Pressing net suitable for half silicon wafer

Abstract

The utility model discloses a pressing net suitable for half silicon wafers, and the pressing net comprises a frame main body which is formed by connecting two long edges and two short edges end to end; the pressing needle assembly is connected to the frame main body, is suitable for pressing a silicon wafer to be processed, and comprises a first pressing needle assembly and a second pressing needle assembly; wherein the first pressing needle assemblies are arranged in parallel at intervals in the long edge direction of the frame main body, the second pressing needle assemblies are arranged between the first pressing needle assemblies and the frame main body, and when a half silicon wafer is placed on the series welding machine, the first pressing needle assemblies are separated from the second pressing needle assemblies. The second pressing needle assembly abuts against the broken end of the half silicon wafer. Through cooperative arrangement of the first pressing needle assembly and the second pressing needle assembly, only the first pressing needle assembly works when a silicon wafer with a normal size needs to be pressed, and when a half silicon wafer needs to be pressed, the second pressing needle assembly is matched with the first pressing needle assembly at the long side end, so that adaptation of the half silicon wafer is realized, and the application range of the pressing net is also widened.

Description

Technical Field

[0001] This application belongs to the field of battery processing technology, specifically relating to a mesh pressing method applicable to half-wafer silicon wafers. Background Technology

[0002] In recent years, the country has attached increasing importance to the use of clean energy. Among them, the light energy converted by photovoltaic modules is a typical clean energy. Photovoltaic modules are the core of solar power generation systems. Their function is to convert solar energy into electrical energy. The electrical energy can be sent to batteries for storage or used to power loads. Photovoltaic modules are usually made up of layers of backsheet, lower EVA, solar cells, upper EVA and tempered glass, which are then laminated together. The quality of the finished product directly determines the quality of the entire solar power generation system.

[0003] Photovoltaic silicon wafer stringing is one of the important processing steps. Photovoltaic silicon wafer stringing is usually done by placing the photovoltaic silicon wafer on the welding platform with a robot arm, then moving the welding platform to the position of placing the solder strip and the pressure mesh, moving the welding platform to the welding position, and melting the solder paste by heating the lamp box so that the solder strip is welded to the PAD point of the photovoltaic silicon wafer. After welding is completed, the pressure mesh is removed to obtain the photovoltaic silicon wafer string.

[0004] In existing technologies, the mesh pressing structures are designed for square, complete silicon wafers of 166mm, 180mm, 182mm, and 210mm. However, as competition in the photovoltaic industry intensifies and the price of photovoltaic silicon wafers continues to decline, the previously overlooked half-cell silicon wafer industry has emerged. From an electrical performance perspective, half-cell silicon wafers can reduce series resistance losses and increase the output power of photovoltaic modules. In terms of thermal performance, the heat generated by half-cell silicon wafers is more evenly distributed during operation, which is beneficial for module heat dissipation, reduces hot spot effects to a certain extent, and improves the stability and safety of the module. In terms of size and installation flexibility, modules made from half-cell silicon wafers are lighter, easier to install, and can adapt to some special installation scenarios and shape requirements. Therefore, there is an urgent need to develop a mesh pressing structure for string welding machines that is compatible with them. Utility Model Content

[0005] Therefore, the technical problem to be solved by this utility model is to provide a mesh that can be applied to half a silicon wafer.

[0006] To solve the above-mentioned technical problems, this utility model provides a mesh pressing method suitable for half-wafer silicon wafers, comprising:

[0007] The main frame is composed of two long sides and two short sides connected end to end;

[0008] A pressure pin assembly, connected to the frame body, is adapted to press the silicon wafer to be processed, and includes a first pressure pin assembly and a second pressure pin assembly;

[0009] The first pressure pin assembly comprises several groups, which are arranged parallel to each other along the long side of the frame body. The second pressure pin assembly comprises two groups, which are positioned between the first pressure pin assembly and the frame body. When the half-wafer is placed in the string bonding machine, the second pressure pin assembly presses against the broken end of the half-wafer. The mesh pressing mechanism also includes a reinforcing rib component, which connects two adjacent groups of the first pressure pin assembly, the second pressure pin assembly, and the second pressure pin assembly near the long side and the long side. The material of the long side is ceramic material.

[0010] Furthermore, the first pressure needle assembly includes a first connecting rod with both ends connected to the short side and a first pressure needle component disposed on the first connecting rod, the first pressure needle component being movable relative to the first connecting rod in the radial direction;

[0011] The first connecting rod is provided with first mounting holes at even intervals, and the first pressure needle component is installed in the first mounting holes.

[0012] Furthermore, the first mounting hole includes a first through hole and a second through hole connected along the radial direction, wherein the diameter of the first through hole is smaller than the diameter of the second through hole;

[0013] The first pressure needle component includes a first pressure needle member and a first limiting ring sleeved and connected to the first pressure needle member;

[0014] The first pressure needle component includes a first needle tip and a first needle rod connected to the first needle tip. The first needle rod includes a first rod body connected to the first needle tip and a second rod body connected to the first rod body. The first limiting ring is sleeved on the second rod body after the second rod body passes through the first mounting hole. The diameter of the first needle tip is larger than the diameter of the first through hole. The diameter of the first rod body is equal to the diameter of the first through hole. The diameter of the second rod body is equal to the diameter of the second through hole. The length of the first needle rod is greater than the length of the first mounting hole. The diameter of the first limiting ring is greater than the diameter of the second through hole.

[0015] Furthermore, a first step is formed between the first through hole and the second through hole, and a second step is formed between the first rod and the second rod. The first pressure needle component also includes a first elastic member, the two ends of which abut against the first step and the second step, respectively.

[0016] Furthermore, the second pressure needle assembly includes a second connecting rod with both ends connected to the short side and a second pressure needle component disposed on the second connecting rod, the second pressure needle component being movable relative to the second connecting rod in the radial direction;

[0017] The second connecting rod is provided with second mounting holes at even intervals, and the second pressure needle component is installed in the second mounting holes.

[0018] Furthermore, the second pressure needle component includes a second pressure needle member and a second limiting ring sleeved and connected to the second pressure needle member;

[0019] The second pressure needle component includes a second needle head and a second needle rod connected to the second needle head. The second limiting ring is sleeved on the second needle rod after the second needle rod passes through the second mounting hole. The diameter of the second needle head is larger than the diameter of the second mounting hole, the diameter of the second needle rod is equal to the diameter of the second mounting hole, and the diameter of the second limiting ring is larger than the diameter of the second mounting hole.

[0020] Furthermore, the second pressure needle component also includes a second elastic element, the two ends of which abut against the second needle tip and the second connecting rod, respectively.

[0021] Furthermore, both the first and second elastic elements are springs, and the second needle tip and the second needle bar are made of titanium alloy.

[0022] Furthermore, the end of the second rod protruding from the first mounting hole is recessed inward to form a first annular groove, and the end of the second needle rod protruding from the second mounting hole is recessed inward to form a second annular groove. The first limiting ring and the second limiting ring are respectively locked and installed in the first annular groove and the second annular groove.

[0023] The first limiting ring and the second limiting ring are copper sleeves.

[0024] Furthermore, the long side is provided with third mounting holes of the same structure as the first mounting holes at even intervals, and a first pressure needle component is installed in the third mounting hole so that the two long sides serve as two first pressure needle assemblies.

[0025] The technical solution provided by this utility model has the following advantages: The clamping mesh for half-wafers of this utility model is provided with a frame body consisting of two long sides and two short sides connected end to end, and a clamping pin assembly connected to the frame body, suitable for clamping the silicon wafer to be processed. The clamping pin assembly includes a first clamping pin assembly and a second clamping pin assembly. Several groups of the first clamping pin assemblies are arranged parallel and spaced along the long side of the frame body. Two groups of the second clamping pin assemblies are arranged between the first clamping pin assemblies and the frame body. The half-wafer is placed... During string bonding, the second pressure pin assembly presses against the broken end of the half silicon wafer; the mesh pressing mechanism also includes a reinforcing rib component, which connects two adjacent sets of first pressure pin assemblies, second pressure pin assemblies, and the second pressure pin assembly near the long side and the long side. The material of the long side is ceramic material. Thus, through the cooperation of the first pressure pin assembly and the second pressure pin assembly, only the first pressure pin assembly works when it is necessary to press a normal-sized silicon wafer. When it is necessary to press a half silicon wafer, the second pressure pin assembly cooperates with the first pressure pin assembly at the long side end to achieve the adaptation of the half silicon wafer and improve the applicability of the mesh pressing mechanism. Attached Figure Description

[0026] To more clearly illustrate the specific embodiments of this utility model or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0027] Figure 1 This is a schematic diagram of the structure of the pressure mesh applicable to half-wafer silicon wafers according to this utility model;

[0028] Figure 2 for Figure 1 A schematic diagram of the cross-sectional structure of the first pressure needle assembly;

[0029] Figure 3 for Figure 1 A cross-sectional structural diagram of the second pressure needle assembly. Detailed Implementation

[0030] The technical solution of this utility model will now be clearly and completely described with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this utility model. The present utility model will be described in detail below with reference to the accompanying drawings and embodiments. It should be noted that, unless otherwise specified, the embodiments and features in the embodiments of this utility model can be combined with each other.

[0031] It should be noted that the terms "first," "second," etc., in the specification, claims, and drawings of this utility model are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence.

[0032] In this utility model, unless otherwise stated, directional terms such as "upper," "lower," "top," and "bottom" are generally used in relation to the direction shown in the accompanying drawings, or in relation to the vertical, perpendicular, or gravitational direction of the component itself; similarly, for ease of understanding and description, "inner" and "outer" refer to the inner and outer contours of each component itself, but the above directional terms are not used to limit this utility model.

[0033] Please see Figures 1 to 3 As shown, a clamping mesh suitable for half-wafer silicon includes a frame body 1 and a clamping pin assembly connected to the frame body 1. In this embodiment, the frame body 1 is composed of two long sides 11 and two short sides 12 connected end to end in a staggered manner, that is, the entire frame body 1 is rectangular. After the clamping pin assembly is connected to the frame body 1, it is suitable for clamping the silicon wafer to be processed.

[0034] The pressure pin assembly includes a first pressure pin assembly 2 and a second pressure pin assembly 3. Several sets of first pressure pin assemblies 2 are arranged parallel and spaced along the long side 11 of the frame body 1. Two sets of second pressure pin assemblies 3 are arranged between the first pressure pin assembly 2 and the frame body 1. When a half-wafer is placed in the string bonding machine, the second pressure pin assembly 3 presses against the broken end of the half-wafer. The mesh pressing mechanism also includes a reinforcing rib component 4, which connects two adjacent sets of first pressure pin assemblies 2 and second pressure pin assemblies 3, as well as the second pressure pin assembly 3 near the long side 11 and the long side 11. Thus, through the cooperation of the first pressure pin assembly 2 and the second pressure pin assembly 3, only the first pressure pin assembly 2 works when it is necessary to press a normal-sized silicon wafer. When it is necessary to press a half-wafer, the second pressure pin assembly 3 cooperates with the first pressure pin assembly 2 at the long side 11 end to achieve the adaptation of the half-wafer and improve the applicability of the mesh pressing mechanism.

[0035] Furthermore, the long side 11 is made of ceramic material, which extends the service life of the entire pressing mesh by leveraging the high strength and wear resistance of ceramic. Ceramic also has good heat dissipation, facilitating heat dissipation during and after use. In this embodiment, the middle part of the long side 11 is made of ceramic material, while the ends connecting to the short side 12 are made of the same material. This ensures the strength and wear resistance of the long side 11, and also allows for a more stable and robust connection between the long side 11 and the short side 12 due to the consistent material, thus guaranteeing the overall stability of the pressing mesh.

[0036] Specifically, the first pressure pin assembly 2 includes a first connecting rod 21 with both ends connected to the short side 12 and a first pressure pin component 22 disposed on the first connecting rod 21. The first pressure pin component 22 can move radially relative to the first connecting rod 21, thereby achieving the pressing effect on the silicon wafer to be processed.

[0037] First mounting holes 211 are evenly spaced on the first connecting rod 21, and the first pressure needle component 22 is installed in the first mounting holes 211. The first mounting holes 211 include a first through hole 2111 and a second through hole 2112 connected in a radial direction. The diameter of the first through hole 2111 is smaller than the diameter of the second through hole 2112. The first pressure needle component 22 includes a first pressure needle element 221 and a first limiting ring sleeved and connected to the first pressure needle element 221. The first pressure needle element 221 includes a first needle tip 2211 and a first needle rod 2212 connected to the first needle tip 2211. The first needle rod 2212 includes a first rod body 2213 connected to the first needle tip 2211 and a second rod body 2214 connected to the first rod body 2213. The first limiting ring is sleeved on the second rod body 2214 after it passes through the first mounting holes 211. The diameter of the first needle tip 2211 is larger than the diameter of the first through hole 2111. The diameter of the first rod 2214 is equal to the diameter of the first through hole 2111, and the diameter of the second rod 2214 is equal to the diameter of the second through hole 2112. The diameter of the first limiting ring is larger than the diameter of the second through hole 2112, so that one end of the first needle 2211 can be held outside the first through hole 2111, and the first limiting ring can be held outside the second through hole 2112. The length of the first needle rod 2212 is greater than the length of the first mounting hole 211, thereby limiting the first pressing needle component 22 on the first mounting hole 211. When it is necessary to press the photovoltaic silicon wafer, only external force is needed to press down the needle, which will allow the second rod 2214 to move away from the first mounting hole 211. The end of the second rod 2214 that protrudes from the first mounting hole 211 is recessed inward to form a first annular groove 2217, and the first limiting ring is held and installed in the first annular groove 2217.

[0038] To achieve automatic reset of the first pressure pin component 22 after pressing, the first pressure pin component 22 also includes a first elastic element 2216. A first step portion 2113 is formed between the first through hole 2111 and the second through hole 2112, and a second step portion 2215 is formed between the first rod body 2213 and the second rod body 2214. The two ends of the first elastic element 2216 abut against the first step portion 2113 and the second step portion 2215 respectively. When pressing the silicon wafer, the second step portion 2215 moves towards the first step portion 2113, and the first elastic element 2216 contracts. After processing, the external force disappears, and the second step portion 2215 can move away from the first step portion 2113 under the elastic action of the first elastic element 2216, so that the first pressure pin component 221 can achieve automatic reset.

[0039] The second pressure needle assembly 3 includes a second connecting rod 31 connected to the short side 12 at both ends and a second pressure needle component 32 disposed on the second connecting rod 31. The second pressure needle component 32 can move radially relative to the second connecting rod 31. The second connecting rod 31 is provided with second mounting holes 311 at even intervals, and the second pressure needle component 32 is installed in the second mounting holes 311. The second pressure pin component 32 includes a second pressure pin member 321 and a second limiting ring sleeved and connected to the second pressure pin member 321. The second pressure pin member 321 includes a second pin head 3211 and a second pin rod 3212 connected to the second pin head 3211. The second limiting ring is sleeved on the second pin rod 3212 after it passes through the second mounting hole 311. The diameter of the second pin head 3211 is larger than the diameter of the second mounting hole, the diameter of the second pin rod 3212 is equal to the diameter of the second mounting hole 311, and the diameter of the second limiting ring is larger than the diameter of the second mounting hole 311. One end of the second pin rod 3212 protruding from the second mounting hole 311 is recessed inward to form a second annular groove 323, and the second limiting ring is engaged and installed in the second annular groove 323. When it is necessary to process a half silicon wafer, the second pin head 3211 of the second pressure pin presses down and abuts against the broken end of the half silicon wafer, thereby achieving the adaptation of the half silicon wafer. The specific working principle is similar to that of the first pressure needle assembly 2, and will not be described in detail here.

[0040] It is worth noting that the second pressure needle component 32 also includes a second elastic element 322. The two ends of the second elastic element 322 abut against the second needle tip 3211 and the second connecting rod 31, respectively. In this embodiment, the overall size of the second pressure needle component 32 is smaller than that of the first pressure needle component 22. Therefore, the strength of the second elastic element 322 is also slightly less than that of the first elastic element 2216. Thus, placing the second elastic element 322 between the second needle tip 3211 and the second connecting rod 31 makes it convenient to observe the usage and perform replacement and maintenance.

[0041] In this embodiment, both the first elastic element 2216 and the second elastic element 322 are springs, both the first and second limiting elements are copper sleeves, and the second needle 3211 and the second needle rod 3212 are made of titanium alloy, which has excellent corrosion resistance. In the silicon wafer processing environment, various chemicals may be encountered. Titanium alloy can resist the corrosion of these chemicals, thereby maintaining the performance and structural integrity of the second pressure needle and the second needle rod 3212, and extending their service life. Secondly, titanium alloy has high strength and high hardness. This allows the second pressure needle and the second needle rod 3212 to provide sufficient pressure when fixing the silicon wafer, effectively preventing the silicon wafer from shifting, and can withstand a certain degree of external force such as mechanical impact, without being easily damaged or deformed, ensuring the stability and reliability of fixing the silicon wafer, and helping to accurately complete the silicon wafer processing operation.

[0042] As mentioned above, third mounting holes 5 with the same structure as the first mounting holes 211 are evenly spaced on the long side 11. The first pressure needle component 22 is installed in the third mounting hole 5 so that the two long sides 11 serve as two of the above-mentioned first pressure needle components 2, thereby maximizing the processing efficiency of the pressing mesh.

[0043] Obviously, the embodiments described above are only some embodiments of this utility model, and not all embodiments. Based on the embodiments of this utility model, those skilled in the art can make other variations or modifications without creative effort, and all such variations or modifications should fall within the protection scope of this utility model.

Claims

1. A pressure grid suitable for half-wafer silicon wafers, characterized in that, The utility model relates to a frame body, the frame body is connected by two long sides and two short sides, a pressing needle assembly is connected on the frame body, and the pressing needle assembly is suitable for pressing the silicon wafer to be processed, and the pressing needle assembly comprises a first pressing needle assembly and a second pressing needle assembly. The first pressing needle assembly is provided with a plurality of groups, the first pressing needle assembly is arranged in parallel along the long side direction of the frame body, the second pressing needle assembly is provided with two groups, the second pressing needle assembly is arranged between the first pressing needle assembly and the frame body, and the second pressing needle assembly is arranged between the first pressing needle assembly and the frame body. The first pressing needle assembly comprises a first connecting rod connected with the short side at both ends and a first pressing needle part arranged on the first connecting rod, and the first pressing needle part can move along the radial direction relative to the first connecting rod. The first connecting rod is uniformly and spacedly provided with a first mounting hole, and the first pressing needle part is mounted in the first mounting hole.

2. The reticle for use with a semiconductor die as recited in claim 1, wherein, The first mounting hole comprises a first through hole and a second through hole connected along the radial direction, and the hole diameter of the first through hole is smaller than the hole diameter of the second through hole. The first pressing needle part comprises a first pressing needle and a first limiting ring sleeved and connected on the first pressing needle.

3. The reticle for use with a semiconductor die as recited in claim 2, wherein, The first pressing needle comprises a first needle head and a first needle rod connected with the first needle head, the first needle rod comprises a first rod body connected with the first needle head and a second rod body connected with the first rod body, the first limiting ring is sleeved on the second rod body after the second rod body passes through the first mounting hole, the diameter of the first needle head is greater than the hole diameter of the first through hole, the diameter of the first rod body is equal to the hole diameter of the first through hole, the diameter of the second rod body is equal to the hole diameter of the second through hole, the length of the first needle rod is greater than the length of the first mounting hole, and the diameter of the first limiting ring is greater than the diameter of the second through hole. The first through hole and the second through hole form a first step part, the first rod body and the second rod body form a second step part, and the first pressing needle part further comprises a first elastic piece, and the two ends of the first elastic piece are respectively abutted on the first step part and the second step part. The second pressing needle assembly comprises a second connecting rod connected with the short side at both ends and a second pressing needle part arranged on the second connecting rod, and the second pressing needle part can move along the radial direction relative to the second connecting rod.

4. The reticle of claim 3, wherein, The second connecting rod is uniformly and spacedly provided with a second mounting hole, and the second pressing needle part is mounted in the second mounting hole.

5. The reticle for use with a semiconductor die as recited in claim 4, wherein, The second pressing needle part comprises a second pressing needle and a second limiting ring sleeved and connected on the second pressing needle. ​ 6. The reticle for use with a semiconductor die as recited in claim 5, wherein, ​ The second needle pressing part comprises a second needle head and a second needle rod connected with the second needle head, the second limiting ring is arranged on the second needle rod after the second needle rod passes through the second mounting hole, the diameter of the second needle head is larger than the diameter of the second mounting hole, the diameter of the second needle rod is equal to the diameter of the second mounting hole, and the diameter of the second limiting ring is larger than the diameter of the second mounting hole.

7. The reticle of claim 6, wherein the reticle is a wafer reticle. The second needle pressing part further comprises a second elastic member, and two ends of the second elastic member are respectively abutted on the second needle head and the second connecting rod.

8. The reticle of claim 7, wherein the reticle is a wafer reticle. The first elastic member and the second elastic member are both springs, and the second needle head and the second needle rod are made of titanium alloy.

9. The reticle of claim 8, wherein, One end of the second rod body protruding out of the first mounting hole is inwardly recessed to form a first ring groove, one end of the second needle rod protruding out of the second mounting hole is inwardly recessed to form a second ring groove, and the first limiting ring and the second limiting ring are respectively clamped and mounted in the first ring groove and the second ring groove. The first limiting ring and the second limiting ring are copper sleeves.

10. The reticle of claim 9, wherein, The long edges are uniformly and interval ly provided with third mounting holes of the same structure as the first mounting hole, first needle pressing parts are mounted in the third mounting holes, and the two long edges serve as two first needle pressing assemblies.

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