Punching device
By designing a stamping device with through slots and elastic devices, the problem of electrode movement and deformation during the stamping process was solved, achieving stable flattening of the electrode and high-quality stamping effect.
Patent Information
- Application Number
- CN202422362214.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-26
- Publication Date
- 2025-12-30
- Estimated Expiration
- 2034-09-26
AI Technical Summary
When traditional stamping equipment stamps uneven electrode sheets, the electrode sheets are prone to movement and deformation, which affects the stamping quality.
A stamping device is designed, comprising a die, a base plate, a first elastic device, and a first pressure plate. The electrode sheet is first flattened by the cooperation of the through groove on the first pressure plate and the first elastic device; then it is further flattened by the second pressure plate and the second elastic device; finally, the die is stamped and cut by the cutter, ensuring that the electrode sheet remains stable throughout the process.
It effectively prevents the electrode sheets from moving and deforming during the stamping process, improves the stamping quality, ensures the flatness of the electrode sheets, and avoids the phenomenon of automatic material collection by the equipment.
Smart Images
Figure CN223733653U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of new energy battery technology, and in particular to a stamping device. Background Technology
[0002] With the rapid development of the lithium battery industry, the market demand for large-capacity batteries is increasing. The electrode compaction density in the battery production process is also increasing. After rolling, high-density electrodes generally exhibit warping and deformation, resulting in uneven electrodes. Traditional stamping equipment cannot keep the electrodes in a stable state during stamping, causing them to move and deform, which affects the stamping quality. Utility Model Content
[0003] This application provides a stamping device, which aims to solve the problem that traditional stamping devices will move and deform when stamping uneven electrode sheets, thus affecting the stamping quality.
[0004] To solve the above-mentioned technical problems, this application proposes a stamping device, which includes: a die, a base plate, a first elastic device, and a first pressure plate;
[0005] The die-cutting mold includes a fixed plate and a cutting tool. The cutting tool is mounted on the fixed plate. The base plate is used to place the electrode sheet. The fixed plate and the base plate are arranged at intervals. The first elastic device and the first pressure plate are both located between the fixed plate and the base plate. The first pressure plate is provided with a through groove for the cutting tool to pass through.
[0006] Furthermore, the stamping device also includes a second elastic device and a second pressure plate. The second elastic device and the second pressure plate are both disposed between the fixed plate and the bottom plate. The second pressure plate is connected to the fixed plate through the second elastic device. The second pressure plate passes through the through groove to press against the electrode sheet to flatten the electrode sheet.
[0007] Furthermore, the stamping device also includes a third elastic device, which is fixedly installed on the side of the fixed plate near the second pressure plate. The third elastic device is used to press the second pressure plate against the electrode to flatten the electrode.
[0008] Furthermore, the second pressure plate is located within the space enclosed by the cutting tool.
[0009] Furthermore, the stamping device also includes a base plate, on which the die is fixedly mounted, and the base plate is used to move the die closer to and away from the base plate.
[0010] Furthermore, the stamping device also includes a guide rod, the substrate is connected to the guide rod, and the substrate moves along the guide rod.
[0011] Furthermore, the length of the cutting tool is greater than the thickness of the first pressure plate, so that the cutting tool can pass through the first pressure plate to press the electrode sheet.
[0012] Furthermore, the stamping device also includes a support column, which is fixedly connected to the base plate and is used to fix the base plate at a preset height.
[0013] Furthermore, the shape of the through groove matches the shape of the cutting tool.
[0014] Furthermore, the length of the cutting tool is greater than the thickness of the second pressure plate, so that the cutting tool can punch the electrode sheet when the second pressure plate presses the electrode sheet together.
[0015] The beneficial effects of this application are as follows: In the stamping device provided in this application, the die includes a fixed plate and a cutting tool. The cutting tool is mounted on the fixed plate, and the base plate is used to place the electrode sheet. The fixed plate and the base plate are arranged at intervals. The first elastic device and the first pressure plate are both arranged between the fixed plate and the base plate. The first pressure plate is provided with a through groove for the cutting tool to pass through. During the process of the cutting tool moving towards the base plate, the first pressure plate is forced to move towards the base plate, so that before the cutting tool contacts the electrode sheet on the base plate, the first pressure plate can flatten the electrode sheet, effectively preventing the phenomenon of stamping disorder due to uneven electrode sheet during the stamping process, and the inability of the equipment to automatically collect the material. Attached Figure Description
[0016] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort. Wherein:
[0017] Figure 1 This is a side view of a stamping device according to an embodiment of the present invention;
[0018] Figure 2 This is a side view of the stamping device according to an embodiment of the present invention when stamping an electrode sheet.
[0019] Explanation of reference numerals in the attached drawings: 100, die-cutting mold; 110, fixing plate; 120, cutting tool; 200, base plate; 300, first elastic device; 310, first pressure plate; 311, through groove; 400, second elastic device; 410, second pressure plate; 500, third elastic device; 600, guide rod; 700, support column; 800, base plate. Detailed Implementation
[0020] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of this application.
[0021] Those skilled in the art will understand that, unless explicitly stated otherwise, the singular forms “a,” “an,” “the,” and “the” used herein may also include the plural forms. It should be further understood that the word “comprising” as used in the specification of this application means the presence of features, integers, steps, operations, elements, modules, and / or components, but does not exclude the presence or addition of one or more other features, integers, steps, operations, elements, modules, module components, and / or groups thereof. It should be understood that when we say an element is “connected” or “coupled” to another element, it can be directly connected or coupled to the other element, or there may be intermediate elements. Furthermore, “connected” or “coupled” as used herein can include wireless connections or wireless coupling. The word “and / or” as used herein includes all or any modules and all combinations of one or more associated listed items.
[0022] Those skilled in the art will understand that, unless otherwise defined, all terms used herein (including technical and scientific terms) have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains. It should also be understood that terms such as those defined in general dictionaries should be understood to have the same meaning as in the context of the prior art, and should not be interpreted in an idealized or overly formal sense unless specifically defined as herein.
[0023] like Figure 1 As shown, this application provides a stamping apparatus, which includes a die 100, a base plate 200, a first elastic device 300, and a first pressure plate 310. The die 100 includes a fixed plate 110 and a cutting tool 120, the cutting tool 120 being mounted on the fixed plate 110. The base plate 200 is used to hold electrode sheets. The fixed plate 110 and the base plate 200 are spaced apart. The first elastic device 300 and the first pressure plate 310 are both located between the fixed plate 110 and the base plate 200. The first pressure plate 310 is connected to the base plate 200 via the first elastic device 300, and the first pressure plate 310 has a through groove 311 for the cutting tool 120 to pass through.
[0024] In one specific embodiment, the die 100 consists of a fixing plate 110 and a cutting tool 120. The fixing plate 110 serves to fix and support the cutting tool 120, ensuring that the cutting tool 120 maintains a stable position and state during operation. The cutting tool 120 is the part used to stamp and cut the electrode sheet. Its shape and size are designed and manufactured according to actual needs. The fixing plate 110 is arranged parallel to and spaced apart from the base plate 200. The cutting tool 120 is fixedly installed on the side of the fixing plate 110 close to the base plate 200.
[0025] The base plate 200 is a support platform for the electrode, providing a stable placement position for the electrode. The base plate 200 is located below the fixing plate 110.
[0026] The first pressure plate 310 is located between the fixed plate 110 and the base plate 200, and the first pressure plate 310 and the base plate 200 are arranged parallel to each other. The first pressure plate 310 is connected to the base plate 200 through the first elastic device 300. A through groove 311 is provided on the first pressure plate 310 at the position corresponding to the cutter 120. The through groove 311 is to allow the cutter 120 to pass smoothly through the first pressure plate 310 to perform stamping operation on the electrode sheet.
[0027] The first elastic device 300 connects the first pressure plate 310 and the base plate 200, providing elastic support for the first pressure plate 310. In this embodiment, the first elastic device 300 is a spring. During the stamping process, the fixed plate 110 pushes the first pressure plate 310 to compress the first elastic device 300, causing the first pressure plate 310 to flatten the electrode sheet. The first elastic device 300 acts as a buffer, reducing the impact of the impact force generated during the stamping process on the stamping device and the electrode sheet. At the same time, the first elastic device 300 also enables the first pressure plate 310 to automatically reset after flattening the electrode sheet, preparing for the next stamping.
[0028] In summary, the cooperation of the fixed plate 110, the first pressure plate 310 and the first elastic device 300 can effectively level the electrode sheet, preventing the electrode sheet from becoming disordered during the stamping process due to unevenness, and preventing the equipment from automatically collecting the material.
[0029] like Figure 1 As shown, the stamping device also includes a second elastic device 400 and a second pressure plate 410. The second elastic device 400 and the second pressure plate 410 are both disposed between the fixed plate 110 and the base plate 200. The second pressure plate 410 is connected to the fixed plate 110 through the second elastic device 400.
[0030] In one specific embodiment, the second pressure plate 410 is disposed between the fixed plate 110 and the base plate 200, and the second pressure plate 410 and the base plate 200 are arranged parallel and spaced apart. The second elastic device 400 connects the second pressure plate 410 and the fixed plate 110, and is suspended on the fixed plate 110. The second elastic device 400 can provide elastic support for the second pressure plate 410. In this embodiment, the second elastic device 400 is a spring. During the stamping process, when the fixed plate 110 moves towards the base plate 200, it will drive the second pressure plate 410 and the cutter 120 to move through the through groove 311 on the first pressure plate 310 towards the base plate 200. The second elastic device 400 extends a certain distance under its own weight, so that the second pressure plate 410 connected to the second elastic device 400 contacts the electrode sheet before the cutter 120. When the fixed plate 110 descends to a certain height, the second elastic device 400 is compressed. Under the action of the second elastic device 400, the second pressure plate 410... Applying pressure to the electrode flattens it, thereby further ensuring its flatness. As the fixing plate 110 moves away from the base plate 200, the cutter 120 detaches directly from the electrode along with the fixing plate 110. However, since the second elastic device 400 is in a compressed state, it applies a spring force towards the base plate 200 to the second pressure plate 410. Under its own weight and the spring force of the second elastic device 400, the second pressure plate 410 detaches from the electrode more slowly than the cutter 120, preventing the cutter 120 from lifting the electrode.
[0031] In summary, a second pressure plate 410 is added on the basis of the first pressure plate 310. Under the action of the second elastic device 400, the second pressure plate 410 can further flatten the electrode sheet, effectively improving the flatness of the electrode sheet and ensuring the stamping effect. After the stamping is completed, the speed at which the second pressure plate 410 leaves the electrode sheet is delayed compared to the speed at which the cutter 120 leaves the electrode sheet, effectively preventing the cutter 120 from lifting the electrode sheet.
[0032] like Figure 2 As shown, the stamping device also includes a third elastic device 500, which is fixedly installed on the side of the fixing plate 110 near the second pressure plate 410. The third elastic device 500 is used to press the second pressure plate 410 against the electrode to flatten the electrode.
[0033] In one specific embodiment, several third elastic devices 500 are provided. These third elastic devices 500 are configured to further enhance pressure control over the first pressure plate 310. The third elastic devices 500 are installed on the side of the fixed plate 110 near the second pressure plate 410, and can directly apply elastic pressure to the first pressure plate 310. In this embodiment, the third elastic device 500 is foam. During the stamping process, the fixed plate 110 moves towards the base plate 200, causing the third elastic devices 500 to move towards the first pressure plate 310, so that before the cutter 120 contacts the electrode sheet, the third elastic device 500 can push the first pressure plate 310 to flatten the electrode sheet.
[0034] like Figure 2 As shown, the second pressure plate 410 is located in the space enclosed by the cutter 120.
[0035] In one specific embodiment, the space enclosed by the cutting tool 120 refers to a specific area defined by the shape and position of the cutting tool 120. In the stamping device, the cutting tool 120 is mounted on the fixed plate 110 according to a certain shape and layout. The second pressure plate 410 is located within the space enclosed by the cutting tool 120, and the shape of the second pressure plate 410 matches the shape enclosed by the cutting tool 120. This design allows the second pressure plate 410 to be closer to the stamping position of the cutting tool 120 when flattening the electrode sheet. During the stamping process, the second pressure plate 410, under the action of the second elastic device 400, can directly flatten the electrode sheet located within the space enclosed by the cutting tool 120, thereby ensuring that the electrode sheet is sufficiently flattened before stamping.
[0036] In summary, during the stamping process, the first pressure plate 310, excluding the through slot 311, flattens and fixes the electrode sheet. The second pressure plate 410 further flattens the electrode sheet within the space enclosed by the cutter 120. Finally, the cutter 120 stamps and cuts the electrode sheet. This design ensures that the electrode sheet remains in a stable state throughout the stamping process, reducing electrode sheet movement and deformation, and improving the stamping quality.
[0037] like Figure 1 As shown, the stamping device also includes a base plate 800, and the die 100 is fixedly mounted on the base plate 800. The base plate 800 is used to drive the die 100 to move closer to and away from the base plate 200.
[0038] In one specific embodiment, the substrate 800 is disposed on the side of the fixing plate 110 away from the base plate 200. The substrate 800 and the fixing plate 110 are arranged parallel and spaced apart, and the substrate 800 provides a platform for mounting and supporting the die 100. The substrate 800 has a certain strength and stability, and can withstand the impact and vibration generated by the die 100 during operation. During the stamping process, the substrate 800 needs to precisely control the position and movement speed of the die 100 according to the work requirements. The substrate 800 can realize the motion control of the die 100 through a driving device such as a motor or cylinder.
[0039] In summary, before stamping, the substrate 800 moves the die 100 away from the base plate 200 to facilitate placing the electrode sheet on the base plate 200. Then, the substrate 800 moves the die 100 closer to the base plate 200 to perform the stamping operation. After stamping, the substrate 800 moves the die 100 away from the base plate 200 again to facilitate removing the stamped electrode sheet.
[0040] like Figure 1 As shown, the stamping device also includes a guide rod 600, and the substrate 800 is connected to the guide rod 600. The substrate 800 moves along the guide rod 600.
[0041] In one specific embodiment, guide rods 600 provide guidance for the movement of the substrate 800. The guide rods 600 are perpendicular to the base plate 200, and several guide rods 600 are provided. The substrate 800 is slidably connected to the guide rods 600, allowing the substrate 800 to move smoothly along the guide rods 600. During the stamping process, the substrate 800 moves along the guide rods 600, preventing the substrate 800 from shifting or wobbling, thereby ensuring the relative positional accuracy between the die 100 and the base plate 200.
[0042] In summary, the guide rod 600 can provide precise guidance for the movement of the substrate 800, ensuring that the substrate 800 always remains in the correct position and direction during movement, thereby improving the accuracy and quality of stamping.
[0043] like Figure 2 As shown, the length of the cutter 120 is greater than the thickness of the first pressure plate 310, so that the cutter 120 can pass through the first pressure plate 310 to press the electrode sheet.
[0044] In one specific embodiment, the length of the cutter 120 refers to its dimension in the direction perpendicular to the base plate 200. The thickness of the first pressure plate 310 refers to its dimension in the direction perpendicular to the base plate 200. Designing the length of the cutter 120 to be greater than the thickness of the first pressure plate 310 ensures that the cutter 120 can smoothly pass through the first pressure plate 310 to perform the stamping operation on the electrode sheet. During the stamping process, after the first pressure plate 310 initially presses and fixes the electrode sheet, the die 100 further compresses the third elastic device 500, allowing the cutter 120 to pass through the first pressure plate 310 to stamp and cut the electrode sheet.
[0045] In summary, the length of the cutting tool 120 is greater than the thickness of the first pressure plate 310, which enables the cutting tool 120 to smoothly punch and cut the electrode sheet, ensuring that the basic functions of the punching device are realized.
[0046] like Figure 2 As shown, the stamping device also includes a support column 700, which is fixedly connected to the base plate 200. The support column 700 is used to fix the base plate 200 at a preset height.
[0047] In one specific embodiment, the support column 700 is used to support and fix the base plate 200. The support column 700 has a certain strength and stability, and can withstand the weight of the base plate 200 and the electrode sheet, as well as the impact force generated during the stamping process. Several support columns 700 are provided, all of which are vertically arranged. The base plate 200 is fixedly assembled with the support columns 700 to fix the base plate 200 at a preset height, ensuring the relative positional relationship between the die 100 and the base plate 200, facilitating the stamping operation of the electrode sheet by the cutting tool 120.
[0048] In summary, the support column 700 provides stable support and fixation for the base plate 200. During the stamping process, the base plate 200 needs to be kept in a stable position to ensure that the cutter 120 can accurately stamp the electrode sheet. The height of the support column 700 can be adjusted according to actual needs to adapt to different stamping processes and working environments.
[0049] like Figure 2 As shown, the shape of the through groove 311 matches the shape of the tool 120.
[0050] In one specific embodiment, the shape of the through groove 311 is designed according to the shape of the cutter 120, so that the cutter 120 can just pass through the through groove 311, so as to minimize the area of the through groove 311, thereby allowing the first pressure plate 310 to flatten the electrode sheet with the maximum pressing area.
[0051] like Figure 2 As shown, the length of the cutter 120 is greater than the thickness of the second pressure plate 410.
[0052] In one specific embodiment, when the vertical length of the cutter 120 is greater than the vertical thickness of the second pressure plate 410, the cutter 120 can continue to move downwards to perform a stamping operation on the electrode after the second pressure plate 410 has completed pressing the electrode sheet. In the actual stamping process, the second pressure plate 410 moves towards the electrode sheet and flattens it under the action of the die 100 and the second elastic device 400. Only when the length of the cutter 120 is greater than the thickness of the second pressure plate 410 can the cutter 120 further stamp and cut the electrode sheet on the basis of the second pressure plate 410 stably pressing the electrode sheet, thereby realizing the processing of the electrode sheet.
[0053] The above are merely preferred embodiments of this application and do not limit the patent scope of this application. Any equivalent structural or procedural transformations made using the content of this application's specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this application.
Claims
1. A stamping device, characterized in that, The punch device comprises a cutter die, a base plate, a first elastic device, and a first pressing plate. The cutter die comprises a fixed plate and a cutter, the cutter is installed on the fixed plate, the base plate is used for placing a pole piece, the fixed plate is arranged opposite to the base plate with a certain interval, the first elastic device and the first pressing plate are both arranged between the fixed plate and the base plate, a through slot for passing the cutter is arranged on the first pressing plate. The punch device further comprises a second elastic device and a second pressing plate, the second elastic device and the second pressing plate are both arranged between the fixed plate and the base plate, the second pressing plate is connected to the fixed plate through the second elastic device. The second pressing plate is located in a space enclosed by the cutter. The shape of the through slot matches the shape of the cutter. The length of the cutter is greater than the thickness of the first pressing plate, so that the cutter can pass through the first pressing plate to punch the pole piece. The punch device further comprises a third elastic device, the third elastic device is fixedly installed on one side of the first pressing plate close to the fixed plate, and the third elastic device is used for pressing the first pressing plate to the pole piece, wherein the third elastic device pushes the first pressing plate to move towards the base plate before the cutter contacts the pole piece.
2. The stamping apparatus of claim 1, wherein The punch device further comprises a base plate, the cutter die is fixedly installed on the base plate, and the base plate is used for driving the cutter die to approach and move away from the base plate.
3. The stamping apparatus of claim 1, wherein The punch device further comprises a guide rod, the base plate is connected to the guide rod, and the base plate moves along the guide rod.
4. The stamping apparatus of claim 3, wherein The punch device further comprises a height-adjustable support column, the support column is fixedly connected to the base plate, and the support column is used for fixing the base plate at a preset height.
5. The stamping apparatus of claim 1, wherein The length of the cutter is greater than the thickness of the second pressing plate.
6. The stamping apparatus of claim 1, wherein