Temperature measuring cookware gasket and electromagnetic heating equipment

Abstract

The utility model discloses a temperature measuring cookware gasket and electromagnetic heating equipment, and relates to the technical field of cooking utensils. The gasket body is provided with a first surface laid on the induction cooker and a second surface arranged opposite to the first surface up and down, and the gasket body is provided with an accommodating cavity and a plurality of opening structures which are communicated with the accommodating cavity and are circumferentially and uniformly arranged on the second surface; the plurality of temperature detecting pieces are in one-to-one correspondence with the plurality of opening structures, and the temperature detecting pieces are fixedly connected to the gasket body and protrude out of the opening structures so as to support the cookware and sense the temperature of the bottom of the cookware; a temperature measuring sensor located in the accommodating cavity is arranged below at least part of the temperature detecting pieces; the electric insulation heat conduction layer is arranged between the temperature detection piece and the temperature measurement sensor and is in heat conduction connection with the temperature detection piece and the temperature measurement sensor; the communication part located in the containing cavity can be in communication connection with the induction cooker so as to transmit temperature data collected by the temperature measuring sensor to the induction cooker. According to the utility model, the temperature of the cookware can be accurately measured, the failure rate is low, and the use safety is high.

Description

Technical Field

[0001] This utility model relates to the field of cooking utensil technology, and in particular to a temperature measuring pot gasket and an electromagnetic heating device. Background Technology

[0002] Traditional electromagnetic heating cooking appliances, such as induction cookers, typically use indirect temperature measurement to monitor the pot's temperature in real time, thus ensuring high safety. Specifically, the temperature measuring device is located inside the induction cooker, below the microcrystalline glass panel. This leads to problems such as low temperature measurement accuracy, inability to precisely control the temperature of the induction cooker, and poor anti-dry-burning effect.

[0003] In view of the above problems, a temperature measuring pad is available on the market. This pad can be placed directly on the microcrystalline glass panel of an induction cooker, providing both stable support and direct temperature measurement for the cookware on it. The contact temperature sensor on the temperature measuring pad typically uses a small, fast-response, wide-range, and highly accurate thermistor temperature sensor, which is electrically connected to the circuit board.

[0004] However, during the direct heating of the cookware by the induction cooker, eddy currents are generated in the cookware. Since the thermistor temperature sensor is in direct contact with the bottom of the cookware, a current path may form between the cookware and the circuit board, making the circuit board susceptible to damage. This can cause the temperature sensing pad to malfunction, preventing accurate temperature measurement of the induction cooker and potentially leading to the cookware overheating. Therefore, existing temperature sensing pads suffer from high failure rates and poor safety, requiring further improvement. Utility Model Content

[0005] This invention aims to solve at least one of the technical problems existing in the prior art. To this end, this invention proposes a temperature-measuring cookware gasket and an electromagnetic heating device, which can accurately measure the temperature of cookware, and has a low failure rate and high safety in use.

[0006] The first aspect of this utility model provides a temperature measuring cookware gasket, which includes:

[0007] The gasket body has a first surface for laying on an induction cooker and a second surface arranged vertically opposite to the first surface. The gasket body is provided with a receiving cavity and a plurality of opening structures communicating with the receiving cavity. The plurality of opening structures are evenly arranged circumferentially on the second surface.

[0008] A temperature sensing element is provided in multiple forms, and is arranged in a one-to-one correspondence with the multiple opening structures. The temperature sensing element is fixedly connected to the gasket body and protrudes from the opening structure to support the cookware and sense the temperature of the bottom of the cookware.

[0009] A temperature sensor is disposed within the accommodating cavity, and the temperature sensor is located below at least a portion of the temperature sensing element;

[0010] An electrically insulating and thermally conductive layer is disposed between the temperature probe and the temperature sensor, and is thermally connected to both the temperature probe and the temperature sensor.

[0011] A communication component, disposed within the accommodating cavity, is configured to communicate with the induction cooker to transmit temperature data collected by the temperature sensor to the induction cooker.

[0012] According to the first aspect of the present invention, the temperature-sensing cookware pad has at least the following beneficial effects: when the pad body is placed on the surface of an induction cooker, the cookware is placed on the second surface of the pad body, allowing all the temperature sensing elements to directly contact the bottom of the cookware, providing stable support for the cookware. Furthermore, the temperature sensing elements can effectively sense the temperature of the bottom of the cookware and quickly transfer the heat from the cookware to the electrically insulating heat-conducting layer. The electrically insulating heat-conducting layer then transfers the heat from the cookware to the temperature sensor, enabling the temperature sensor to complete the real-time temperature acquisition of the cookware. Finally, the temperature sensor is transmitted to the temperature sensor via a communication component. The temperature data collected by the temperature sensor is transmitted to the induction cooker to enable precise temperature control and prevent the cookware from drying out. Furthermore, by adding an electrically insulating and heat-conducting layer between the temperature probe and the temperature sensor, a barrier with current isolation is formed between them. Even if eddy currents are generated in the cookware during induction cooker operation, a current path can be avoided between the cookware and the communication component. This ensures the normal operation of the communication component, guarantees that the temperature-sensing cookware gasket can accurately measure temperatures for a long time, reduces the failure rate, and improves safety.

[0013] In some embodiments of this utility model, the temperature measuring pot pad further includes a PCB board assembly. The PCB board assembly is disposed in the accommodating cavity and is electrically connected to the communication component along with the temperature sensor. The PCB board assembly is located below the temperature sensor, and there is an upper and lower gap between the PCB board assembly and the temperature probe. The temperature sensor and the electrically insulating and heat-conducting layer are both disposed in the upper and lower gap and are located in the middle of the temperature probe.

[0014] In some embodiments of this utility model, the projected area of ​​the electrically insulating and thermally conductive layer in the vertical direction is greater than or equal to the projected area of ​​the temperature sensor in the vertical direction; and / or, the thickness of the electrically insulating and thermally conductive layer is less than the thickness of the temperature sensing element.

[0015] In some embodiments of this utility model, the temperature probe is a copper sheet; and / or, there are three temperature probes and at least two temperature sensors.

[0016] In some embodiments of this utility model, the temperature measuring cookware pad further includes an electromagnetic induction coil, which is disposed in the accommodating cavity and electrically connected to the PCB board assembly. The electromagnetic induction coil is configured to collect electromagnetic waves from the induction cooker and generate current to power the temperature sensor and the communication component. A plurality of temperature sensing elements are arranged circumferentially around the central axis of the electromagnetic induction coil.

[0017] In some embodiments of this utility model, the electromagnetic induction coil is etched on the PCB board assembly, and the PCB board assembly is etched with wires for electrically connecting the temperature sensor and the communication component.

[0018] In some embodiments of this utility model, the temperature measuring cookware gasket further includes an LED light assembly, which is fixedly connected to the gasket body and disposed on the second surface. The LED light assembly is electrically connected to the communication component, and the communication component is further configured to control the brightness of the LED light assembly to increase according to the increase of the power of the induction cooker or the increase of the temperature data collected by the temperature sensor.

[0019] In some embodiments of this utility model, the temperature sensor is a semiconductor temperature sensor; and / or, the communication component is a wireless communication element or a wired communication element.

[0020] In some embodiments of this utility model, the communication component is an RF chip.

[0021] The second aspect of this utility model provides an electromagnetic heating device, which includes an induction cooker and a temperature measuring pot pad as described in the first aspect embodiment.

[0022] The electromagnetic heating device according to the second aspect of this utility model has at least the following beneficial effects: When the induction cooker directly heats the pot, a temperature-measuring pot pad is placed between the pot and the surface of the induction cooker. The temperature-measuring pot pad accurately collects the bottom temperature data of the pot and transmits it to the induction cooker. This helps to achieve precise temperature control of the induction cooker based on the bottom temperature data, avoiding the problem of the pot burning dry. At the same time, during the process of collecting the bottom temperature data, by adding an electrically insulating heat-conducting layer between the temperature probe and the temperature sensor, the heat of the pot can be transferred to the temperature sensor in sequence through the temperature probe and the electrically insulating heat-conducting layer, so that the temperature sensor can obtain the bottom temperature data. Furthermore, when the pot generates eddy currents, the electrically insulating heat-conducting layer can effectively block the eddy currents generated by the pot from flowing through the temperature probe to the temperature sensor and the communication component, thereby preventing damage to the communication component due to the current path between the pot and the communication component, and causing the temperature-measuring pot pad to fail.

[0023] Other features and advantages of this invention will be set forth in the description which follows, and will be apparent in part from the description, or may be learned by practicing the invention. The objects and other advantages of this invention may be realized and obtained by means of the structures particularly pointed out in the description, claims, and drawings. Attached Figure Description

[0024] Figure 1 This is an exploded view of the structure of the temperature measuring pot gasket provided according to an embodiment of the present utility model;

[0025] Figure 2 This is a three-dimensional structural diagram of the temperature measuring pot pad provided according to an embodiment of the present utility model;

[0026] Figure 3 This is a top view of the temperature measuring pot pad provided according to an embodiment of the present utility model;

[0027] Figure 4 yes Figure 3 Schematic diagram of cross section AA.

[0028] Reference numerals: 100, gasket body; 101, protrusion; 102, circular plate; 103, upper shell; 104, lower shell; 110, opening structure; 200, PCB board assembly; 210, wire; 300, temperature sensing element; 400, electromagnetic induction coil; 500, electrically insulating and heat-conducting layer; 600, temperature sensor; 700, upper and lower gap. Detailed Implementation

[0029] The embodiments of this utility model are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this utility model, and should not be construed as limiting this utility model.

[0030] In the description of this utility model, it should be understood that features specified as "first" or "second" may explicitly or implicitly include one or more of those features. In the description of this utility model, unless otherwise stated, "multiple" means two or more.

[0031] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "connected" and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0032] The following is for reference. Figures 1 to 4 This invention describes a temperature measuring cookware gasket and an electromagnetic heating device provided according to embodiments of the present invention.

[0033] like Figures 1 to 4 As shown, the temperature-measuring cookware gasket according to the first aspect of this utility model can be used with an induction cooker. The function of the temperature-measuring cookware gasket is to support the cookware and collect the real-time temperature of the cookware, feeding it back to the induction cooker. The temperature-measuring cookware gasket of this embodiment can accurately measure the temperature of the cookware and has the advantages of unique design, practicality and reliability, low failure rate and high safety in use.

[0034] The structure of the temperature measuring cookware gasket includes a gasket body 100, a temperature sensing element 300, a temperature sensor 600, an electrically insulating and heat-conducting layer 500, and a communication component.

[0035] The gasket body 100 has a first surface and a second surface, wherein the first surface and the second surface are arranged vertically opposite each other. In this embodiment, the second surface is located above the first surface. The function of the first surface is to be laid on the induction cooker; specifically, when the gasket body 100 is placed on the induction cooker, the first surface of the gasket body 100 can directly contact the cooktop surface of the induction cooker. The function of the second surface is to support the cookware.

[0036] The gasket body 100 has a receiving cavity and an opening structure 110. The receiving cavity serves to provide space for the installation of the temperature probe 300, the temperature sensor 600, the electrically insulating and thermally conductive layer 500, and the communication components. The opening structure 110 is interconnected with the receiving cavity, and there are multiple opening structures 110, which are evenly distributed circumferentially on the second surface.

[0037] It is understood that the thickness and shape of the gasket body 100 can be selected according to actual needs, and the shape and size of the accommodating cavity can be designed according to the temperature probe 300, temperature sensor 600, electrically insulating and heat-conducting layer 500, and communication components. The shape and size of the opening structure 110 are set according to the shape and size of the temperature probe 300, and are not specifically limited here. The gasket body 100 can be made of a heat-resistant, non-thermal-conducting material such as silicone.

[0038] Multiple temperature sensors 300 are provided, and the number of temperature sensors 300 is the same as the number of opening structures 110. The multiple temperature sensors 300 are arranged in a one-to-one correspondence with the multiple opening structures 110, meaning that one temperature sensor 300 is provided at each opening structure 110. The temperature sensors 300 are fixedly connected to the gasket body 100, for example, by adhesive bonding or screw connection. Furthermore, the temperature sensors 300 protrude from the opening structures 110 on the gasket body 100. The function of the temperature sensors 300 is to support the cookware and sense the temperature of the bottom of the pot.

[0039] Understandably, when the cookware is placed on the gasket body 100, the protruding temperature probe 300 can directly contact the bottom of the cookware and provide strong support. Simultaneously, the temperature probe 300, with its excellent thermal conductivity, can quickly absorb and conduct heat from the bottom of the cookware. The number of temperature probes 300 can be selected according to actual needs. The contact area between the temperature probe 300 and the bottom of the cookware, as well as the size of the protrusion of the temperature probe 300 from the opening structure 110, can be designed according to actual needs and are not specifically limited here. In some examples, the protrusion size of the temperature probe 300 is designed to be relatively large, so that when the temperature probe 300 provides support to the cookware, the bottom of the cookware does not contact the second surface of the gasket body 100. In other examples, the protrusion size of the temperature probe 300 is designed to be relatively small, so that when the bottom of the cookware directly contacts the temperature probe 300, the bottom of the cookware also contacts the second surface of the gasket body 100.

[0040] In this embodiment, the temperature sensing element 300 is a copper sheet. This design gives the temperature sensing element 300 a high thermal conductivity, enabling rapid transfer of a large amount of heat. Moreover, when the temperature sensing element 300 is made of a copper sheet with a certain deformation capacity, the copper sheet is easy to undergo elastic deformation under the external force of the cookware. At the same time, the copper sheet is more likely to deform after absorbing the heat of the cookware, which enables the copper sheet to make more effective contact with the bottom of the cookware and better sense the temperature of the bottom of the cookware.

[0041] In this embodiment, three temperature sensing elements 300 are provided. The gasket body 100 includes a protrusion 101 and a circular plate 102, wherein the protrusion 101 is integrally formed with the circular plate 102, the circular plate 102 has a central axis extending in the vertical direction, the protrusion 101 is located on the outer side of the circular plate 102 and is fixedly connected to the outer edge of the circular plate 102, and the upper surface of the circular plate 102 is lower than the upper surface of the protrusion 101. The opening structure 110 and the temperature sensing element 300 are both provided on the circular plate 102, and all the opening structures 110 are evenly arranged in a circle around the central axis of the circular plate 102, that is, the three opening structures 110 are arranged at intervals of 120°, and the temperature sensing element 300 is correspondingly provided at the opening structure 110.

[0042] At least a portion of the temperature sensing element 300 has a temperature sensor 600 located below it. The temperature sensor 600 is housed within the receiving cavity of the gasket body 100, and there is a certain vertical distance between the temperature sensor 600 and the temperature sensing element 300, meaning the temperature sensor 600 does not directly contact the temperature sensing element 300. In this embodiment, the temperature sensor 600 is a semiconductor temperature sensor. Because semiconductor temperature sensors have advantages such as small size, light weight, high sensitivity, small measurement error, low power consumption, high reliability, and long lifespan, the temperature sensor 600 can quickly and accurately detect minute temperature changes at the bottom of the pot, achieving precise temperature measurement. Simultaneously, it allows for a smaller thickness design for the temperature-sensing pot gasket, resulting in lower cost and energy consumption.

[0043] It is understandable that in some examples, the number of temperature sensors 600 is the same as the number of temperature probes 300. In other examples, the number of temperature sensors 600 is less than the number of temperature probes 300. In this embodiment, at least two temperature sensors 600 are provided, which allows for temperature detection at different locations on the bottom of the pot. Of course, it is not excluded that in other embodiments, only one temperature sensor 600 is provided, and it is arranged vertically opposite one of the temperature probes 300.

[0044] An electrically insulating and thermally conductive layer 500 is disposed between the temperature sensing element 300 and the temperature sensor 600, and is thermally connected to both the temperature sensing element 300 and the temperature sensor 600. It is understood that the electrically insulating and thermally conductive layer 500 can be made of electrically insulating and thermally conductive materials such as alumina or aluminum nitride. The electrically insulating and thermally conductive layer 500 is sheet-like, and when viewed vertically, it can be circular, square, or other shapes. The thickness of the electrically insulating and thermally conductive layer 500 can be set according to actual needs and is not specifically limited here.

[0045] The electrically insulating and heat-conducting layer 500 has high thermal conductivity and good electrical insulation. Therefore, when the upper surface of the electrically insulating and heat-conducting layer 500 is in contact with the temperature probe 300 and the lower surface of the electrically insulating and heat-conducting layer 500 is in contact with the temperature measuring end of the temperature sensor 600, the temperature probe 300 can transfer the heat of the pot to the temperature measuring end of the temperature sensor 600 through the electrically insulating and heat-conducting layer 500, so that the temperature sensor 600 can successfully collect the bottom temperature data of the pot and feed back the real-time bottom temperature data to the induction cooker. At the same time, the eddy currents generated by the pot may flow to the temperature probe 300, but the electrically insulating and heat-conducting layer 500 can play an electrical insulation role, effectively avoiding the problem of potential difference or conductive path forming between the pot and the temperature sensor 600 due to the eddy currents flowing to the temperature sensor 600, thus preventing the occurrence of conductivity.

[0046] The projected area of ​​the electrically insulating and heat-conducting layer 500 in the vertical direction is greater than or equal to the projected area of ​​the temperature sensor 600 in the vertical direction. The projected area of ​​the electrically insulating and heat-conducting layer 500 in the vertical direction is less than or equal to the projected area of ​​the temperature probe 300 in the vertical direction. In this embodiment, the projected area in the vertical direction of the electrically insulating and heat-conducting layer 500 is larger than the temperature measuring end of the temperature sensor 600 and smaller than that of the temperature probe 300. The thickness of the electrically insulating and heat-conducting layer 500 is less than the thickness of the temperature probe 300. It can be understood that through this design, the temperature probe 300 can quickly transfer the heat absorbed from the bottom of the pot to the electrically insulating and heat-conducting layer 500, and the electrically insulating and heat-conducting layer 500 can quickly conduct the heat to the temperature measuring end of the temperature sensor 600. At the same time, it ensures that the contact area between the temperature probe 300 and the bottom of the pot is large enough so that the temperature probe 300 can effectively support the pot.

[0047] The communication component is located in the receiving cavity of the gasket body 100, and is electrically connected to the temperature sensor 600. The temperature sensor 600 can transmit the temperature data of the bottom of the pot that it collects to the communication component. The communication component is configured to communicate with the induction cooker to transmit the temperature data collected by the temperature sensor 600 to the induction cooker. This enables the induction cooker to adjust its output power according to the temperature data to achieve temperature control and prevent the pot from overheating and drying.

[0048] In this embodiment, the communication component is a wireless communication element, enabling wireless data transmission between the temperature-sensing cookware gasket and the induction cooker. Specifically, the communication component is an RF (Radio Frequency) chip. It is understood that the RF chip has analog-to-digital conversion and wireless radio frequency functions. The analog-to-digital conversion function converts the temperature data collected by the temperature sensor 600 into digital data, and the wireless radio frequency function transmits the digital temperature data to the induction cooker via wireless radio frequency technology. The communication component is located at the protrusion 101 of the gasket body 100.

[0049] Of course, in other embodiments, it is possible that the communication component is a wired communication element, enabling wired data transmission between the temperature-sensing cookware gasket and the induction cooker. The wired communication element can be a data transmission line.

[0050] In some embodiments, such as Figure 1 and Figure 4 As shown, the structure of the temperature measuring pot gasket also includes a PCB (Printed Circuit Board) assembly.

[0051] The PCB assembly 200 is housed within the receiving cavity of the gasket body 100, and both the PCB assembly 200 and the temperature sensor 600 are electrically connected to the communication component via wiring. The PCB assembly 200 is located below the temperature sensor 600, and a vertical gap 700 exists between the PCB assembly 200 and the temperature probe 300. Both the temperature sensor 600 and the electrically insulating and heat-conducting layer 500 are disposed within the vertical gap 700, and both are located at the center of the temperature probe 300. This design ensures that the heat absorbed by the temperature probe 300 is sequentially transferred from the center of the temperature probe 300 to the electrically insulating and heat-conducting layer 500 and the temperature-sensing end of the temperature sensor 600; furthermore, the presence of the vertical gap 700 allows for the elastic deformation of the temperature probe 300.

[0052] The PCB board assembly 200 includes a PCB board and a voltage regulator circuit. The communication component uses an RF chip and is mounted on the PCB board. The voltage regulator circuit, also mounted on the PCB board, provides the necessary operating voltage to the temperature sensor 600 and the communication component. In this embodiment, the bottom of the temperature sensor 600 abuts against the upper surface of the PCB board assembly 200. The temperature sensing element 300 is rectangular when viewed vertically, and L-shaped supports are provided at opposite ends of the temperature sensing element 300. These supports engage with the gasket body 100 and also abut against the upper surface of the PCB board assembly 200.

[0053] In some embodiments, the PCB board assembly 200 is electrically connected to the induction cooker via a cable, allowing the induction cooker to provide operating power to the communication components and the temperature sensor 600. In other embodiments, a built-in power supply is provided within the gasket body 100, which can be a rechargeable battery or a dry cell battery, etc. The PCB board assembly 200 is electrically connected to the built-in power supply, which can provide operating current to the communication components and the temperature sensor 600.

[0054] In some other embodiments, such as Figure 1 and Figure 4 As shown, the structure of the temperature measuring pot gasket also includes an electromagnetic induction coil 400.

[0055] The electromagnetic induction coil 400 is housed within the receiving cavity of the gasket body 100 and is electrically connected to the PCB board assembly 200. The electromagnetic induction coil 400 is configured to collect electromagnetic waves from the induction cooker and generate current to power the temperature sensor 600 and communication components. Multiple temperature sensing elements 300 are arranged circumferentially around the central axis of the electromagnetic induction coil 400.

[0056] Understandably, the electromagnetic induction coil 400 can sense the magnetic field generated by the induction cooker and generate an induced electromotive force, providing current to the PCB board assembly 200. The current flows through the PCB board assembly 200 to the communication components and temperature sensor 600, enabling the communication components and temperature sensor 600 to function normally. This design effectively utilizes the leakage magnetic energy of the induction cooker without consuming additional electrical energy, thus achieving the goal of saving energy.

[0057] In this embodiment, as Figure 1 As shown, the electromagnetic induction coil 400 is etched on the PCB board assembly 200. Specifically, copper foil is provided on the PCB board assembly 200, and the electromagnetic induction coil 400 is etched on the copper foil. In addition, the PCB board assembly 200 is etched with wires 210, which are used to electrically connect the temperature sensor 600 and the communication component.

[0058] like Figures 1 to 4 As shown, in this embodiment, the PCB board assembly 200 includes a PCB board, a voltage regulator circuit, and a rectifier circuit. The voltage regulator circuit and the rectifier circuit are disposed on the PCB board. In addition, the RF chip is also disposed on the PCB board. The rectifier circuit can rectify the electrical energy generated by the electromagnetic induction coil 400 into direct current, and the voltage regulator circuit regulates the current, enabling the communication components and the temperature sensor 600 to operate normally under the operating voltage.

[0059] Furthermore, the gasket body 100 is formed by connecting an upper housing 103 and a lower housing 104. The upper housing 103 and the lower housing 104 can be connected by screws or be integrally formed. The second surface is located on the upper housing 103, and the first surface is located on the lower housing 104. The shape of the PCB board is the same as the shape of the gasket body 100. The upper housing 103 and the lower housing 104 are fixedly connected and form a receiving cavity, in which the PCB board is disposed, and the upper housing 103 and the lower housing 104 enclose the PCB board.

[0060] In the use of the temperature-sensing cookware pad provided in the first aspect embodiment of this utility model, after the pad body 100 is placed on the surface of the induction cooker, the cookware is placed on the second surface of the pad body 100, so that all the temperature sensing elements 300 can directly contact the bottom of the cookware, providing stable support for the cookware. Moreover, the temperature sensing elements 300 can also effectively sense the temperature of the bottom of the cookware and quickly transfer the heat of the cookware to the electrically insulating heat-conducting layer 500. The electrically insulating heat-conducting layer 500 then transfers the heat of the cookware to the temperature sensor 600, enabling the temperature sensor 600 to complete the real-time temperature acquisition of the cookware. Finally, using the communication component, the temperature data collected by the temperature sensor 600 is transmitted to the induction cooker to achieve precise temperature control of the induction cooker and prevent the cookware from dry-burning.

[0061] Furthermore, by adding an electrically insulating and thermally conductive layer 500 between the temperature probe 300 and the temperature sensor 600, a barrier with current isolation is formed between the temperature probe 300 and the temperature sensor 600. Therefore, even if the cookware generates eddy currents when the induction cooker is running, it can prevent the formation of a current path between the cookware and the communication component and / or between the cookware and the circuits on the PCB board assembly 200. This ensures that the communication component and the PCB board assembly 200 can work normally, ensures that the temperature measuring cookware gasket can play an accurate temperature measuring role for a long time, reduces the failure rate, and improves the safety performance.

[0062] In some embodiments, the structure of the temperature-measuring cookware gasket also includes an LED light assembly.

[0063] The LED light assembly is fixedly connected to the gasket body 100 and is disposed on the second surface of the gasket body 100. The LED light assembly is electrically connected to the communication component, which is also configured to control the brightness of the LED light assembly to increase according to the increase of the power of the induction cooker or the increase of the temperature data collected by the temperature sensor 600, thereby providing the user with a light indication of the power of the induction cooker.

[0064] Understandably, in some examples, the induction cooker communicates with the communication component, transmitting its output power data to the component. The communication component then controls the brightness of the LED assembly to increase when the induction cooker's power increases and to decrease when the induction cooker's power decreases. In other examples, the communication component controls the brightness of the LED assembly to increase when the temperature data collected by the temperature sensor 600 increases and to decrease when the temperature data decreases.

[0065] The LED light assembly includes at least one LED. The LED light assembly can be disposed on the upper surface of the protrusion 101 of the gasket body 100. In this embodiment, the LED light assembly includes six LEDs. The LEDs can be monochrome LEDs or multicolor LEDs. When multicolor LEDs are used, the temperature range can be graded, and the LEDs will emit different colors according to the temperature level of the collected real-time temperature data.

[0066] In some embodiments, the LED light assembly includes multiple LEDs disposed within a receiving cavity, and these LEDs are evenly arranged circumferentially around the central axis of the electromagnetic induction coil 400. Correspondingly, the gasket body 100 is provided with multiple light-transmitting plates located on a second surface, allowing the LEDs to emit light upwards, which passes through the light-transmitting plates and is emitted outwards. The light can illuminate the bottom of the cookware, thus enabling the LEDs to emit simulated flame light, allowing the user to visually observe the intensity of the light emitted by the LEDs, thereby realistically simulating the changes in the induction cooker's heat and indicating the changes in the induction cooker's output power.

[0067] like Figures 1 to 4 As shown, the electromagnetic heating device according to the second aspect of the present invention includes an induction cooker and a temperature measuring pot pad as described in the first aspect embodiment.

[0068] Understandably, the induction cooker is equipped with a communication unit that can communicate with the communication component in the temperature-sensing cookware gasket to achieve data transmission. When the communication component uses an RF chip, the induction cooker's communication unit can also be an RF chip to complete the wireless data transmission between the induction cooker and the temperature-sensing cookware gasket. The temperature-sensing cookware gasket can be detachably installed on the induction cooker's surface.

[0069] In the use of the electromagnetic heating device provided in the second aspect embodiment of this utility model, when the induction cooker directly heats the pot, a temperature measuring pot pad is placed between the pot and the surface of the induction cooker. The temperature measuring pot pad accurately collects the bottom temperature data of the pot and transmits it to the induction cooker. This helps to achieve precise temperature control of the induction cooker based on the bottom temperature data and avoids the problem of the pot burning dry.

[0070] Simultaneously, during the acquisition of pot bottom temperature data, an electrically insulating and heat-conducting layer 500 is added between the temperature sensing element 300 and the temperature sensor 600. This allows the heat from the pot to be transferred sequentially through the temperature sensing element 300 and the electrically insulating and heat-conducting layer 500 to the temperature sensor 600, enabling the temperature sensor 600 to acquire the pot bottom temperature data. Furthermore, when eddy currents are generated in the pot, the electrically insulating and heat-conducting layer 500 effectively prevents the eddy currents generated by the pot from flowing through the temperature sensing element 300 to the temperature sensor 600 and the communication component. This prevents damage to the communication component due to a current path between the pot and the communication component, thus preventing the temperature-sensing pot gasket from malfunctioning.

[0071] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0072] Although embodiments of the present invention have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the claims and their equivalents.

Claims

1. A temperature measuring pot gasket, characterized by, The temperature measuring pot gasket comprises: a gasket body having a first surface for laying on an electromagnetic oven and a second surface arranged oppositely to the first surface, the gasket body being provided with a receiving cavity and a plurality of opening structures communicating with the receiving cavity, the plurality of opening structures being uniformly arranged on the second surface in a circle; a plurality of temperature sensing pieces arranged one by one with the plurality of opening structures, the temperature sensing pieces being fixedly connected to the gasket body and protruding from the opening structures for supporting a pot and sensing the temperature of the bottom of the pot; a temperature sensor arranged in the receiving cavity, the temperature sensor being arranged below at least part of the temperature sensing pieces; an electrically insulating and heat conducting layer arranged between the temperature sensing pieces and the temperature sensor and being in heat conducting connection with the temperature sensing pieces and the temperature sensor respectively; a communication component arranged in the receiving cavity, the communication component being configured to be communicatively connected with the electromagnetic oven to transmit the temperature data collected by the temperature sensor to the electromagnetic oven.

2. The temperature measuring pot gasket according to claim 1, wherein Further comprising a PCB assembly arranged in the receiving cavity and being in electrical connection with the temperature sensor and the communication component, the PCB assembly being arranged below the temperature sensor, the PCB assembly and the temperature sensing pieces having an up-down gap therebetween, the temperature sensor and the electrically insulating and heat conducting layer being arranged in the up-down gap and being located at the middle position of the temperature sensing pieces.

3. The temperature measuring pot gasket according to claim 2, wherein The projection area of the electrically insulating and heat conducting layer in the up-down direction is greater than or equal to the projection area of the temperature sensor in the up-down direction; and / or, the thickness of the electrically insulating and heat conducting layer is less than the thickness of the temperature sensing pieces.

4. The temperature measuring pot gasket of claim 2, wherein, The temperature sensing pieces are copper sheets; and / or, the temperature sensing pieces are three in number, and the temperature sensor is at least two in number.

5. The temperature measuring pot gasket of claim 2, wherein, Further comprising an electromagnetic induction coil arranged in the receiving cavity and being in electrical connection with the PCB assembly, the electromagnetic induction coil being configured to collect electromagnetic waves of the electromagnetic oven and generate an electric current for powering the temperature sensor and the communication component, the plurality of temperature sensing pieces being arranged uniformly around the central axis of the electromagnetic induction coil in a circle.

6. The temperature measuring pot gasket according to claim 5, wherein The electromagnetic induction coil is etched on the PCB assembly, and the PCB assembly is etched with wires for electrically connecting the temperature sensor and the communication component.

7. The temperature measuring pot gasket according to claim 2 or 5, wherein Further comprising an LED lamp assembly fixedly connected to the gasket body and arranged on the second surface, the LED lamp assembly being in electrical connection with the communication component, the communication component being further configured to control the brightness of the LED lamp assembly to increase according to the increase of the power of the electromagnetic oven or the temperature data collected by the temperature sensor.

8. The temperature probe gasket of claim 1, wherein, The temperature sensor is a semiconductor temperature sensor; and / or, the communication component is a wireless communication element or a wired communication element.

9. The temperature probe gasket of claim 1, wherein, The communication component is an RF chip.

10. An electromagnetic heating apparatus, characterized by, The temperature measuring pot gasket is used in combination with an electromagnetic oven.

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