Semiconductor refrigeration module
By using a dual-motor driven impeller and thermal insulation design in the semiconductor refrigeration module, the problems of complex structure and high cost in the prior art are solved, achieving low-cost and high-efficiency refrigeration effect, and facilitating installation and maintenance.
Patent Information
- Application Number
- CN202520133246.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-01-20
- Publication Date
- 2025-12-30
- Estimated Expiration
- 2035-01-20
AI Technical Summary
Existing semiconductor cooling modules require fans on both the heat dissipation and cooling sides, resulting in complex structures and high costs, which limits their widespread use.
It uses a dual-head motor to drive two impellers, which promote airflow in two separate air ducts. One air duct delivers cold air, and the other delivers hot air. Only one motor is needed, and the addition of a heat insulation layer and heat insulation ring simplifies the structure and reduces costs.
A simple and low-cost semiconductor cooling module has been developed, which is suitable for widespread use, has high heat transfer efficiency, and is easy to install and maintain.
Smart Images
Figure CN223741028U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of refrigeration technology, and in particular to a semiconductor refrigeration module. Background Technology
[0002] Semiconductor cooling modules are well-suited for portable, small-scale cooling devices due to their advantages such as small size and quiet, vibration-free operation. However, existing semiconductor cooling modules require fans on both the heat dissipation and cooling sides, resulting in a complex structure and high cost, which hinders their widespread adoption. Utility Model Content
[0003] The present invention aims to solve at least one of the technical problems existing in the prior art. To this end, the present invention proposes a semiconductor cooling module.
[0004] The semiconductor cooling module according to an embodiment of the present invention includes:
[0005] The outer casing has two air ducts inside, with an air inlet and an air outlet at each end of the air ducts, and a partition between the two air ducts, with a first through hole in the partition.
[0006] A fan assembly includes two impellers and a dual-head motor disposed between the two impellers. The two impellers are respectively disposed in two air ducts, and the dual-head motor is used to drive the two impellers.
[0007] The cooling assembly includes a cooling plate disposed in the first through hole, with heat sinks contacting both sides of the cooling plate, and the two heat sinks respectively disposed in the two air ducts.
[0008] The semiconductor cooling module according to the embodiments of this utility model has at least the following technical effects: when in use, one side of the cooling chip absorbs heat and the other side releases heat. The dual-head motor can drive two impellers to rotate, promoting the flow of air in the two air ducts, so that one air duct sends out cold air to achieve the purpose of cooling, and the other air duct sends out hot air for heat dissipation; only one dual-head motor is required, the structure is simple, the cost is low, which is conducive to the promotion and use of semiconductor cooling modules.
[0009] According to some embodiments of the present invention, the partition includes two heat insulation layers and a skeleton layer disposed between the two heat insulation layers.
[0010] According to some embodiments of this utility model, the skeleton layer is a plastic component.
[0011] According to some embodiments of this utility model, the heat insulation layer is heat insulation cotton.
[0012] According to some embodiments of the present invention, one of the heat insulation layers is provided with a clearance hole, and the main body of the dual-head motor is disposed in the clearance hole and connected to the skeleton layer.
[0013] According to some embodiments of this utility model, the partition is arranged horizontally, the two air ducts are respectively located on the upper and lower sides of the partition, the two impellers are centrifugal impellers, and the axial direction of the dual-head motor and the axial direction of the two impellers are both vertical.
[0014] According to some embodiments of the present invention, a heat insulation ring is provided in the first through hole, the heat insulation ring is sleeved between the inner wall of the first through hole and the cooling chip, and the heat insulation ring is disposed between the two heat sinks.
[0015] According to some embodiments of the present invention, the outer shell includes a bottom shell and an upper cover disposed on the upper side of the bottom shell, the upper cover and the bottom shell are detachably connected, and the partition is disposed between the upper cover and the bottom shell.
[0016] According to some embodiments of the present invention, the semiconductor cooling module further includes an annular mounting flange, which is fitted onto the outside of the housing. The housing has an annular protrusion, and the mounting flange is detachably connected to the protrusion.
[0017] According to some embodiments of this utility model, the protruding edge is provided on the bottom shell, and the horizontal projection of the top cover is provided on the inner side of the mounting flange.
[0018] Additional aspects and advantages of this invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description
[0019] The above and / or additional aspects and advantages of this utility model will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which:
[0020] Figure 1 This is a three-dimensional structural schematic diagram of the semiconductor cooling module according to an embodiment of the present utility model;
[0021] Figure 2 This is a cross-sectional view of the semiconductor cooling module according to an embodiment of the present invention;
[0022] Figure 3 This is an exploded structural diagram of the semiconductor cooling module according to an embodiment of the present invention;
[0023] In the attached image:
[0024] 101-Top cover; 102-Bottom shell; 103-Air inlet; 104-Exhaust outlet; 110-Mounting flange; 111-Raised edge; 120-Partition plate; 121-Insulation layer; 122-Frame layer; 200-Dual-head motor; 210-Impeller; 300-Refrigeration element; 310-Radiator; 320-Insulation ring. Detailed Implementation
[0025] The embodiments of this utility model are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this utility model, and should not be construed as limiting this utility model.
[0026] In the description of this utility model, it should be understood that the directional descriptions, such as up, down, front, back, left, right, etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. Furthermore, "several" means one or more, "multiple" means two or more, "greater than," "less than," "exceeding," etc., are understood to exclude the stated number, while "above," "below," "within," etc., are understood to include the stated number. If "first" or "second" is used in the description, it is only for the purpose of distinguishing technical features and should not be construed as indicating relative importance or implicitly indicating the number of indicated technical features or the order of the indicated technical features.
[0027] In the description of this utility model, unless otherwise explicitly defined, terms such as "setting," "installation," and "connection" should be interpreted broadly, and those skilled in the art can reasonably determine the specific meaning of the above terms in this utility model in conjunction with the specific content of the technical solution.
[0028] The following is for reference. Figures 1 to 3 This invention describes a semiconductor cooling module according to an embodiment of the present invention.
[0029] The semiconductor cooling module of this utility model includes a housing, a fan assembly, and a cooling assembly.
[0030] The outer casing contains two air ducts, referred to as the upper channel and the lower channel. The upper channel is located above the lower channel. Each end of the air duct has an air inlet 103 and an air outlet 104. Each air duct has its own air inlet 103 and air outlet 104. The air inlet 103 of the upper channel is located at its left end, and the air outlet 104 of the upper channel is located at its right end. The air inlet 103 of the lower channel is located at its left end, and the air outlet 104 of the lower channel is located at its right end. A partition 120 is provided between the two air ducts. The partition 120 is the bottom wall of the upper channel and the top wall of the lower channel. The partition 120 has a first through hole that penetrates the partition 120 vertically.
[0031] The fan assembly is used to promote airflow within two air ducts. The fan assembly includes two impellers 210 and a dual-head motor 200 disposed between the two impellers 210. The dual-head motor 200 has two output shafts to drive two independent loads. Generally, the two output shafts of the dual-head motor 200 are opposite to each other and coaxial. The dual-head motor 200 is a conventional component in the art and can be purchased directly, so its specific structure will not be described in detail here. The two impellers 210 are respectively disposed within the two air ducts, and the two output shafts of the dual-head motor 200 are respectively connected to the two impellers 210. The dual-head motor 200 is used to drive the two impellers 210. The two impellers 210 are referred to as the upper impeller and the lower impeller, respectively. The upper impeller is disposed within the upper channel, and the lower impeller is disposed within the lower channel.
[0032] The cooling assembly includes a cooling chip 300 disposed in the first through hole. The cooling chip 300 is arranged horizontally. Heat sinks 310 are in contact with both sides of the cooling chip 300. The two heat sinks 310 are respectively abutted against the upper and lower sides of the cooling chip 300 and are respectively disposed in two air ducts.
[0033] In use, one side of the cooling chip 300 absorbs heat and the other side releases heat. The dual-head motor 200 drives the two impellers 210 to rotate, promoting the airflow in the two air ducts. One air duct delivers cold air to achieve the purpose of cooling, while the other air duct delivers hot air for heat dissipation. Only one dual-head motor is required, resulting in a simple structure and low cost, which is conducive to the widespread use of semiconductor cooling modules. In addition, the two heat sinks 310 are in direct contact with the cooling chip 300, eliminating the need for additional heat-conducting components. This simplifies the assembly process, saves costs, and improves heat transfer efficiency to enhance energy efficiency.
[0034] In some embodiments of this utility model, the partition 120 includes two heat insulation layers 121 and a skeleton layer 122 disposed between the two heat insulation layers 121. This can block heat transfer between the two air ducts to improve the cooling effect, and the partition 120 has high strength, is not easily damaged, and is easy to assemble and maintain.
[0035] In some embodiments of this invention, the skeleton layer 122 is a plastic component. This results in lower cost and easier manufacturing.
[0036] In some embodiments of this invention, the insulation layer 121 is insulation cotton. Insulation cotton is inexpensive, easy to install and cut, and suitable as the insulation layer 121.
[0037] In some embodiments of this utility model, one of the heat insulation layers 121 is provided with a clearance hole, and the main body of the dual-head motor 200 is disposed in the clearance hole and connected to the skeleton layer 122. The two heat insulation layers 121 are respectively referred to as the upper cotton layer and the lower cotton layer, which are respectively disposed on the upper and lower sides of the skeleton layer 122. The clearance hole is disposed in the lower cotton layer. Figure 2 The main body of the dual-head motor 200 is located on the lower side of the frame layer 122. One output shaft of the dual-head motor 200 extends upward and passes through the frame layer 122 and the upper cotton layer before connecting with the upper wheel. The other output shaft of the dual-head motor 200 extends downward and connects with the lower wheel. By mounting the main body of the dual-head motor 200 on the frame layer 122, the structure is relatively stable and not easy to loosen or fall off.
[0038] In some embodiments of this utility model, the partition 120 is arranged horizontally, two air ducts are respectively arranged on the upper and lower sides of the partition 120, both impellers 210 are centrifugal impellers 210, and the axial direction of the dual-head motor 200 and the axial direction of the two impellers 210 are both vertical. (Refer to...) Figure 3 The upper channel extends from left to right. The air inlet 103 of the upper channel is located on the top wall of the housing and above the upper wheel. The heat sink 310 inside the upper channel is located to the right of the upper wheel. The exhaust port 104 of the upper channel is located at the right end of the upper channel. The lower channel extends from left to right. The air inlet 103 of the lower channel is located on the lower wall of the housing and below the lower wheel. The heat sink 310 inside the lower channel is located to the right of the lower wheel. The exhaust port 104 of the lower channel is located at the right end of the lower channel. This structure is reasonable and compact. The vertical dimension, i.e., the thickness dimension, of the semiconductor cooling module is small, which makes it easy to install on the side wall of the container that needs to be cooled, and is conducive to its widespread use.
[0039] In some embodiments of this utility model, a heat insulation ring 320 is provided in the first through hole, the heat insulation ring 320 is sleeved between the inner wall of the first through hole and the cooling chip 300, and the heat insulation ring 320 is disposed between the two heat sinks 310. Both insulation layers 121 have a certain thickness to achieve a better heat insulation effect, making the overall thickness of the partition 120 greater than the thickness of the cooling plate 300. Therefore, in this embodiment, the upper cotton layer is fitted over the outside of the radiator 310 in the upper channel, and the lower cotton layer is fitted over the outside of the radiator 310 in the lower channel, so that the radiator 310 can fit tightly against the cooling plate 300. In addition, it can be understood that in order to obtain a better heat dissipation effect, the front-to-back and lateral dimensions of the radiator 310 are larger than those of the cooling plate 300, and the edge of the radiator 310 protrudes beyond the edge of the cooling plate 300, resulting in a cavity between the two radiators 310, which is not conducive to blocking the heat transfer between the two radiators 310. In this embodiment, the purpose of blocking the heat transfer between the two radiators 310 is achieved by setting the insulation ring 320.
[0040] In some embodiments of this utility model, the outer shell includes a bottom shell 102 and an upper cover 101 disposed on the upper side of the bottom shell 102. The upper cover 101 and the bottom shell 102 are detachably connected, and a partition 120 is disposed between the upper cover 101 and the bottom shell 102. The upper cover 101 and the bottom shell 102 can be connected by bolts, which facilitates disassembly and assembly. Of course, the upper cover 101 and the bottom shell 102 can also be detachably connected by snap-fit, threaded connection, or other suitable means.
[0041] In some embodiments of this utility model, the semiconductor cooling module further includes an annular mounting flange 110, see reference. Figure 1 The mounting flange 110 is fitted onto the outside of the outer casing, which has an annular raised edge 111. The mounting flange 110 and the raised edge 111 are detachably connected. The mounting flange 110 and the raised edge 111 are connected by bolts. In use, a mounting hole can be made in the wall of the container that needs to be refrigerated. The mounting flange 110 and the outer casing are separated, and the outer casing is inserted into the mounting hole, so that the edge of the mounting hole is located between the mounting flange 110 and the raised edge 111. Then, the mounting flange 110 is connected to the raised edge 111, thus completing the installation of the semiconductor refrigeration module into the container that needs to be refrigerated.
[0042] In some embodiments of this utility model, the protruding edge 111 is provided on the bottom shell 102, and the horizontal projection of the top cover 101 is provided on the inner side of the mounting flange 110. In this way, the disassembly and assembly of the mounting flange 110 and the disassembly and assembly of the top cover 101 will not affect each other, and the top cover 101 can be removed without removing the mounting flange 110 for inspection and maintenance of the fan assembly and refrigeration assembly.
[0043] The preferred embodiments of the present invention have been described in detail above, but the present invention is not limited to the embodiments. Those skilled in the art can make various equivalent modifications or substitutions without departing from the spirit of the present invention, and these equivalent modifications or substitutions are all included within the scope defined by the claims of this application.
Claims
1. A semiconductor refrigeration module, characterized by The utility model relates to a refrigeration device, including: A shell is internally provided with two air ducts, both ends of the air ducts are respectively provided with air inlet and air outlet, the air ducts are provided with a partition plate between two, the partition plate is provided with a first through hole; A fan assembly includes two impellers and a double-head motor provided between the two impellers, the two impellers are respectively provided in the two air ducts, and the double-head motor is used to drive the two impellers; A refrigeration assembly includes a refrigeration fin provided in the first through hole, both sides of the refrigeration fin are in contact with heat sinks, and the two heat sinks are respectively provided in the two air ducts.
2. The semiconductor refrigeration module of claim 1, wherein: The partition plate includes two heat insulation layers and a framework layer provided between the two heat insulation layers.
3. The semiconductor refrigeration module of claim 2, wherein: The framework layer is a plastic component.
4. The semiconductor refrigeration module of claim 2, wherein: The heat insulation layer is heat insulation cotton.
5. The semiconductor refrigeration module of claim 2, wherein: One of the heat insulation layers is provided with a relief hole, and the main body of the double-head motor is provided in the relief hole and connected with the framework layer.
6. The semiconductor refrigeration module of claim 1, wherein: The partition plate is transversely arranged, the two air ducts are respectively arranged on the upper side and the lower side of the partition plate, the two impellers are both centrifugal impellers, and the axial direction of the double-head motor and the axial direction of the two impellers are both vertical.
7. The semiconductor refrigeration module of claim 1, wherein: The first through hole is provided with a heat insulation ring, the heat insulation ring is sleeved between the inner wall of the first through hole and the refrigeration fin, and the heat insulation ring is arranged between the two heat sinks.
8. The semiconductor refrigeration module of claim 1, wherein: The shell includes a bottom shell and an upper cover arranged on the upper side of the bottom shell, the upper cover and the bottom shell are detachably connected, and the partition plate is arranged between the upper cover and the bottom shell.
9. The semiconductor refrigeration module of claim 8, wherein: It also includes a mounting flange in the form of a ring, the mounting flange is sleeved on the outer side of the shell, the shell is provided with a convex edge in the form of a ring, and the mounting flange is detachably connected with the convex edge.
10. The semiconductor refrigeration module of claim 9, wherein: The convex edge is arranged on the bottom shell, and the horizontal projection of the upper cover is arranged on the inner side of the mounting flange.