the specific embodiments of the present application or the technical solutions in the prior art, the following will briefly introduce the drawings needed to be used in the specific embodiments or prior art description. Obviously, the drawings described below are some embodiments of the present application, and those skilled in the art can also obtain other drawings according to these drawings without creative labor.

[0021] Figure 1The utility model provides an HDI adapter plate's front view and rear view provided for the embodiment of the utility model,

[0022] Figure 2 The utility model provides an HDI adapter plate and circuit board between split schematic diagram provided for the embodiment of the utility model,

[0023] Figure 3 The utility model provides an HDI adapter plate, chip and circuit board's connection schematic diagram provided for the embodiment of the utility model,

[0024] Figure 4 Another HDI adapter plate, chip and circuit board's connection schematic diagram provided for the embodiment of the utility model of the utility model,

[0025] Icon: 1, HDI adapter plate;11, base plate;111, first base plate face;112, second base plate face;13, wiring channel;131, first hole;132, second hole;133, first channel;14, shield cover;15, filter circuit;16, crystal oscillator;17, electric capacity;2, chip;3, circuit board;31, soldering area;32, through hole;4, solder. Specific implementation

[0026] The technical scheme of the utility model will be described clearly and completely in combination with the embodiments below, and obviously, the described embodiments are a part of the embodiments of the utility model, not all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by the person skilled in the art without creative labor belong to the protection scope of the utility model.

[0027] In order to make the purpose, technical scheme and advantage of the embodiment of the utility model clearer, the technical scheme in the embodiment of the utility model will be described clearly and completely in combination with the drawings in the embodiment of the utility model, obviously, the described embodiment is a part of the embodiments of the utility model, not all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by the person skilled in the art without creative labor belong to the protection scope of the utility model. Therefore, the following detailed description of the embodiment of the utility model provided in the drawings is not intended to limit the scope of the claimed utility model, but only represents the selected embodiment of the utility model. Based on the embodiments in the utility model, all other embodiments obtained by the person skilled in the art without creative labor belong to the protection scope of the utility model.

[0028] In the utility model, unless another definite provision and limitation, the terms "mount", "link", "connect", "fix" and so on should do broad sense understanding, for example, can be fixed connection, also can be detachable connection, or be integrated;Can be mechanical connection, also can be electrical connection;Can be direct connection, also can through intermediate medium indirectly connect, can be two element inside's intercommunication or two element's interaction relationship.For the ordinary skill in the art, can understand the concrete meaning of above-mentioned term in the utility model according to specific circumstances.In addition, the terms "first", "second", "third" and so on are only used to distinguish description, and cannot be understood as indicating or suggesting relative importance.

[0029] In the utility model, unless another definite provision and limitation, first feature is on or under second feature can include that first and second features are directly contacted, also can include that first and second features are not directly contacted but are contacted through additional features between them.Moreover, first feature is on, above and on second feature includes that first feature is directly above and obliquely above second feature, or just indicates that the horizontal height of first feature is higher than second feature.First feature is under, below and under second feature includes that first feature is directly under and obliquely under second feature, or just indicates that the horizontal height of first feature is less than second feature.

[0030] With the continuous development of semiconductor technology, the function of single chip 2 is more and more powerful, but the size of chip 2 is required to be smaller and smaller, and the number of pins in the unit area of chip 2 is also more and more, which puts forward higher requirements for the connection of chip 2 and circuit board 3.

[0031] For the chip 2 with small pin pitch, the pin pitch of the ordinary circuit board 3 (PCB board) is large, which cannot meet the welding requirement of the chip 2.The BGA packaged chip 2 is difficult to solder.

[0032] In some prior art, the ordinary circuit board 3 is usually replaced by an HDI board manufactured by using HDI technology, the HDI board has high line distribution density and can meet the wiring requirement of the chip 2 with small pin pitch, but usually only several chips 2 have small pin pitch, if the entire printed board is replaced by the HDI board, it will cause waste, and the cost of the HDI board is also high.

[0033] HDI is High Density Interconnector, which is an advanced printed circuit board 3 (PCB) manufacturing technology. The HDI board is a circuit board 3 with high line distribution density using micro blind buried hole technology. However, the cost of PCB manufactured by HDI technology is high. Only a few IC devices need to be introduced into the HDI board. If the entire PCB uses HDI technology, it will cause a huge waste of cost.

[0034] Referring to Figure 1 The application provides an HDI adapter plate, which can electrically connect the required conversion chip 2 to the local HDI board. Only the local position uses the HDI adapter plate, and the production cost is low.

[0035] The HDI adapter plate 1 of the application is an HDI adapter plate 1 manufactured by HDI technology. The HDI adapter plate 1 is provided with a first solder pad, and the line distribution density on the first substrate surface 111 is high, which can meet the connection requirement of the small pin pitch of the chip 2. The HDI adapter plate 1 includes a substrate 11 with a maximum area of the receiving surface. The substrate 11 is a flat plate structure, and the substrate 11 has a first substrate surface 111 and a second substrate surface 112 arranged oppositely. The first substrate surface 111 is used to connect the chip 2, and the second substrate surface 112 is used to connect the circuit board 3.

[0036] The chip 2 and the first substrate surface 111 are welded. In some embodiments, the chip 2 is an IC device, and the chip 2 and the first substrate surface 111 are welded by heating and melting the solder, so that the chip 2 is fixed on the first substrate surface 111.

[0037] The second substrate surface 112 and the circuit board 3 are welded by heating and melting the solder. The second substrate surface 112 of the substrate 11 is also provided with a second solder pad, which is arranged at the middle position of the second substrate surface 112 of the substrate 11.

[0038] In some prior art, the ordinary circuit board 3 is usually replaced by an HDI board manufactured by HDI technology. The HDI board has high line distribution density, which can meet the wiring requirement of the chip 2 with small pin pitch. However, usually only a few chips 2 have small pin pitch. If the entire printed board is replaced by the HDI board, it will cause waste.

[0039] Compared with the prior art of replacing all the circuit board 3 with an HDI board, the application realizes the connection between the chip 2 and the circuit board 3 by using an HDI adapter board 1 using HDI technology. The first substrate surface 111 of the HDI adapter board 1 is connected to the chip 2, and the second substrate surface 112 is connected to the circuit board 3. The chip 2 is first connected to the HDI adapter board 1 through high-density interconnection, and then the HDI adapter board 1 is connected to the ordinary circuit board 3. Only a few local HDI adapter boards 1 are needed at the required chip 2, and the entire circuit board 3 does not need to be replaced with an HDI board, thereby reducing the processing cost of the circuit board 3 and significantly improving the prior art.

[0040] In another prior art, a patent with application publication number CN108695295A discloses an HDI adapter board 1. The HDI adapter board 1 includes a board body. First pads on the first substrate surface 111 of the board body are used to connect chip 2 pins, and second pads on the second substrate surface 112 are used to connect circuit boards 3. The first pads and the second pads are electrically connected to solder the chip 2 with small-pitch pins to a PCB board with large-pitch PCB pins, thereby realizing impedance requirements without using high-cost and low-yield technology. However, when this technical solution is implemented, two pads are provided on the HDI adapter board 1, and the pads are electrically connected by compression. Punching is required on the pads, which requires high processing technology and complicated production steps, thereby increasing production costs.

[0041] Compared with the HDI adapter board 1 that requires new processing technology for two pads, the HDI adapter board 1 of the application does not need to compress the two pads of the HDI adapter board 1 to connect the lines. The HDI adapter board 1 is manufactured using HDI technology. The HDI adapter board 1 does not require special processing technology, and the processing is relatively simple, the cost is lower, and the processing steps are fewer. Compared with the prior art, the application has made significant progress.

[0042] Reference Figures 2-4 The application also provides a circuit board 3 with an HDI adapter board 1. The circuit board 3 is provided with a through hole 32, and the outer periphery of the through hole 32 is provided with a soldering area 31. The circuit board 3 has a first circuit board 3 side opposite to the second substrate surface 112 of the substrate 11, and the first circuit board 3 side is provided with a soldering area 31.

[0043] The second substrate surface 112 is provided with pads and soldering areas 31 opposite to each other, so that at least part of the second pads are soldered to the soldering areas 31, thereby transmitting signals of the HDI adapter board 1 to the circuit board 3. At least part of the second pads or the capacitors 17 are accommodated in the through hole 32.

[0044] For the case that only part of the chips 2 have connection requirements with the HDI board, the application connects the chips 2 having the requirements with the HDI adapter board 1, realizes high-density interconnection by the HDI adapter board 1, and then connects the HDI adapter board 1 with the circuit board 3, thereby realizing the technical scheme of transmitting the signals of the chips 2 to the circuit board 3 through the HDI adapter board 1. The entire circuit board 3 does not need to be set as an HDI board, thereby reducing the difficulty of using the HDI technology for processing and reducing the processing cost of the circuit board 3. Compared with the scheme of using the HDI technology for the entire circuit board 3 in the prior art, the application only needs to locally add the HDI adapter board 1, can realize the connection of the HDI adapter board 1 to the ordinary circuit board 3, and meets the high-density wiring requirements of the chips 2, has low cost, and the HDI adapter board 1 can be punched by using the existing HDI manufacturing technology, without the need of adding other processing technologies, and has a significant progress compared with the prior art.

[0045] The number of the HDI adapter boards 1 is equal to the number of the chips 2 that cannot be directly connected with the circuit board 3, so that the chips 2 with small pins are connected through the HDI adapter boards 1, and the remaining chips 2 can be directly connected to the circuit board 3, thereby reducing the cost.

[0046] In some embodiments, the welding area 31 is a ring-shaped area for realizing the electrical connection of the HDI adapter board 1 and the circuit board 3. Optionally, the welding area 31 is a rectangular area with a hole in the middle. The area in which the second solder pad is located is matched with the shape of the ring-shaped welding area 31, so that the second solder pad and the welding area 31 are more easily positioned when being welded, thereby reducing the difficulty of the welding process.

[0047] In some embodiments, the circuit board 3 is provided with a through hole 32 located at the center of the welding area 31. The HDI adapter board 1 further includes a capacitor 17 arranged at the middle position of the second substrate surface 112, and the through hole 32 is opposite to the capacitor 17 and is used for accommodating the capacitor 17, so that the HDI adapter board 1 is connected to the circuit board 3 without being tilted due to the extrusion of the capacitor 17.

[0048] In some embodiments of the application, a wiring channel is formed in the substrate 11, one opening of the wiring channel is arranged on the first substrate surface 111, and the other opening is arranged on the second substrate surface 112. The wiring channel communicates the first substrate surface 111 and the second substrate surface 112.

[0049] The extension direction of the HDI adapter board 1 between the first substrate surface 111 and the second substrate surface 112 is defined as the first direction.

[0050] In some embodiments of the present application, the first substrate surface 111 is provided with a first hole 131, the axial direction of the first hole 131 extends along the first direction, it should be noted that the extension depth of the first hole 131 is D1, the distance between the first substrate surface 111 and the second substrate surface 112 is D0, and D1≤D0.

[0051] The second substrate surface 112 is provided with a second hole 132, the axial direction of the second hole 132 extends along the first direction, it should be noted that the extension depth of the second hole 132 is D2, and D2≤D0.

[0052] In some embodiments, D1<D0, D2<D0, the first hole 131 does not penetrate the substrate 11 of the HDI adapter plate 1, the second hole 132 also does not penetrate the substrate 11 of the HDI adapter plate 1, and the opening of the first hole 131 and the opening of the second hole 132 are not arranged opposite to each other, the first hole 131 and the second hole 132 are communicated through the first channel 133, so that the electric wire can enter the first hole 131 from the opening of the first hole 131, then enter the first channel 133 through the bottom of the first hole 131, and then enter the second hole 132 through the first channel 133, so that the electric wire passes through the first hole 131, the first channel 133 and the second hole 132 to realize wiring.

[0053] The first hole 131, the second hole 132 and the first channel 133 jointly form a wiring channel, and the electronic elements on the first substrate surface 111 can be electrically connected to the second substrate surface 112 or other positions through the wiring channel, so that the electronic elements on the first substrate surface 111 are connected with the power supply, the connection wiring is convenient, and the wiring looks more neat and beautiful.

[0054] In some embodiments of the present application, the HDI adapter plate 1 comprises a shielding cover 14, the shielding cover 14 is used for shielding interference signals, and the shielding cover 14 is a ring structure.

[0055] The shielding cover 14 has a certain height, and the chip 2 is arranged in the internal space of the shielding cover 14 on the first substrate 11.

[0056] The shielding cover 14 has the effect of preventing electromagnetic interference, can surround the interference source of components, circuits, assemblies, cables or the whole system, prevent the interference electromagnetic field from spreading outward, and also can prevent the receiving circuit, device or system from being affected by the external electromagnetic field.

[0057] The shielding cover 14 can protect the electronic elements, and can also prevent static short circuit caused by dust and other external substances, shield the elements on the PCB and the LCM, so as to protect the electronic elements from damage.

[0058] The shielding cover 14 can improve the circuit performance, isolate the interference signal, reduce the noise level of the circuit system, improve the signal-to-noise ratio, and thus improve the performance of the entire circuit. In addition, it can also reduce the leakage capacitance 17 and inductance of the circuit board 3, and avoid mutual interference between the circuit boards 3.

[0059] The shielding cover 14 can also prevent mutual interference between devices. In electronic devices, especially wireless communication devices, the shielding cover 14 can effectively prevent the device from generating interference and radiation to the outside world, and also prevent external interference sources from affecting the device, ensuring the normal operation of the device.

[0060] In some embodiments, the shielding cover 14 is provided with heat dissipation holes to dissipate the heat in the internal space of the shielding cover 14, so as to reduce the temperature difference of the shielding cover during welding, enhance the reliability of welding, and reduce the probability of damage to the shielding cover 14 or internal welding failure caused by high temperature.

[0061] In some embodiments of the present application, the HDI adapter board 1 includes a filter circuit 15, the filter circuit 15 is used for filtering, the filter circuit 15 is connected with the substrate 11, the filter circuit 15 is arranged on the first substrate surface 111, and the filter circuit 15 is arranged in the internal space of the shielding cover 14.

[0062] The filter circuit 15 can remove interference and noise in the signal to improve the signal quality between the chip 2 and the circuit board 3, and also reduce the probability of damage to the electronic device caused by signal interference. The filter circuit 15 eliminates unnecessary components in the signal to make the signal more accurate.

[0063] In some embodiments, the filter circuit 15 is connected with an external power supply, and the filter circuit 15 filters out the alternating component after rectification to make the output direct current more stable.

[0064] In some embodiments, the filter circuit 15 is a π-type filter circuit 15 or a PI-type filter circuit 15.

[0065] In some embodiments of the present application, the HDI adapter board 1 includes a crystal oscillator 16, the HDI adapter board 1 includes the crystal oscillator 16, the crystal oscillator 16 is arranged on the first substrate surface 111, and the crystal oscillator 16 is arranged in the internal space of the shielding cover 14.

[0066] The crystal oscillator 16 is used to provide a relatively stable frequency signal, which is used as a clock reference for various components in the electronic device to ensure that they can operate according to the predetermined time sequence. The crystal oscillator 16 can change its oscillation frequency by adjusting the voltage or current, thereby realizing the adjustment of the frequency of the wireless signal. The crystal oscillator 16 performs frequency synthesis to generate higher or lower frequency signals to meet the demand of different frequencies, so that the connection between the chip 2 and the local HDI board is more accurate.

[0067] In some embodiments of the present application, the HDI adapter board 1 further comprises a capacitor 17, a projection of the capacitor 17 on the first substrate surface 111 at least partially falls on the chip 2, so that the capacitor 17 is closer to the chip 2 on the first substrate surface 111, thereby making the chip 2 work more stably.

[0068] In some embodiments, the capacitor 17 and the chip 2 are arranged in an overlapping manner, so that the distance between the capacitor 17 and the chip 2 is shorter, thereby enhancing the working stability of the chip 2.

[0069] The capacitor 17 filters out the noise interference in the power supply by the principle of charging and discharging, thereby stabilizing the working voltage of the chip 2. When the power consumption of the circuit suddenly increases, the capacitor 17 can quickly release the stored electrical energy, prevent the power supply voltage from being too low, thereby reducing the noise or ringing phenomenon, reducing the probability of the chip 2 restarting due to sudden charging and discharging, and making the signal transmission between the chip 2 and the local HDI board more stable.

[0070] In some embodiments of the present application, the filter circuit 15, the crystal oscillator 16 and the shield 14 are arranged on the first substrate surface 111, thereby shortening the connection distance between the chip 2, making the filtering effect, anti-interference effect and shielding effect better, and making the signal transmission quality between the chip 2 and the HDI adapter board 1 better.

[0071] The arrangement of the filter circuit 15, the capacitor 17, the crystal oscillator 16 and the shield 14 on the HDI adapter board 1 can meet the power supply requirements of the chip 2, without the need to connect the chip 2 to the external crystal oscillator 16 and then to the HDI adapter board, and meet the EMC requirements of the electronic device, thereby making the transmission between the chip 2 and the local HDI board more stable and reducing the risk of poor signal transmission quality caused by only adapting the chip 2.

Claims

1. An HDI adapter plate, characterized by, include: The substrate has a first substrate surface and a second substrate surface disposed opposite to each other. The first pad is disposed on the surface of the first substrate, and the HDI adapter board is connected to the chip through the first pad. The second pad is disposed on the surface of the second substrate and is used for soldering the circuit board.

2. The HDI board of claim 1, wherein, A trace channel is formed within the substrate. One opening of the trace channel is located on the first substrate surface, and the other opening is located on the second substrate surface. The trace channel connects the first substrate surface and the second substrate surface.

3. The HDI adapter board according to claim 2, characterized in that, A first hole is provided on the first substrate surface, and the depth of the first hole is D1; ​​the distance between the first substrate surface and the second substrate surface is D0; A second hole is provided on the surface of the second substrate; the depth of the second hole is D2; D1 < D0, D2 < D0; The first hole and the second hole are connected by a first channel, and the first hole, the second hole and the first channel together form a wiring channel.

4. The HDI board of claim 1, wherein, The HDI adapter board includes a shielding cover, which has a ring-shaped structure, and the chip is disposed in the internal space of the shielding cover.

5. The HDI board of claim 1 or 2 or 3 or 4, wherein, The HDI adapter board includes a filter circuit, which is disposed on the first substrate surface.

6. The HDI board of claim 1 or 2 or 3 or 4, wherein, The HDI adapter board includes a crystal oscillator, which is disposed on the first substrate surface.

7. The HDI board of claim 1 or 2 or 3 or 4, wherein, The HDI adapter board also includes a capacitor, which is disposed on the second substrate surface.

8. The HDI board of claim 7, wherein, The projection of the capacitor onto the first substrate surface at least partially falls onto the chip.

9. A circuit board having an HDI adapter board, said circuit board using the HDI adapter board of claims 1-8, characterized by, include: At least one HDI adapter board includes a substrate, the substrate having a first substrate surface and a second substrate surface disposed opposite to each other; a first pad is provided on the first substrate surface, the first pad being connected to a chip; The second pad is disposed on the surface of the second substrate; The circuit board has a first circuit board side surface opposite to the second substrate surface. The first circuit board side surface has a soldering area, which is opposite to and soldered to the second pad, so that the signal of the chip can be transmitted to the circuit board through the HDI adapter board.

10. The circuit board with HDI transition plate of claim 9, wherein, The circuit board has a through hole located at the center of the soldering area; the HDI adapter board also includes a capacitor located at the center of the second substrate surface; the through hole is opposite to the capacitor and is used to accommodate the capacitor.

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