Small wafer machine

Abstract

The utility model belongs to the technical field of punching machine equipment, and particularly relates to a small wafer machine which comprises a machine frame, the supporting surface is arranged on the rack and is positioned below the hopper; the first air cylinder is vertically arranged below the rack, the driving end of the first air cylinder is located under the hopper, and a wafer adsorption head is arranged at the driving end of the first air cylinder; the second air cylinder is horizontally arranged on the rack, and the axial direction of the second air cylinder is parallel to the length direction of the supporting surface; the pushing claw group comprises two pushing claws which are movably arranged on the two sides of the supporting surface; wherein the pushing claw group can be driven by the second air cylinder to reciprocate along the length direction of the supporting surface, the first air cylinder can move wafers in the material head to the supporting surface through the wafer adsorption head, and compared with the prior art, the small wafer machine is pushed by the air cylinders, so that the cost is reduced, accessories are easier to replace, and the maintenance of the small wafer machine is facilitated.

Description

TECHNICAL FIELD

[0001] The utility model belongs to punch press equipment technical field, especially, relate to a small round piece machine. BACKGROUND

[0002] Small round piece machine is the small round piece that punch press of punch press is sent to another punch press's die piece by piece, in order, small round piece machine generally includes frame, hopper and support surface, the existing feeding mode is that motor rotates, linear guide sliding is realized to feeding, but this existing feeding structure cost is high, is not economical and thrifty, has increased the production cost for the user of production output requirement is lower, and the existing small round piece machine structure is complex, is inconvenient for the user to maintain replacement, thus it is necessary to make improvement. CONTENT OF UTILITY MODEL

[0003] The utility model aims at the above existing technical problem, provides a small round piece machine to effectively reduce production cost and facilitate the maintenance of small round piece machine.

[0004] Therefore, the utility model provides a small round piece machine, which comprises:

[0005] Frame, the frame is provided with a hopper;

[0006] Support surface, the support surface is arranged on the frame and below the hopper;

[0007] Further comprising:

[0008] First air cylinder, the first air cylinder is vertically arranged below the frame, the driving end of the first air cylinder is located directly below the hopper, and a round piece suction head is arranged on the driving end of the first air cylinder;

[0009] Second air cylinder, the second air cylinder is horizontally arranged on the frame, and the axial direction of the second air cylinder is parallel to the length direction of the support surface;

[0010] Push claw group, the push claw group comprises two push claws movably arranged on both sides of the support surface;

[0011] Wherein, the push claw group can reciprocate along the length direction of the support surface under the driving of the second air cylinder, and the first air cylinder can move the round piece in the hopper to the support surface through the round piece suction head.

[0012] In the technical solution, in the working process of the small wafer machine, the first cylinder drives the wafer suction head to ascend to the bottom of the hopper, the wafer suction head adsorbs the wafer, and then the first cylinder resets, the wafer is lowered to the supporting surface under the driving of the wafer suction head, the wafer is blocked by the two sides of the supporting surface with the resetting of the first cylinder, the wafer suction head is separated from the wafer, then the second cylinder starts to drive the two pushers of the pusher group to move, and the wafer is conveyed during the movement of the pushers, so that the material is accurately pushed to the mold, and compared with the prior art, the small wafer machine is pushed by the cylinder, the cost is reduced, the accessories are more easily replaced, and the maintenance of the small wafer machine is facilitated.

[0013] In the above technical solution, further, the pusher group further comprises:

[0014] Linear light axis, the linear light axis is arranged in the supporting surface;

[0015] Linear bearing, the linear bearing is movably arranged on the linear light axis;

[0016] Bearing seat, the bearing seat is arranged on the linear bearing;

[0017] Wherein, the two sides of the supporting surface are provided with a strip-shaped groove, the two sides of the bearing seat are provided with a connecting block, and the connecting block is connected with the pusher through the strip-shaped groove.

[0018] In the above technical solution, further, the bearing seat further comprises:

[0019] Main body, the main body is provided with a bearing mounting cavity, and the top of the main body is provided with an adjustment gap;

[0020] Bolt hole, the bolt hole is arranged on the top of the main body and penetrates through the adjustment gap;

[0021] Fastening bolt, the fastening bolt is inserted on the bolt hole and is in threaded connection with the bolt hole;

[0022] Thermal copper column, the thermal copper column is arranged in the main body;

[0023] Wherein, one end of the thermal copper column extends to the bearing mounting cavity and is attached to the surface of the linear bearing, and the other end extends to the bolt hole and is attached to the surface of the fastening bolt.

[0024] In the above technical solution, further, it further comprises:

[0025] Air slot, the air slot is arranged on the inner wall of the bearing mounting cavity, and the air slot extends along the length direction of the bearing mounting cavity and forms a slot opening on the surface of one end of the main body;

[0026] Air inlet, the air inlet is arranged on the side wall of the main body;

[0027] The air groove can be uniformly distributed along the circumference of the bearing mounting cavity, and the air inlets are connected with the connecting air ducts.

[0028] In the above technical solution, further, the straight light axis further comprises:

[0029] The inner cavity is arranged on the straight light axis and extends along the straight light axis, and the inner cavity forms an opening at both ends of the straight light axis.

[0030] The heat-conducting sheet is uniformly distributed along the circumference of the inner cavity.

[0031] In the above technical solution, further, the straight light axis further comprises:

[0032] The composite wear-resistant layer is arranged on the surface of the straight light axis.

[0033] The lubricating layer is arranged on the surface of the composite wear-resistant layer.

[0034] The beneficial effects of the present application are as follows:

[0035] 1. By arranging the air cylinder and the pusher claw group, the air cylinder pushes, and the straight bearing slides, which can effectively reduce the cost, and it is easier to replace the accessories, and the maintenance of the small disc machine is facilitated.

[0036] 2. By arranging the heat-conducting copper column and the air groove, the overheating of the straight bearing can be effectively reduced, and the adverse effects caused by the thermal expansion of the straight bearing can be reduced.

[0037] 3. By arranging the inner cavity and the heat-conducting sheet, the heat on the straight light axis can be effectively dissipated, and the overheating of the straight light axis can be prevented.

[0038] 4. By arranging the composite wear-resistant layer and the lubricating layer, the wear resistance of the straight light axis can be effectively improved, the friction between the straight light axis and the straight bearing can be reduced, and the moving precision of the pusher claw group can be improved. BRIEF DESCRIPTION OF DRAWINGS

[0039] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the drawings needed in the embodiment or prior art description will be briefly introduced below, and obviously, the drawings in the following description are only some embodiments of the present application, and those skilled in the art can obtain other drawings according to these drawings without creative labor.

[0040] Figure 1 The specific embodiment structure of the present application is shown in the figure.

[0041] Figure 2 It is the horizontal section view perspective structure schematic diagram of the pushing claw group of the utility model.

[0042] Figure 3 It is the vertical section view perspective structure schematic diagram of the pushing claw group of the utility model.

[0043] Figure 4 It is the bearing seat structure schematic diagram of the utility model.

[0044] Figure 5 It is the optical axis structure schematic diagram of the utility model.

[0045] The mark in the figure indicates that:

[0046] 1, rack; 2, hopper; 3, support surface; 4, first cylinder; 5, round piece suction head; 6, second cylinder; 7, pushing claw; 8, straight line optical axis; 80, inner cavity; 81, heat conduction sheet; 82, composite wear-resistant layer; 83, lubricating layer; 9, straight line bearing; 10, bearing seat; 100, main body; 101, bearing mounting cavity; 102, gap adjustment; 103, bolt hole; 104, heat conduction copper column; 105, air groove; 106, air inlet hole; 107, connecting air duct; 11, strip-shaped groove; 12, connecting block. DETAILED DESCRIPTION

[0047] The technical solutions in the embodiments of the utility model will be clearly and completely described in combination with the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, rather than all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the utility model.

[0048] In the description of the present application, it should be noted that the terms used herein are only for describing the specific embodiments, and are not intended to limit the exemplary embodiments according to the present application. In order to facilitate description, the size of each part shown in the drawings is not drawn according to the actual proportion relationship. The technology, method and equipment known to those skilled in the relevant art may not be discussed in detail, but in appropriate cases, the technology, method and equipment should be regarded as part of the authorized description. In all examples shown and discussed here, any specific value should be interpreted as only exemplary, and not as a limitation. Therefore, other examples of exemplary embodiments can have different values. It should be noted that similar reference numbers and letters represent similar items in the following drawings, so once an item is defined in one drawing, it does not need to be further discussed in subsequent drawings.

[0049] Example 1:

[0050] The embodiment of the application provides a small wafer machine, which comprises a rack 1, a hopper 2 arranged on the rack 1, a supporting surface 3 arranged on the rack 1 and located below the hopper 2,

[0051] Further comprising a first cylinder 4 vertically arranged below the rack 1, a driving end of the first cylinder 4 located directly below the hopper 2, and a wafer suction head 5 arranged on the driving end of the first cylinder 4; a second cylinder 6 horizontally arranged on the rack 1 and having an axial direction parallel to the length direction of the supporting surface 3; and a push claw group comprising two push claws 7 movably arranged on both sides of the supporting surface 3.

[0052] The push claw group is movable along the length direction of the supporting surface 3 under the drive of the second cylinder 6, and the first cylinder 4 can move the wafer in the material head to the supporting surface 3 through the wafer suction head 5.

[0053] Furthermore, the rack 1 and the hopper 2 are of a conventional structure, the supporting surface 3 is generally composed of a panel and two side plates, one end of the supporting surface 3 is located directly below the hopper 2, and the end is only composed of the two side plates to facilitate the movement of the first cylinder 4, the wafer suction head 5 can be a conventional magnetic suction head, the push claw 7 is of a conventional structure and generally comprises a push claw 7 mounting plate, a plurality of push claw 7 bodies are mounted on the push claw 7 mounting plate, and the plurality of push claw 7 bodies are uniformly and spacedly distributed along the length direction of the push claw 7 mounting plate.

[0054] In the embodiment, in the working process of the small wafer machine, the first cylinder 4 drives the wafer suction head 5 to ascend to the bottom of the hopper 2, the first cylinder 4 is reset after the wafer suction head 5 adsorbs the wafer, the wafer is lowered to the supporting surface 3 under the drive of the wafer suction head 5, the wafer is blocked by the two sides of the supporting surface 3 after the first cylinder 4 is reset, the wafer suction head 5 is separated from the wafer, then the second cylinder 6 is started to drive the two push claws 7 of the push claw group to move, the wafer is conveyed in the moving process of the push claw 7, and the material is accurately pushed to the mold in this way. Compared with the prior art, the small wafer machine is pushed by the cylinder, the cost is reduced, the accessories are more easily replaced, and the maintenance of the small wafer machine is facilitated.

[0055] Embodiment 2

[0056] The embodiment of the application provides a small wafer machine, which comprises a rack 1, a hopper 2 arranged on the rack 1, a supporting surface 3 arranged on the rack 1 and located below the hopper 2,

[0057] Further comprising a first cylinder 4 vertically arranged below the rack 1, a driving end of the first cylinder 4 located directly below the hopper 2, and a wafer suction head 5 arranged on the driving end of the first cylinder 4; a second cylinder 6 horizontally arranged on the rack 1 and having an axial direction parallel to the length direction of the supporting surface 3; and a push claw group comprising two push claws 7 movably arranged on both sides of the supporting surface 3.

[0058] In the embodiment, in the working process of the small wafer machine, the first cylinder 4 drives the wafer suction head 5 to ascend to the bottom of the hopper 2, and after the wafer suction head 5 adsorbs the wafer, the first cylinder 4 resets, the wafer is lowered to the support surface 3 under the driving of the wafer suction head 5, and with the resetting of the first cylinder 4, the wafer is blocked by the two sides of the support surface 3, the wafer suction head 5 is separated from the wafer, then the second cylinder 6 drives the two pushers 7 of the pusher group to move, the linear shaft moves along the linear optical axis 8 for guidance during the movement of the pusher 7, and the wafer is conveyed during the movement of the pusher 7, so that the material is accurately pushed to the mold, and compared with the prior art, the small wafer machine is pushed by the cylinder and the linear bearing 9 slides, the cost is reduced, the accessories are more easily replaced, and the maintenance of the small wafer machine is facilitated.

[0059] Embodiment 3:

[0060] The embodiment provides a small wafer machine, in addition to the technical solutions of the above-mentioned embodiments, further having the following technical features, the bearing seat 10 further comprises: a main body 100, a bearing mounting cavity 101 is arranged in the main body 100, and an adjustment gap 102 is arranged at the top of the main body 100; a bolt hole 103 is arranged at the top of the main body 100 and penetrates through the adjustment gap 102; a fastening bolt is inserted into the bolt hole 103 and is in threaded connection with the bolt hole 103; a heat-conducting copper column 104 is arranged in the main body 100.

[0061] One end of the heat-conducting copper column 104 extends to the surface of the linear bearing 9 and is attached to the surface of the linear bearing 9, and the other end extends to the surface of the fastening bolt and is attached to the surface of the fastening bolt.

[0062] Further comprising: a wind groove 105, the wind groove 105 is arranged on the inner wall of the bearing mounting cavity 101, the wind groove 105 extends along the length direction of the bearing mounting cavity 101 and forms a notch on the surface of one end of the main body 100; and an air inlet hole 106, the air inlet hole 106 is arranged on the side wall of the main body 100.

[0063] The wind groove 105 can have a plurality of wind grooves and be uniformly and spacedly distributed along the circumference of the bearing mounting cavity 101, the plurality of layers are communicated through a connecting air duct 107, the air inlet hole 106 is communicated with the connecting air duct 107, and the air inlet hole 106 is connected with a gas source.

[0064] Moreover, the air inlet hole 106 is connected with a conventional gas source and can be connected through a conventional hose.

[0065] In the embodiment, the linear bearing 9 is connected to the external air source through the air inlet hole 106 to introduce air flow into the air groove 105 during operation, thereby effectively dissipating the heat generated by the linear bearing 9 and reducing the overheating phenomenon of the linear bearing 9. At the same time, during the heating process of the linear bearing 9, the heat generated by the linear bearing 9 can be transmitted to the fastening bolt through the heat-conducting copper column 104. After being heated, the fastening bolt expands to expand the adjustment gap 102, and finally the bearing mounting cavity 101 can expand with the heating and expansion of the linear bearing 9, preventing the linear bearing 9 from being damaged due to heating and expansion, and improving the working stability of the linear bearing 9.

[0066] Embodiment 4:

[0067] The embodiment provides a small wafer machine, in addition to the technical solutions of the above-mentioned embodiments, further having the following technical features, the linear optical axis 8 further comprises: an inner cavity 80, the inner cavity 80 is arranged in the linear optical axis 8 and extends along the linear optical axis 8 in the axial direction, and the inner cavity 80 forms an opening at both ends of the linear optical axis 8; a heat-conducting sheet 81, the heat-conducting sheet 81 has a plurality of and is uniformly and spacedly distributed along the circumference of the inner cavity 80.

[0068] Moreover, the heat-conducting sheet 81 also extends along the length direction of the linear optical axis 8, one end of the heat-conducting sheet 81 is connected with the inner wall of the inner cavity 80, the composite wear-resistant layer 82 is composed of a first wear-resistant layer and a second wear-resistant layer, the first wear-resistant layer is arranged on the surface of the linear optical axis 8, the second wear-resistant layer is arranged on the surface of the first wear-resistant layer, and the lubricating layer 83 is arranged on the surface of the second wear-resistant layer. The lubricating layer 83 can be lubricated copper powder, the first wear-resistant layer can be graphite steel, and the second wear-resistant layer can be nickel tungsten alloy.

[0069] In the embodiment, the setting of the inner cavity 80 can improve the air flow around the linear optical axis 8, thereby improving the heat dissipation performance of the linear optical axis 8 and reducing the overheating phenomenon of the linear optical axis 8. At the same time, the setting of the heat-conducting sheet 81 can further improve the heat dissipation area of the linear optical axis 8, thereby further reducing the overheating phenomenon of the linear optical axis 8 and improving the working stability of the linear optical axis 8.

[0070] Embodiment 5:

[0071] The embodiment provides a small wafer machine, in addition to the technical solutions of the above-mentioned embodiments, further having the following technical features, further comprising: a composite wear-resistant layer 82, the composite wear-resistant layer 82 is arranged on the surface of the linear optical axis 8; and a lubricating layer 83, the lubricating layer 83 is arranged on the surface of the composite wear-resistant layer 82.

[0072] In the embodiment, the setting of the composite wear-resistant layer 82 and the lubricating layer 83 can effectively improve the wear resistance of the linear optical axis 8 and reduce the friction between the linear optical axis 8 and the linear bearing 9, and improve the moving precision of the pusher claw group.

[0073] The embodiments of the present application are described above with reference to the drawings, and the embodiments and features in the embodiments of the present application can be combined with each other without conflict, and the present application is not limited to the above-described specific embodiments, and the above-described specific embodiments are only illustrative but not restrictive, and a person of ordinary skill in the art can make many forms under the inspiration of the present application without departing from the purpose of the present application and the scope protected by the claims, and all belong to the protection of the present application.

Claims

1. A wafer machine, comprising: a rack (1) on which a hopper (2) is arranged; a support surface (3) arranged on the rack (1) below the hopper (2); characterized in that it further comprises: a first cylinder (4) vertically arranged below the rack (1), the driving end of the first cylinder (4) being directly below the hopper (2), and a wafer suction head (5) being arranged on the driving end of the first cylinder (4); a second cylinder (6) horizontally arranged on the rack (1) and the axial direction of the second cylinder (6) being parallel to the length direction of the support surface (3); a push claw group comprising two push claws (7) movably arranged on both sides of the support surface (3); wherein the push claw group can move back and forth along the length direction of the support surface (3) under the driving of the second cylinder (6), and the first cylinder (4) can move the wafers in the hopper to the support surface (3) through the wafer suction head (5).

2. A wafer dicing machine according to claim 1, wherein The push claw group further comprises: a linear light axis (8) arranged in the support surface (3); a linear bearing (9) movably arranged on the linear light axis (8); a bearing seat (10) arranged on the linear bearing (9); wherein both sides of the support surface (3) are provided with a strip-shaped groove (11), both sides of the bearing seat (10) are provided with a connecting block (12), and the connecting block (12) is connected with the push claw (7) through the strip-shaped groove (11).

3. A wafer dicing machine according to claim 2, wherein The bearing seat (10) further comprises: a main body (100) in which a bearing mounting cavity (101) is arranged, and an adjustment gap (102) is arranged on the top of the main body (100); a bolt hole (103) arranged on the top of the main body (100) and penetrating through the adjustment gap (102); a fastening bolt inserted into the bolt hole (103) and threadedly connected with the bolt hole (103); a heat-conducting copper column (104) arranged in the main body (100); wherein one end of the heat-conducting copper column (104) extends to the bearing mounting cavity (101) and is in surface contact with the linear bearing (9), and the other end extends to the bolt hole (103) and is in surface contact with the fastening bolt.

4. A wafer dicing machine according to claim 3, wherein Further comprising: an air slot (105) arranged on the inner wall of the bearing mounting cavity (101), the air slot (105) extending along the length direction of the bearing mounting cavity (101) and forming a notch on the surface of one end of the main body (100); an air inlet hole (106) arranged on the side wall of the main body (100); wherein the air slot (105) can have several and be uniformly distributed along the circumference of the bearing mounting cavity (101), and the several layers are communicated through a connecting air duct (107), the air inlet hole (106) is communicated with the connecting air duct (107), and the air inlet hole (106) is circumscribed by an air source.

5. A wafer dicing machine according to claim 4, wherein The linear light axis (8) further comprises: An inner cavity (80) is arranged along the straight light axis (8) and extends axially along the straight light axis (8), and the inner cavity (80) forms an opening at both ends of the straight light axis (8); A heat-conducting sheet (81) is arranged along the circumference of the inner cavity (80) and is uniformly spaced.

6. A wafer dicing machine according to claim 5, wherein Further comprising: A composite wear-resistant layer (82) is arranged on the surface of the straight light axis (8); A lubricating layer (83) is arranged on the surface of the composite wear-resistant layer (82).

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