Cleaning device

By introducing flow guiding components and cooling airflow paths into the cleaning device, the problem of insufficient heat dissipation of the circuit board was solved, achieving effective heat dissipation of the circuit board and improving the stability and reliability of the device.

CN223731314UActive Publication Date: 2025-12-30SKYBEST ELECTRIC APPLIANCE (SUZHOU) CO LTD
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Patent Information

Application Number
CN202422894964.7
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-11-26
Publication Date
2025-12-30
Estimated Expiration
2034-11-26

AI Technical Summary

Technical Problem

The heat dissipation problem of the circuit board in the existing cleaning device leads to frequent activation of the temperature control protection and poses a risk of damage.

Method used

The cleaning device is equipped with a flow guide component and a cooling airflow path, so that the cooling airflow passes over the surface of the circuit board and is guided to the surface of the circuit board by the flow guide component to improve the heat dissipation effect.

Benefits of technology

Effectively control the circuit board temperature, reduce the circuit board temperature, avoid damage caused by high temperature, and improve the stability and reliability of the cleaning device.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model discloses a cleaning device, and the cleaning device comprises a motor assembly which is used for generating vacuum in the cleaning device so as to form a cleaning airflow path which carries away dirt on a to-be-cleaned surface and a cooling airflow path which at least partially passes through the motor assembly; the fan cover at least partially encloses the motor assembly and is used for at least partially forming a clean airflow path and a cooling airflow path; the circuit board is at least partially located in the cooling airflow path and used for controlling the motor assembly to work; the flow guide assembly is connected with the fan cover, the circuit board is fixedly arranged on the cooling airflow path through the flow guide assembly, and the flow guide assembly is used for at least partially guiding airflow in the cooling airflow path to pass through the surface of the circuit board. According to the cleaning device, by arranging the flow guide assembly, at least part of the circuit board can be fixedly arranged in the cooling airflow path, airflow can be guided to pass through the surface of the circuit board, and the heat dissipation effect of the circuit board is improved.
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Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of mechanical design and manufacturing, and particularly relates to a cleaning device. BACKGROUND

[0002] The cleaning device generally comprises a machine head, a dust bucket and a suction head. The machine head is provided with a wind cover and a motor assembly. When the motor assembly operates and generates a suction airflow at the suction head, the dirt (i.e. any substance that can be sucked into the cleaning device, such as dust, debris, waste liquid or a mixture thereof) on the surface of the object (i.e. the surface to be cleaned) that needs to be cleaned can be sucked and treated through the suction head, so as to achieve the cleaning purpose. During the cleaning process, the airflow carrying the dirt such as dust enters the inside of the dust bucket, and then is filtered when passing through the filtering device in the dust bucket. At this time, the liquid and solid in the dirt are collected in the dust bucket, and the cleaned airflow formed after filtering is discharged to the outside of the cleaning device through the cleaning airflow path in the wind cover.

[0003] During the operation of the cleaning device, the motor assembly, the circuit board (which can be a brushless control board, and its functions at least include controlling the operation of the motor assembly), wires and the like will generate heat. The greater the current, the more heat is generated. If the heat of the circuit board is too high, the temperature control protection program will act to force the cleaning device to stop running. Moreover, if the heat of the circuit board is too high, the circuit board will have a high risk of damage.

[0004] Therefore, how to dissipate heat for the circuit board in the cleaning device is a technical problem to be solved by those skilled in the art. CONTENT OF THE UTILITY MODEL

[0005] Therefore, the purpose of the present application is to provide a cleaning device which can dissipate heat for the circuit board for controlling the motor assembly in the cleaning device through a cooling airflow path.

[0006] To achieve the above purpose, the present application provides the following technical solutions:

[0007] A cleaning device comprises:

[0008] a motor assembly for generating a vacuum in the cleaning device to form a cleaning airflow path for taking away the dirt on the surface to be cleaned and a cooling airflow path at least partially passing through the motor assembly;

[0009] a wind cover at least partially enclosing the motor assembly for at least partially forming the cleaning airflow path and the cooling airflow path;

[0010] a circuit board at least partially located in the cooling airflow path for controlling the operation of the motor assembly;

[0011] The cleaning device further comprises a flow guide assembly connected with the air cover, the circuit board is fixedly arranged in the cooling airflow path through the flow guide assembly, and the flow guide assembly is used for guiding the airflow in the cooling airflow path to at least partially pass through the surface of the circuit board.

[0012] Optionally, in the cleaning device, the flow guide assembly and the air cover are detachably connected.

[0013] Alternatively, the flow guide assembly and the air cover are integrated structural members.

[0014] Optionally, in the cleaning device, the flow guide assembly comprises a baffle, the baffle is located in the cooling airflow path and has a gap with the circuit board to guide the airflow to pass through the surface of the circuit board through the gap.

[0015] Optionally, in the cleaning device, the circuit board is located on the side of the baffle adjacent to the motor assembly, and the circuit board and the baffle are substantially parallel.

[0016] Optionally, in the cleaning device, the baffle is provided with a connecting portion protruding therefrom, wherein:

[0017] The connecting portion is detachably connected with the circuit board through a buckle structure.

[0018] And / or, the connecting portion is detachably connected with the circuit board through a fastener.

[0019] Optionally, in the cleaning device, the air cover comprises an air inlet cylinder.

[0020] The circumferential side edge of the baffle and the annular inner wall of the air inlet cylinder form a cooling airflow inlet of the cooling airflow path.

[0021] Optionally, in the cleaning device, at least two connecting ribs are arranged at intervals in the circumferential direction between the circumferential side edge of the baffle and the annular inner wall of the air inlet cylinder, and the cooling airflow inlet is formed between adjacent connecting ribs.

[0022] Optionally, in the cleaning device, the circuit board is provided with a ventilation hole, and the ventilation hole is arranged in a staggered manner with the cooling airflow inlet.

[0023] Optionally, in the cleaning device:

[0024] The motor assembly comprises a suction fan, and the cooling airflow inlet, the gap, the ventilation hole, and the air inlet end of the suction fan constitute an air inlet section of the cooling airflow path.

[0025] The air cover is provided with an annular air outlet pipe, at least part of the outer wall of the air inlet cylinder and part of the outer wall of the annular air outlet pipe form the cooling air outlet of the cooling air flow path, and the air outlet end of the air suction fan and the cooling air outlet constitute the air outlet section of the cooling air flow path.

[0026] Optionally, in the cleaning device, the air inlet cylinder is composed of a first arc-shaped wall plate and a second arc-shaped wall plate, wherein:

[0027] The cooling air inlet and the cooling air outlet are respectively located on both sides of the second arc-shaped wall plate;

[0028] In the direction opposite to the air inlet direction of the cooling air inlet, the second arc-shaped wall plate is protrusively arranged relative to the first arc-shaped wall plate to isolate the cooling air inlet and the cooling air outlet.

[0029] From the above technical solution, it can be seen that in the cleaning device provided by the present application, by arranging the flow guide assembly, the circuit board can be at least partially fixed in the cooling air flow path, and the air flow in the cooling air flow path can be at least partially guided to pass through the surface of the circuit board, so that the cooling air flow fully contacts the end surface of the circuit board, improves the heat dissipation effect of the circuit board, and fully dissipates heat. BRIEF DESCRIPTION OF DRAWINGS

[0030] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the drawings needed to be used in the embodiments or the prior art description will be briefly introduced. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative labor.

[0031] Figure 1 A perspective view of a cleaning device provided by an embodiment of the present application.

[0032] Figure 2 A structural schematic view of a circuit board provided by an embodiment of the present application.

[0033] Figure 3 A perspective view of an air cover provided by an embodiment of the present application (the dotted area represents the cooling air outlet of the cooling air flow path).

[0034] Figure 4 A top view of an air cover provided by an embodiment of the present application (the dotted area represents the cooling air outlet of the cooling air flow path).

[0035] Figure 5 A bottom view of an air cover provided by an embodiment of the present application (the dotted line represents the cleaning air flow path).

[0036] Figure 6 A front view of a shroud (dotted line represents part of the air inlet section of the cooling air flow path) is provided for an embodiment of the present application.

[0037] Figure 7 An axonometric view of a shroud (dotted line represents part of the air inlet section of the cooling air flow path) is provided for an embodiment of the present application.

[0038] Figure 8 A top view of a cleaning device is provided for an embodiment of the present application.

[0039] Figure 9 An enlarged structural schematic view of area A is provided for an embodiment of the present application. Figure 8

[0040] An enlarged structural schematic view of area B is provided for an embodiment of the present application (dotted line represents the cooling air flow path). Figure 10

[0041] An enlarged structural schematic view of area C is provided for an embodiment of the present application (dotted line represents the cooling air flow path). Figure 11 Figure 10 A side view of a cleaning device is provided for an embodiment of the present application (dotted line represents the cleaning air flow path).

[0042] Figure 12 An enlarged structural schematic view of area C is provided for an embodiment of the present application (dotted line represents the cooling air flow path).

[0043] Figure 13 Figure 12 An enlarged structural schematic view of area C is provided for an embodiment of the present application (dotted line represents the cooling air flow path).

[0044] Wherein:

[0045] 100 - head, 200 - dust bucket,

[0046] 1 - air suction fan, 2 - circuit board, 20 - ventilation hole,

[0047] 3 - air inlet cylinder, 301 - cooling air inlet, 302 - cooling air outlet,

[0048] 31 - first arc-shaped wall plate, 32 - second arc-shaped wall plate, 33 - limiting portion,

[0049] 4 - air deflector, 5 - connecting rib, 6 - connecting portion,

[0050] 70 - cleaning air outlet, 71 - annular air outlet pipe, 72 - straight cylindrical air outlet pipe,

[0051] 9 - air baffle, 91 - first vertical plate, 92 - second vertical plate. DETAILED DESCRIPTION

[0052] ​​The application discloses a cleaning device which can dissipate heat from a circuit board for controlling a motor assembly in the cleaning device through a cooling air flow path.

[0053] The technical solutions in the embodiments of the application will be apparently and completely described below with reference to the drawings in the embodiments of the application. Obviously, the described embodiments are only part of the embodiments of the application, rather than all the embodiments of the application. Based on the embodiments in the application, all the other embodiments obtained by a person of ordinary skill in the art without any creative work fall within the protection scope of the application.

[0054] Please refer to Figure 1 and Figure 10 and Figure 11 The cleaning device provided by the embodiments of the application comprises a motor assembly, a fan cover, a circuit board 2 and a flow guide assembly. The motor assembly is used to generate a vacuum in the cleaning device to form a cleaning air flow path capable of carrying away dirt on a surface to be cleaned and a cooling air flow path at least partially passing through the motor assembly. The fan cover at least partially encloses the motor assembly and is used to at least partially form the cleaning air flow path and the cooling air flow path. The circuit board 2 is used to control the operation of the motor assembly. The flow guide assembly is connected with the fan cover, and the circuit board 2 is at least partially fixed in the cooling air flow path through the flow guide assembly. The flow guide assembly can at least partially guide the air flow in the cooling air flow path to pass through the surface of the circuit board 2, so that the cooling air flow sufficiently contacts the end surface of the circuit board 2, improves the heat dissipation effect of the circuit board 2 and sufficiently dissipates heat.

[0055] Please refer to Figure 6 and Figure 7 In some embodiments, the flow guide assembly comprises a flow guide plate 4. The flow guide plate 4 and the circuit board 2 are both located in the cooling air flow path, and the flow guide plate 4 has a gap with the circuit board 2 to guide the air flow in the cooling air flow path to pass through the surface of the circuit board 2 through the gap to cool and dissipate heat.

[0056] Please refer to Figure 1 and Figures 3 to 9In some embodiments, the air outlet pipe 71 is a volute structure, and the inner annular passage of the volute structure is used to collect the filtered clean air flow, forming part of the clean air flow path; the inlet of the straight air outlet pipe 72 is in communication with the air outlet pipe 71, and the outlet of the straight air outlet pipe 72 is the clean air outlet 70 of the clean air flow path; the air inlet pipe 3 of the air baffle 4 is located in the middle hole region surrounded by the air outlet pipe 71, and in general, the central axis of the air inlet pipe 3 is collinear with the central axis of the air outlet pipe 71; the air baffle 4 is located in the air inlet pipe 3, and the circumferential side of the air baffle 4 and the annular inner wall of the air inlet pipe 3 form the cooling air inlet 301 of the cooling air flow path, which is in communication with the gap between the air baffle 4 and the circuit board 2, thereby forming part of the cooling air flow path, which is used to guide the air flow to pass through the surface of the circuit board 2, so that the cooling air flow fully contacts the end surface of the circuit board 2, and the circuit board 2 is fully cooled.

[0057] Please refer to Figure 3 and Figure 4 In some embodiments, the circumferential side of the air baffle 4 and the annular inner wall of the air inlet pipe 3 are spaced apart along the circumference and are provided with a plurality of (at least two) connecting ribs 5, and the cooling air inlet 301 is formed between adjacent connecting ribs 5. Specifically, the connecting rib 5 is a vertical plate structure, one end of which is connected to the side of the air baffle 4, and the other end is connected to the annular inner wall of the air inlet pipe 3, thereby fixing the air baffle 4 in the air inlet pipe 3, and the connecting rib 5 of the vertical plate structure also has a certain guiding effect on the air flow.

[0058] Please refer to Figure 2 , Figure 6 and Figure 7 In some embodiments, the circuit board 2 is provided with a ventilation hole 20, which is arranged in a staggered manner with the cooling air inlet 301, so that the gap between the air baffle 4 and the circuit board 2 is formed for guiding the air flow to pass through the surface of the circuit board 2. In general, at least the central region of the circuit board 2 is provided with a ventilation hole 20. However, it is not limited to this, and in other embodiments, the ventilation hole 20 can also be arranged in the eccentric region of the circuit board 2 according to the actual situation, as long as it can be arranged in a staggered manner with the cooling air inlet 301 to form the cooling air flow gap.

[0059] Please refer to Figures 10 to 13In some embodiments, the motor assembly includes the air suction fan 1, the cooling air inlet 301 located between the annular inner wall of the air inlet cylinder 3 and the circumferential side of the air guide plate 4, the gap between the inner side of the air guide plate 4 and the circuit board 2, the air vent 20 opened on the circuit board 2, and the air inlet end of the air suction fan 1, which are sequentially communicated to form an air inlet section of the cooling air flow path. In addition, the cooling air outlet 302 is formed between at least part of the outer wall of the air inlet cylinder 3 and part of the outer wall of the annular air outlet pipe 71, and the air outlet end of the air suction fan 1 is communicated with the cooling air outlet 302 to form an air outlet section of the cooling air flow path. The air inlet section and the air outlet section are connected to form the cooling air flow path. For details, see the dashed arrows in Figure 11 and Figure 13 .

[0060] Further, since the cooling air inlet 301 and the cooling air outlet 302 are located on the inner and outer sides of the air inlet cylinder 3, respectively, in order to isolate the cooling air inlet 301 and the cooling air outlet 302, the height of part of the air inlet cylinder 3 is increased, and the two sides of the increased area are connected with the first vertical plate 91 and the second vertical plate 92, respectively, to form the air baffle 9 which can isolate the cooling air inlet 301 and the cooling air outlet 302. For details, see Figure 3 The air inlet cylinder 3 is formed by the first arc-shaped wall plate 31 and the second arc-shaped wall plate 32, and the cooling air inlet 301 and the cooling air outlet 302 are located on the two sides of the second arc-shaped wall plate 32, respectively. In the direction opposite to the air inlet direction of the cooling air inlet 301, the second arc-shaped wall plate 32 is protrudingly arranged relative to the first arc-shaped wall plate 31, and the first vertical plate 91, the second arc-shaped wall plate 32, and the second vertical plate 92 are sequentially connected to form the air baffle 9. Through the air baffle 9, the cooling air inlet 301 and the cooling air outlet 302 can be isolated, and the air inlet area outside the cooling air inlet 301 and the air outlet area outside the cooling air outlet 302 can be isolated to some extent, so that the air inlet flow and the air outlet flow can be guided and isolated, and the rapid mixing of the air outlet flow and the air inlet flow is avoided to affect the heat dissipation efficiency.

[0061] For details, see Figure 6 and Figure 7In some embodiments, the circuit board 2 is located on one side of the air deflector 4 adjacent to the motor assembly, and the circuit board 2 and the air deflector 4 are substantially parallel; and the inner side of the circuit board 2 is provided with a connecting portion 6 for connecting the circuit board 2. The connecting portion 6 is detachably connected to the circuit board 2 by a buckle structure; and / or the connecting portion 6 is detachably connected to the circuit board 2 by a fastener. For example, the circuit board 2 is a circular ring-shaped plate structure, the center of which is a circular through-hole-shaped ventilation hole 20, the connecting portion 6 is located on the inner side of the air deflector 4 and has a hook structure, so as to be able to extend into the ventilation hole 20 of the circuit board 2 and be clamped and limited by the bottom surface of the circuit board 2; in addition, the inner side of the top of the air inlet cylinder 3 is further provided with a limiting portion 33, which is clamped and limited by the top surface of the circuit board 2. Thus, the circuit board 2 can be fixedly installed in the air inlet cylinder 3 by the connecting portion 6 and the limiting portion 33.

[0062] In specific implementation, the above-mentioned air deflector assembly and the air cover can be provided as an integrated structure, at this time, the air deflector 4, the connecting rib 5, the air inlet cylinder 3, the annular air outlet pipe 71 and the air baffle 9 are different parts in the integrated structure. Alternatively, in other embodiments, the air deflector assembly and the air cover can also be detachably connected. For example, one end of the connecting rib 5 and the air deflector 4 are connected by any mode of insertion, screw connection, adhesion or buckle connection; and / or the other end of the connecting rib 5 and the annular inner wall of the air inlet cylinder 3 are connected by any mode of insertion, screw connection, adhesion or buckle connection; and / or the annular outer wall of the air inlet cylinder 3 and the outer wall of the annular air outlet pipe 71 are fixedly connected by a connecting structure, which can be any mode of insertion, screw connection, adhesion or buckle connection, or can be part of the integrated structure, which is not limited in the present application.

[0063] It has been proved by tests that the temperature of the circuit board 2 without the air deflector assembly can reach above 120℃ after about two minutes of operation, and the circuit board 2 with the air deflector assembly can operate for a long time, and the highest temperature is about 100℃. It can be seen that the above-mentioned air deflector assembly and the cooling air flow path can improve the heat dissipation efficiency of the circuit board 2 and control the temperature of the circuit board 2.

[0064] It should be noted that the internal passage of the annular air outlet pipe 71 (i.e. the volute structure) in the air cover and the airflow passage communicated with the filtering device in the dust bucket are the clean airflow path, wherein the bottom of the volute structure is the clean airflow inlet in the clean airflow path, and the outlet of the volute structure is the clean airflow outlet; the cooling airflow inlet 301 and the cooling airflow outlet 302 in the cooling airflow path in the present application are located outside the annular air outlet pipe 71, which are different from the cooling airflow inlet and the cooling airflow outlet of the clean airflow path.

[0065] Finally, it should be noted that the terms "first" and "second", and the like, herein do not denote any order, quantity, combination or importance, but are used to identify one element from another, and do not imply any actual relationship or sequence between such elements. Moreover, the terms "comprises", "comprising", or any other variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but can also include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element preceded by "comprises a" does not, without more constraints, foreclose the existence of additional identical elements in the process, method, article, or apparatus that comprises the recited element.

[0066] The various embodiments in the specification are described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same or similar parts between the embodiments can be mutually referred to.

[0067] The above description of the disclosed embodiments enables a person skilled in the art to implement or use the present application. Various modifications to the embodiments will be apparent to those skilled in the art, and the general principles defined herein can be implemented in other embodiments without departing from the spirit or scope of the present application. Therefore, the present application will not be limited to the embodiments shown herein, but will conform to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A cleaning device, comprising: a motor assembly for generating a vacuum within the cleaning device to form a cleaning airflow path for carrying dirt away from a surface to be cleaned and a cooling airflow path at least partially passing through the motor assembly; a shroud at least partially enclosing the motor assembly for at least partially forming the cleaning airflow path and the cooling airflow path; a circuit board (2) at least partially located in the cooling airflow path for controlling operation of the motor assembly; characterized in that: the cleaning device further comprises a flow guide assembly connected with the shroud, the circuit board (2) is fixedly arranged in the cooling airflow path by the flow guide assembly, and the flow guide assembly is configured to at least partially guide an airflow in the cooling airflow path to pass through a surface of the circuit board (2).

2. The cleaning device of claim 1, wherein, the flow guide assembly and the shroud are detachably connected; or the flow guide assembly and the shroud are integrated as a one-piece structure.

3. The cleaning device according to claim 2, characterized in that: the flow guide assembly comprises a baffle (4) located in the cooling airflow path and having a gap with the circuit board (2) to guide the airflow to pass through the surface of the circuit board (2) through the gap.

4. The cleaning device of claim 3, wherein, the circuit board (2) is located on a side of the baffle (4) adjacent to the motor assembly, and the circuit board (2) and the baffle (4) are substantially parallel.

5. The cleaning device of claim 4, wherein, the baffle (4) is provided with a connecting portion (6) protruding therefrom, wherein: the connecting portion (6) and the circuit board (2) are detachably connected by a snap structure; and / or the connecting portion (6) and the circuit board (2) are detachably connected by a fastener.

6. The cleaning device of claim 3, wherein, the shroud comprises an air inlet cylinder (3): a cooling airflow inlet (301) of the cooling airflow path is formed between a circumferential side edge of the baffle (4) and an annular inner wall of the air inlet cylinder (3).

7. The cleaning device of claim 6, wherein, at least two connecting ribs (5) are arranged in a circumferential direction between the circumferential side edge of the baffle (4) and the annular inner wall of the air inlet cylinder (3), and the cooling airflow inlet (301) is formed between adjacent connecting ribs (5).

8. The cleaning device of claim 6, wherein, the circuit board (2) is provided with a ventilation hole (20) arranged in a staggered manner with the cooling airflow inlet (301).

9. The cleaning device according to claim 8, characterized in that: the motor assembly comprises a suction fan (1), and the cooling airflow inlet (301), the gap, the ventilation hole (20), and an air inlet end of the suction fan (1) constitute an air inlet section of the cooling airflow path; the shroud is provided with an annular air outlet pipe (71), at least part of an outer wall of the air inlet cylinder (3) and part of an outer wall of the annular air outlet pipe (71) form a cooling airflow outlet (302) of the cooling airflow path, and an air outlet end of the suction fan (1) and the cooling airflow outlet (302) constitute an air outlet section of the cooling airflow path.

10. The cleaning device of claim 9, wherein, the air inlet cylinder (3) is formed by a first arc-shaped wall plate (31) and a second arc-shaped wall plate (32) being buckled together, wherein: The cooling air inlet (301) and the cooling air outlet (302) are respectively located on two sides of the second arc-shaped wall plate (32); In the direction opposite to the air inlet direction of the cooling air inlet (301), the second arc-shaped wall plate (32) is protrusively arranged relative to the first arc-shaped wall plate (31) to isolate the cooling air inlet (301) and the cooling air outlet (302).