High-precision Hall sensor

By introducing a moisture-proof and heat dissipation mechanism into the Hall sensor, the problems of inconvenient disassembly and heat accumulation caused by sealing are solved, realizing convenient disassembly and efficient heat dissipation, and improving the service life and measurement accuracy of the sensor.

CN223742593UActive Publication Date: 2025-12-30CHUANDONG MAGNETIC ELECTRONICS CO LTD
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Patent Information

Application Number
CN202423061828.6
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-12-11
Publication Date
2025-12-30
Estimated Expiration
2034-12-11

AI Technical Summary

Technical Problem

Existing Hall effect sensors suffer from poor sealing, making disassembly and assembly inconvenient, and the drying plate cannot be replaced. This also hinders heat dissipation, affecting the sensor's lifespan and accuracy.

Method used

The design incorporates a moisture-proof mechanism and a heat dissipation mechanism, including a slide, a slide frame, a silica gel drying plate, a heat dissipation coil, and a miniature semiconductor cooler. The design allows for easy assembly and disassembly via a snap-fit ​​mechanism, the silica gel drying plate is replaceable, and the miniature pump and cooler provide effective heat dissipation.

Benefits of technology

The moisture resistance and heat dissipation of the Hall sensor have been improved, the ease of disassembly and assembly has been enhanced, the service life has been extended, and the measurement accuracy and reliability have been improved.

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Abstract

The utility model relates to the technical field of Hall sensors, and particularly discloses a high-precision Hall sensor which comprises a base, a protection box is fixedly installed in the middle of the top of the base, a moisture-proof mechanism is movably installed in the middle of the upper end in the protection box, and a sealing cover is fixedly installed at the front end of the moisture-proof mechanism. A clamping mechanism is fixedly installed at the upper end of the front face of the sealing cover, the sealing cover is connected with the protection box through the clamping mechanism, a heat dissipation mechanism is fixedly installed at the top of the protection box, a pressing plate is pressed through the clamping mechanism to enable a pushing shaft to move downwards, a movable block is driven to slide, a linkage rod and a linkage plate are in rotary linkage, and a limiting frame is pushed to move outwards. During installation, a new silica gel drying plate is inserted into the sliding frame, the sliding frame is inserted into the sliding groove, the limiting spring enables the limiting block to be inserted into the limiting hole for limiting, and use convenience is improved.
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Description

Technical Field

[0001] This utility model relates to the field of Hall sensor technology, and in particular to a high-precision Hall sensor. Background Technology

[0002] Hall effect sensors are important sensors based on the Hall effect. The Hall effect refers to the phenomenon where, when a current flows through a semiconductor perpendicular to an external magnetic field, charge carriers are deflected, generating an additional electric field perpendicular to both the current and the magnetic field, resulting in a potential difference across the semiconductor. Hall effect sensors are characterized by high accuracy, high reliability, and rapid response. They are non-contact measurements, causing no wear or interference to the measured object. They are also small, lightweight, and low-power, operating stably and unaffected by environmental factors. They accurately measure changes in magnetic fields and react quickly. In the automotive field, they can be used to measure vehicle speed, engine speed, and wheel speed. For example, in electronic ignition systems, they can accurately detect engine speed and phase to control ignition timing. In industrial automation, they can measure motor speed and position detection, providing reliable solutions for various measurement and control tasks. (Publication number: "CN") Chinese patent 212780963U discloses a moisture-proof Hall sensor, which includes a mounting plate. A protective shell is fixedly mounted on the top of the mounting plate. A Hall sensor body is located inside the cavity of the protective shell. Pins are located on the right side of the Hall sensor body. A sealing plate is located on the right side of the cavity of the protective shell. A fixing plate is located at the right end of the protective shell. A first through hole is opened on the sealing plate. A second through hole is opened on both sides of the fixing plate. A sealing cover is located on the left side of the protective shell. A clamping plate is connected to the right side of the sealing cover by a compression spring. The clamping plate is located at the left end of the protective shell. Guide strips are symmetrically arranged on the inner wall of the protective shell. Guide grooves are opened on both sides of the Hall sensor body. The guide grooves are slidably connected to the guide strips to facilitate the installation of the Hall sensor. The sealing cover is sealed at the pin wire passage to prevent moisture from entering the protective shell through the pins, thereby improving the moisture resistance of the Hall sensor body.

[0003] While the aforementioned device possesses a certain degree of sealing performance during use, its internal sensors are inconvenient to disassemble and repair quickly, and its internal drying plate cannot be replaced. Once the drying plate is saturated, it obviously cannot achieve a drying effect. Furthermore, its enclosed and sealed design means that the heat generated inside the sensor cannot dissipate during operation, and the accumulated temperature during use can easily lead to a high sensor temperature, thus affecting the overall use of the sensor. Therefore, it is evident that the existing technology has certain defects and shortcomings, and needs to be improved. Utility Model Content

[0004] The purpose of this invention is to provide a high-precision Hall sensor to solve the problems mentioned in the background art.

[0005] To achieve the above objectives, this utility model provides a high-precision Hall sensor, including a base, a protective box fixedly installed at the top center of the base, a moisture-proof mechanism movably installed in the upper center of the protective box, a sealing cover fixedly installed at the front end of the moisture-proof mechanism, a clamping mechanism fixedly installed at the upper front of the sealing cover, the sealing cover being connected to the protective box via the clamping mechanism, a heat dissipation mechanism fixedly installed at the top of the protective box, through holes opened in the rear center of the protective box and the middle of the sealing cover, a Hall sensor body slidably connected inside the protective box, a pin fixedly installed through the through hole at the rear end of the Hall sensor body, a detection probe at the front end of the Hall sensor body passing through the through hole located in the middle of the sealing cover, a heat dissipation end of the heat dissipation mechanism covering the outer surface of the Hall sensor body, and sealing gaskets fitted at both ends of the Hall sensor body, the outer side of the sealing gaskets being fitted and connected to the inner wall of the through hole.

[0006] Furthermore, the moisture-proof mechanism includes a chute, which is located in the middle of the top of the protective box. A sliding frame is slidably connected inside the chute. The front end of the sliding frame is fixedly connected to the upper back of the sealing cover. A silica gel drying plate is slidably connected inside the sliding frame.

[0007] Furthermore, mounting holes are provided at all four corners of the base, and the mounting holes are countersunk holes.

[0008] Furthermore, the mounting mechanism includes a limiting hole and a front rail. The front rail is fixedly installed on the upper front of the sealing cover. Limiting components are fixedly installed at both ends of the front rail. A linkage component is fixedly connected to the upper front of the front rail. The limiting hole is opened at the front ends of both sides of the protective box. The outer end of the limiting component is inserted into the inner side of the slot.

[0009] Furthermore, the limiting component includes a limiting spring, which is fixedly connected at equal intervals to both ends of the front rail. A limiting frame is fixedly connected to the outer end of the limiting spring, and a limiting block is fixedly installed on the outer end of the limiting frame. The outer end of the limiting block is inserted into the inner side of the limiting hole.

[0010] Furthermore, the linkage component includes a top rail and a linkage plate. The top rail is fixedly installed at the top center of the front rail, and the linkage plate is fixedly installed at the inner end of the front of the limiting frame. A movable block is slidably connected to the inner side of the top rail, and a fixed plate is fixedly connected to the side of the movable block away from the top rail. Both ends of the fixed plate are rotatably connected to linkage rods, and the lower end of the linkage rod is hinged to the inner end of the linkage plate.

[0011] Furthermore, a push shaft is fixedly installed on the top of the movable block, and a pressing plate is fixedly installed on the top of the push shaft through the top rail.

[0012] Furthermore, the heat dissipation mechanism includes a heat dissipation coil and a cooling box. The cooling box is filled with coolant. The heat dissipation coil is fixedly installed on the inner wall of the protective box. The inner side of the heat dissipation coil is in contact with the outer surface of the Hall sensor body. A micro pump is fixedly installed on one side of the cooling box. The input of the micro pump is connected to the cooling box. The output of the micro pump is connected to the heat dissipation coil. The output of the heat dissipation coil is connected to the cooling box.

[0013] Furthermore, a miniature semiconductor cooler is fixedly installed on the top of the cooling box, and the cooling end of the miniature semiconductor cooler is located inside the cooling box. Specifically, the miniature semiconductor cooler is a miniature semiconductor cooler of model TES1-068020.

[0014] Compared with the prior art, the beneficial effects of this utility model are:

[0015] Firstly, in this utility model, the Hall sensor body is inserted into the protective box, and the sealing cover is installed at the front end of the protective box through the clamping mechanism. The Hall sensor has through holes at both ends, and the sealing gaskets in the through holes enhance the seal. The sliding frame in the sliding groove is connected to the silicone drying plate, which can absorb moisture and ensure sealing and moisture prevention. When disassembling, the clamping mechanism can be adjusted, and the sliding frame and silicone drying plate can be pulled out and replaced, which improves the convenience of use.

[0016] Secondly, in this utility model, by pressing the pressing plate through the clamping mechanism, the push shaft moves downward, causing the movable block to slide. Through the linkage rod and linkage plate, the limit frame is pushed outward, causing the limit block to disengage from the limit hole. The sealing cover and protective box are released from the limit, making it easier to disassemble and repair the sealing cover. During installation, the new silica gel drying plate is inserted into the slide frame, the slide frame is inserted into the slide groove, and the limit spring causes the limit block to be inserted into the limit hole for limitation, improving the ease of use.

[0017] Thirdly, in this utility model, when the Hall sensor body is in use, the micro pump and micro semiconductor cooler are started. The micro pump pumps coolant to circulate in the heat dissipation coil. After the Hall sensor body is installed, it is in contact with the heat dissipation coil. The heat is sent to the cooling box through the coolant. The micro semiconductor cooler cools and dissipates heat from the cooling box, so that the inside of the protective box has good sealing and cooling performance, improving heat dissipation capacity and service life. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0019] Figure 2 This is a schematic diagram of the rear view structure of this utility model;

[0020] Figure 3 This is a top view of the structure of this utility model;

[0021] Figure 4 This is a top view of the Hall sensor body in the disassembled state in this utility model;

[0022] Figure 5 This is a top-view structural diagram of the Hall sensor body in its disassembled state in this utility model;

[0023] Figure 6 This is a front view structural diagram of the disassembled mounting mechanism in this utility model;

[0024] Figure 7 This is a schematic diagram of the disassembled mounting mechanism in this utility model.

[0025] Figure 8 This is a schematic diagram of the protective box and heat dissipation mechanism in this utility model.

[0026] In the diagram: 1. Base; 2. Protective box; 3. Moisture-proof mechanism; 31. Slide groove; 32. Slide frame; 33. Silica gel drying plate; 4. Sealing cover; 5. Through hole; 6. Heat dissipation mechanism; 61. Heat dissipation coil; 62. Cooling box; 63. Miniature semiconductor cooler; 64. Miniature pump; 7. Mounting mechanism; 71. Limiting hole; 72. Front rail; 73. Limiting assembly; 731. Limiting spring; 732. Limiting frame; 733. Limiting block; 74. Linkage assembly; 741. Top rail; 742. Linkage plate; 743. Movable block; 744. Fixing plate; 745. Linkage rod; 746. Push shaft; 747. Pressing plate; 8. Hall sensor body; 9. Pin; 10. Sealing gasket; 11. Mounting hole. Detailed Implementation

[0027] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0028] Please see Figures 1-7In this embodiment of the present invention, a high-precision Hall sensor includes a base 1, a protective box 2 fixedly installed at the top center of the base 1, a moisture-proof mechanism 3 movably installed at the upper center of the protective box 2, a sealing cover 4 fixedly installed at the front end of the moisture-proof mechanism 3, a clamping mechanism 7 fixedly installed at the upper front end of the sealing cover 4, and the sealing cover 4 connected to the protective box 2 through the clamping mechanism 7. A heat dissipation mechanism 6 is fixedly installed at the top of the protective box 2. Through holes 5 are provided in the middle of the rear side of the protective box 2 and the middle of the sealing cover 4. A Hall sensor body 8 is slidably connected inside the protective box 2. A pin 9 is fixedly installed through the through hole 5 at the rear end of the Hall sensor body 8. The detection probe at the front end of the Hall sensor body 8 passes through the through hole 5 located in the middle of the sealing cover 4. The heat dissipation end of the heat dissipation mechanism 6 covers the outer surface of the Hall sensor body 8. Sealing gaskets 10 are fitted at both ends of the Hall sensor body 8. The outer side of the sealing gasket 10 is fitted to the inner wall of the through hole 5. The protective box 2 at the top of the base 1 provides a stable installation environment for the Hall sensor body 8. The internal moisture-proof mechanism 3 is conveniently connected via a sealing cap 4 and a locking mechanism 7, while the sealing gasket 10 ensures a good seal at the through-hole 5, enhancing the overall moisture-proof performance. The heat dissipation mechanism 6 covers the outer surface of the Hall sensor body 8, effectively improving heat dissipation capacity and ensuring stable operation of the sensor over a long period. This design allows the Hall sensor body 8 to avoid external interference while maintaining good working condition within the protective box 2, extending its service life, improving measurement accuracy and reliability, and adapting to various complex working environments.

[0029] Please see Figures 4-7 The moisture-proof mechanism 3 includes a slide 31, which is located in the middle of the top of the protective box 2. A sliding frame 32 is slidably connected inside the slide 31. The front end of the sliding frame 32 is fixedly connected to the upper back of the sealing cover 4. A silica gel drying plate 33 is slidably connected inside the sliding frame 32. This design allows the silica gel drying plate 33 to be flexibly installed and replaced. By sliding the sliding frame 32 within the slide 31, the silica gel drying plate 33 can be easily operated, thereby effectively absorbing moisture inside the protective box 2 and enhancing the overall moisture-proof effect.

[0030] Please see Figures 1-3 Mounting holes 11 are provided at each of the four corners of the base 1. These mounting holes 11 are countersunk holes. The countersunk hole design allows the head of the mounting screw to be recessed into the hole, resulting in a smoother and more aesthetically pleasing surface after installation. It also reduces the interference and impact of the screw head on the outside to some extent. This design facilitates the installation of the base 1 and helps to securely fix the entire device in the required position.

[0031] Please see Figures 4-7 The mounting mechanism 7 includes a limiting hole 71 and a front rail 72. The front rail 72 is fixedly installed on the upper front of the sealing cover 4. Limiting components 73 are fixedly installed at both ends of the front rail 72. A linkage component 74 is fixedly connected to the upper front of the front of the front rail 72. The limiting hole 71 is opened at the front ends of both sides of the protective box 2. The outer end of the limiting component 73 is inserted into the inner side of the slot. The limiting component 73 includes a limiting spring 731. The limiting spring 731 is fixedly connected to both ends of the front rail 72 at equal intervals. The outer end of the limiting spring 731 is fixedly connected to a limiting frame 732. A limiting block 733 is fixedly installed on the outer end of the limiting frame 732. The outer end of the limiting block 733 is inserted into the slot. Inside the limiting hole 71, the front rail 72 is fixed to the upper front of the sealing cover 4. The limiting components 73 at both ends are connected to the limiting frame 732 through the equally spaced limiting springs 731. The limiting block 733 at the outer end of the limiting frame 732 can be inserted into the limiting hole 71 at the front end of both sides of the protective box 2. This design makes the connection between the sealing cover 4 and the protective box 2 stable and reliable. The limiting spring 731 provides a certain elastic buffer, which enhances the adaptability and stability of the connection. At the same time, the insertion and cooperation between the limiting block 733 and the limiting hole 71 makes the disassembly and assembly operation simple and can quickly realize the installation and disassembly of the sealing cover 4, which is convenient for maintenance and repair of internal components.

[0032] Please see Figures 4-7 The linkage component 74 includes a top rail 741 and a linkage plate 742. The top rail 741 is fixedly installed at the top center of the front rail 72. The linkage plate 742 is fixedly installed at the inner end of the front of the limit frame 732. A movable block 743 is slidably connected to the inner side of the top rail 741. A fixed plate 744 is fixedly connected to the side of the movable block 743 away from the top rail 741. Both ends of the fixed plate 744 are rotatably connected to linkage rods 745. The lower end of the linkage rods 745 is hinged to the inner end of the linkage plate 742. A push shaft 746 is fixedly installed on the top of the movable block 743. A pressing plate 747 is fixedly installed through the top rail 741. The top rail 741 is fixed at the top center of the front rail 72, and the movable block 743 passes through its inner side. The sliding mechanism transmits the motion. The linkage plate 742 is fixed to the inner end of the front of the limit frame 732. The linkage rod 745, which is rotatably connected to both ends of the fixed plate 744 on the movable block 743, is hinged to the inner end of the linkage plate 742, so that the operation can be linked. When the pressing plate 747 on the push shaft 746 that passes through the top rail 741 is pressed, the movable block 743 drives the linkage rod 745 to move, thereby pushing the linkage plate 742 and realizing the control of the limit frame 732. This design is compact, simple and direct to operate, and can accurately and quickly realize the control of the limit frame 732, thereby efficiently completing the disassembly and assembly of the sealing cover 4, greatly improving work efficiency, and also enhancing the stability and reliability of the entire clamping mechanism 7.

[0033] Please see Figure 7The heat dissipation mechanism 6 includes a heat dissipation coil 61 and a cooling box 62. The cooling box 62 is filled with coolant. The heat dissipation coil 61 is fixedly installed on the inner wall of the protective box 2. The inner side of the heat dissipation coil 61 is in contact with the outer surface of the Hall sensor body 8. A micro pump 64 is fixedly installed on one side of the cooling box 62. The input of the micro pump 64 is connected to the cooling box 62, and the output of the micro pump 64 is connected to the heat dissipation coil 61. The output of the heat dissipation coil 61 is connected to the cooling box 62. A micro semiconductor cooler 63 is fixedly installed on the top of the cooling box 62. The cooling end of the cooler 63 is located inside the cooling box 62. The micro semiconductor cooler 63 is specifically a micro semiconductor cooler 63 of model TES1-068020. The cooling box 62 is filled with coolant. The heat dissipation coil 61 is fixed to the inner wall of the protective box 2 and is attached to the outer surface of the Hall sensor body 8. The micro pump 64 makes the coolant circulate between the cooling box 62 and the heat dissipation coil 61. The cooling end of the micro semiconductor cooler 63 is located inside the cooling box 62 to cool the coolant. This heat dissipation design can effectively remove the heat generated by the Hall sensor during operation and ensure its stable operation.

[0034] The working principle of this utility model is as follows: During use, the Hall sensor body 8 is inserted into the protective box 2. At this time, the sealing cover 4 is installed on the front end of the protective box 2 with the assistance of the clamping mechanism 7. At this time, both ends of the Hall sensor pass through the through holes 5. Since the sealing gasket 10 is set inside the through hole 5, the sealing gasket 10 fits against the inner wall of the through hole 5, which can help seal the through hole 5 of the protective box 2. This gives the Hall sensor body 8 a strong sealing performance after installation. During use, the sliding frame 3 is slidably connected inside the sliding groove 31. 2. The sliding frame 32 is internally connected to the silicone drying plate 33. The silicone drying plate 33 can then help absorb the moisture inside the protective box 2, giving the sensor a strong sealing and moisture-proof performance. If disassembly is required, simply adjust the locking mechanism 7 to remove the sealing cover 4 of the protective box 2. Then, the sliding frame 32 can be pulled out from the inside of the sliding groove 31, and the silicone drying plate 33 can be pulled out from the inside of the sliding frame 32 for replacement. This allows the entire device to be quickly disassembled and replaced, improving the overall ease of use of the device.

[0035] By setting up the clamping mechanism 7, when it is necessary to disassemble and repair the Hall sensor or disassemble the silica gel drying plate 33 during use, the pressing plate 747 can be pressed to push the shaft 746 downward. The downward movement of the shaft 746 will cause the movable block 743 to slide inside the top rail 741. The movable block 743 will drive the linkage rod 745 and the linkage plate 742 to rotate in coordination, which will help push the two limit frames 732 to move outward. The outward movement of the limit frames 732 will cause the limit block 733 at the outer end of the limit frame 732 to disengage from the limit hole 71. The limit hole 71 and the limit block 733 will separate from each other. At this time, the sealing cover 4 and the protective box 2 will lose their connection. The limiting mechanism facilitates quick and easy disassembly and assembly of the sealing cover 4, enabling rapid inspection and maintenance of the sensor. During use, if installation is required, simply insert the new silica gel drying plate 33 into the slide frame 32, then insert the slide frame 32 into the inner side of the slide groove 31. When the limiting block 733 contacts the limiting hole 71, the limiting spring 731 resets, causing the limiting block 733 to engage with the inner side of the limiting hole 71. The mutual limiting and locking of the limiting block 733 and the limiting hole 71 ensures the sealing cover 4 is stably installed at the front end of the protective box 2. This allows for quick disassembly and maintenance of the Hall sensor body 8, improving the overall ease of use of the device.

[0036] During the use of the Hall sensor body 8, the micro pump 64 and micro semiconductor cooler 63 can be started. When the micro pump 64 is started, the coolant inside the cooling box 62 is pumped and circulated inside the heat dissipation coil 61. After the Hall sensor body 8 is installed inside the protective box 2, the heat dissipation coil 61 is attached to the outer surface of the Hall sensor body 8. The heat dissipation coil 61 can assist in heat conduction and heat dissipation through the inner side of the Hall sensor body 8 and the heat dissipation coil 61. The heat of the Hall sensor body 8 can be sent to the inside of the cooling box 62 through the coolant in the heat dissipation coil 61. At this time, the micro semiconductor cooler 63 can be used to cool the inside of the cooling box 62, so that the inside of the protective box 2 of this sensor can have good sealing and cooling performance, which can improve the overall heat dissipation capacity of this Hall sensor and extend its overall service life.

Claims

1. A high-precision Hall sensor, characterized by, The device includes a base, a protective box fixedly installed at the top center of the base, a moisture-proof mechanism movably installed at the upper center of the protective box, a sealing cover fixedly installed at the front end of the moisture-proof mechanism, a clamping mechanism fixedly installed at the upper front of the sealing cover, the sealing cover being connected to the protective box via the clamping mechanism, a heat dissipation mechanism fixedly installed at the top of the protective box, through holes opened at the rear center of the protective box and the middle of the sealing cover, a Hall sensor body slidably connected inside the protective box, a pin fixedly installed at the rear end of the Hall sensor body through the through hole, a detection probe at the front end of the Hall sensor body passing through the through hole located in the middle of the sealing cover, a heat dissipation end of the heat dissipation mechanism covering the outer surface of the Hall sensor body, and sealing gaskets fitted at both ends of the Hall sensor body, the outer side of the sealing gaskets being fitted and connected to the inner wall of the through hole.

2. The high-precision Hall sensor according to claim 1, characterized in that The moisture-proof mechanism includes a slide groove, which is located in the middle of the top of the protective box. A sliding frame is slidably connected inside the slide groove. The front end of the sliding frame is fixedly connected to the upper back of the sealing cover. A silica gel drying plate is slidably connected inside the sliding frame.

3. The high-precision Hall sensor according to claim 1, characterized in that, Mounting holes are provided at all four corners of the base, and the mounting holes are countersunk holes.

4. The high-precision Hall sensor according to claim 1, characterized in that, The mounting mechanism includes a limiting hole and a front rail. The front rail is fixedly installed on the upper front of the sealing cover. Limiting components are fixedly installed at both ends of the front rail. A linkage component is fixedly connected to the upper front of the front rail. The limiting hole is opened at the front ends of both sides of the protective box. The outer end of the limiting component is inserted into the inner side of the slot.

5. The high-precision Hall sensor according to claim 4, characterized in that The limiting component includes a limiting spring, which is fixedly connected to both ends of the front rail at equal intervals. A limiting frame is fixedly connected to the outer end of the limiting spring, and a limiting block is fixedly installed on the outer end of the limiting frame. The outer end of the limiting block is inserted into the inner side of the limiting hole.

6. The high-precision Hall sensor according to claim 5, characterized in that The linkage assembly includes a top rail and a linkage plate. The top rail is fixedly installed at the top center of the front rail. The linkage plate is fixedly installed at the inner end of the front of the limiting frame. A movable block is slidably connected to the inner side of the top rail. A fixed plate is fixedly connected to the side of the movable block away from the top rail. Both ends of the fixed plate are rotatably connected to linkage rods. The lower end of the linkage rod is hinged to the inner end of the linkage plate.

7. The high-precision Hall sensor according to claim 6, characterized in that A push shaft is fixedly installed on the top of the movable block, and a pressing plate is fixedly installed on the top of the push shaft through the top rail.

8. The high-precision Hall sensor according to claim 1, characterized in that, The heat dissipation mechanism includes a heat dissipation coil and a cooling box. The interior of the cooling box is filled with coolant. The heat dissipation coil is fixedly installed on the inner wall of the protective box. The inner side of the heat dissipation coil is in contact with the outer surface of the Hall sensor body. A micro pump is fixedly installed on one side of the cooling box. The input of the micro pump is connected to the cooling box. The output end of the micro pump is connected to the heat dissipation coil. The output end of the heat dissipation coil is connected to the cooling box.

9. The high-precision Hall sensor according to claim 8, characterized in that A miniature semiconductor cooler is fixedly installed on the top of the cooling box, and the cooling end of the miniature semiconductor cooler is located inside the cooling box.

Citation Information

Patent Citations

  • Moisture-proof Hall sensor

    CN212780963U