Phase change radiator and electronic device

Abstract

The utility model relates to a phase change radiator and an electronic device, the phase change radiator comprises a first plate body and a second plate body, the first plate body is used for being in contact with a heating element, the first plate body is provided with a first inner cavity, the second plate body is provided with a second inner cavity, and the second inner cavity is communicated with the first inner cavity; the first preset included angle larger than 90 degrees is formed between the second plate body and the first plate body, that is, the second plate body is obliquely arranged, the difficulty that a liquid heat exchange medium flows back into the first cavity is reduced, and the risk that the liquid heat exchange medium is accumulated in the second plate body and cannot flow back due to oblique installation of the phase change radiator is also reduced; therefore, the amount of the liquid heat exchange medium in the first cavity is ensured, so that the heat dissipation efficiency of the phase change radiator to the heating element is improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of heat dissipation, in particular to a phase change heat sink and an electronic device. BACKGROUND

[0002] Electronic devices such as power converters contain power elements such as diodes. The power elements generate heat when working. In order to reduce the temperature of the power elements, a phase change heat sink is usually attached to the surface of the power elements. The phase change heat sink is internally provided with a liquid medium. The liquid medium absorbs the heat of the power elements to reduce the temperature of the power elements. At the same time, part of the liquid medium absorbs heat and evaporates into gaseous medium. The gaseous medium flows through the cooling flow channel of the heat sink and exchanges heat with the external environment at the cooling flow channel, so that the temperature of the gaseous medium is reduced and the gaseous medium is condensed into liquid medium again, and finally returns to the power elements.

[0003] In the application scenario of the phase change heat sink, the phase change heat sink is installed in a tilted manner away from the power elements. At this time, the liquid medium inside the phase change heat sink accumulates on the side of the cooling flow channel away from the power elements and cannot return, resulting in a decrease in the amount of liquid medium in contact with the power elements and an increase in the difficulty of the return of the liquid medium in the cooling flow channel, which blocks the circulation of the medium and affects the heat dissipation efficiency of the phase change heat sink.

[0004] Therefore, how to reduce the risk of the decline of the heat dissipation performance of the phase change heat sink caused by the tilted installation in the application scenario is a problem to be solved in the field. Invention content

[0005] In view of this, the present application provides a phase change heat sink and an electronic device, which can reduce the risk of the decline of the heat dissipation performance of the phase change heat sink caused by the tilted installation in the application scenario.

[0006] The first aspect of the present application provides a phase change heat sink. The phase change heat sink comprises a first plate body and a second plate body. The first plate body is used to contact a heat generating element. The first plate body has a first inner cavity. The second plate body has a second inner cavity. The second inner cavity is in communication with the first inner cavity. The first preset included angle between the second plate body and the first plate body is greater than 90°. The first plate body has a first mounting hole. A part of the second plate body is mounted in the first mounting hole. The extension direction of the central axis of the first mounting hole is perpendicular to the height direction of the first plate body.

[0007] In the present application, the second plate body is tilted, which reduces the difficulty of the return of the liquid heat exchange medium in the second inner cavity to the first inner cavity, reduces the risk of the accumulation of the liquid heat exchange medium in the second plate body caused by the tilt in the tilted installation scenario of the phase change heat sink, and further ensures the amount of the liquid heat exchange medium in the first inner cavity, so as to improve the heat dissipation efficiency of the phase change heat sink on the heat generating element.

[0008] The side wall of the first mounting hole extends horizontally along the second direction, so as to facilitate processing of the first mounting hole and reduce processing difficulty of the first plate body.

[0009] In a possible design, the first preset included angle α satisfies 95°≤α≤150°.

[0010] In the present application, α≥95°, which increases the inclination angle of the second plate body, thereby further improving the backflow efficiency of the liquid heat exchange medium in the second plate body. α≤150°, which reduces the installation difficulty of the second plate body, thereby facilitating reduction of the installation cost and shortening of the installation period of the phase change heat dissipation device.

[0011] In a possible design, the second plate body includes a first body and a first protrusion, the second inner cavity is arranged in the first body, the first body has a first face, the first face abuts against the side wall of the first mounting hole in the first direction, the first protrusion has a second face, the second face abuts against the end face of the first plate body in the second direction, the first face is connected with the second face, and the first face and the second face have a fifth preset included angle; wherein the height direction of the first plate body is the first direction, and the extension direction of the center axis of the first mounting hole is the second direction.

[0012] In the present application, the opening structure is arranged on the side of the second plate body close to the first plate body to form the adjacent first face and second face, the relative position of the first plate body and the second plate body is limited through the abutment of the first face against the first plate body in the first direction and the abutment of the second face against the first plate body in the second direction, thereby improving the accuracy of the installation position of the second plate body on the first plate body.

[0013] In a possible design, the fifth preset included angle is 90°.

[0014] In the present application, the fifth preset included angle is 90°, so that the first face is parallel to the side wall of the first mounting hole, and the second face is parallel to the outer wall of the first plate body, thereby increasing the area of the abutment surface of the first face against the first plate body in the first direction and the area of the abutment surface of the second face against the first plate body in the second direction, and further improving the stability of the abutment of the first plate body and the second plate body, thereby reducing the risk of shaking of the second plate body during installation.

[0015] In a possible design, the second plate body has a first partition plate, the first partition plate divides the second inner cavity into at least two flow channels, and the two flow channels are arranged along the first direction; the phase change heat dissipation device further includes a third plate body, which is located on the side of the second plate body away from the first plate body along the extension direction of the second plate body, and the third plate body is used to block the side of the flow channel away from the first inner cavity.

[0016] In the present application, the second inner cavity is divided into multiple flow channels by the first partition plate, which reduces the risk of the single flow channel having a large size in the first direction, thereby reducing the risk of the flow direction of the gaseous heat exchange medium in the flow channel being diversified to cause the flow rate to be reduced, thereby improving the consistency of the flow direction of the gaseous heat exchange in the flow channel, so as to improve the flow speed of the gaseous heat exchange medium in the flow channel, and thereby facilitating the improvement of the reflux efficiency of the medium, so as to improve the heat dissipation efficiency of the phase change heat sink and the electronic device.

[0017] The third plate body blocks the flow channel, so that the second plate body can adopt a flat tube structure with both ends open, thereby simplifying the second plate body and facilitating the reduction of the processing cost of the second plate body.

[0018] In a possible design, the third plate body has a third inner cavity and a second mounting hole, and the third inner cavity is in communication with at least part of the flow channel.

[0019] In the present application, the liquid heat exchange medium in the flow channel can enter the third inner cavity under the driving of the airflow and accumulate at the bottom of the third inner cavity in the first direction under the action of gravity. When the liquid level of the liquid heat exchange medium is higher than the lowest flow channel, the liquid heat exchange medium in the third inner cavity will flow back to the first inner cavity along the lowest flow channel. The third inner cavity can collect the liquid heat exchange medium in the flow channel, thereby reducing the risk of the liquid heat exchange medium being dispersed in multiple flow channels, and thereby reducing the risk of the amount of the liquid heat exchange medium in a single flow channel being small and the liquid heat exchange medium flowing back slowly or even being unable to flow back. Therefore, the third inner cavity can collect the liquid heat exchange medium, thereby causing the liquid heat exchange medium to flow back in a concentrated manner, and thereby improving the single flow amount and the flow rate of the liquid heat exchange medium.

[0020] In a possible design, the extension direction of the central axis of the second mounting hole is the second direction, and the second direction is perpendicular to the first direction; the second plate body includes a second body and a second protrusion, the second inner cavity is arranged in the second body, the second body has a third face, the third face abuts against the side wall of the second mounting hole in the first direction, the second protrusion has a fourth face, the fourth face abuts against the third plate body in the second direction, the third face is adjacent to the fourth face, and a sixth preset included angle is present between the third face and the fourth face.

[0021] In the present application, the extension direction of the central axis of the second mounting hole is the second direction, i.e., the side wall of the second mounting hole extends horizontally along the second direction, so as to facilitate the processing of the second mounting hole and reduce the processing difficulty of the third plate body, thereby reducing the cost of the phase change heat sink and the electronic device.

[0022] In a possible design, the sixth preset included angle is 90°.

[0023] In the present application, the sixth preset included angle is 90°, so that the third surface is parallel to the side wall of the second mounting hole, and the fourth surface is parallel to the outer wall of the third plate body, thereby increasing the area of the abutting surface of the third surface and the third plate body in the first direction, the area of the abutting surface of the fourth surface and the third plate body in the second direction, and further improving the stability of the abutting of the second plate body and the third plate body, and reducing the risk of shaking of the second plate body and the third plate body during installation.

[0024] In a possible design, the number of the second plate bodies is a plurality, and the plurality of second plate bodies are arranged at intervals along a third direction perpendicular to the first direction.

[0025] In the present application, a plurality of second plate bodies are provided, so that the gaseous heat exchange medium is dispersed in different second plate bodies, thereby increasing the area of the gaseous heat exchange medium for heat dissipation to the outside, and further improving the heat dissipation efficiency of the phase change heat sink and the electronic device.

[0026] In a possible design, the phase change heat sink further comprises fins, the fins are located between adjacent second plate bodies along the third direction, and a plurality of fins are arranged at intervals along the extension direction of the second plate body.

[0027] In the present application, the fins increase the contact surface of the second plate body and the air, thereby increasing the heat exchange efficiency of the second plate body and the air, and further improving the heat exchange efficiency of the gaseous heat exchange medium in the second plate body and the air; at the same time, the fins divide the space between adjacent second plate bodies into a plurality of channels, when there is a fan on one side of the second plate body in the first direction, the airflow stirred by the fan passes through the second plate body and the fins, the fins can improve the consistency of the flow direction of the airflow between adjacent second plate bodies, and further improve the flow rate of the airflow, so as to further improve the heat dissipation efficiency of the phase change heat sink and the electronic device.

[0028] In a possible design, the first plate body has one or more second partitions, the second partition at least divides the first inner cavity into a first sub-cavity and a second sub-cavity, the first sub-cavity and the second sub-cavity each have liquid heat exchange medium therein, and the second plate body at least includes a first sub-plate body and a second sub-plate body, the second inner cavity of the first sub-plate body is in communication with the first sub-cavity, and the second inner cavity of the second sub-plate body is in communication with the second sub-cavity.

[0029] In the present application, the first plate body is divided into a plurality of cavities by the second partition, and each cavity is connected with the second plate body and the third plate body, so that one phase change heat sink can simultaneously dissipate heat for a plurality of heat generating elements, thereby reducing the number of phase change heat sinks required in the electronic device, reducing the installation space occupied by the phase change heat sink, and thereby facilitating the reduction of the overall size of the electronic device and the improvement of the integration of the electronic device.

[0030] In a possible design, the first sub-cavity and the second sub-cavity are arranged along a first direction.

[0031] In the present application, the first sub-cavity and the second sub-cavity can be arranged along a first direction, so that one fan can simultaneously satisfy the heat dissipation of the first sub-plate body and the second sub-plate body, i.e., the number of required fans can be reduced, which is beneficial to further reduce the overall size of the electronic device and improve the integration of the electronic device.

[0032] The second aspect of the present application provides an electronic device, which comprises a shell, a heat generating element and the phase change heat sink of any one of the preceding aspects, the shell has a mounting cavity, the heat generating element and the phase change heat sink are both mounted in the mounting cavity, and the first plate body of the phase change heat sink is in contact with the heat generating element.

[0033] In the present application, the gasification and liquefaction of the medium can quickly take away a large amount of heat, therefore, the phase change heat sink is used to dissipate heat from the heat generating element, which can improve the heat dissipation efficiency of the heat generating element, and further improve the heat dissipation efficiency of the electronic device.

[0034] The second plate body is arranged obliquely, which reduces the difficulty of backflow of the liquid heat exchange medium into the first inner cavity, and also reduces the risk of accumulation of the liquid heat exchange medium in the second plate body caused by oblique installation of the phase change heat sink, thereby ensuring the amount of liquid heat exchange medium in the first inner cavity, so as to improve the heat dissipation efficiency of the phase change heat sink to the heat generating element, and improve the heat dissipation efficiency of the electronic device.

[0035] In a possible design, the electronic device is an inverter, a rectifier or a communication device.

[0036] In the present application, the phase change heat sink described above can meet the heat dissipation requirements of the inverter, the rectifier and the communication device, thereby reducing the risk of stop working or even damage of the inverter and the rectifier caused by high temperature, and further improving the working stability of the inverter and the rectifier. BRIEF DESCRIPTION OF DRAWINGS

[0037] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings needed in the embodiments will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative labor.

[0038] Figure 1 A cross-sectional view of the electronic device provided by the present application in an embodiment;

[0039] Figure 2 A cross-sectional view of a conventional structure of the phase change heat sink;

[0040] Figure 3 AFigure 1 enlarged view of portion A in

[0041] Figure 4 a cross-sectional view of an electronic device provided by the present application in another embodiment;

[0042] Figure 5 a cross-sectional view of an electronic device provided by the present application in another embodiment; Figure 4 enlarged view of portion B in

[0043] Figure 6 a cross-sectional view of an electronic device provided by the present application in another embodiment; Figure 2 a cross-sectional view of a phase change heat spreader mounted in one embodiment;

[0044] Figure 7 a cross-sectional view of a phase change heat spreader mounted in another embodiment; Figure 2 a cross-sectional view of a phase change heat spreader mounted in another embodiment;

[0045] Figure 8 a cross-sectional view of a phase change heat spreader provided by the present application in one embodiment;

[0046] Figure 9 a cross-sectional view of a phase change heat spreader provided by the present application in one embodiment, wherein the phase change heat spreader is mounted without inclination;

[0047] Figure 10 a cross-sectional view of a phase change heat spreader provided by the present application in one embodiment, wherein the phase change heat spreader is mounted with inclination;

[0048] Figure 11 a cross-sectional view of a first plate in one embodiment;

[0049] Figure 12 a cross-sectional view of a first plate in another embodiment;

[0050] Figure 13 a cross-sectional view of a second plate in one embodiment;

[0051] Figure 14 enlarged view of portion D in Figure 13

[0052] enlarged view of portion C in Figure 15 Figure 9 a cross-sectional view of a phase change heat spreader provided by the present application in another embodiment;

[0053] Figure 16 a cross-sectional view of a phase change heat spreader provided by the present application in another embodiment;

[0054] Figure 17 a cross-sectional view of a phase change heat spreader provided by the present application in another embodiment;

[0055] Figure 18 a cross-sectional view of a phase change heat spreader provided by the present application in another embodiment;​Figure 17 Enlarged view of the E part in Fig. 1;

[0056] Figure 19 Structure schematic view of the phase change heat spreader provided by the present application in another embodiment;

[0057] Figure 20 Sectional view of the phase change heat spreader provided by the present application in another embodiment.

[0058] Reference signs:

[0059] 01 - housing; 011 - mounting cavity; 011a - first mounting cavity; 011b - second mounting cavity; 012 - through hole; 013 - air inlet; 014 - air outlet;

[0060] 02 - heat generating element; 021 - first element; 022 - second element;

[0061] 03 - phase change heat spreader; 031 - evaporation plate; 032 - condensation tube; 033 - heat exchange medium;

[0062] 1 - first plate body; 11 - first inner cavity; 111 - condensation area; 112 - evaporation area; 113 - first sub-cavity; 14 - second sub-cavity; 12 - liquid heat exchange medium; 13 - first mounting hole; 131 - central axis; 14 - second partition plate;

[0063] 2 - second plate body; 21 - second inner cavity; 211 - flow channel; 22 - body part; 221 - first face; 222 - third face; 223 - first body; 224 - second body; 23 - protruding part; 231 - second face; 232 - fourth face; 233 - first protrusion; 234 - second protrusion; 24 - first partition plate; 25 - first sub-plate body; 26 - second sub-plate body; 27 - first end; 28 - second end;

[0064] 3 - third plate body; 31 - third inner cavity; 32 - second mounting hole;

[0065] 4 - fin;

[0066] 5 - fan. DETAILED DESCRIPTION

[0067] In order to better understand the technical solutions of the present application, the embodiments of the present application are described in detail below with reference to the drawings.

[0068] It should be clear that the described embodiments are only some of the embodiments of the present application, but not all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.

[0069] The terminology used in the embodiments of this application is for the purpose of describing particular embodiments only and is not intended to be limiting of this application. The singular forms “a,” “the,” and “the” used in the embodiments of this application and the appended claims are also intended to include the plural forms unless the context clearly indicates otherwise.

[0070] It should be understood that the term "and / or" used in this article is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, or B existing alone. Additionally, the character " / " in this article generally indicates that the preceding and following related objects have an "or" relationship.

[0071] This application provides an electronic device, which can be a power converter, communication equipment, etc. Specifically, the power converter can be, but is not limited to, a rectifier, an inverter, etc., and the communication equipment can be, but is not limited to, a wireless communication base station RRU, a multi-antenna MIMO base station, an outdoor independent baseband processing module, an outdoor wired broadband access module. This application does not impose any special limitations on the type or function of the electronic device.

[0072] Figure 1 This is a schematic diagram of the structure of an electronic device in one embodiment. For example... Figure 1 As shown, the electronic device includes a housing 01, which forms a mounting cavity 011. Multiple power components are housed within the mounting cavity 011. The power component that generates high temperatures and requires heat dissipation during operation is designated as the heating element 02. A phase-change heat sink 03 is also installed in the mounting cavity 011. The phase-change heat sink 03 is in contact with the heating element 02, enabling heat exchange between the high-temperature heating element 02 and the low-temperature external environment, thereby dissipating heat from the heating element 02.

[0073] The height direction of the electronic device is denoted as the first direction X, and the distribution direction of the heat-generating element 02 and the phase change heat sink 03 is denoted as the second direction Y.

[0074] Figure 2 This is a cross-sectional view of a phase change heat sink. (Example) Figure 2As shown, the phase change heat sink 03 includes an evaporation plate 031 and a condensation pipe 032, and the evaporation plate 031 is internally provided with a heat exchange medium 033, which exists in two forms of liquid and gas. In the first direction X, the liquid heat exchange medium 033 is accumulated at the bottom of the evaporation plate 031 under the action of gravity, and the heat generating element 02 is opposite to the liquid heat exchange medium 033 at the bottom of the evaporation plate 031. When the temperature of the heat generating element 02 rises, the liquid heat exchange medium 033 is heated to evaporate part of the liquid heat exchange medium 033 into gaseous heat exchange medium 033, and then the gaseous heat exchange medium 033 can enter the condensation pipe 032 and exchange heat with the external environment at the condensation pipe 032, so that the gaseous heat exchange medium 033 is cooled and re-condensed into liquid heat exchange medium 033. The liquid heat exchange medium 032 in the condensation pipe 032 will be accumulated at the bottom of the condensation pipe 032 under the action of gravity, and as the amount of heat exchange medium 033 accumulated at the bottom of the condensation pipe 032 increases, the liquid heat exchange medium 033 will flow along the condensation pipe 032, that is, the liquid heat exchange medium 033 in the condensation pipe 032 flows back to the bottom of the evaporation plate 031, realizing the circulation of the heat exchange medium 033 between the evaporation plate 031 and the condensation pipe 032. Figure 2 The condensation of the liquid heat exchange medium 033 in the condensation pipe 032 is shown in the bottom of the condensation pipe 032 and flows back to the evaporation plate 031.

[0075] In the process of gasification and liquefaction of the medium 033, a large amount of heat is taken away, so that the use of the phase change heat sink 03 for heat dissipation of the heat generating element 02 can improve the heat dissipation efficiency of the heat generating element 02, and further improve the heat dissipation efficiency of the electronic device.

[0076] Referring again to Figure 1 , the shell 01 includes a first mounting cavity 011a and a second mounting cavity 011b, the heat generating element 02 is located in the first mounting cavity 011a, and the phase change heat sink 03 is located in the second mounting cavity 011b, and the air inlet 013 and the air outlet 014 are respectively arranged on the two side walls of the second mounting cavity 011b in the first direction X.

[0077] In this embodiment, placing the heating element 02 within the first mounting cavity 011a helps meet the airtightness requirements of the heating element 02, thereby improving its operational stability. Simultaneously, the phase change radiator 03 is placed in the second mounting cavity 011b. Low-temperature gas from the outside can enter the second mounting cavity 011b through the air inlet 013. When the low-temperature air flows through the condenser tube 032, it exchanges heat with the heat exchange medium 033 within the condenser tube 032. The low-temperature air absorbs heat from the gaseous heat exchange medium 033, causing its temperature to rise. The heated air is then discharged to the outside through the air outlet 014. A fan 5 can also be installed in the second mounting cavity 011b. By agitating the airflow within the second mounting cavity 011b, the fan 5 promotes the entry of low-temperature air from the outside into the second mounting cavity 011b through the air inlet 013, thereby improving the heat dissipation efficiency of the medium 033 at the condenser tube 032, and consequently, improving the heat dissipation efficiency of the phase change radiator 03 for the heating element 02.

[0078] By placing the heating element 02 and the phase change heat sink 03 in the first mounting cavity 011a and the second mounting cavity 011b respectively, the requirements of the heating element 02 for the airtightness of the space and the heat dissipation requirements of the phase change heat sink 03 can be met simultaneously, thereby improving the heat dissipation efficiency of the heating element 02 without affecting the working stability of the heating element 02.

[0079] In order to achieve heat dissipation of the heating element 02 by the phase change heat sink 03, it is necessary to ensure contact between the heating element 02 and the phase change heat sink 03. The contact between the heating element 02 and the phase change heat sink 03 can be direct contact or indirect contact through thermally conductive materials.

[0080] Figure 3 for Figure 1 A magnified view of part A in the middle. Figure 3 The connection relationship between the heating element 02 and the phase change heat sink 03 in one embodiment is shown as follows: Figure 3 As shown, the heating element 02 and the phase change heat sink 03 can be indirectly contacted through the housing 01 or other parts with good thermal conductivity. In this embodiment, reference is also made to... Figure 1 The heating element 02 and the phase change heat sink 03 are indirectly in contact through the outer shell 01, so that the heating element 02 can be placed in the first mounting cavity 011a with good sealing performance, which helps to meet the requirements of the heating element 02 for the sealing of the space and reduces the difficulty of sealing the space.

[0081] Figure 4 This is a schematic diagram showing the connection relationship between the heating element 02 and the phase change heat sink 03 in another embodiment. Figure 5 for Figure 4 A magnified view of a local structure. For example... Figure 5As shown, the housing 01 is provided with a through hole 012, and a part of the heat generating element 02 extends to the evaporation plate 031 of the phase change radiator 03 through the through hole 012, that is, the heat generating element 02 is in direct contact with the evaporation plate 031 of the phase change radiator 03, thereby facilitating the improvement of the heat transfer efficiency between the heat generating element 02 and the phase change radiator 03, and further facilitating the improvement of the heat dissipation efficiency of the phase change radiator 03 to the heat generating element 02.

[0082] In the application scenario of the phase change radiator 03, the phase change radiator 03 is installed in an inclined manner. In one case, the phase change radiator 03 is inclined towards the heat generating element 02, and in another case, the phase change radiator 03 is inclined away from the heat generating element 02. Figure 6 A structure cross-sectional view of the phase change radiator 03 after installation, Figure 6 It is shown that the phase change radiator 03 is installed in an inclined manner towards the heat generating element 02. As Figure 6 shown, the phase change radiator 03 is inclined towards the heat generating element 02, at this time, the liquid heat exchange medium 033 inside the phase change radiator 03 will accumulate on the side of the condensation pipe 032 close to the heat generating element 02. In another case, the phase change radiator is inclined away from the heat generating element 02. Figure 7 A structure cross-sectional view of the phase change radiator 03 after installation, Figure 7 It is shown that the phase change radiator 03 is installed in an inclined manner away from the heat generating element 02. As Figure 7 shown, the liquid heat exchange medium 033 inside the phase change radiator 03 will accumulate on the side of the condensation pipe 032 away from the heat generating element 02, resulting in a decrease in the liquid medium 033 in contact with the heat generating element 02, thereby reducing the heat dissipation efficiency of the heat generating element 02, at the same time, increasing the difficulty of backflow of the liquid medium 033 in the condensation pipe 032, making the circulation of the medium 033 in the phase change radiator 03 blocked, affecting the heat dissipation performance of the phase change radiator 03, and also reducing the heat dissipation efficiency of the heat generating element 02.

[0083] Therefore, the embodiment of the present application provides a phase change radiator which can reduce the influence of inclined installation on the heat dissipation efficiency.

[0084] Figure 8 A structure schematic view of the phase change radiator is shown, as Figure 8 shown, the phase change radiator 03 includes a first plate body 1 and a second plate body 2. Figure 9 A cross-sectional view of the phase change radiator is shown, as Figure 9As shown, the first plate 1 is used to contact the heating element 02. The first plate 1 has a first inner cavity 11, which has a condensation region 111 and an evaporation region 112 distributed along the first direction X. The condensation region 111 contains a liquid heat exchange medium 12. When the temperature of the heating element 02 rises, the temperature of the liquid heat exchange medium 12 in the condensation region 111 also rises. At least a portion of the liquid heat exchange medium 12 evaporates into a gaseous heat exchange medium, which flows along the first direction X and enters the evaporation region 112. Figure 9 As shown, the second plate 2 has a second inner cavity 21, which is connected to the first inner cavity 11. Specifically, the second inner cavity 21 is connected to the evaporation region 112. The gaseous heat exchange medium in the evaporation region 112 will enter the second inner cavity 21. The gaseous heat exchange medium exchanges heat with the external environment in the second inner cavity 21 and is recooled into a liquid heat exchange medium 12. The liquid heat exchange medium 12 drips onto the side wall of the second plate 2 under the action of gravity and gradually gathers at the bottom of the second plate 2.

[0085] Among them, such as Figure 9 As shown, the second plate 2 and the first plate 1 have a first preset angle α greater than 90°, i.e., α > 90°, causing the extension direction T of the second inner cavity 21 to be inclined relative to the first direction. When the phase change radiator 03 is not installed at an incline, as... Figure 9 As shown, the first plate 1 extends along the first direction X. At this time, the second plate 2 is inclined, and the second plate 2 has a second preset angle β with the horizontal plane, that is, the second plate 2 has a second preset angle β with the extension direction T and the second direction Y. The second plate 2 has a first end 27 and a second end 28 arranged opposite to each other. The first end 27 is connected to the first plate 1. At this time, the height of the first end 27 along the first direction X is lower than the height of the second end 28 along the first direction X. When the liquid heat exchange medium 12 in the second inner cavity 21 drips under the action of gravity, the liquid heat exchange medium 12 can flow along the inclined side wall of the second inner cavity 21, so that the liquid heat exchange medium 21 gradually approaches and enters the first inner cavity 11.

[0086] Figure 10 This is a cross-sectional view of a phase change heat sink. When the phase change heat sink 03 is installed at an angle away from the end of the heat-generating element 02, as shown... Figure 10 As shown, the first plate 1 has a third preset angle γ relative to the first direction X. At this time, the second plate 2 is inclined and has a fourth preset angle δ between itself and the horizontal plane, that is, the extension direction T of the second plate 2 has a fourth preset angle δ with the second direction Y. In some embodiments, such as... Figure 10As shown, when the inclination degree of the first plate body 1 is small (γ is small), δ can be greater than 0°, that is, the second plate body 2 is still inclined, and δ < β, at this time, the height of the first end 27 along the first direction X is lower than the height of the second end 28 along the first direction X, when the liquid heat exchange medium 12 in the second inner cavity 21 drops under the action of gravity, the liquid heat exchange medium 12 can flow along the inclined side wall of the second inner cavity 21, so that the liquid heat exchange medium 21 gradually approaches and enters the first inner cavity 11. In other embodiments, δ can be 0°, that is, the second plate body 2 is horizontal, when the liquid heat exchange medium 12 in the second inner cavity 21 drops under the action of gravity, the liquid heat exchange medium 12 can flow along the inclined side wall of the second inner cavity 21, so that the liquid heat exchange medium 21 gradually approaches and enters the first inner cavity 11. Therefore, in this embodiment, the second plate body 2 is arranged to be inclined, which reduces the difficulty of the liquid heat exchange medium 21 flowing back into the first inner cavity 11, and also reduces the risk that the liquid heat exchange medium 21 accumulates in the second plate body 2 due to the inclined installation of the phase change heat dissipation device 03, thereby improving the content of the liquid heat exchange medium 12 in the first inner cavity 11, so as to improve the heat dissipation performance of the phase change heat dissipation device 03 on the heat generating element 02, thereby improving the heat dissipation efficiency of the electronic device, when the electronic device is an inverter, a rectifier, or communication equipment, the above phase change heat dissipation device can meet the heat dissipation needs of the inverter, the rectifier, or the communication equipment, thereby reducing the risk that the inverter, the rectifier, or the communication equipment stops working or is damaged due to high temperature, thereby improving the working stability of the inverter, the rectifier, or the communication equipment.

[0087] The first preset included angle α can satisfy: α≥95°, and specifically, the first preset included angle α can be 95°, 96°, 97°, 98°, 99°, 100°, 101°, 102°, 103°, 104°, 105°, 106°, 107°, 108°, 109°, 110°, 111°, 112°, 113°, 114°, 115°, 116°, 117°, 118°, 119°, 120°, 121°, 122°, 123°, 124°, 125°, 126°, 127°, 128°, 129°, 130°, 131°, 132°, 133°, 134°, 135°, 136°, 137°, 138°, 139°, 140°, 141°, 142°, 143°, 144°, 145°, 146°, 147°, 148°, 149°, 150°, 151°, 152°, 153°, 154°, 155°, 156°, 157°, 158°, 159°, 160°, 161°, 162°, 163°, 164°, 165°, 166°, 167°, 168°, 169°, 170°, 171°, 172°, 173°, 174°, 175°, 176°, 177°, 178°, 179°, and the like.

[0088] In a specific implementation, 95°≤α≤150°, and the first preset included angle can be specifically 95°, 96°, 97°, 98°, 99°, 100°, 101°, 102°, 103°, 104°, 105°, 106°, 107°, 108°, 109°, 110°, 111°, 112°, 113°, 114°, 115°, 116°, 117°, 118°, 119°, 120°, 121°, 122°, 123°, 124°, 125°, 126°, 127°, 128°, 129°, 130°, 131°, 132°, 133°, 134°, 135°, 136°, 137°, 138°, 139°, 140°, 141°, 142°, 143°, 144°, 145°, 146°, 147°, 148°, 149°, 150°, or the like.

[0089] In the present embodiment, α≥95°, the inclination angle of the second plate body 2 is increased, thereby further improving the backflow efficiency of the liquid heat exchange medium 12 in the second plate body 2. α≤150°, the installation difficulty of the second plate body 2 is reduced, thereby facilitating the reduction of the installation cost and the shortening of the installation period of the phase change heat dissipation device 03.

[0090] Referring again to Figure 8 , the first plate body 1 is provided with a first mounting hole 13, and a part of the second plate body 2 is located in the first mounting hole 13, that is, the second plate body 2 is inserted into the first mounting hole 13 to realize the connection of the first plate body 1 and the second plate body 2. Among them, the second plate body 2 is in sealing connection with the side wall of the first mounting hole 13, so as to reduce the risk of leakage of the liquid heat exchange medium 12 from the first mounting hole 13, thereby improving the stability of the amount of medium in the phase change heat dissipation device, and further improving the stability of the heat dissipation performance of the phase change heat dissipation device. At the same time, the risk of pollution of the environment by the leakage of the liquid heat exchange medium 12 is reduced, thereby improving the environmental protection performance of the phase change heat dissipation device and the electronic device.

[0091] Figure 11 is a sectional view of the first plate body 1 in an embodiment. Since the extension direction T of the second plate body 2 is arranged obliquely relative to the first direction X, in an embodiment, as shown in Figure 11 , the central axis 131 of the first mounting hole 13 can be inclined along the extension direction T of the second plate body 2, that is, the side wall of the first mounting hole 13 is also inclined along the extension direction T of the second plate body 2, so as to facilitate the installation of the second plate body 2.

[0092] Figure 12 is a sectional view of the first plate body 1 in another embodiment. In another embodiment, as shown in Figure 12As shown, the extension direction of the central axis 131 of the first mounting hole 13 is the second direction Y, which is perpendicular to the first direction X. That is, the sidewall of the first mounting hole 13 extends horizontally along the second direction Y to facilitate the processing of the first mounting hole 13, reduce the processing difficulty of the first plate 1, and reduce the cost of the phase change heat sink and electronic devices.

[0093] Figure 13 This is a schematic diagram of the structure of the second plate 2. Figure 14 This is a magnified view of a portion of the structure of the second plate 2. Figure 15 This is an enlarged view of the connection position between the first plate 1 and the second plate 2. When the first mounting hole 13 is... Figure 12 When the structure is shown, such as Figure 13 As shown, the second plate 2 includes a body portion 22 and a protrusion portion 23, as... Figure 14 As shown, the second inner cavity 21 is disposed in the main body 22, and at the same time, referencing Figure 15 Along the second direction Y, the main body 22 includes a first body 223 and the protrusion 23 includes a second protrusion 233. The first body 223 and the second protrusion 223 are both located on the side of the second plate 2 close to the first plate 1. The first body 223 has a first surface 221, which abuts against the sidewall of the first mounting hole 13 in the first direction X. The second protrusion 233 has a second surface 231, which abuts against the first plate 1 in the second direction Y. The first surface 221 and the second surface 231 are adjacent to each other and have a fifth preset angle.

[0094] In this embodiment, an opening structure is provided on the side of the second plate 2 close to the first plate 1 to form an adjacent first surface 221 and second surface 231. By the contact between the first surface 221 and the first plate 1 in the first direction X, and the contact between the second surface 231 and the first plate 1 in the second direction Y, the relative positions of the first plate 1 and the second plate 2 are restricted, thereby improving the accuracy of the installation position of the second plate 2 on the first plate 1.

[0095] The included angle between the first surface 221 and the second surface 231 is 90°, that is, the fifth preset included angle is 90°, so that the first surface 221 is parallel to the side wall of the first mounting hole 13 and the second surface 231 is parallel to the outer wall of the first plate 1. This increases the area of ​​the contact surface between the first surface 221 and the first plate 1 in the first direction X and the area of ​​the contact surface between the second surface 231 and the first plate 1 in the second direction Y, thereby improving the stability of the contact between the first plate 1 and the second plate 2 and reducing the risk of the second plate 2 shaking during installation.

[0096] The side wall of the first mounting hole 13 extends horizontally along the second direction Y, and the included angle between the first surface 221 and the second surface 231 is 90°, so that the second plate body 2 can be vertically inserted into the first mounting hole 13 along the second direction Y, thereby reducing the operation difficulty of inserting the second plate body 2 into the first mounting hole 13, and facilitating the shortening of the assembly period of the first plate body 1 and the second plate body 2.

[0097] Figure 16 It is a sectional view of the phase change heat sink. As shown in Figure 16 , the second plate body 2 has a first partition plate 24, and the first partition plate 24 divides the second inner cavity 21 into at least two flow channels 211. The flow channels 211 are arranged along the first direction X, and the flow channels 211 extend along the extension direction T of the second plate body 2.

[0098] In this embodiment, the second inner cavity 21 is divided into a plurality of flow channels 211 by the first partition plate 24, which reduces the risk of the single flow channel 211 having a large size in the first direction X, thereby reducing the risk that the flow direction of the gaseous heat exchange medium in the flow channel 211 is diversified, thereby improving the consistency of the flow direction of the gaseous heat exchange medium in the flow channel 211, so as to improve the flow speed of the gaseous heat exchange medium in the flow channel, and thereby facilitate the improvement of the backflow efficiency of the liquid heat exchange medium 12, so as to improve the heat dissipation efficiency of the phase change heat sink and the electronic device.

[0099] As shown in Figure 16 , the phase change heat sink further comprises a third plate body 3. Along the extension direction T of the second plate body 2, the third plate body 3 is located on the side of the second plate body 2 away from the first plate body 1, and the third plate body 3 is used to block the side of the flow channel 211 away from the first inner cavity 11.

[0100] In this embodiment, the third plate body 3 blocks the flow channel 211, so that the second plate body 2 can adopt a flat tube structure with both ends open, thereby simplifying the second plate body 2 and facilitating the reduction of the processing cost of the second plate body 2.

[0101] In one possible design, as shown in Figure 16 , the third plate body 3 is a solid plate structure, and the sealing of the flow channel 211 is realized through the sealing connection between the third plate body 3 and the second plate body 2.

[0102] Figure 17 It is a sectional view of the phase change heat sink, Figure 18 It is an enlarged view of the connection position of the second plate body 2 and the third plate body 3. In another possible design, referring to Figure 17 and Figure 18 , the third plate body 3 has a third inner cavity 31 and a second mounting hole 32, and a part of the second plate body 2 extends into the second mounting hole 32, so that the third inner cavity 31 communicates with the flow channel 211.

[0103] In the embodiment, as shown in Figure 17 The liquid heat exchange medium 12 in the flow channel 211 can enter the third inner cavity 31 under the driving of the airflow and accumulate at the bottom of the third inner cavity 31 in the first direction X under the action of gravity. When the liquid level of the liquid heat exchange medium 12 is higher than the lowest flow channel 211, the liquid heat exchange medium 12 in the third inner cavity 31 will flow back to the first inner cavity 11 along the lowest flow channel 211. The third inner cavity 31 can collect the liquid heat exchange medium 12 in the flow channel 211, reducing the risk of the liquid heat exchange medium 12 being dispersed in multiple flow channels 211, thereby reducing the risk of the amount of liquid heat exchange medium 12 in a single flow channel 211 being too small to slow down or even unable to flow back. Therefore, the third inner cavity 31 can collect the liquid heat exchange medium 12, thereby making the liquid heat exchange medium 12 flow back in a concentrated manner, improving the single flowback amount and flowback rate of the liquid heat exchange medium 12.

[0104] The second plate body 2 is sealingly connected with the side wall of the second mounting hole 31 to reduce the risk of leakage of the liquid heat exchange medium 12 from the first mounting hole 31, thereby improving the stability of the amount of medium in the phase change heat sink, and further improving the stability of the heat dissipation performance of the phase change heat sink. At the same time, the risk of the liquid heat exchange medium 12 leaking and polluting the environment is reduced, thereby improving the environmental performance of the phase change heat sink and electronic devices.

[0105] Like the first mounting hole, the side wall of the second mounting hole can extend obliquely along the extension direction T of the second plate body 2, or extend horizontally along the second direction Y.

[0106] As shown in Figure 18 The extension direction of the center axis of the second mounting hole 32 is the second direction Y, i.e., the side wall of the second mounting hole 32 extends horizontally along the second direction Y, so as to facilitate the processing of the second mounting hole 32, reduce the processing difficulty of the third plate body 3, and reduce the cost of the phase change heat sink and electronic devices.

[0107] As shown in Figure 18 The body part 22 of the second plate body further includes a second body 224, and the protruding part 23 further includes a second protruding part 234. Along the second direction Y, the second body 224 and the second protruding part 234 are located on the side of the second plate body close to the third plate body. The second body 224 has a third face 222 abutting against the side wall of the second mounting hole 32 in the first direction X. The second protruding part 234 has a fourth face 232 abutting against the third plate body 3 in the second direction Y. The third face 222 is adjacent to the fourth face 232, and a sixth preset included angle exists between the third face 222 and the fourth face 232.

[0108] In the embodiment, the opening structure is arranged on the side of the second plate body 2 close to the third plate body 3 to form the adjacent third face 222 and fourth face 232, and the relative position of the third plate body 3 and the second plate body 2 is limited through the abutment of the third face 222 with the third plate body 3 in the first direction X and the abutment of the fourth face 232 with the third plate body 3 in the second direction Y, thereby improving the accuracy of the mounting position of the second plate body 2 on the third plate body 3.

[0109] The included angle between the third face 222 and the fourth face 232 is 90°, that is, the sixth preset included angle is 90°, so that the third face 222 is parallel to the side wall of the second mounting hole 32 and the fourth face 232 is parallel to the outer wall of the third plate body 3, thereby increasing the area of the abutment surface of the third face 222 with the third plate body 3 in the first direction X and the area of the abutment surface of the fourth face 232 with the third plate body 3 in the second direction Y, and further improving the stability of the abutment of the second plate body 2 and the third plate body 3, thereby reducing the risk of shaking of the second plate body 2 and the third plate body 3 during installation.

[0110] The side wall of the second mounting hole 32 extends horizontally along the second direction Y, and the included angle between the third face 222 and the fourth face 232 is 90°, so that the second plate body 2 can be vertically inserted into the second mounting hole 32 along the second direction Y, thereby reducing the operation difficulty of inserting the second plate body 2 into the second mounting hole 32 and being beneficial to shorten the assembly cycle of the second plate body 2 and the third plate body 3.

[0111] Figure 19 A structural schematic view of the phase change heat sink. As shown in Figure 19 , the number of the second plate bodies 2 is multiple, and the multiple second plate bodies 2 are arranged at intervals along the third direction Z, and the third direction Z, the first direction X and the second direction Y are perpendicular to each other.

[0112] In the embodiment, the multiple second plate bodies 2 are arranged, so that the gaseous heat exchange medium is dispersed in different second plate bodies 2, thereby increasing the area of the gaseous heat exchange medium for heat dissipation with the outside, and further improving the heat dissipation efficiency of the phase change heat sink and the electronic device.

[0113] As shown in Figure 19 , the phase change heat sink further comprises fins 4, which are located between adjacent second plate bodies 2 along the third direction Z, and the multiple fins 4 are arranged at intervals along the extension direction T of the second plate body 2.

[0114] In this embodiment, the fins 4 increase the contact surface between the second plate 2 and the air, thereby increasing the heat exchange efficiency between the second plate 2 and the air, and further improving the heat exchange efficiency between the gaseous heat exchange medium and the air within the second plate 2. At the same time, the fins 4 divide the space between adjacent second plates 2 into multiple channels. When a fan is present on one side of the second plate 2 in the first direction X, the airflow stirred by the fan passes through the second plate 2 and the fins 4. The fins 4 can improve the consistency of the airflow direction between adjacent second plates 2, thereby increasing the airflow velocity and shortening the residence time of the high-temperature air after heat exchange in the second plate 2, so as to further improve the heat dissipation efficiency of the phase change heat sink and electronic devices.

[0115] Figure 20 This is a schematic diagram of a phase change heat sink. Figure 20 As shown, the first plate 1 has a second partition 14, which divides the first inner cavity 11 into at least two cavities. Taking the two cavities as an example, the two cavities are respectively referred to as the first sub-cavity 113 and the second sub-cavity 114. Both the first sub-cavity 113 and the second sub-cavity 114 contain a liquid heat exchange medium 12. The second plate 2 includes at least a first sub-plate 25 and a second sub-plate 26. The second inner cavity 21 of the first sub-plate 25 is connected to the first sub-cavity 113, and the second inner cavity 21 of the second sub-plate 26 is connected to the second sub-cavity 114. The heating element 02 includes at least a first element 021 and a second element 022. The liquid heat exchange medium 12 in the first sub-cavity 113 is used to dissipate heat from the first element 021, and the liquid heat exchange medium 12 in the second sub-cavity 114 is used to dissipate heat from the second element 022.

[0116] In this embodiment, the first plate 1 is divided into multiple cavities by the second partition 14, and each cavity is connected to the second plate 2 and the third plate 3, so that one phase change heat sink can dissipate heat for multiple heat-generating elements 02 at the same time, thereby reducing the number of phase change heat sinks required in the electronic device and reducing the installation space occupied by the phase change heat sink, which is conducive to reducing the overall size of the electronic device and improving the integration of the electronic device.

[0117] like Figure 20 As shown, the first sub-cavity 113 and the second sub-cavity 114 can be arranged along the first direction X, or along... Figure 8 The third party in the Z-direction is arranged. In this embodiment, as... Figure 20 As shown, the first sub-cavity 113 and the second sub-cavity 114 can be arranged along the first direction X, so that one fan can simultaneously meet the heat dissipation of the first sub-board 25 and the second sub-board 26, which can reduce the number of fans required, and is conducive to further reducing the overall size of electronic devices and improving the integration of electronic devices.

[0118] Reference is made to the same or similar parts among various embodiments in the specification.

Claims

1. A phase change heat spreader, comprising: The phase change heat sink comprises: a first plate body for contacting a heat generating element, the first plate body having a first inner cavity; a second plate body having a second inner cavity, the second inner cavity being in communication with the first inner cavity; the first preset included angle between the second plate body and the first plate body is greater than 90°; the first plate body has a first mounting hole, a portion of the second plate body is mounted in the first mounting hole, and the extension direction of the central axis of the first mounting hole is perpendicular to the height direction of the first plate body.

2. The phase change heat spreader of claim 1, wherein, The first preset included angle α satisfies: 95°≤α≤150°.

3. The phase change heat spreader of claim 1, wherein, The second plate body comprises a first body and a first protrusion, the second inner cavity is arranged in the first body, the first body has a first face, the first face abuts against the side wall of the first mounting hole in a first direction, the first protrusion has a second face, the second face abuts against the end face of the first plate body in a second direction, the first face is connected with the second face, and the first face and the second face have a fifth preset included angle; wherein the height direction of the first plate body is the first direction, and the extension direction of the central axis of the first mounting hole is the second direction.

4. The phase change heat spreader of claim 3, wherein, The fifth preset included angle is 90°.

5. The phase change heat spreader of claim 1, wherein, The second plate body has a first partition plate, the first partition plate separates the second inner cavity into at least two flow channels, and the two flow channels are arranged along the first direction; The phase change heat sink further comprises a third plate body, along the extension direction of the second plate body, the third plate body is located on the side of the second plate body away from the first plate body, and the third plate body is used for plugging the side of the flow channel away from the first inner cavity.

6. The phase change heat spreader of claim 5, wherein, The third plate body has a third inner cavity and a second mounting hole, and the third inner cavity is in communication with at least part of the flow channel.

7. The phase change heat spreader of claim 6, wherein, The extension direction of the central axis of the second mounting hole is a second direction, and the second direction is perpendicular to the first direction; The second plate body comprises a second body and a second protrusion, the second inner cavity is arranged in the second body, the second body has a third face, the third face abuts against the side wall of the second mounting hole in the first direction, the second protrusion has a fourth face, the fourth face abuts against the third plate body in the second direction, the third face is adjacent to the fourth face, and there is a sixth preset included angle between the third face and the fourth face.

8. The phase change heat spreader of claim 7, wherein, The sixth preset included angle is 90°.

9. The phase change heat spreader of any of claims 1 to 8, wherein, The number of the second plate bodies is multiple, and the multiple second plate bodies are arranged in a third direction, and the third direction is perpendicular to the first direction.

10. The phase change heat spreader of claim 9, wherein, The phase change heat sink further comprises fins, along the third direction, the fins are located between adjacent second plate bodies, and multiple fins are arranged in the extension direction of the second plate body.

11. The phase change heat spreader of any of claims 1 to 8, wherein, The first plate body has one or more second partitions, the second partitions at least separating the first inner cavity into a first sub-cavity and a second sub-cavity, the first sub-cavity and the second sub-cavity each having a liquid heat exchange medium therein, the second plate body at least including a first sub-plate body and a second sub-plate body, the second inner cavity of the first sub-plate body being in communication with the first sub-cavity, the second inner cavity of the second sub-plate body being in communication with the second sub-cavity.

12. The phase change heat spreader of claim 11, wherein, The first sub-cavity and the second sub-cavity are arranged along a first direction.

13. An electronic device, characterized by The electronic device includes: a housing having a mounting cavity; a heat generating element mounted in the mounting cavity; a phase change heat spreader according to any one of claims 1 to 12 mounted in the mounting cavity, a first plate body of the phase change heat spreader being in contact with the heat generating element.

14. Electronic device according to claim 13, characterized in that The electronic device is an inverter.

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