Backflow structure and mold spraying device

Abstract

The utility model discloses a backflow structure and a mold spraying device, and belongs to the technical field of electroplating. The backflow structure comprises an external component, an internal component and a connecting piece, wherein the external component is in a horn mouth shape; the inner component is located in the outer component, and an electroplating area is formed between the inner component and the outer component; the connector connects the inner member and the outer member. The internal component and the external component are connected into a whole through the connecting piece, an annular electroplating area is formed in the whole, the external component is provided with the first boss, the internal component is provided with the second boss, and the connecting piece, the first boss and the second boss are arranged so that the strength of the backflow structure mold can be improved, and the stability of the mold can be improved; and the mold debugging difficulty is reduced. The external component is expanded outwards in the outline direction of the external component, and the internal component is contracted inwards in the outline direction of the internal component, so that the backflow space of the backflow structure can be expanded, redundant electroplating liquid is discharged in time, the electroplating liquid is prevented from accumulating or polluting a product, and the mold obtains a better backflow effect.

Description

Technical Field

[0001] This utility model relates to a reflux structure and a spraying device, belonging to the field of electroplating technology. Background Technology

[0002] The annular disc plating mold is a mold specifically designed for electroplating integrated circuit lead frames. It includes a mold body, positioning holes, ceramic positioning pins, a reflow structure, and a mask structure. By using this mold, precise electroplating of integrated circuit lead frames can be achieved, improving their electrical performance and reliability, and meeting the high-quality and high-reliability requirements of electronic products.

[0003] In annular disc spray molds, the reflux structure is typically a sloping, funnel-shaped reflux channel. During electroplating, this structure guides the electroplating solution back into the plating tank after plating, preventing waste and contamination. However, in existing technologies, the reflux effect is poor for disc molds with small plating areas, failing to promptly drain excess plating solution, leading to solution accumulation or product contamination. Furthermore, existing molds generally have weak strength, resulting in poor stability during production and significantly increasing the difficulty of mold adjustment. Utility Model Content

[0004] This invention provides a reflux structure and a spraying device. The reflux structure improves the reflux effect, promptly discharges excess electroplating solution, and solves the problem of electroplating solution accumulation or product contamination. Simultaneously, the reflux structure enhances the overall strength of the mold and addresses the issue of poor mold stability.

[0005] This utility model is achieved through the following technical solution:

[0006] Firstly, this utility model provides a reflux structure, comprising:

[0007] External component, wherein the external component is funnel-shaped;

[0008] An internal component is located within an external component, and an electroplating area is formed between the internal component and the external component;

[0009] A connector that connects the internal component and the external component.

[0010] In one embodiment of this utility model, the external component is provided with a first boss, and the internal component is provided with a second boss. This can enhance the mold strength of the reflow structure, improve the mold stability, and reduce the difficulty of mold debugging.

[0011] In one embodiment of this utility model, the internal component is funnel-shaped and its direction is opposite to that of the external component.

[0012] In one embodiment of this invention, the height of the second boss is greater than the height of the first boss. This results in a larger space on the side closer to the external component, which is beneficial for the recirculation of the electroplating solution.

[0013] In one embodiment of this invention, the connector is provided with a groove. This ensures that the electroplating solution can flow within the annular area formed by the internal and external components, thereby forming annular electroplating.

[0014] In one embodiment of this utility model, the electroplating area has a ring-shaped structure.

[0015] In one embodiment of this utility model, the inward contraction distance of the internal component is no greater than 0.15mm, and the outward expansion distance of the external component is no greater than 0.15mm. This expands the space at the return port, increases the return flow of the electroplating solution, and promptly discharges excess electroplating solution, preventing the accumulation of electroplating solution or contamination of the product.

[0016] Secondly, this utility model provides a spray molding device, including the aforementioned recirculation structure.

[0017] In one embodiment of this utility model, a mask structure is also included, which is connected to the reflow structure.

[0018] In one embodiment of this utility model, the reflux structure has multiple components and is interconnected.

[0019] Beneficial effects

[0020] The reflow structure provided by this utility model includes a connector, an internal component, and an external component. The internal and external components are connected as a whole by the connector, forming an annular electroplating area inside. The external component has a first boss, and the internal component has a second boss. By setting the connector, the first boss, and the second boss, the strength of the reflow structure mold can be increased, the stability of the mold can be improved, and the difficulty of mold debugging can be reduced. The external component expands outward along its contour direction, and the internal component contracts inward along its contour direction. The distance of expansion of the external component or contraction of the internal component should be less than 0.15mm, which can expand the reflow space of the reflow structure, timely discharge of excess electroplating liquid, avoid accumulation of electroplating liquid or contamination of the product, and enable the mold to achieve a better reflow effect. The bottom of the connector is provided with a groove to ensure that the electroplating liquid can flow within the annular area formed by the internal and external components, forming an annular electroplating. Attached Figure Description

[0021] Figure 1 A partial perspective view of the spraying device provided by this utility model.

[0022] Figure 2 for Figure 1 A magnified view of a portion of point A in the middle.

[0023] Figure 3 This is a partial perspective view of the spraying device provided by this utility model.

[0024] Figure 4 Rear view of the recirculation structure provided by this utility model.

[0025] Figure 5 for Figure 4 A magnified view of a section at point B in the middle.

[0026] In the figure: 1. Reflow structure; 11. Connector; 12. Internal component; 13. External component; 14. First boss; 15. Second boss; 2. Mask structure; 3. Electroplating area; 100. Spraying device. Detailed Implementation

[0027] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of the present utility model.

[0028] In this utility model, unless otherwise explicitly specified and limited, the terms "connected," "linked," and "fixed" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0029] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0030] like Figures 1 to 5As shown, this application provides a reflux structure for guiding the electroplating solution back into the electroplating tank smoothly after electroplating, avoiding waste and contamination of the electroplating solution. The reflux structure 1 is a flared structure, wide at one end and narrow at the other, with the narrow opening near the product to be electroplated. The reflux structure 1 includes a connector 11, an internal component 12, and an external component 13. The external component 13 is flared, with the narrow opening near the product to be electroplated. The internal component 12 is a solid flared structure, with its width decreasing from the external component 13 to the internal component 13, and is located inside the external component 13. The internal component 12 and the external component 13 are connected by the connector 11, which integrates them into a single unit, forming an electroplating area 3 between them. The electroplating area 3 is the area of ​​the product to be electroplated, and its shape and size can be adapted to the shape and size of the product. Specifically, in this embodiment, the electroplating area 3 is an annular structure. The outer component 13 and the inner component 12 form a shielding area, which can shield the areas of the electroplated product that do not need to be electroplated, and prevent the electroplating solution from contaminating the non-electroplated areas.

[0031] Furthermore, such as Figure 2 As shown, in some embodiments, the outer component 13 has a first protrusion 14 around its perimeter on the side near the electroplating area 3, which strengthens the outer component 13. The inner component 12 has a second protrusion 15 around its perimeter on the side near the electroplating area 3, which strengthens the inner component 12. By providing the first protrusion 14 and the second protrusion 15, the mold strength of the reflow structure 1 can be strengthened, the mold stability can be improved, and the difficulty of mold debugging can be reduced. Specifically, in this embodiment, by increasing the height of the second protrusion 15, the strength of the inner component 12 can be enhanced, preventing the inner component 12 from shifting under the impact of the electroplating solution, thus preventing the electroplating solution from contaminating the non-electroplated area.

[0032] Furthermore, in some embodiments, the outer component 13 expands outward along its contour on the side near the electroplating solution, while the inner component 12 contracts inward along its contour on the side near the electroplating solution, thereby expanding the space at the reflux port, increasing the reflux of the electroplating solution, and timely discharging excess electroplating solution to avoid accumulation of electroplating solution or contamination of the product.

[0033] Optionally, the connector 11 has a cross structure or an X-shaped cross structure. The connector 11 can not only connect the internal component 12 and the external component 13, but also strengthen the mold and improve its stability. The connector 11 has a groove on the side near the electroplated product to ensure that the electroplating solution can flow within the annular area formed by the internal component 12 and the external component 13, forming annular electroplating.

[0034] Optionally, the height of the first boss 14 and the second boss 15 should not be too high, so as to ensure that the external component 13 and the internal component 12 are in a funnel shape, and the height of the second boss 15 is greater than the height of the first boss 14, so that the space on the side closer to the external component 13 is larger, which is conducive to the return of the electroplating solution.

[0035] like Figure 3 As shown, this application also provides a spraying device 100, which includes a return flow structure 1 and a mask structure 2. Multiple return flow structures 1 are interconnected in a row, and the multiple rows of return flow structures 1 are evenly arranged on the spraying device 100, allowing simultaneous electroplating of multiple products requiring electroplating, thus improving work efficiency. The return flow structure 1 has multiple protrusions and grooves on the side near the electroplated product. The protrusions are used to shield non-electroplated areas, and the grooves are used to cooperate with the mask structure 2, allowing the mask structure 2 to cover the return flow structure 1. The mask structure 2 is made of silicone, which has a certain degree of elasticity, allowing the mask structure 2 to fit onto the return flow structure 1. The mask structure 2 is used to shield non-electroplated areas, ensuring that these areas are not contaminated by the electroplating solution.

[0036] Furthermore, in some embodiments, such as Figure 5 As shown, the mask structure 2 covers the reflow structure 1. The outward expansion distance of the outer component 13 and the inward contraction distance of the inner component 12 should not exceed 0.15 mm. Preferably, the outward expansion distance of the outer component 13 and the inward contraction distance of the inner component 12 are 0.06 mm, which can not only enable the reflow structure 1 to obtain a better reflow effect, but also ensure that the mask structure 2 will not detach due to a deviation of 0.06 mm under the scouring of the electroplating solution, thus preventing the electroplating solution from contaminating the non-electroplated areas.

[0037] Optionally, the reflux structure 1 is made of PEEK material. This material has high temperature resistance, corrosion resistance, and excellent mechanical properties, ensuring the dimensional stability of the reflux structure. The mask structure 2 is made of silicone material, which has a certain degree of elasticity and can cover the surface of the reflux structure 1. Through the compression between the reflux structure 1 and the electroplated product, the mask structure 2 can better prevent the electroplating solution from entering the non-electroplated areas.

[0038] The working principle of this utility model is as follows: The reflow structure 1 connects the internal component 12 and the external component 13 into a whole through the connector 11. An electroplating area 3 is formed between the internal component 12 and the external component 13. The connector 11 has a groove on the side near the electroplated product to facilitate the flow of the electroplating solution and ensure that the electroplating area 3 has a ring-shaped structure. The external component 13 and the internal component 12 are respectively provided with a first boss 14 and a second boss 15. The first boss 14 and the second boss 15 can enhance the mold strength of the reflow structure 1, thereby improving the mold stability and reducing the difficulty of mold debugging. The mask structure 2 covers the reflow structure 1 to shield the non-electroplated areas and prevent the electroplating solution from contaminating the non-electroplated areas.

[0039] The reflux structure 1 is funnel-shaped. The electroplating solution is sprayed out from the funnel, narrowing from wide to narrow, and flows within the electroplating area 3 formed by the internal component 12 and the external component 13. It reacts with the product to be electroplated within the electroplating area 3, and excess electroplating solution flows back through the reflux port. The external component 13 expands outward along its contour on the side closest to the electroplating solution, while the internal component 12 contracts inward along its contour on the side closest to the electroplating solution, thereby expanding the reflux space, improving the reflux effect of the mold, and solving the problem of excess electroplating solution not being discharged in time, causing electroplating solution accumulation or product contamination.

[0040] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0041] The above embodiments only illustrate several implementation methods of this utility model, and their descriptions are relatively specific and detailed, but they should not be construed as limiting the scope of the invention patent. It should be noted that those skilled in the art can make several modifications and improvements without departing from the concept of this utility model, and these all fall within the protection scope of this utility model.

[0042] This document uses specific embodiments to illustrate the principles and implementation methods of this utility model. The descriptions of these embodiments are merely for the purpose of helping to understand the method and core ideas of this utility model. It should be noted that those skilled in the art can make various improvements and modifications to this utility model without departing from its principles, and these improvements and modifications also fall within the protection scope of the claims of this utility model. Therefore, the protection scope of this utility model patent should be determined by the appended claims.

Claims

1. A reflow structure, characterized by, The application relates to a reflow structure (1), comprising: an outer member (13) in the shape of a trumpet; an inner member (12) located in the outer member (13), forming a plating area (3) between the inner member (12) and the outer member (13); a connecting member (11) connecting the inner member (12) and the outer member (13).

2. A reflow structure according to claim 1, wherein, The outer member (13) is provided with a first boss (14), and the inner member (12) is provided with a second boss (15).

3. A reflow structure according to claim 2, wherein, The inner member (12) is in the shape of a trumpet, and the direction is opposite to that of the outer member (13).

4. A reflow structure according to claim 3, wherein, The height of the second boss (15) is greater than that of the first boss (14).

5. A reflow structure according to claim 4, wherein, The connecting member (11) is provided with a groove.

6. A reflow structure according to claim 5, wherein, The plating area (3) is in the shape of a ring.

7. A reflow structure according to claim 6, wherein The inner member (12) is inwardly contracted by a distance not greater than 0.15 mm, and the outer member (13) is outwardly expanded by a distance not greater than 0.15 mm.

8. A die casting apparatus characterized by comprising: The application further relates to a reflow structure (1) according to any one of claims 1-7.

9. An apparatus as claimed in claim 8, wherein, The application further relates to a mask structure (2) connected to the reflow structure (1).

10. A die casting apparatus as defined in claim 9, wherein The application further relates to a plurality of reflow structures (1) connected to each other.

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