Head-mounted display with efficient heat dissipation

Abstract

The utility model relates to an efficient heat dissipation head-mounted display, which comprises a display main body and a heat dissipation structure arranged on the display main body, and is characterized in that the heat dissipation structure comprises a plurality of heat dissipation pieces with heat dissipation surfaces so as to abut against a mainboard module of the display main body, and heat is sequentially transmitted and led out to the outside of the display main body through the plurality of heat dissipation surfaces; heat dissipation flow channels are formed among the heat dissipation pieces, the area of the mainboard module is communicated with the outside through the heat dissipation flow channels, and heat dissipation modules are arranged in the heat dissipation flow channels so that air in the heat dissipation flow channels can be exhausted to the outside of the display body. According to the utility model, heat generated by the mainboard module is sequentially transmitted through the plurality of heat dissipation pieces and is led out to the outside of the display main body, so that the heat is gradually and effectively dissipated; due to the fact that the heat dissipation flow channel is formed by connecting the three heat dissipation pieces, when the heat dissipation module dissipates heat, heat transmitted to the heat dissipation face can be brought out to the outside of the display body along with air flow in the heat dissipation flow channel, and heat dissipation is completed; and the temperature of the heat dissipation surface in the heat dissipation process is reduced.

Description

TECHNICAL FIELD

[0001] The utility model relates to head mounted display technical field more specifically, relate to a high -efficient heat dissipation head -mounted display. BACKGROUND

[0002] Head mounted display (HMD), namely head-mounted display. Through various head-mounted displays, optical signals are sent to the eyes, and different effects such as virtual reality (VR), augmented reality (AR) and mixed reality (MR) can be realized.

[0003] During the operation of the head-mounted display, not only complex image and video data need to be processed, but also high-speed operation and interaction with external devices need to be supported, which makes the device generate a large amount of heat during operation, and the internal structure of the head-mounted display usually integrates multiple modules with different functions, such as lens module, mainboard control module and display module. These modules are arranged compactly and close to each other. When the device is running, each module will generate heat. Due to the limited space, heat is easily accumulated inside and difficult to dissipate naturally, resulting in an increase in the overall temperature of the device and affecting the performance and service life of the device.

[0004] Currently, some head-mounted displays use passive heat dissipation methods, such as setting finned heat sinks or graphite heat sinks, to conduct heat by increasing the heat dissipation area. However, the heat dissipation efficiency of this method is relatively low, and it is difficult to meet the heat dissipation requirements of high-performance head-mounted displays. Some head-mounted displays use active heat dissipation technology, such as installing fans to accelerate air flow and improve heat dissipation efficiency. However, this also brings new problems, such as noise caused by high fan power and weight increase caused by setting fans. UTILITY MODEL CONTENTS

[0005] The technical problem to be solved by the utility model is to provide a high-efficiency heat dissipation head-mounted display to solve the above-mentioned defects of the prior art.

[0006] The technical solution adopted by the utility model to solve its technical problem is:

[0007] A high-efficiency heat dissipation head-mounted display is constructed, which includes a display main body and a heat dissipation structure arranged on the display main body. The heat dissipation structure includes multiple heat dissipation pieces with heat dissipation surfaces to abut against the mainboard module of the display main body and sequentially transfer heat from the heat dissipation surfaces to the outside of the display main body. A heat dissipation flow channel is formed between the multiple heat dissipation pieces, which communicates the area of the mainboard module with the outside, and a heat dissipation module is arranged in the heat dissipation flow channel to discharge air in the heat dissipation flow channel to the outside of the display main body.

[0008] As an improvement of the head-mounted display, the plurality of heat dissipation members comprises a first heat dissipation member, a second heat dissipation member and a third heat dissipation member connected in sequence, the first heat dissipation member is in abutment with the mainboard module, and a heat dissipation surface of the third heat dissipation member is at least partially exposed outside the display body.

[0009] As an improvement of the head-mounted display, the first heat dissipation member comprises a first heat dissipation fin, and a first heat conduction block is connected to the first heat dissipation fin and in abutment with the mainboard module.

[0010] As an improvement of the head-mounted display, the first heat dissipation member further comprises a shielding cover connected to the mainboard module, the shielding cover covers the first heat dissipation fin and the first heat conduction block, and is connected to the second heat dissipation member, and edges of the first heat dissipation fin are in abutment with inner walls of the shielding cover.

[0011] As an improvement of the head-mounted display, the second heat dissipation member comprises a second heat conduction block and a second heat dissipation fin, the second heat dissipation fin is connected to the third heat dissipation member, and the second heat conduction block is connected between the second heat dissipation fin and the first heat dissipation member.

[0012] As an improvement of the head-mounted display, the second heat dissipation fin has at least two, respectively connected to two ends of the third heat dissipation member, and the heat dissipation flow channel is located in the middle of the third heat dissipation member.

[0013] As an improvement of the head-mounted display, the third heat dissipation member comprises a third heat dissipation fin partially exposed outside the display body, and the third heat dissipation fin is provided with a third heat conduction block to be connected to the second heat dissipation member.

[0014] As an improvement of the head-mounted display, the air outlet is arranged on the third heat dissipation fin and has a slot structure.

[0015] As an improvement of the head-mounted display, the display body further comprises a left display module and a right display module, and the display body is provided with a first air duct and a second air duct; the first air duct is in communication with the heat dissipation flow channel in sequence through the left display module and the mainboard module; and the second air duct is in communication with the heat dissipation flow channel in sequence through the right display module and the mainboard module.

[0016] As an improvement of the head-mounted display, the first air duct and the second air duct each have at least two air inlets.

[0017] The head-mounted display heat dissipation structure has the advantages that the heat generated by the heat source is sequentially transmitted through the multiple heat dissipation members, and finally exported to the outside of the display, so that the heat is gradually and effectively dissipated; the effective heat dissipation surface area is increased; the heat is distributed on multiple heat dissipation surfaces in the heat dissipation process, and is evenly distributed on a two-dimensional plane, so that the heat is effectively transferred and the temperature is reduced.

[0018] In addition, the three heat dissipation members form a heat dissipation flow channel, and the region of the heat source is communicated with the external space, and the heat dissipation module is arranged in the heat dissipation flow channel, when the heat dissipation module works, the air flow in the heat dissipation flow channel is accelerated, so that the heat is discharged faster, and the heat dissipation efficiency is improved.

[0019] At the same time, since the heat dissipation flow channel is formed by connecting the three heat dissipation members, when the heat dissipation module dissipates heat, the heat transferred on the heat dissipation surface will also be taken out to the external environment with the air flow in the heat dissipation flow channel, and the heat dissipation is completed; and the temperature of the heat dissipation surface in the heat dissipation process is further reduced, so that the temperature in the head-mounted display is not too high, and the internal related components can work at a temperature. BRIEF DESCRIPTION OF DRAWINGS

[0020] In order to more clearly illustrate the technical scheme in the embodiments of the present application or the prior art, the present application will be further described below with reference to the drawings and embodiments. The drawings in the following description are only some embodiments of the present application, and for those skilled in the art, other drawings can also be obtained without creative labor on the basis of these drawings:

[0021] Figure 1 is a structural schematic view of the head-mounted display heat dissipation structure provided by the present application;

[0022] Figure 2 is one of the partial structure exploded views of the head-mounted display heat dissipation structure provided by the present application;

[0023] Figure 3 is the second partial structure exploded view of the head-mounted display heat dissipation structure provided by the present application;

[0024] Figure 4 is one of the three-dimensional structure schematic views of the head-mounted display provided by the present application;

[0025] Figure 5 is the second three-dimensional structure schematic view of the head-mounted display provided by the present application;

[0026] Figure 6 is one of the heat dissipation flow channel circuit diagrams of the head-mounted display provided by the present application;

[0027] Figure 7It is partial stereoscopic structure schematic diagram of head-mounted display provided by the utility model.

[0028] Figure 8 It is exploded view of head-mounted display provided by the utility model.

[0029] Figure 9 It is heat dissipation flow channel circuit diagram two of head-mounted display provided by the utility model.

[0030] In the drawing: 1, first heat dissipation piece;11, first heat conduction block;12, first radiating fin;13, shielding cover;2, second heat dissipation piece;21, second heat conduction block;22, second radiating fin;3, third heat dissipation piece;31, third heat conduction block;32, third radiating fin;4, heat dissipation flow channel;41, air outlet;42, heat dissipation module;5, display main body;51, mainboard module;52, left display module;53, right display module;54, first air duct;55, second air duct;56, air inlet. Specific implementation

[0031] In order to make the utility model embodiment purposes, technical solutions and advantages more clearly, below will combine the technical scheme in the utility model embodiment to be clear, complete description, obviously, the described embodiment is the part embodiment of the utility model, rather than all embodiments. Based on the embodiment of the utility model, all other embodiments obtained by the person skilled in the art without paying creative labor belong to the protection scope of the utility model.

[0032] It should be noted that, Figure 1 , Figure 6 And Figure 9 The red line in, it is the line schematic of heat dissipation flow channel.

[0033] A kind of head-mounted display of high efficiency heat dissipation, as shown in Figure 1 , Figure 2 And Figure 3 It includes display main body 5 and the heat dissipation structure of setting in display main body 5, and the heat dissipation structure includes multiple heat dissipation pieces with radiating surface, to abut with the mainboard module of display main body 5, and the heat generated by mainboard module is sequentially transmitted to the outside of display main body 5 through multiple radiating surfaces;Multiple heat dissipation pieces are formed with heat dissipation flow channel 4, and heat dissipation flow channel 4 communicates the area of mainboard module with outside, and heat dissipation flow channel 4 is provided with heat dissipation module 42, to export the air of heat dissipation flow channel 4 to the outside of display main body 5.

[0034] Specifically, the heat dissipation module 42 is a heat dissipation fan; the number of heat dissipation pieces is three, and the three heat dissipation pieces with heat dissipation surfaces are connected with each other and closely abut against the heat source, for directly absorbing heat, for example, the mainboard module 51 of the head-mounted display; the heat is sequentially transmitted through the plurality of heat dissipation pieces and finally exported to the outside of the display body 5, so as to realize the gradual and effective dissipation of heat. In addition, the heat dissipation flow channel 4 is formed between the three heat dissipation pieces, which connects the area of the heat source with the external space, and the heat dissipation module 42 is arranged in the heat dissipation flow channel 4, which can accelerate the air flow in the heat dissipation flow channel 4 when the heat dissipation module 42 works, so as to discharge the heat more quickly and improve the heat dissipation efficiency. At the same time, since the heat dissipation flow channel 4 is formed by connecting the three heat dissipation pieces, when the heat dissipation module 42 is used for heat dissipation, the heat transferred to the heat dissipation surface will also be taken out to the external environment with the air flow in the heat dissipation flow channel 4, so as to complete the heat dissipation; and then the temperature of the heat dissipation surface in the heat dissipation process is reduced, so as to avoid that the temperature inside the head-mounted display is too high, and the related components inside can work at the temperature.

[0035] Since the three heat dissipation pieces all have heat dissipation surfaces, the effective heat dissipation surface area is increased; the heat generated by the mainboard module 51 is distributed on the three heat dissipation surfaces in the heat dissipation process, so as to uniformly distribute the heat on the two-dimensional plane, thereby effectively transferring the heat, and finally the surface heat is taken away by the external cooling medium (i.e. air). In combination with the cooperation of the heat dissipation module 42 and the heat dissipation flow channel 4, the heat inside the display body 5 can be efficiently transferred to the outside, and then the heat dissipation of the display module and the mainboard module 51 can be quickly realized, so as to quickly dissipate the heat points, thereby enabling the related components to work at the temperature.

[0036] In some embodiments of the present application, the plurality of heat dissipation pieces includes a first heat dissipation piece 1, a second heat dissipation piece 2 and a third heat dissipation piece 3 connected in sequence, the first heat dissipation piece 1 abuts against the mainboard module 51, and the heat dissipation surface of the third heat dissipation piece 3 is at least partially exposed to the outside of the display body 5. Specifically, the first heat dissipation piece 1 closely abuts against the mainboard module 51, effectively conducts the heat generated by the mainboard module 51 to the second heat dissipation piece 2; the second heat dissipation piece 2 is connected between the first heat dissipation piece 1 and the third heat dissipation piece 3, and plays a role of a bridge for heat transmission, further transmitting the heat to the third heat dissipation piece 3; since the heat dissipation surface of the third heat dissipation piece 3 is partially exposed to the outside of the display body 5, the heat can be directly dissipated to the air. At the same time, the heat dissipation module 42 in the heat dissipation flow channel 4 accelerates the air flow, thereby further improving the heat dissipation efficiency.

[0037] In some embodiments of the present application, the first heat dissipation member 1 comprises a first heat dissipation fin 12, and the first heat dissipation fin 12 is connected with a first heat conduction block 11 which is in abutment with the mainboard module 51. Specifically, the first heat conduction block 11 is used to efficiently conduct the heat generated by the mainboard module 51 to the first heat dissipation fin 12; and the first heat dissipation fin 12 is used to increase the heat dissipation area, and conduct and disperse the heat generated by the mainboard module 51, thereby further reducing the temperature of the heat dissipation member when dissipating the heat of the mainboard module 51. The design of the first heat dissipation member 1 can effectively conduct and disperse the heat generated by the mainboard module 51 to a larger heat dissipation area, thereby significantly improving the heat dissipation efficiency and helping to quickly reduce the temperature inside the display body 5.

[0038] It should be noted that the material of the first heat dissipation fin 12 is graphite; and the material of the first heat conduction block 11 is heat-conductive silica gel.

[0039] In some embodiments of the present application, the first heat dissipation member 1 further comprises a shielding cover 13 connected with the mainboard module 51, the shielding cover 13 covers the first heat dissipation fin 12 and the first heat conduction block 11, and is connected with the second heat dissipation member 2, and the edges of the first heat dissipation fin 12 are tightly attached to the inner wall of the shielding cover 13. Specifically, the shielding cover 13 can shield the influence of external electromagnetic waves on the internal circuit and the external radiation of the internal generated electromagnetic waves. The shielding cover 13 is first tightly connected with the mainboard module 51, ensuring the direct contact of the heat dissipation structure with the heat source and providing a basis for effective heat transfer; the shielding cover 13 completely covers the first heat dissipation fin 12 and the first heat conduction block 11, not only playing a protection role, but also ensuring the integrity of the heat dissipation structure; the shielding cover 13 is connected with the second heat dissipation member 2, forming a continuous heat dissipation path, so that the heat can be smoothly transferred and dissipated. The edges of the first heat dissipation fin 12 are tightly attached to the inner wall of the shielding cover 13, so as to maximize the area of the first heat dissipation fin 12 inside the shielding cover 13 and ensure uniform heat dispersion.

[0040] In other embodiments, the number of heat dissipation members can also be set to 4, 5, 6, 7 or 8; the additional heat dissipation members are arranged between the first heat dissipation member 1 and the third heat dissipation member 3 in series, thereby increasing the heat dissipation surface area.

[0041] In some embodiments of the present application, the second heat dissipation member 2 includes a second heat conduction block 21 and a second heat dissipation fin 22, the second heat dissipation fin 22 is connected with the third heat dissipation member 3, and the second heat conduction block 21 is connected between the second heat dissipation fin 22 and the first heat dissipation member 1. Specifically, the second heat conduction block 21 is used to efficiently conduct the heat transferred from the first heat dissipation member 1 to the second heat dissipation fin 22; the second heat dissipation fin 22 is also used to increase the heat dissipation area and is connected with the third heat dissipation member 3 to further transfer the heat to the third heat dissipation member 3 and finally dissipate to the external environment. The design of the second heat dissipation member 2 enables the heat to be more evenly distributed in the entire heat dissipation structure, optimizes the heat dissipation path, improves the heat dissipation effect, and avoids the accumulation of heat in a certain area. It helps to reduce the temperature of the display body 5 during operation, reduces the discomfort of the user due to overheating of the device, and improves the comfort and use experience of the user.

[0042] It should be noted that the material of the second heat dissipation fin 22 is copper foil; the material of the second heat conduction block 21 is graphite foam.

[0043] In some embodiments of the present application, the second heat dissipation fin 22 has two, respectively connected with both ends of the third heat dissipation member 3, and the heat dissipation flow channel 4 is located in the middle of the third heat dissipation member 3. Specifically, the second heat dissipation fin 22 effectively receives heat from the second heat conduction block 21 connected thereto through its large-area structure. Since the second heat dissipation fin 22 has two and is connected at both ends of the third heat dissipation member 3, it helps to more evenly disperse the heat to the heat dissipation surface of the third heat dissipation member 3, avoiding the accumulation of heat in a certain area of the heat dissipation surface, thereby improving the heat dissipation efficiency. When the three heat dissipation members are dissipating heat to the mainboard module 51, after the heat dissipation module 42 is started, an air flow is formed in the heat dissipation flow channel 4. Since the heat dissipation flow channel 4 is located in the middle of the third heat dissipation member 3, after the air flow contacts the third heat dissipation member 3, it will carry away part of the heat of the third heat dissipation member 3, so that the heat dissipation surface of the third heat dissipation member 3 has a relatively lower middle temperature compared to both ends. Therefore, the heat at both ends of the third heat dissipation member 3 will be more concentrated than the middle, and then be carried away by the air flow of the heat dissipation flow channel 4 for heat dissipation, further enhancing the heat dissipation efficiency of the third heat dissipation member 3.

[0044] In some embodiments of the present application, the third heat dissipation member 3 includes a third heat dissipation fin 32 partially exposed outside the display body 5, and the third heat dissipation fin 32 is provided with a third heat conduction block 31 to be connected with the second heat dissipation member 2. Specifically, the third heat dissipation fin 32 is tightly connected with the second heat dissipation member 2 through the third heat conduction block 31, forming an effective heat transfer path; when the mainboard module 51 generates heat, the heat is sequentially transferred to the third heat dissipation member 3 through the first heat dissipation member 1 and the second heat dissipation member 2; finally, the third heat dissipation fin 32 dissipates the heat to the external environment outside the display body 5, achieving effective heat management. By partially exposing the third heat dissipation fin 32 outside the display body 5, the heat dissipation area is increased, so that the heat can be dissipated to the external environment more quickly, thereby improving the overall heat dissipation efficiency. Avoiding the traditional display body 5 directly transferring heat to the shell, which causes the shell temperature to be too high, affecting the user's experience. It helps to reduce the temperature inside the display body 5 and avoid the performance degradation or damage of the device due to heat accumulation.

[0045] It should be noted that the third heat conduction block 31 is made of heat-conducting silica gel; the third heat dissipation fin 32 is made of metal material, specifically copper; in other embodiments, it can also be made of silver, aluminum, titanium, nickel, tungsten copper alloy or stainless steel, etc.

[0046] In some embodiments of the present application, the third heat dissipation fin 32 can also be made of natural graphite or artificial graphite according to actual needs.

[0047] In some embodiments of the present application, the air outlet 41 is arranged on the third heat dissipation fin 32 and has a slit structure. Specifically, the air outlet 41 is arranged on the third heat dissipation fin 32 and designed as a slit structure, allowing the air in the heat dissipation flow channel 4 to be smoothly discharged to the outside of the display body 5 under the action of the heat dissipation module 42. The air outlet 41 with a slit structure increases the contact area between the third heat dissipation fin 32 and the air in the heat flow channel, so that more air can contact the third heat dissipation fin 32 and carry away heat during the outward flow, significantly improving the heat dissipation efficiency and helping to quickly reduce the device temperature.

[0048] In some embodiments of the present application, as shown in Figure 4 , Figure 5 , Figure 6 , Figure 7 , Figure 8 and Figure 9 , the display body 5 includes a left display module 52 and a right display module 53, and the display body 5 is provided with a first air duct 54 and a second air duct 55; the first air duct 54 communicates with the heat dissipation flow channel 4 in sequence through the left display module 52 and the mainboard module 51; the second air duct 55 communicates with the heat dissipation flow channel 4 in sequence through the right display module 53 and the mainboard module 51.

[0049] Specifically, the first air duct 54 passes through the left display module 52 and the mainboard module 51 in sequence, and finally communicates with the heat dissipation flow channel 4; the second air duct 55 passes through the right display module 53 and the mainboard module 51 in sequence, and also communicates with the heat dissipation flow channel 4; the air duct design in this way ensures that the heat generated inside the head-mounted display can be quickly guided to the heat dissipation flow channel 4. Under the action of the heat dissipation module 42, the air in the heat dissipation flow channel 4 flows, and the heat generated inside the display body 5 is transmitted to the heat dissipation flow channel 4 through the heat dissipation structure, and finally the hot air is discharged to the outside of the display body 5 by the heat dissipation module 42, realizing effective management of heat. The heat generated inside the head-mounted display can be quickly and effectively discharged, significantly improving the heat dissipation efficiency, maintaining the low-temperature operation state of the equipment, and avoiding performance problems caused by overheating.

[0050] In some embodiments of the present application, the first air duct 54 and the second air duct 55 each have at least two air inlets 56. Specifically, the first air duct 54 and the second air duct 55 each have two air inlets 56, ensuring that air can flow smoothly into the air duct from multiple directions, thereby improving the uniformity and efficiency of air flow. During the operation of the head-mounted display, the heat generated by the internal components needs to be effectively discharged through the heat dissipation structure. The presence of multiple air inlets 56 can more effectively inhale external cold air and accelerate the flow of air inside the air duct, so that heat can be taken away and discharged to the outside of the display body 5 more quickly.

[0051] It should be understood that for those skilled in the art, improvements or changes can be made according to the above description, and all such improvements and changes shall fall within the scope of the appended claims of the present application.

Claims

1. A head-mounted display with efficient heat dissipation, characterized in that, The display body and the heat dissipation structure arranged on the display body, the heat dissipation structure comprising a plurality of heat dissipation members with heat dissipation surfaces, abutting against the mainboard module of the display body and sequentially transmitting heat to the outside of the display body through the plurality of heat dissipation surfaces; a heat dissipation flow channel is formed between the plurality of heat dissipation members, the heat dissipation flow channel communicates the area of the mainboard module with the outside, and a heat dissipation module is arranged in the heat dissipation flow channel to discharge air in the heat dissipation flow channel to the outside of the display body.

2. The head-mounted display of claim 1, wherein, The plurality of heat dissipation members comprise a first heat dissipation member, a second heat dissipation member and a third heat dissipation member connected in sequence, the first heat dissipation member abutting against the mainboard module, and the heat dissipation surface of the third heat dissipation member being at least partially exposed outside the display body.

3. The head-mounted display of claim 2, wherein, The first heat dissipation member comprises a first heat dissipation fin connected with a first heat conduction block, and the first heat conduction block abuts against the mainboard module.

4. The head-mounted display of claim 3, wherein, The first heat dissipation member further comprises a shielding cover connected with the mainboard module, the shielding cover covering the first heat dissipation fin and the first heat conduction block, and the shielding cover being connected with the second heat dissipation member, and the edges of the first heat dissipation fin being fitted with the inner wall of the shielding cover.

5. The head-mounted display of claim 2, wherein, The second heat dissipation member comprises a second heat conduction block and a second heat dissipation fin, the second heat dissipation fin being connected with the third heat dissipation member, and the second heat conduction block being connected between the second heat dissipation fin and the first heat dissipation member.

6. The head-mounted display of claim 5, wherein, The second heat dissipation fin has at least two, respectively connected with both ends of the third heat dissipation member, and the heat dissipation flow channel is located in the middle of the third heat dissipation member.

7. The head-mounted display of claim 2, wherein, The third heat dissipation member comprises a third heat dissipation fin partially exposed outside the display body, and the third heat dissipation fin is provided with a third heat conduction block to be connected with the second heat dissipation member.

8. The head-mounted display of claim 7, wherein, The air outlet is arranged on the third heat dissipation fin and has a slot structure.

9. The head-mounted display of claim 1, wherein, The display body further comprises a left display module and a right display module, and the display body is provided with a first air duct and a second air duct; the first air duct sequentially passes through the left display module and the mainboard module to communicate with the heat dissipation flow channel; the second air duct sequentially passes through the right display module and the mainboard module to communicate with the heat dissipation flow channel.

10. The head-mounted display of claim 9, wherein, The first air duct and the second air duct each have at least two air inlets.

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