Novel electronic module heat dissipation structure

Abstract

The utility model relates to the technical field of electronic module thermal design, and discloses a novel electronic module heat radiation structure, which is characterized in that a heat conduction layer is arranged between an electronic module structural member and a rack guide rail, and after the electronic module structural member conducts heat to the heat conduction layer, the heat is further conducted to the rack guide rail through the heat conduction layer. And a second complete heat transfer path is formed. Therefore, the novel electronic module structure with the two heat transfer paths can transfer heat to the rack guide rail more efficiently, finally, the heat is taken away by the heat dissipation measure of the rack guide rail, and the heat dissipation efficiency can be greatly improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to electronic module heat design technical field discloses a novel electronic module heat radiation structure. BACKGROUND

[0002] With the increasingly complex function of airborne system, the integration of airborne electronic equipment is higher and higher. Several or even dozens of electronic equipment are often integrated in one electronic equipment, and such high integration makes the power consumption of electronic equipment increase rapidly.

[0003] As shown in Figure 1 When the conventional electronic module is in working condition, the components 8 on the module printed board 4 of the electronic module structural member 1 work and generate heat, the heat diffuses to the whole electronic module structural member 1, and the heat is transmitted to the rack guide rail 1 because the plug-in part 5 of the electronic module structural member 1 is attached to the rack guide rail 1, forming a complete heat transfer path (the dotted line with an arrow in the middle) Figure 1 However, such heat transfer path is relatively single, and sometimes it is difficult to support the heat dissipation demand of electronic equipment with excessively high integration. UTILITY MODEL CONTENTS

[0004] The utility model discloses a novel electronic module heat radiation structure can transmit heat to the rack guide rail more efficiently.

[0005] In order to realize the above technical effect, the utility model adopts the technical scheme that:

[0006] A novel electronic module heat radiation structure, comprising:

[0007] Rack guide rail, the rack guide rail is set up with the plug-in part of the electronic module structural member on the plug-in groove;

[0008] Electronic module structural member, the electronic module structural member is used to install module printed board, and the plug-in part of the electronic module structural member is provided with the plug-in groove;

[0009] Locking strip, the locking strip is arranged in the plug-in groove, and the locking strip is located at the gap position between the plug-in part and the side wall of the plug-in groove, and is used for pressing the plug-in part and attaching in the plug-in groove;

[0010] Thermal conductive layer, one end of the thermal conductive layer is fixed on the electronic module structural member, and the other end is fixed on the rack guide rail.

[0011] Further, the thermal conductive layer is made of a film sheet structure of a thermal conductive material.

[0012] Further, the end of the thermal conductive layer fixed with the rack guide rail is pressed on the side wall of the plug-in groove through the locking strip.

[0013] Furthermore, the heat-conducting layer is disposed opposite to the plug-in portion, and the locking strip is installed in the gap between the heat-conducting layer and the plug-in portion.

[0014] Furthermore, the locking bar includes a frame arranged along the length of the slot, and two opposing sides of the frame are elastic portions. The frame is interference-fitted between the inner wall of the slot and the insertion portion through the elastic portions.

[0015] Furthermore, the frame is provided with a protrusion that can contact the elastic part, and the frame is also provided with an adjusting nut that is coaxially and fixedly connected to the protrusion.

[0016] Furthermore, the electronic module structural component includes a structural component housing, the module printed circuit board is fixed inside the structural component housing, and the thermal conductive layer is fixedly connected to the structural component housing.

[0017] Furthermore, a thermal pad is provided between the components on the module printed circuit board and the structural housing.

[0018] Compared with existing technologies, the beneficial effects of this invention are as follows: By setting a heat-conducting layer between the electronic module structure and the rack rail, the electronic module structure conducts heat to the heat-conducting layer, and the heat is further conducted to the rack rail through the heat-conducting layer, forming a second complete heat transfer path. This ensures that the novel electronic module structure with two heat transfer paths can more efficiently transfer heat to the rack rail, and finally, the rack rail's heat dissipation measures remove the heat, greatly improving heat dissipation efficiency. Attached Figure Description

[0019] Figure 1 This is a schematic diagram of the installation structure of a traditional electronic module and a rack rail;

[0020] Figure 2 This is a schematic diagram of the heat dissipation structure of the novel electronic module in the embodiment;

[0021] Figure 3 This is a schematic diagram of the locking strip in the embodiment;

[0022] Among them, 1. rack rail; 2. slot; 3. electronic module structural component; 4. module printed circuit board; 5. plug-in part; 6. locking strip; 601. frame; 602. elastic part; 603. protrusion; 604. adjusting nut; 7. heat-conducting layer; 8. components; 9. heat-conducting pad. Detailed Implementation

[0023] The present invention will now be described in further detail with reference to the embodiments and accompanying drawings. However, this should not be construed as limiting the scope of the present invention to the following embodiments; all technologies implemented based on the content of the present invention fall within the scope of the present invention.

[0024] Embodiment

[0025] Reference Figures 2-3 A new electronic module heat dissipation structure comprises:

[0026] A rack guide rail 1, wherein a slot 2 is formed in the rack guide rail 1;

[0027] An electronic module structural member 3, wherein the electronic module structural member 3 is used for mounting a module printed board 4, and the electronic module structural member 3 is provided with a plug-in part 5 which can be inserted into the slot 2;

[0028] A locking strip 6, wherein the locking strip 6 is arranged in the slot 2, and the locking strip 6 is located at a gap position between a side wall of the slot 2 and the plug-in part 5, and is used for pressing and tightly fitting the plug-in part 5 in the slot 2;

[0029] A heat conduction layer 7, wherein one end of the heat conduction layer 7 is fixed on the electronic module structural member 3, and the other end of the heat conduction layer 7 is fixed on the rack guide rail 1.

[0030] In the embodiment, by arranging the heat conduction layer 7 between the electronic module structural member 3 and the rack guide rail 1, the heat conducted by the electronic module structural member 3 to the heat conduction layer 7 is further conducted to the rack guide rail 1 through the heat conduction layer 7, thereby forming a second complete heat conduction path. Thus, the embodiment increases one heat conduction path on the basis of the traditional heat conduction path, thereby ensuring that the new electronic module structure with two heat conduction paths (such as Figure 2 the dotted line with an arrow in the middle) can more efficiently transfer heat to the rack guide rail 1, and finally the heat is taken away by the heat dissipation measures of the rack guide rail 1, thereby greatly improving the heat dissipation efficiency.

[0031] In the embodiment, the heat conduction layer 7 is made of a film-shaped structure of a heat conduction material, for example, a copper foil layer with high heat conduction efficiency, thereby further improving the heat dissipation efficiency.

[0032] In the new electronic module heat dissipation structure in the embodiment, the end of the heat conduction layer 7 fixed on the rack guide rail 1 is pressed on a side wall of the slot 2 through the locking strip 6. The structure is simple, and can ensure that the positioning surface is not additionally increased while the heat conduction path is increased.

[0033] In the embodiment, the heat conduction layer 7 is arranged opposite to the plug-in part 5, and the locking strip 6 is arranged in a gap between the heat conduction layer 7 and the plug-in part 5. In the traditional electronic module structural member 3, the heat conduction surface and the positioning surface of the plug-in part 5 are in the same plane. In the present application, the left and right sides of the plug-in part 5 of the electronic module structural member 3 are tightly fitted in the slot 2 of the rack guide rail 1 through the flexible copper foil layer, thereby realizing the design of single positioning surface and double heat conduction surfaces.

[0034] In the embodiment, the locking strip 6 comprises a frame body 601 arranged along the length direction of the slot 2, two opposite sides of the frame body 601 are elastic portions 602, and the frame body 601 is mounted between the inner wall of the slot 2 and the plug-in part 5 through the elastic portions 602. Good fixation of the plug-in part 5 and the heat-conducting pad 9 is achieved. In the embodiment, the frame body 601 is provided with convex strips 603 which can contact the elastic portions 602, and the frame body 601 is further provided with an adjusting nut 604 coaxially fixedly connected with the convex strips 603. When locking of the locking strip 6 is needed, the adjusting nut 604 is rotated to make the convex strips 603 abut against the elastic portions 602 of the frame body 601, so that the locking strip 6 expands in the width direction, and the heat-conducting layer 7 and the plug-in part 5 are respectively pressed to the left and right sides, so that the heat-conducting layer 7 and the plug-in part 5 are tightly fitted in the slot 2 of the rack guide rail 1.

[0035] The electronic module structure 3 comprises a structure shell, the module printed board 4 is fixed in the structure shell, and the heat-conducting layer 7 is fixedly connected with the structure shell. In the embodiment, the module printed board 4 is fastened in the center of the structure shell by screws, and the heat-conducting layer 7 (a copper foil layer) can be fixed to the structure shell by riveting or welding according to actual application scenarios, and the other side is clamped in the inner wall of the slot 2 through the locking strip 6.

[0036] In the embodiment, in order to further improve the heat dissipation effect, the heat-conducting pad 9 is arranged between the components 8 on the module printed board 4 and the structure shell.

[0037] The above is only a preferred embodiment of the utility model, and is not used to limit the utility model, and any modification, equivalent replacement and improvement within the spirit and principle of the utility model should be included in the protection scope of the utility model.

Claims

1. A novel electronic module heat dissipation structure, characterized by, include: A rack guide rail (1) is provided with a slot (2); Electronic module structure (3), the electronic module structure (3) is used to install module printed circuit board (4), and the electronic module structure (3) is provided with a plug-in part (5) that can be inserted into the slot (2); Locking strip (6), the locking strip (6) is disposed in the slot (2), and the locking strip (6) is located at the gap between one side wall of the slot (2) and the plug (5), for pressing the plug (5) tightly against the slot (2); A heat-conducting layer (7) is fixed at one end to the electronic module structure (3) and at the other end to the rack guide rail (1).

2. The novel electronic module heat sink structure according to claim 1, wherein The thermally conductive layer (7) is a film-like structure made of thermally conductive material.

3. The novel electronic module heat sink structure of claim 2, wherein, The end of the heat-conducting layer (7), which is fixed to the frame guide rail (1), is pressed against one side wall of the slot (2) by the locking strip (6).

4. The novel electronic module heat dissipation structure according to any one of claims 1 to 3, characterized by, The heat-conducting layer (7) is disposed opposite to the plug-in part (5), and the locking strip (6) is installed in the gap between the heat-conducting layer (7) and the plug-in part (5).

5. The novel electronic module heat sink structure according to claim 1, wherein The locking bar (6) includes a frame (601) arranged along the length of the slot (2), and the two opposite sides of the frame (601) are elastic parts (602). The frame (601) is interference-fitted between the inner wall of the slot (2) and the insertion part (5) through the elastic parts (602).

6. The novel electronic module heat sink structure of claim 5, wherein, The frame (601) is provided with a protrusion (603) that can contact the elastic part (602), and the frame (601) is also provided with an adjusting nut (604) that is coaxially fixedly connected to the protrusion (603).

7. The novel electronic module heat sink structure according to claim 1, wherein The electronic module structural component (3) includes a structural component housing, the module printed circuit board (4) is fixed inside the structural component housing, and the heat-conducting layer (7) is fixedly connected to the structural component housing.

8. The novel electronic module heat sink structure of claim 7, wherein, A thermal pad (9) is provided between the components (8) on the module printed circuit board (4) and the structural housing.

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